CREAT BY ART
- Glass passivated junction
- Ideal for printed circuit board
- High case dielectric strength of 2000VRMS
- Reliable low cost construction
- UL Recognized File # E-326243
- Halogen-free according to IEC 61249-2-21 definition
Molding compound, UL flammability classification rating 94V-0
Base P/N with suffix "G" on packing code - halogen-free
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 1A whisker test
V
RRM
50 100 200 400 600 800 1000 V
V
RMS
35 70 140 280 420 560 700 V
V
DC
50 100 200 400 600 800 1000 V
I
F(AV)
A
I
2
t A
2
s
R
θJC O
C/W
T
JO
C
T
STG O
C
Document Number: DS_D1311041 Version: G13
TS10B01G thru TS10B07G
Taiwan Semiconductor
Glass Passivated Brid
g
e Rectifiers
FEATURES
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
TS4B
MECHANICAL DATA
Case: TS4B
Polarity: Polarity as marked on the body
Mounting torque: 5 in-lbs maximum
Weight: 4 g (approximately)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (T
A
=25℃ unless otherwise noted)
PARAMETER SYMBOL TS10B
01G
TS10B
02G
TS10B
03G
TS10B
04G
TS10B
05G
TS10B
06G
TS10B
07G UNIT
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
V
Maximum average forward rectified current 10
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load I
FSM
150 A
1.4
Rating for fusing (t<8.3ms) 93
Maximum instantaneous forward voltage (Note 1)
@ 5 A
@ 10 A
V
F
1.0
1.1
Operating junction temperature range - 55 to +150
Storage temperature range - 55 to +150
Note 1: Pulse test with PW=300μs, 1% duty cycle
Maximum DC reverse current T
J
=25 ℃
at rated DC blocking voltage T
J
=125℃I
R
10
500 μA
Typical thermal resistance
PART NO.
Note 1: "x" defines voltage from 50V (TS10B01G) to 1000V (TS10B07G)
PART NO.
TS10B01G
TS10B01G
(TA=25℃ unless otherwise noted)
Document Number: DS_D1311041 Version: G13
EXAMPLE
TS10B01G thru TS10B07G
Taiwan Semiconductor
PACKING
20 / TUBE
Forming
20 / TUBE
ORDERING INFORMATION
PACKING COD E GREEN COMPOUND
CODE
PACKAGE
TS10B0xG
(Note 1)
C2
Suffix "G"
TS4B
X0 TS4B
D2 TS4B
PREFERRED P/N PACKING CODE GREEN COMPOUND
CODE DESCRIPTION
RATINGS AND CHARACTERISTICS CURVES
TS10B01G C2 C2
TS10B01G C2G C2 G Green compound
0
2
4
6
8
10
12
50 60 70 80 90 100 110 120 130 140 150
AVERAGE FORWARD A
CURRENT (A)
CASE TEMPERATURE (oC)
FIG.1 FORWARD CURRENT DERATING CURVE
RESISTIVE OR
INDUCTIVE LOAD
WITH HEATSINK
0
50
100
150
200
250
300
1 10 100
PEAK FORWARD SURGE CURRENT (A)
NUMBER OF CYCLES AT 60 Hz
FIG. 3 MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
8.3ms Single Half Sine Wave
JEDEC Method
0.1
1
10
100
0 20 40 60 80 100 120 140
INSTANTANEOUS REVERSE CURRENT
(μA)
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
FIG. 2 TYPICAL REVERSE CHARACTERISTICS
TJ=25℃
TJ=125℃
0.1
1
10
100
0.6 0.8 1 1.2 1.4 1.6 1.8 2
INSTANTANEOUS FORWARD CURRENT (A)
FORWARD VOLTAGE (V)
FIG. 4 TYPICAL FORWARD CHARACTERISTICS
Min Max Min Max
A 24.70 25.30 0.972 0.996
B 0.90 1.10 0.035 0.043
C 1.80 2.20 0.071 0.087
D 14.70 15.30 0.579 0.602
E 3.96 4.37 0.156 0.172
F 17.00 18.00 0.669 0.709
G 7.30 7.70 0.287 0.303
H 3.30 3.70 0.130 0.146
I 3.10 3.40 0.122 0.134
J 9.30 9.70 0.366 0.382
K 1.52 1.73 0.060 0.068
L 0.55 0.75 0.022 0.030
P/N = Specific Device Code
G = Green Compound
YWW = Date Code
F = Factory Code
Document Number: DS_D1311041 Version: G13
MARKING DIAGRAM
TS10B01G thru TS10B07G
Taiwan Semiconductor
PACKAGE OUTLINE DIMENSIONS
DIM. Unit (mm) Unit (inch)
0
100
200
300
400
500
600
700
0.1 1 10 100
J UNCTION CAPACITANCE (pF) A
REVERSE VOLTAGE (V)
FIG. 5 TYPICAL JUNCTION CAPACITANCE
f=1.0MHz
Vsig=50mVp-p
CREAT BY ART
assumes no responsibility or liability for any errors inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied,to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or seling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_D1311041 Version: G13
TS10B01G thru TS10B07G
Taiwan Semiconductor
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
