© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com F3082_LDB • 7/31/2017 1
One world. One KEMET
Benets
• Rated voltage: 16VDC – 50VDC
• Capacitance range: 0.0033µF – 0.1µF
• EIA Size 1206 – 1812
• Capacitance tolerance: ±2%, ±5%
• Climatic category: 55/125/56
• RoHS compliance and lead-free terminations
• Operating temperature range of −55°C to +125°C
Overview
Polyphenylene sulphide (PPS) lm capacitor for surface
mounting.
Applications
Typical applications include timing, ltering and use as
a memory capacitor. The LDB Series is designed for high
stability, accuracy and temperature.
Surface Mount Metallized PPS Film Capacitor
LDB, Unencapsulated Stacked Chip,
Size 1206 – 1812, 16 and 50 VDC
Part Number System
LDB A A 2120 GC 5 N 0
Series Rated Voltage
(VDC) Size Code Capacitance
Code (pF)
Capacitance
Tolerance Dielectric Version Packaging Internal Use
Metallized PPS A = 16
C = 50
See Dimension
Table
Digits two –
four indicate
the rst three
digits of the
capacitance
value.
First digit
indicates the
number of
zeros to be
added.
G = ±2%
J = ±5%
C = PPS 5 = Standard See Ordering
Options Table
0 (Standard)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com F3082_LDB • 7/31/2017 2
Surface Mount Metallized PPS Film Capacitors
LDB, Unencapsulated Stacked Chip, Size 1206 – 1812, 16 and 50 VDC
Ordering Options Table
Packaging Type Packaging
Code
Standard Packaging Options
Tape & Reel (Standard Reel)
N
Dimensions – Millimeters
L
B
W
H
Size Code Chip Size
(EIA)
WH
(Maximum)
L B
Nominal Tolerance Nominal Tolerance Nominal Tolerance
A
1206
1.7
±0.2
See Part Number Table
3.3
+0.3/−0.1
0.5
+0.5/−0.3
B
1210
2.5
±0.3
3.3
+0.3/−0.1
0.5
+0.5/−0.3
C
1812
3.3
±0.3
4.7
+0.3/−0.2
0.5
+0.5/−0.3
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com F3082_LDB • 7/31/2017 3
Surface Mount Metallized PPS Film Capacitors
LDB, Unencapsulated Stacked Chip, Size 1206 – 1812, 16 and 50 VDC
Performance Characteristics
Rated Voltage (VDC) 16 50
Capacitance Range (μF) 0.012 – 0.1 0.0033 – 0.1
Chip Size (EIA) 1206 – 1812
Capacitance Values E12 series
Capacitance Tolerance ±2%, ±5%
Category Temperature Range −55°C to +125°C
Rated Temperature +105°C
Voltage Derating
C
R
Climatic Category 55/125/56
Capacitance Drift
Reliability
(Reference MIL-HDBK-217)
Failure rate ≤ 1 FIT, T = +40°C, V = 0.5 x VR
1 FIT = 10-9 failures / (components * hours)
Insulation Resistance
Measured at +25°C ±5°C
Minimum Value Between Terminals
3,000 MΩ
Charging time: 1 minute
Charging voltage:
10 VDC for VR = 16 VDC
50 V
for VR = 50 V
Dissipation Factor Maximum Values at 25°C ±5°C
1 kHz 0.6%
Surge Voltage Test 1.75 x V
(5 seconds; T = 25 ± 5°C)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com F3082_LDB • 7/31/2017 4
Surface Mount Metallized PPS Film Capacitors
LDB, Unencapsulated Stacked Chip, Size 1206 – 1812, 16 and 50 VDC
PPS Dielectric Typical Temperature Graphs
1.0
0.5
0.0
−1.0
−0.5
−1.5
−60 −40 −20 020 40 60 80 100 120 140
∆ C/C [%]
Capacitance vs. Temperature
(f = 1 kHz)
Temperature [°C]
50
40
30
10
20
0
−60 −40 −20 020 40 60 80 100 120 140
Dissipation Factor vs. Temperature
(f = 1 kHz)
Temperature [°C]
tgδ x 10−4
1E+7
1E+6
1E+5
1E+4
−60 −40 −20 020 40 60 80 100 120 140
IR [MΩ]
Insulation Resistance vs. Temperature
Temperature [°C]
PPS Dielectric Typical Frequency Graphs
2.0
1.5
1.0
0.5
0.0
−0.5
−1.0
−1.5
−2.0
0.1 1 10 100 1,000
∆ C/C [%]
Capacitance vs. Frequency
f [kHZ]
100
80
60
40
20
0
0.1 1 10 100 1,000
tg δ x 10−4
Dissipation Factor vs. Frequency
f [kHZ]
1E+2
1E+1
1E+0
1E−1
1E−2
0.1 1 10 100 1,000
ESR [Ω]
Equivalent Series Resisteance vs. Frequency
f [kHZ]
10
1
0.1
0.01
0.1
Note: Measurements performed at T = 25±5°C
1 10 100
|Z| [Ω]
PEN and PPS Impedance vs. Frequency
f [MHZ]
0.1 µF
10 nF
10 nF
0.1 µF
0.1 µF 0.01 µF
1.0 µF
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com F3082_LDB • 7/31/2017 5
Surface Mount Metallized PPS Film Capacitors
LDB, Unencapsulated Stacked Chip, Size 1206 – 1812, 16 and 50 VDC
Environmental Test Data
Damp Heat, Steady State
Test Conditions
Temperature +40°C ±2°C
Relative Humidity (RH) 93% ±2%
Test Duration 56 days
Performance
Capacitance Change |∆ C/C| ≤ 5%
DF Change (∆tgδ) ≤ 30 x 10−4 at 1 kHz
Insulation Resistance ≥ 50% of limit value
Endurance
Test Conditions
Temperature 125°C ±2°C
Test Duration 2,000 hours
Voltage Applied 1.25 x V
C
Performance
Capacitance Change |∆ C/C| ≤ 3%
DF Change (∆tgδ) ≤ 30 x 10−4 at 1 kHz
Insulation Resistance ≥ 50% of limit value
Rapid Change of Temperature
Test Conditions
Temperature
1 hour at −55°C, 1 hour at
+125°C
Number of Cycles 1,000
Performance
Capacitance Change |∆ C/C| ≤ 3%
DF Change (∆tgδ) ≤ 50 x 10−4 at 1 kHz
Insulation Resistance ≥ limit value
No Mechanical Damage
Reow
Test Conditions
See Solder Process
Performance
Capacitance Change |∆ C/C| ≤ 3%
DF Change (∆tgδ) ≤ 50 x 10−4 at 1 kHz
Insulation Resistance ≥ limit value
No Mechanical Damage
Bending
Test Conditions
Deection 1 to 6 mm
Performance
Capacitance Change |∆ C/C| ≤ 1%
No visible damage on the terminations
(pealing) neither on the body (cracking)
Environmental Compliance
All KEMET surface mount capacitors are RoHS Compliant.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com F3082_LDB • 7/31/2017 6
Surface Mount Metallized PPS Film Capacitors
LDB, Unencapsulated Stacked Chip, Size 1206 – 1812, 16 and 50 VDC
Table 1 – Ratings & Part Number Reference
VDC Capacitance
Value (µF) Size Code Dimensions in mm Chip Size New KEMET
Part Number
Legacy Part
Number
WH (max) L
16 0.012 A1.7 1.1 3.3 1206 DBAA2120(1)C5N0 LDBAA2120(1)C5N0
16 0.015 A1.7 1.1 3.3 1206 DBAA2150(1)C5N0 LDBAA2150(1)C5N0
16 0.018 A1.7 1.1 3.3 1206 DBAA2180(1)C5N0 LDBAA2180(1)C5N0
16 0.022 A1.7 1.1 3.3 1206 DBAA2220(1)C5N0 LDBAA2220(1)C5N0
16 0.027 A1.7 1.1 3.3 1206 DBAA2270(1)C5N0 LDBAA2270(1)C5N0
16 0.033 A1.7 1.1 3.3 1206 DBAA2330(1)C5N0 LDBAA2330(1)C5N0
16 0.039 A1.7 1.2 3.3 1206 DBAA2390(1)C5N0 LDBAA2390(1)C5N0
16 0.047 A1.7 1.3 3.3 1206 DBAA2470(1)C5N0 LDBAA2470(1)C5N0
16 0.056 B2.5 1.7 3.3 1210 DBAB2560(1)C5N0 LDBAB2560(1)C5N0
16 0.068 B2.5 1.7 3.3 1210 DBAB2680(1)C5N0 LDBAB2680(1)C5N0
16 0.082 B2.5 1.7 3.3 1210 DBAB2824(1)C5N0 LDBAB2824(1)C5N0
16 0.10 B2.5 2.0 3.3 1210 DBAB3100(1)C5N0 LDBAB3100(1)C5N0
50 0.0033 A1.7 1.1 3.3 1206 DBCA1330(1)C5N0 LDBCA1330(1)C5N0
50 0.0039 A1.7 1.1 3.3 1206 DBCA1390(1)C5N0 LDBCA1390(1)C5N0
50 0.0047 A1.7 1.1 3.3 1206 DBCA1470(1)C5N0 LDBCA1470(1)C5N0
50 0.0056 A1.7 1.1 3.3 1206 DBCA1560(1)C5N0 LDBCA1560(1)C5N0
50 0.0068 A1.7 1.1 3.3 1206 DBCA1680(1)C5N0 LDBCA1680(1)C5N0
50 0.0082 A1.7 1.1 3.3 1206 DBCA1820(1)C5N0 LDBCA1820(1)C5N0
50 0.010 A1.7 1.1 3.3 1206 DBCA2100(1)C5N0 LDBCA2100(1)C5N0
50 0.012 A1.7 1.1 3.3 1206 DBCA2120(1)C5N0 LDBCA2120(1)C5N0
50 0.015 B2.5 1.4 3.3 1210 DBCB2150(1)C5N0 LDBCB2150(1)C5N0
50 0.018 B2.5 1.5 3.3 1210 DBCB2180(1)C5N0 LDBCB2180(1)C5N0
50 0.022 B2.5 1.5 3.3 1210 DBCB2220(1)C5N0 LDBCB2220(1)C5N0
50 0.027 B2.5 1.5 3.3 1210 DBCB2270(1)C5N0 LDBCB2270(1)C5N0
50 0.033 B2.5 1.7 3.3 1210 DBCB2330(1)C5N0 LDBCB2330(1)C5N0
50 0.039 B2.5 1.9 3.3 1210 DBCB2390(1)C5N0 LDBCB2390(1)C5N0
50 0.047 B2.5 2.3 3.3 1210 DBCB2470(1)C5N0 LDBCB2470(1)C5N0
50 0.056 C3.3 1.7 4.7 1812 DBCC2560(1)C5N0 LDBCC2560(1)C5N0
50 0.068 C3.3 1.7 4.7 1812 DBCC2680(1)C5N0 LDBCC2680(1)C5N0
50 0.082 C3.3 1.7 4.7 1812 DBCC2824(1)C5N0 LDBCC2824(1)C5N0
50 0.10 C3.3 2.0 4.7 1812 DBCC3100(1)C5N0 LDBCC3100(1)C5N0
VDC Capacitance
Value (µF) Size Code W
(mm)
H
(mm)
L
(mm) Chip Size New KEMET
Part Number Legacy Part Number
(1) G = ±2%, J = ±5%.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com F3082_LDB • 7/31/2017 7
Surface Mount Metallized PPS Film Capacitors
LDB, Unencapsulated Stacked Chip, Size 1206 – 1812, 16 and 50 VDC
Soldering Process
Reow Recommendations
Preheating
Maximum Preheating Time 180 seconds
Minimum Temperature 150°C
Maximum Temperature 200°C
Maximum Time within Tmax and
Tmax – 5°C (∆T5)
30 seconds (Tmax ≤ 250°C)
10 seconds
(250 °C < T
max
≤ 260°C)
Maximum Time Over 217°C
(∆T
217
)150 seconds
Maximum Temperature Ramp
Rate
3°C/seconds (heating)
6°C/seconds (cooling)
Second reow
If two reow processes are needed, be sure that before the second
reow, the temperature on the capacitor’s surface is lower than 50°C.
* Maximum Temperature on the component's body (Tmax): = 260 °C.
Flux/Cleaning/Storage and Moisture
Flux suggestions
KEMET suggests to use a no-clean ux with a halogen content lower than 0.1%.
Cleaning suggestions
To clean the PCB assembly KEMET recommends to use a suitable solvent like Isopropyl alcohol, deionized water or neutral
pH detergents. Aggressive solvents shall not be used. For any different cleaning solvent used please contact KEMET
Technical Services to analyze the potential impact on KEMET products.
Storage and moisture recommendations
KEMET SMD Film Capacitors are supplied in a MBB (Moisture Barrier Bag) Class 1. We can guarantee a 24 months shelf life
(temperature ≤ 40°C/relative humidity ≤ 90%). After the MBB has been opened, components may stay in areas with controlled
temperature and humidity (temperature ≤ 30°C/relative humidity ≤ 60%) for 168 hours [MSL 3]. For longer periods of time
and/or higher temperature and/or higher relative humidity values, it is absolutely necessary to protect the components
against humidity. If the reel inside the MBB is partially used, KEMET recommends to re-use the same MBB or to avoid areas
without controlled temperature and humidity (see above). If the above conditions are not respected, components require a
baking (minimum time: 48 hours at 55±5°C) before the reow.
Preheating
Reflow Temperature Profile
Time
Temperature
Linear profiles are also allowed (if in line with the reflow recommendations)
∆T217
∆T5
217°C
Tmax−5°C
Tmax
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com F3082_LDB • 7/31/2017 8
Surface Mount Metallized PPS Film Capacitors
LDB, Unencapsulated Stacked Chip, Size 1206 – 1812, 16 and 50 VDC
Flux/Cleaning/Storage and Moisture cont'd
Manual assembly recommendations
If PCBs are assembled manually, care must be taken to avoid any mechanical damage to
the components. Our recommendations are the following (see Fig. 1):
1. When using tweezers, the components should be gripped across the two
terminations (A);
2. Avoid any contact with the two cutting surfaces (C);
3. A vacuum pen is recommended on the top and bottom surfaces (B).
Manual soldering recommendations
LDE and LDB series have been designed for Surface Mount Technology, pick and place machines and reow soldering
systems. Using a manual soldering iron, issues may occur because the typical temperature for manual soldering is around
350°C. Therefore please pay careful attention:
• Never touch the capacitor body with the soldering iron but rather touch the soldering iron and the end termination with the
tin wire edge (see Fig. 2);
• If the soldering iron is equipped with a temperature controller device:
Set the temperature to 250±3°C and proceed as per Fig. 2 (the maximum soldering time, on both terminations, is 5
seconds);
• If the soldering iron is NOT equipped with a temperature controller device:
This is the worst situation. The following are a few practical suggestions but, clearly, the operator’s experience is
extremely important:
1. Proceed as per Fig. 2;
2. As soon as the tin wire starts melting, move the soldering iron away as quickly as possible;
3. Wait a few seconds and check that the soldering joint has been properly created;
• If the soldering iron is equipped with a hot air ow device:
Set the hot air temperature to 250±3°C and do not send the hot air directly onto the capacitor plastic body. In this
situation, the operator’s experience is very important;
• In any case, avoid mass-mounting SMD Film Capacitors manually.
SMD Film Capacitor
PCB
Landing Area
Tin Wire Fig. 2
Soldering Iron
B
B
A
C
A
C
Fig. 1
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com F3082_LDB • 7/31/2017 9
Surface Mount Metallized PPS Film Capacitors
LDB, Unencapsulated Stacked Chip, Size 1206 – 1812, 16 and 50 VDC
Packaging Quantities
Chip Size (EIA) Height (mm) Reel
1206
1.1
3,000
1206
1.2
3,000
1206
1.3
3,000
1210
1.4
2,250
1210
1.5
2,250
1210
1.7
2,250
1210
1.9
2,250
1210
2.0
2,250
1210
2.3
2,250
1812
1.7
4,000
1812
2.0
3,000
Landing
A
B C
D
Size Dimensions in mm
A B CD
1206
1.5
1.1
2.3
4.5
1210
2.3
1.1
2.3
4.5
1812
3
1.7
3.1
6.5
These landing area dimensions have the aim of taking full advantage of the new RoHS 6 terminations design.
We suggest to use a Sn/Ag/Cu solder paste (suggested thickness: 0.10 – 0.15 mm).
If a NOT Lead Free solder paste is used, a minimum peak temperature of 210°C on the component’s body is suggested.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com F3082_LDB • 7/31/2017 10
Surface Mount Metallized PPS Film Capacitors
LDB, Unencapsulated Stacked Chip, Size 1206 – 1812, 16 and 50 VDC
Production process basic suggestions
In case of: Typical cause Typical solution
no solder joint on one
end termination
landing area dimensions see landing areas suggestions, page 9
solder paste quality see solder paste suggestions, page 9
not-uniform solder paste thickness
on the landing areas
set the dispensing solder paste machine properly
wrong position of the capacitor
on the landing areas
set the pick and place machine properly
thermal prole temperature see reow recommendations, page 7
bad temperature distribution
in the reow oven
check the reow oven temperature
distribution and variations"
no solder joint on both
end termination
landing area dimensions see landing areas suggestions, page 9
solder paste quality see solder paste suggestions, page 9
no solder paste on the landing areas set the dispensing solder paste machine properly
thermal prole temperature see reow recommendations, page 7
bad temperature distribution
in the reow oven
check the reow oven temperature
distribution and variations
oxidated end terminations see moisture recommendations, page 8
capacitor's body
mechanical deformation
too long time over 217°C see reow recommendations, page 7
too long time within Tmax and Tmax−5°C see reow recommendations, page 7
too high temperature ramp rate see reow recommendations, page 7
capacitor damaged by a soldering iron see manual soldering recommendations, page 8
capacitance drop (up to 20%)
too long time over 217°C see reow recommendations, page 7
too long time within Tmax and Tmax−5°C see reow recommendations, page 7
too high temperature ramp rate see reow recommendations, page 7
capacitor damaged by a soldering iron see manual soldering recommendations, page 8
capacitance drop (over 20%) capacitor damaged by a soldering iron see manual soldering recommendations, page 8
Note: small ssures on the capacitor’s cutting surface are actually slight detachments of two adjacent metallized lm layers and have to be considered
only as an aesthetic issue related to the SMD Film Capacitors’ manufacturing process and technology.
Therefore, small ssures on SMD Film Capacitors are not comparable to cracks on SMD Ceramics.
Fissures do not inuence in anyway SMD Film Capacitors’ reliability.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com F3082_LDB • 7/31/2017 11
Surface Mount Metallized PPS Film Capacitors
LDB, Unencapsulated Stacked Chip, Size 1206 – 1812, 16 and 50 VDC
Carrier Taping & Packaging (IEC 60286–2)
Horizontal Taping Orientation
L
SMD Film Capacitor (Top View) Tape Reel
P±0.1
2.0±0.05
4.0±0.1 1.75±0.1
1.5+0.1
0
W+0.3
−0.1
A0
K0
B0
T
ØW1
W2
Chip Size (EIA)
Horizontal
Mounting
Dimensions in mm Taping Specication
W H L W P
1
A
0
B
0
K
0
D W
1
W
2
Nominal
Nominal
Nominal
−0.1/+0.3
+/−0.1
Nominal
Nominal
Nominal
−/+2.0
−0/+2
Maximum
1206
1.7
All
3.3
8
4
2
3.8
1.3
180
8
12
1210
2.5
All
3.3
8
4
3
3.8
2.1
180
8
12
1812
3.3
≤ 1.9
4.7
12
8
3.8
5.3
2
330
12
16
1812
3.3
2.1 – 2.6
4.7
12
8
3.9
5.2
2.6
330
12
16
In accordance with IEC 60286–3
Materials:
- carrier tape: antistatic material
- cover tape: polyester + polythene
- reel: recyclable polystyrene
All parts in reels are packed in hermetically sealed Moisture Barrier Bag (MBB) Class 1.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com F3082_LDB • 7/31/2017 12
Surface Mount Metallized PPS Film Capacitors
LDB, Unencapsulated Stacked Chip, Size 1206 – 1812, 16 and 50 VDC
KEMET Electronics Corporation Sales Of ces
For a complete list of our global sales of ces, please visit www.kemet.com/sales.
Disclaimer
All product speci cations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for
checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed.
All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such
applications, but are not intended to constitute – and KEMET speci cally disclaims – any warranty concerning suitability for a speci c customer application or use.
The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any
technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no
obligation or liability for the advice given or results obtained.
Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component
failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards
(such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or
property damage.
Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other
measures may not be required.
KEMET is a registered trademark of KEMET Electronics Corporation.