LM3671MF-1.6/NOPB - National Semiconductor

October 28, 2008

LM3671

2MHz, 600mA Step-Down DC-DC Converter

General Description

The LM3671 step-down DC-DC converter is optimized for

powering low voltage circuits from a single Li-Ion cell battery

and input voltage rails from 2.7V to 5.5V. It provides up to

600mA load current, over the entire input voltage range.

There are several different fixed voltage output options avail-

able as well as an adjustable output voltage version range

from 1.1V to 3.3V.

The device offers superior features and performance for mo-

bile phones and similar portable systems. Automatic intelli-

gent switching between PWM low-noise and PFM low-current

mode offers improved system control. During PWM mode, the

device operates at a fixed-frequency of 2 MHz (typ.). Hys-

teretic PFM mode extends the battery life by reducing the

quiescent current to 16 µA (typ.) during light load and standby

operation. Internal synchronous rectification provides high ef-

ficiency during PWM mode operation. In shutdown mode, the

device turns off and reduces battery consumption to 0.01 µA

(typ.).

The LM3671 is available in SOT23-5, tiny 5-bump micro SMD

and a 6-pin LLP packages in leaded (PB) and lead-free (NO

PB) versions. A high switching frequency of 2 MHz (typ.) al-

lows use of tiny surface-mount components. Only three ex-

ternal surface-mount components, an inductor and two

ceramic capacitors, are required.

Features

■16 µA typical quiescent current

■600 mA maximum load capability

■2 MHz PWM fixed switching frequency (typ.)

■Automatic PFM/PWM mode switching

■Internal synchronous rectification for high efficiency

■Internal soft start

■0.01 µA typical shutdown current

■Operates from a single Li-Ion cell battery

■Only three tiny surface-mount external components

required (one inductor, two ceramic capacitors)

■Current overload and Thermal shutdown protection

■Available in fixed output voltages and adjustable version

■SOT23-5, 5-bump micro SMD and 6-pin LLP packages

Applications

■Mobile phones

■PDAs

■MP3 players

■W-LAN

■Portable instruments

■Digital still cameras

■Portable Hard disk drives

Typical Application Circuits

20108401

FIGURE 1. Typical Application Circuit

LM3671 2MHz, 600mA Step-Down DC-DC Converter

20108431

FIGURE 2. Typical Application Circuit for ADJ version

Connection Diagram and Package Mark Information

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FIGURE 3. Top View

SOT23-5 Package NS Package Number MF05A (2.92mm x 2.84mm x 1.2mm)

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FIGURE 4. 5-Bump Micro SMD Package NS Package Number TLA05CBA (1.05mm x 1.38mm x 0.6mm)

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LM3671

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FIGURE 5. 6-Pin LLP Package Number LCA06B (2mm x 2mm x 0.6mm)

Pin Descriptions (SOT23-5)

Pin # Name Description

1 VIN Power supply input. Connect to the input filter capacitor (Figure 1).

2 GND Ground pin.

3 EN Enable pin. The device is in shutdown mode when voltage to this pin is <0.4V and enabled

when >1.0V. Do not leave this pin floating.

4 FB Feedback analog input. Connect directly to the output filter capacitor for fixed voltage

versions. For adjustable version external resistor dividers are required (Figure 2). The

internal resistor dividers are disabled for the adjustable version.

5 SW Switching node connection to the internal PFET switch and NFET synchronous rectifier.

Pin Descriptions (5-Bump Micro SMD)

Pin # Name Description

A1 VIN Power supply input. Connect to the input filter capacitor (Figure 1).

A3 GND Ground pin.

C1 EN Enable pin. The device is in shutdown mode when voltage to this pin is <0.4V and enabled

when >1.0V. Do not leave this pin floating.

C3 FB Feedback analog input. Connect directly to the output filter capacitor for fixed voltage

versions. For adjustable version external resistor dividers are required (Figure 2). The

internal resistor dividers are disabled for the adjustable version.

B2 SW Switching node connection to the internal PFET switch and NFET synchronous rectifier.

Pin Descriptions (6-Pin LLP)

Pin # Name Description

1 EN Enable pin. The device is in shutdown mode when voltage to this pin is <0.4V and enabled

when >1.0V. Do not leave this pin floating.

2 Pgnd Ground pin.

3 VIN Power supply input. Connect to the input filter capacitor ().

4 SW Switching node connection to the internal PFET switch and NFET synchronous rectifier.

5 Sgnd Singnal ground (feedback ground).

6 FB Feedback analog input. Connect directly to the output filter capacitor for fixed voltage

versions. For adjustable version external resistor dividers are required (Figure 2). The

internal resistor dividers are disabled for the adjustable version.

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LM3671

Ordering Information (SOT23-5)

Voltage Option Order Number Spec Package Marking Supplied As

ADJ LM3671MF-ADJ NOPB

SBTB

1000 units, Tape-and-Reel

LM3671MFX-ADJ NOPB 3000 units, Tape-and-Reel

LM3671MF-ADJ 1000 units, Tape-and-Reel

LM3671MFX-ADJ 3000 units, Tape-and-Reel

1.2 LM3671MF-1.2 NOPB

SBPB

1000 units, Tape-and-Reel

LM3671MFX-1.2 NOPB 3000 units, Tape-and-Reel

LM3671MF-1.2 1000 units, Tape-and-Reel

LM3671MFX-1.2 3000 units, Tape-and-Reel

1.25 LM3671MF-1.25 NOPB

SDRB

1000 units, Tape-and-Reel

LM3671MFX-1.25 NOPB 3000 units, Tape-and-Reel

LM3671MF-1.25 1000 units, Tape-and-Reel

LM3671MFX-1.25 3000 units, Tape-and-Reel

1.375 LM3671MF-1.375 NOPB

SEDB

1000 units, Tape-and-Reel

LM3671MFX-1.375 NOPB 3000 units, Tape-and-Reel

LM3671MF-1.375 1000 units, Tape-and-Reel

LM3671MFX-1.375 3000 units, Tape-and-Reel

1.5 LM3671MF-1.5 NOPB

SBRB

1000 units, Tape-and-Reel

LM3671MFX-1.5 NOPB 3000 units, Tape-and-Reel

LM3671MF-1.5 1000 units, Tape-and-Reel

LM3671MFX-1.5 3000 units, Tape-and-Reel

1.6 LM3671MF-1.6 NOPB

SDUB

1000 units, Tape-and-Reel

LM3671MFX-1.6 NOPB 3000 units, Tape-and-Reel

LM3671MF-1.6 1000 units, Tape-and-Reel

LM3671MFX-1.6 3000 units, Tape-and-Reel

1.8 LM3671MF-1.8 NOPB

SBSB

1000 units, Tape-and-Reel

LM3671MFX-1.8 NOPB 3000 units, Tape-and-Reel

LM3671MF-1.8 1000 units, Tape-and-Reel

LM3671MFX-1.8 3000 units, Tape-and-Reel

1.875 LM3671MF-1.875 NOPB

SDVB

1000 units, Tape-and-Reel

LM3671MFX-1.875 NOPB 3000 units, Tape-and-Reel

LM3671MF-1.875 1000 units, Tape-and-Reel

LM3671MFX-1.875 3000 units, Tape-and-Reel

2.5 LM3671MF-2.5 NOPB

SJRB

1000 units, Tape-and-Reel

LM3671MFX-2.5 NOPB 3000 units, Tape-and-Reel

LM3671MF-2.5 1000 units, Tape-and-Reel

LM3671MFX-2.5 3000 units, Tape-and-Reel

2.8 LM3671MF-2.8 NOPB

SJSB

1000 units, Tape-and-Reel

LM3671MFX-2.8 NOPB 3000 units, Tape-and-Reel

LM3671MF-2.8 1000 units, Tape-and-Reel

LM3671MFX-2.8 3000 units, Tape-and-Reel

3.3 LM3671MF-3.3 NOPB

SJEB

1000 units, Tape-and-Reel

LM3671MFX-3.3 NOPB 3000 units, Tape-and-Reel

LM3671MF-3.3 1000 units, Tape-and-Reel

LM3671MFX-3.3 3000 units, Tape-and-Reel

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LM3671

Ordering Information (5-bump Micro SMD)

Voltage Option Order Number Spec Package Marking Supplied As

ADJ LM3671TL-ADJ NOPB

250 units, Tape-and-Reel

LM3671TLX-ADJ NOPB 3000 units, Tape-and-Reel

LM3671TL-ADJ 250 units, Tape-and-Reel

LM3671TLX-ADJ 3000 units, Tape-and-Reel

1.2 LM3671TL-1.2 NOPB

250 units, Tape-and-Reel

LM3671TLX-1.2 NOPB 3000 units, Tape-and-Reel

LM3671TL-1.2 250 units, Tape-and-Reel

LM3671TLX-1.2 3000 units, Tape-and-Reel

1.5 LM3671TL-1.5 NOPB

250 units, Tape-and-Reel

LM3671TLX-1.5 NOPB 3000 units, Tape-and-Reel

LM3671TL-1.5 250 units, Tape-and-Reel

LM3671TLX-1.5 3000 units, Tape-and-Reel

1.8 LM3671TL-1.8 NOPB

250 units, Tape-and-Reel

LM3671TLX-1.8 NOPB 3000 units, Tape-and-Reel

LM3671TL-1.8 250 units, Tape-and-Reel

LM3671TLX-1.8 3000 units, Tape-and-Reel

1.875 LM3671TL-1.875 NOPB

250 units, Tape-and-Reel

LM3671TLX-1.875 NOPB 3000 units, Tape-and-Reel

LM3671TL-1.875 250 units, Tape-and-Reel

LM3671TLX-1.875 3000 units, Tape-and-Reel

2.5 LM3671TL-2.5 NOPB

250 units, Tape-and-Reel

LM3671TLX-2.5 NOPB 3000 units, Tape-and-Reel

LM3671TL-2.5 250 units, Tape-and-Reel

LM3671TLX-2.5 3000 units, Tape-and-Reel

2.8 LM3671TL-2.8 NOPB

250 units, Tape-and-Reel

LM3671TLX-2.8 NOPB 3000 units, Tape-and-Reel

LM3671TL-2.8 250 units, Tape-and-Reel

LM3671TLX-2.8 3000 units, Tape-and-Reel

3.3 LM3671TL-3.3 NOPB

250 units, Tape-and-Reel

LM3671TLX-3.3 NOPB 3000 units, Tape-and-Reel

LM3671TL-3.3 250 units, Tape-and-Reel

LM3671TLX-3.3 3000 units, Tape-and-Reel

Ordering Information (6-Pin LLP)

Voltage Option Order Number Spec Package Marking Supplied As

1.2 LM3671LC-1.2 NOPB S39 1000 units, Tape-and-Reel

LM3671LCX-1.2 NOPB 4500 units, Tape-and-Reel

1.3 LM3671LC-1.3 NOPB S40 1000 units, Tape-and-Reel

LM3671LCX-1.3 NOPB 4500 units, Tape-and-Reel

1.6 LM3671LC-1.6 NOPB S41 1000 units, Tape-and-Reel

LM3671LCX-1.6 NOPB 4500 units, Tape-and-Reel

1.8 LM3671LC-1.8 NOPB S42 1000 units, Tape-and-Reel

LM3671LCX-1.8 NOPB 4500 units, Tape-and-Reel

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LM3671

Absolute Maximum Ratings (Note 1)

If Military/Aerospace specified devices are required,

please contact the National Semiconductor Sales Office/

Distributors for availability and specifications.

VIN Pin: Voltage to GND −0.2V to 6.0V

FB, SW, EN Pin: (GND−0.2V) to

(VIN + 0.2V)

Continuous Power Dissipation

(Note 3)

Internally Limited

Junction Temperature (TJ-MAX) +125°C

Storage Temperature Range −65°C to +150°C

Maximum Lead Temperature

(Soldering, 10 sec.)

260°C

ESD Rating (Note 4)

Human Body Model 2 kV

Machine Model 200V

Operating Ratings (Notes 1, 2)

Input Voltage Range (Note 10) 2.7V to 5.5V

Recommended Load Current 0mA to 600 mA

Junction Temperature (TJ) Range −30°C to +125°C

Ambient Temperature (TA) Range (Note

−30°C to +85°C

Thermal Properties

Junction-to-Ambient Thermal

Resistance (θJA) (SOT23-5) for 4

layer board (Note 6)

130°C/W

Junction-to-Ambient Thermal

Resistance (θJA) (Micro SMD) for 4

layer board (Note 6)

85°C/W

Junction-to-Ambient Thermal

Resistance (θJA) (COL) for 4 layer

board (Note 6)

165°C/W

Electrical Characteristics (Notes 2, 8, 9) Limits in standard typeface are for TJ = 25°C. Limits in boldface type

apply over the full operating ambient temperature range (−30°C ≤ TA ≤ +85°C). Unless otherwise noted, specifications apply to

the LM3671MF/TL/LC with VIN = EN = 3.6V

Symbol Parameter Condition Min Typ Max Units

VIN Input Voltage (Note 10) 2.7 5.5 V

VFB Feedback Voltage (Fixed) MF PWM mode (Note 12) -4 +4 %

Feedback Voltage (Fixed) TL -2.5 +2.5

Feedback Voltage (Fixed) LC -4 +4

Feedback Voltage (ADJ) MF

(Note 11)

PWM mode (Note 12) -4 +4 %

Feedback Voltage (ADJ) TL -2.5 +2.5

Line Regulation 2.7V ≤ VIN ≤ 5.5V

IO = 10 mA

0.031 %/V

Load Regulation 100 mA ≤ IO ≤ 600 mA

VIN= 3.6V

0.0013 %/mA

VREF Internal Reference Voltage 0.5 V

ISHDN Shutdown Supply Current EN = 0V 0.01 1µA

IQDC Bias Current into VIN No load, device is not switching (FB

forced higher than programmed

output voltage)

16 35 µA

RDSON (P) Pin-Pin Resistance for PFET VIN= VGS= 3.6V 380 500 mΩ

RDSON (N) Pin-Pin Resistance for NFET VIN= VGS= 3.6V 250 400 mΩ

ILIM Switch Peak Current Limit Open Loop (Note 7) 830 1020 1150 mA

VIH Logic High Input 1.0 V

VIL Logic Low Input 0.4 V

IEN Enable (EN) Input Current 0.01 1µA

FOSC Internal Oscillator Frequency PWM Mode (Note 12) 1.6 22.6 MHz

Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions under which operation of

the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see

the Electrical Characteristics tables.

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LM3671

Note 2: All voltages are with respect to the potential at the GND pin.

Note 3: Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ= 150°C (typ.) and disengages at

TJ= 130°C (typ.).

Note 4: The Human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. The machine model is a 200 pF capacitor discharged

directly into each pin. MIL-STD-883 3015.7

Note 5: In Applications where high power dissipation and/or poor package resistance is present, the maximum ambient temperature may have to be derated.

Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX), the maximum power dissipation of the device in

the application (PD-MAX) and the junction to ambient thermal resistance of the package (θJA) in the application, as given by the following equation:TA-MAX= TJ-MAX

− (θJAx PD-MAX). Refer to Dissipation rating table for PD-MAX values at different ambient temperatures.

Note 6: Junction to ambient thermal resistance is highly application and board layout dependent. In applications where high power dissipation exists, special care

must be given to thermal dissipation issues in board design. Specified value of 130 °C/W for SOT23-5 is based on a 4 layer, 4" x 3", 2/1/1/2 oz. Cu board as per

JEDEC standards is used.

Note 7: Refer to datasheet curves for closed loop data and its variation with regards to supply voltage and temperature. Electrical Characteristic table reflects

open loop data (FB=0V and current drawn from SW pin ramped up until cycle by cycle current limit is activated). Closed loop current limit is the peak inductor

current measured in the application circuit by increasing output current until output voltage drops by 10%.

Note 8: Min and Max limits are guaranteed by design, test or statistical analysis. Typical numbers are not guaranteed, but do represent the most likely norm.

Note 9: The parameters in the electrical characteristic table are tested at VIN= 3.6V unless otherwise specified. For performance over the input voltage range

refer to datasheet curves.

Note 10: The input voltage range recommended for ideal applications performance for the specified output voltages are given below:

VIN = 2.7V to 4.5V for 1.1V ≤ VOUT < 1.5V

VIN = 2.7V to 5.5V for 1.5V ≤ VOUT < 1.8V

VIN = (VOUT+ VDROPOUT) to 5.5V for 1.8V ≤ VOUT ≤ 3.3V

where VDROPOUT = ILOAD *( RDSON, PFET + RINDUCTOR)

Note 11: ADJ version is configured to 1.5V output. For ADJ output version:

VIN = 2.7V to 4.5V for 0.90V ≤ VOUT < 1.1V

VIN = 2.7V to 5.5V for 1.1V ≤ VOUT < 3.3V

Note 12: Test condition: for VOUT less than 2.5V, VIN = 3.6V; for VOUT greater than or equal to 2.5V, VIN = VOUT+ 1V.

Dissipation Rating Table

θJA TA≤ 25°C

Power Rating

TA= 60°C

Power Rating

TA= 85°C

Power Rating

130°C/W (4 layer board)

SOT23-5

770mW 500mW 310mW

85°C/W (4 layer board) 5-bump

Micro SMD

1179mW 765mW 470mW

165°C/W (4 layer board) 6-pin

LLP

606mW 394mW 242mW

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LM3671

Block Diagram

20108418

FIGURE 6. Simplified Functional Diagram

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LM3671

Typical Performance Characteristics

LM3671MF/TL/LC, Circuit of Figure 1, VIN= 3.6V, VOUT= 1.5V, TA= 25°C, unless otherwise noted.

Quiescent Supply Current vs. Supply Voltage

20108404

Shutdown Current vs. Temp

20108405

Feedback Bias Current vs. Temp

20108440

Switching Frequency vs. Temperature

20108447

RDS(ON) vs. Temperature

20108433

Open/Closed Loop Current Limit vs. Temperature

20108448

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LM3671

Output Voltage vs. Supply Voltage

(VOUT = 1.5V)

20108429

Output Voltage vs. Supply Voltage

(VOUT = 2.5V)

20108458

Output Voltage vs. Temperature

(VOUT = 1.5V)

20108406

Output Voltage vs. Temperature

(VOUT = 2.5V)

20108459

Output Voltage vs. Output Current

(VOUT = 1.5V)

20108407

Output Voltage vs. Output Current

(VOUT = 2.5V)

20108460

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LM3671

Efficiency vs. Output Current

(VOUT = 1.5V, L= 2.2 µH)

20108408

Efficiency vs. Output Current

(VOUT = 1.8V, L= 2.2 µH)

20108409

Efficiency vs. Output Current

(VOUT = 2.5V, L= 2.2 µH)

20108441

Efficiency vs. Output Current

(VOUT = 3.3V, L= 2.2 µH)

20108442

Line Transient Response

VOUT = 1.5V (PWM Mode)

20108412

Line Transient Response

VOUT = 2.5V (PWM Mode)

20108450

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LM3671

Load Transient Response

VOUT = 1.5V (PWM Mode)

20108413

Load Transient Response

VOUT = 2.5V (PWM Mode)

20108451

Load Transient Response (VOUT = 1.5V)

(PFM Mode 0.5mA to 50mA)

20108414

Load Transient Response (VOUT = 1.5V)

(PFM Mode 50mA to 0.5mA)

20108415

Load Transient Response (VOUT = 2.5V)

(PFM Mode 0.5mA to 50mA)

20108452

Load Transient Response (VOUT = 2.5V)

(PFM Mode 50mA to 0.5mA)

20108453

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LM3671

Mode Change by Load Transients

VOUT = 1.5V (PFM to PWM)

20108420

Mode Change by Load Transients

VOUT = 1.5V (PWM to PFM)

20108421

Mode Change by Load Transients

VOUT = 2.5V (PFM to PWM)

20108454

Mode Change by Load Transients

VOUT = 2.5V (PWM to PFM)

20108455

Start Up into PWM Mode

VOUT = 1.5V (Output Current= 300mA)

20108424

Start Up into PWM Mode

VOUT = 2.5V (Output Current= 300mA)

20108456

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LM3671

Start Up into PFM Mode

VOUT = 1.5V (Output Current= 1mA)

20108419

Start Up into PFM Mode

VOUT = 2.5V (Output Current= 1mA)

20108457

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LM3671

Operation Description

DEVICE INFORMATION

The LM3671, a high efficiency step down DC-DC switching

buck converter, delivers a constant voltage from a single Li-

Ion battery and input voltage rails from 2.7V to 5.5V to

portable devices such as cell phones and PDAs. Using a volt-

age mode architecture with synchronous rectification, the

LM3671 has the ability to deliver up to 600 mA depending on

the input voltage, output voltage, ambient temperature and

the inductor chosen.

There are three modes of operation depending on the current

required - PWM (Pulse Width Modulation), PFM (Pulse Fre-

quency Modulation), and shutdown. The device operates in

PWM mode at load current of approximately 80 mA or higher.

Lighter load current cause the device to automatically switch

into PFM for reduced current consumption (IQ = 16 µA typ)

and a longer battery life. Shutdown mode turns off the device,

offering the lowest current consumption

(ISHUTDOWN = 0.01 µA typ).

Additional features include soft-start, under voltage protec-

tion, current overload protection, and thermal shutdown pro-

tection. As shown in Figure 1, only three external power

components are required for implementation.

The part uses an internal reference voltage of 0.5V. It is rec-

ommended to keep the part in shutdown until the input voltage

is 2.7V or higher.

CIRCUIT OPERATION

During the first portion of each switching cycle, the control

block in the LM3671 turns on the internal PFET switch. This

allows current to flow from the input through the inductor to

the output filter capacitor and load. The inductor limits the

current to a ramp with a slope of (VIN–VOUT)/L, by storing en-

ergy in a magnetic field.

During the second portion of each cycle, the controller turns

the PFET switch off, blocking current flow from the input, and

then turns the NFET synchronous rectifier on. The inductor

draws current from ground through the NFET to the output

filter capacitor and load, which ramps the inductor current

down with a slope of - VOUT/L.

The output filter stores charge when the inductor current is

high, and releases it when inductor current is low, smoothing

the voltage across the load.

The output voltage is regulated by modulating the PFET

switch on time to control the average current sent to the load.

The effect is identical to sending a duty-cycle modulated rect-

angular wave formed by the switch and synchronous rectifier

at the SW pin to a low-pass filter formed by the inductor and

output filter capacitor. The output voltage is equal to the av-

erage voltage at the SW pin.

PWM OPERATION

During PWM operation the converter operates as a voltage-

mode controller with input voltage feed forward. This allows

the converter to achieve good load and line regulation. The

DC gain of the power stage is proportional to the input voltage.

To eliminate this dependence, feed forward inversely propor-

tional to the input voltage is introduced.

While in PWM mode, the output voltage is regulated by

switching at a constant frequency and then modulating the

energy per cycle to control power to the load. At the beginning

of each clock cycle the PFET switch is turned on and the in-

ductor current ramps up until the comparator trips and the

control logic turns off the switch. The current limit comparator

can also turn off the switch in case the current limit of the

PFET is exceeded. Then the NFET switch is turned on and

the inductor current ramps down. The next cycle is initiated

by the clock turning off the NFET and turning on the PFET.

20108423

FIGURE 7. Typical PWM Operation

Internal Synchronous Rectification

While in PWM mode, the LM3671 uses an internal NFET as

a synchronous rectifier to reduce rectifier forward voltage

drop and associated power loss. Synchronous rectification

provides a significant improvement in efficiency whenever the

output voltage is relatively low compared to the voltage drop

across an ordinary rectifier diode.

Current Limiting

A current limit feature allows the LM3671 to protect itself and

external components during overload conditions. PWM mode

implements current limiting using an internal comparator that

trips at 1020 mA (typ.). If the output is shorted to ground the

device enters a timed current limit mode where the NFET is

turned on for a longer duration until the inductor current falls

below a low threshold. This allows the inductor current more

time to decay, thereby preventing runaway.

PFM OPERATION

At very light load, the converter enters PFM mode and oper-

ates with reduced switching frequency and supply current to

maintain high efficiency.

The part automatically transitions into PFM mode when either

of two conditions occurs for a duration of 32 or more clock

cycles:

A. The NFET current reaches zero.

B. The peak PMOS switch current drops below the IMODE

level, (Typically IMODE < 30mA + VIN/42 Ω ).

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LM3671

20108422

FIGURE 8. Typical PFM Operation

During PFM operation, the converter positions the output volt-

age slightly higher than the nominal output voltage during

PWM operation, allowing additional headroom for voltage

drop during a load transient from light to heavy load. The PFM

comparators sense the output voltage via the feedback pin

and control the switching of the output FETs such that the

output voltage ramps between ~0.6% and ~1.7% above the

nominal PWM output voltage. If the output voltage is below

the ‘high’ PFM comparator threshold, the PMOS power switch

is turned on. It remains on until the output voltage reaches the

‘high’ PFM threshold or the peak current exceeds the IPFM

level set for PFM mode. The typical peak current in PFM mode

is: IPFM = 112mA + VIN/27Ω .

Once the PMOS power switch is turned off, the NMOS power

switch is turned on until the inductor current ramps to zero.

When the NMOS zero-current condition is detected, the

NMOS power switch is turned off. If the output voltage is be-

low the ‘high’ PFM comparator threshold (see Figure 9), the

PMOS switch is again turned on and the cycle is repeated

until the output reaches the desired level. Once the output

reaches the ‘high’ PFM threshold, the NMOS switch is turned

on briefly to ramp the inductor current to zero and then both

output switches are turned off and the part enters an ex-

tremely low power mode. Quiescent supply current during this

‘sleep’ mode is 16µA (typ.), which allows the part to achieve

high efficiency under extremely light load conditions.

If the load current should increase during PFM mode (see

Figure 9) causing the output voltage to fall below the ‘low2’

PFM threshold, the part will automatically transition into fixed-

frequency PWM mode. When VIN =2.7V the part transitions

from PWM to PFM mode at ~35mA output current and from

PFM to PWM mode at ~85mA , when VIN=3.6V, PWM to PFM

transition happens at ~50mA and PFM to PWM transition

happens at ~100mA, when VIN =4.5V, PWM to PFM transition

happens at ~65mA and PFM to PWM transition happens at

~115mA.

20108403

FIGURE 9. Operation in PFM Mode and Transfer to PWM Mode

SHUTDOWN MODE

Setting the EN input pin low (<0.4V) places the LM3671 in

shutdown mode. During shutdown the PFET switch, NFET

switch, reference, control and bias circuitry of the LM3671 are

turned off. Setting EN high (>1.0V) enables normal operation.

It is recommended to set EN pin low to turn off the LM3671

during system power up and undervoltage conditions when

the supply is less than 2.7V. Do not leave the EN pin floating.

SOFT START

The LM3671 has a soft-start circuit that limits in-rush current

during start-up. During start-up the switch current limit is in-

creased in steps. Soft start is activated only if EN goes from

logic low to logic high after Vin reaches 2.7V. Soft start is im-

plemented by increasing switch current limit in steps of 70mA,

140mA, 280mA and 1020mA (typical switch current limit). The

start-up time thereby depends on the output capacitor and

www.national.com 16

LM3671

load current demanded at start-up. Typical start-up times with

a 10µF output capacitor and 300mA load is 400 µs and with

1mA load is 275µs.

LDO - LOW DROP OUT OPERATION

The LM3671-ADJ can operate at 100% duty cycle (no switch-

ing; PMOS switch completely on) for low drop out support of

the output voltage. In this way the output voltage will be con-

trolled down to the lowest possible input voltage. When the

device operates near 100% duty cycle, output voltage ripple

is approximately 25 mV.

The minimum input voltage needed to support the output volt-

age is

VIN, MIN = ILOAD * (RDSON, PFET + RINDUCTOR) + VOUT

•ILOAD Load current

•RDSON, PFET Drain to source resistance of PFET

switch in the triode region

•RINDUCTOR Inductor resistance

Application Information

OUTPUT VOLTAGE SELECTION FOR LM3671-ADJ

The output voltage of the adjustable parts can be pro-

grammed through the resistor network connected from VOUT

to FB, then to GND. VOUT is adjusted to make the voltage at

FB equal to 0.5V. The resistor from FB to GND (R2) should

be 200 kΩ to keep the current drawn through this network well

below the 16 µA quiescent current level (PFM mode) but large

enough that it is not susceptible to noise. If R2 is 200 kΩ, and

VFB is 0.5V, the current through the resistor feedback network

will be 2.5 µA. The output voltage of the adjustable parts

ranges from 1.1V to 3.3V.

The formula for output voltage selection is:

•VOUT: output voltage (volts)

•VFB : feedback voltage = 0.5V

•R1: feedback resistor from VOUT to FB

•R2: feedback resistor from FB to GND

For any output voltage greater than or equal to 1.1V, a zero

must be added around 45 kHz for stability. The formula for

calculation of C1 is:

For output voltages higher than 2.5V, a pole must be placed

at 45 kHz as well. If the pole and zero are at the same fre-

quency the formula for calculation of C2 is:

The formula for location of zero and pole frequency created

by adding C1 and C2 is given below. By adding C1, a zero as

well as a higher frequency pole is introduced.

See the "LM3671-ADJ configurations for various VOUT" table.

17 www.national.com

LM3671

LM3671-ADJ Configurations For Various VOUT (Circuit of Figure 2)

(Refer to Note 11 for VIN requirements)

VOUT(V) R1(kΩ) R2 (kΩ) C1 (pF) C2 (pF) L (µH) CIN (µF) COUT(µF)

0.90 160 200 22 none 2.2 4.7 10

1.1 240 200 15 none 2.2 4.7 10

1.2 280 200 12 none 2.2 4.7 10

1.3 320 200 12 none 2.2 4.7 10

1.5 357 178 10 none 2.2 4.7 10

1.6 442 200 8.2 none 2.2 4.7 10

1.7 432 178 8.2 none 2.2 4.7 10

1.8 464 178 8.2 none 2.2 4.7 10

1.875 523 191 6.8 none 2.2 4.7 10

2.5 402 100 8.2 none 2.2 4.7 10

2.8 464 100 8.2 33 2.2 4.7 10

3.3 562 100 6.8 33 2.2 4.7 10

INDUCTOR SELECTION

There are two main considerations when choosing an induc-

tor; the inductor should not saturate, and the inductor current

ripple should be small enough to achieve the desired output

voltage ripple. Different saturation current rating specifica-

tions are followed by different manufacturers so attention

must be given to details. Saturation current ratings are typi-

cally specified at 25°C. However, ratings at the maximum

ambient temperature of application should be requested from

the manufacturer. The minimum value of inductance to

guarantee good performance is 1.76µH at ILIM (typ.) dc

current over the ambient temperature range. Shielded in-

ductors radiate less noise and should be preferred.

There are two methods to choose the inductor saturation cur-

rent rating.

Method 1:

The saturation current should be greater than the sum of the

maximum load current and the worst case average to peak

inductor current. This can be written as

•IRIPPLE: average to peak inductor current

•IOUTMAX: maximum load current (600mA)

•VIN: maximum input voltage in application

•L : min inductor value including worst case tolerances

(30% drop can be considered for method 1)

•f : minimum switching frequency (1.6Mhz)

•VOUT: output voltage

Method 2:

A more conservative and recommended approach is to

choose an inductor that has a saturation current rating greater

than the maximum current limit of 1150mA.

A 2.2 µH inductor with a saturation current rating of at least

1150 mA is recommended for most applications.The

inductor’s resistance should be less than 0.3Ω for good effi-

ciency. Table 1 lists suggested inductors and suppliers. For

low-cost applications, an unshielded bobbin inductor could be

considered. For noise critical applications, a toroidal or shield-

ed-bobbin inductor should be used. A good practice is to lay

out the board with overlapping footprints of both types for de-

sign flexibility. This allows substitution of a low-noise shielded

inductor, in the event that noise from low-cost bobbin models

is unacceptable.

INPUT CAPACITOR SELECTION

A ceramic input capacitor of 4.7 µF, 6.3V is sufficient for most

applications. Place the input capacitor as close as possible to

the VIN pin of the device. A larger value may be used for im-

proved input voltage filtering. Use X7R or X5R types; do not

use Y5V. DC bias characteristics of ceramic capacitors must

be considered when selecting case sizes like 0805 and 0603.

The minimum input capacitance to guarantee good per-

formance is 2.2µF at 3V dc bias; 1.5µF at 5V dc bias

including tolerances and over ambient temperature

range. The input filter capacitor supplies current to the PFET

switch of the LM3671 in the first half of each cycle and re-

duces voltage ripple imposed on the input power source. A

ceramic capacitor’s low ESR provides the best noise filtering

of the input voltage spikes due to this rapidly changing cur-

rent. Select a capacitor with sufficient ripple current rating.

The input current ripple can be calculated as:

www.national.com 18

LM3671

TABLE 1. Suggested Inductors and Their Suppliers

Model Vendor Dimensions LxWxH(mm) D.C.R (max)

DO3314-222MX Coilcraft 3.3 x 3.3 x 1.4 200 mΩ

LPO3310-222MX Coilcraft 3.3 x 3.3 x 1.0 150 mΩ

ELL5GM2R2N Panasonic 5.2 x 5.2 x 1.5 53 mΩ

CDRH2D14NP-2R2NC Sumida 3.2 x 3.2 x 1.55 94 mΩ

OUTPUT CAPACITOR SELECTION

A ceramic output capacitor of 10 µF, 6.3V is sufficient for most

applications. Use X7R or X5R types; do not use Y5V. DC bias

characteristics of ceramic capacitors must be considered

when selecting case sizes like 0805 and 0603. DC bias char-

acteristics vary from manufacturer to manufacturer and dc

bias curves should be requested from them as part of the ca-

pacitor selection process.

The minimum output capacitance to guarantee good per-

formance is 5.75µF at 1.8V dc bias including tolerances

and over ambient temperature range. The output filter ca-

pacitor smoothes out current flow from the inductor to the

load, helps maintain a steady output voltage during transient

load changes and reduces output voltage ripple. These ca-

pacitors must be selected with sufficient capacitance and

sufficiently low ESR to perform these functions.

The output voltage ripple is caused by the charging and dis-

charging of the output capacitor and by the RESR and can be

calculated as:

Voltage peak-to-peak ripple due to capacitance can be ex-

pressed as follow:

Voltage peak-to-peak ripple due to ESR can be expressed as

follow:

VPP-ESR = (2 * IRIPPLE) * RESR

Because these two components are out of phase the rms (root

mean squared) value can be used to get an approximate val-

ue of peak-to-peak ripple.

The peak-to-peak ripple voltage, rms value can be expressed

as follow:

Note that the output voltage ripple is dependent on the induc-

tor current ripple and the equivalent series resistance of the

output capacitor (RESR).

The RESR is frequency dependent (as well as temperature

dependent); make sure the value used for calculations is at

the switching frequency of the part.

TABLE 2. Suggested Capacitors and Their Suppliers

Model Type Vendor Voltage Rating Case Size

Inch (mm)

4.7 µF for CIN

C2012X5R0J475K Ceramic, X5R TDK 6.3V 0805 (2012)

JMK212BJ475K Ceramic, X5R Taiyo-Yuden 6.3V 0805 (2012)

GRM21BR60J475K Ceramic, X5R Murata 6.3V 0805 (2012)

C1608X5R0J475K Ceramic, X5R TDK 6.3V 0603 (1608)

10 µF for COUT

GRM21BR60J106K Ceramic, X5R Murata 6.3V 0805 (2012)

JMK212BJ106K Ceramic, X5R Taiyo-Yuden 6.3V 0805 (2012)

C2012X5R0J106K Ceramic, X5R TDK 6.3V 0805 (2012)

C1608X5R0J106K Ceramic, X5R TDK 6.3V 0603 (1608)

Micro SMD PACKAGE ASSEMBLY AND USE

Use of the Micro SMD package requires specialized board

layout, precision mounting and careful re-flow techniques, as

detailed in National Semiconductor Application Note 1112.

Refer to the section "Surface Mount Technology (SMD) As-

sembly Considerations". For best results in assembly, align-

ment ordinals on the PC board should be used to facilitate

placement of the device. The pad style used with Micro SMD

package must be the NSMD (non-solder mask defined) type.

This means that the solder-mask opening is larger than the

pad size. This prevents a lip that otherwise forms if the solder-

mask and pad overlap, from holding the device off the surface

of the board and interfering with mounting. See Application

Note 1112 for specific instructions how to do this. The 5-Bump

package used for LM3671 has 300 micron solder balls and

requires 10.82 mils pads for mounting on the circuit board.

The trace to each pad should enter the pad with a 90° entry

angle to prevent debris from being caught in deep corners.

Initially, the trace to each pad should be 7 mil wide, for a sec-

tion approximately 7 mil long or longer, as a thermal relief.

Then each trace should neck up or down to its optimal width.

The important criteria is symmetry. This ensures the solder

bumps on the LM3671 re-flow evenly and that the device sol-

ders level to the board. In particular, special attention must be

paid to the pads for bumps A1 and A3, because VIN and GND

19 www.national.com

LM3671

are typically connected to large copper planes, inadequate

thermal relief can result in late or inadequate re-flow of these

bumps.

The Micro SMD package is optimized for the smallest possi-

ble size in applications with red or infrared opaque cases.

Because the Micro SMD package lacks the plastic encapsu-

lation characteristic of larger devices, it is vulnerable to light.

Backside metallization and/or epoxy coating, along with front-

side shading by the printed circuit board, reduce this sensi-

tivity. However, the package has exposed die edges. In

particular, Micro SMD devices are sensitive to light, in the red

and infrared range, shining on the package’s exposed die

edges.

BOARD LAYOUT CONSIDERATIONS

PC board layout is an important part of DC-DC converter de-

sign. Poor board layout can disrupt the performance of a DC-

DC converter and surrounding circuitry by contributing to EMI,

ground bounce, and resistive voltage loss in the traces. These

can send erroneous signals to the DC-DC converter IC, re-

sulting in poor regulation or instability.

Good layout for the LM3671 can be implemented by following

a few simple design rules below. Refer to Figure 9 for top layer

board layout.

1. Place the LM3671, inductor and filter capacitors close

together and make the traces short. The traces between

these components carry relatively high switching

currents and act as antennas. Following this rule reduces

radiated noise. Special care must be given to place the

input filter capacitor very close to the VIN and GND pin.

2. Arrange the components so that the switching current

loops curl in the same direction. During the first half of

each cycle, current flows from the input filter capacitor

through the LM3671 and inductor to the output filter

capacitor and back through ground, forming a current

loop. In the second half of each cycle, current is pulled

up from ground through the LM3671 by the inductor to

the output filter capacitor and then back through ground

forming a second current loop. Routing these loops so

the current curls in the same direction prevents magnetic

field reversal between the two half-cycles and reduces

radiated noise.

3. Connect the ground pins of the LM3671 and filter

capacitors together using generous component-side

copper fill as a pseudo-ground plane. Then, connect this

to the ground-plane (if one is used) with several vias. This

reduces ground-plane noise by preventing the switching

currents from circulating through the ground plane. It also

reduces ground bounce at the LM3671 by giving it a low-

impedance ground connection.

4. Use wide traces between the power components and for

power connections to the DC-DC converter circuit. This

reduces voltage errors caused by resistive losses across

the traces.

5. Route noise sensitive traces, such as the voltage

feedback path, away from noisy traces between the

power components. The voltage feedback trace must

remain close to the LM3671 circuit and should be direct

but should be routed opposite to noisy components. This

reduces EMI radiated onto the DC-DC converter’s own

voltage feedback trace. A good approach is to route the

feedback trace on another layer and to have a ground

plane between the top layer and layer on which the

feedback trace is routed. In the same manner for the

adjustable part it is desired to have the feedback dividers

on the bottom layer.

6. Place noise sensitive circuitry, such as radio IF blocks,

away from the DC-DC converter, CMOS digital blocks

and other noisy circuitry. Interference with noise-

sensitive circuitry in the system can be reduced through

distance.

In mobile phones, for example, a common practice is to place

the DC-DC converter on one corner of the board, arrange the

CMOS digital circuitry around it (since this also generates

noise), and then place sensitive preamplifiers and IF stages

on the diagonally opposing corner. Often, the sensitive cir-

cuitry is shielded with a metal pan and power to it is post-

regulated to reduce conducted noise, using low-dropout

linear regulators.

20108449

FIGURE 10. Top layer board layout for SOT23-5

www.national.com 20

LM3671

21 www.national.com

LM3671

Physical Dimensions inches (millimeters) unless otherwise noted

5-Lead SOT23-5 Package

NS Package Number MF05A

5-Bump (Large) Micro SMD Package, 0.5mm Pitch

NS Package Number TLA05CBA

The dimensions for X1, X2, and X3 are as given:

X1 = 1.057 mm +/- 0.030mm

X2 = 1.387 mm +/- 0.030mm

X3 = 0.600 mm +/- 0.075mm

www.national.com 22

LM3671

6-Pin LLP Package, 0.5mm Pitch

NS Package Number LCA06B

The dimensions for X1, X2, and X3 are as given:

X1 = 2.000 mm +/- 0.100mm

X2 = 2.000 mm +/- 0.100mm

X3 = 0.600 mm +/- 0.075mm

23 www.national.com

LM3671

Notes

LM3671 2MHz, 600mA Step-Down DC-DC Converter

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