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Surface-Mount Package ("M" suffi x)
Murata Power Solutions’ ULE series SMT DC/DC converters are the only higher-
power DC/DCs that can be automatically “pick-and-placed” using standard
vacuum-pickup equipment and subsequently refl owed using high-temperature,
lead-free solder.
Virtually all SMT DC/DCs today are unprotected "open-frame" devices as-
sembled by their vendors with high-temperature solder (usually Sn96.5/Ag3.5
with a melting point +221°C) so that you may attach them to your board using
low-temperature solder (usually Sn63/Pb37 with a melting point of +183°C).
Conceptually straightforward, this "stepped" solder approach has its limita-
tions . . . and is clearly out of step with an industry trending toward the broad
use of lead-free solders. Users need to experiment and develop refl ow profi les
that ensure the components on their DC/DC never exceed 215-216°C. If those
components get too hot, "double-refl ow" could compromise the reliability of
their solder joints. Virtually all these devices demand you "cool down" the Sn63
profi le you are likely using today.
Murata Power Solutions is not exempted from the Laws of Physics. And we
do not have magic solders no one else has. We do have a simple and practical,
straightforward approach that works. We assemble our SMT DC/DCs on a
thermally-stable plastic lead-frame (nylon 46, UL94V-0 fl ammability rated) using
a high temperature lead-free solder. The lead-frame ensures coplanarity (to
within 0.004 in.) of the unit's tin-plated (150 microinches) copper leads and
also supports a removable heat shield.
The disposable heat shield, with a cutaway exposing the package leads,
provides thermal insulation to internal components during refl ow and doubles as
the vacuum pick-up location. The insulation properties of the heat shield are so
effective that temperature differentials as high as 50°C develop inside-to-outside
the shield. Oven temperature profi les with peaks of 250-260°C and dwell times
exceeding 2 minutes above 221°C are easily achieved. Murata Power Solutions’
new-generation SMT units are shipped in stackable, JEDEC-style plastic trays
(Figure 13).
Automated Assembly Production Notes
Murata Power Solutions’ new high-effi ciency DC/DC converters are designed
for modern surface-mount technology (SMT) automated assembly using
screened solder paste, "pick and place" component positioning and forced
hot air refl ow oven soldering. If you are new to SMT techniques and have a
volume application, these features save time, cost and improve manufacturing
effi ciency. Murata Power Solutions’ DC/DC assembly operations themselves
make extensive use of such techniques.
Even if you have previous SMT experience, you should read the sections be-
low on solder refl ow profi les and heat shields. This information is not intended
to replace the documentation for your SMT system. We assume that you are
already experienced with all the components of your SMT system.
This section will discuss several SMT issues, including:
I/O Mechanical Confi guration
Part Handling and Supply
Printed Circuit Board (pcb) Mounting
Soldering using Refl ow Technology
Temperature Profi ling
Heat Shields and Removal
Mechanical Confi guration of Input/Output Connections
These new converters are supplied either using traditional through-hole pins
or SMT leads. (Note that some models are offered only with lead mounting).
The pin options insert into plated-through holes in the host pcb. Be aware that
some heat dissipation is carried off by either the pins or leads. The Derating
Curves assume that some additional pad area is available on your host pcb to
absorb the heat.
The lead option uses either short tabs in "gullwing" style or standoff leads
under the converter. The gullwing leads typically are copper alloy with 150
microinches of tin plating. Solder paste (typically 0.008" to 0.009" thick) is ap-
plied to the host pcb using a solder mask pressure screening technique and the
board is heated and cooled long enough for the solder to refl ow and adhere to
both the host pads and the converter’s mounting leads.
After such mounting, the entire mechanical mounting load is carried by the
solder. Obviously the converters must be accurately positioned all during the
solder refl ow period. Where solder surface tension is suffi cient to force tiny
components into position, these larger converters may not move and must be
accurately positioned by your SMT system.
Part Handling and Supply
SMT eighth- and quarter-brick DC/DC converters (plus installed heat shields if
used) are supplied in JEDEC-standard 5.35" by 12.4" waffl
e trays which are
compatible with the feeders on industry-standard pick-and-place machines.
Since the converters are larger and heavier than many other components,
make sure your system can reliably remove the units from their trays, move
them to the host pcb and accurately position them. The plastic heat shield
(Figure 10) doubles as a vacuum pickup area.
Figure 10. ULE SMT DC/DC with Disposable Heat Shield
Solder Balls
ULE converters are thoroughly inspected according to military standard
J-STD-001B for the presence of solder balls. The specifi cation allows small
solder balls as long as they are rigidly attached and do not compromise the
spacing and clearance requirements needed to maintain electrical isolation.
ULE Series
Isolated, High Density, Eighth-Brick
1.25–20 Amp, DC/DC Converters
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