DATA SH EET
Product data sheet
Supersedes data of 2001 Aug 30 2001 Nov 07
DISCRETE SEMICONDUCTORS
BC847BVN
NPN/PNP general purpose
transistor
M3D74
4
2001 Nov 07 2
NXP Semiconductors Product data sheet
NPN/PNP general purpose transistor BC847BVN
FEATURES
300 mW total powe r dissipation
Very small 1.6 mm x 1.2 mm ultra thin package
Excellent coplanarity due to s tr aight leads
Replaces two SC-75/SC -89 packaged transisto rs on
same PCB area
Reduced required PCB area
Reduced pick and place costs.
APPLICATIONS
General purpose switc hing and amplification
Switch mode power supply complementary MOSFET
driver
Complementary driver for audio a m plifiers.
DESCRIPTION
NPN/PNP transistor pair in a SOT666 plastic package.
MARKING
PINNING
TYPE NUMBER MARKING CODE
BC847BVN 13
PIN DESCRIPTION
1, 4 emitter TR1; TR2
2, 5 base TR1; TR2
6, 3 collector TR1; TR2
handbook, halfpage
MAM443 132
TR1 TR2
64
5
123
46 5
Top view
Fig.1 Simplified outline (SOT666) and sym bol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
Note
1. Transistor mounted on an FR4 printed- circuit board.
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
Per transistor; for the PNP transistor with negative polarity
VCBO collector-base volta ge open emitter 50 V
VCEO collector-emitter voltage open base 45 V
VEBO emitter-base voltage open collector 5 V
ICcollector current (DC) 100 mA
ICM peak collector current 200 mA
IBM peak base current 200 mA
Ptot total power dissipation Tamb 25 °C; note 1 200 mW
Tstg storage temperature 65 +150 °C
Tjjunction temperature 150 °C
Tamb operating ambient temperature 65 +150 °C
Per device
Ptot total power dissipation Tamb 25 °C; note 1 300 mW
2001 Nov 07 3
NXP Semiconductors Pr oduct data shee t
NPN/PNP general purpose transistor BC847BVN
THERMAL CHARACTE RISTICS
Notes
1. Transistor mounted on an FR4 printed- circuit board.
2. The only recommended soldering is reflow soldering.
CHARACTERISTICS
Tamb = 25 °C unless otherwise specified.
Note
1. Pulse test: tp 300 μs; δ 0.02.
SYMBOL PARAMETER CONDITIONS VALUE UNIT
Rth j-a thermal resistance from junction to ambient notes 1 and 2 416 K/W
SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Per transistor; for the PNP transistor with negative polarity
ICBO collector-base cut-off current VCB = 30 V; IE = 0 −−15 nA
VCB = 30 V; IE = 0; Tj = 150 °C−−5μA
IEBO emitter-base cu t-off current VEB = 5 V; IC = 0 −−100 nA
hFE DC current gain VCE = 5 V; IC = 2 mA 200 450
VCEsat collector-emitter saturation
voltage IC = 10 mA; IB = 0.5 mA −−100 mV
IC = 100 mA; IB = 5 mA; note 1 −−300 mV
VBEsat collector-emitter saturation
voltage IC = 10 mA; IB = 0.5 mA 755 mV
fTtransition frequen c y IC = 10 mA; VCE = 5 V; f = 100 MHz 100 −−MHz
NPN transistor
VBE base-emitter turn-on voltage VCE = 5 V; IC = 2 mA 580 655 700 mV
Cccollector capacitance VCB = 10 V; IE = Ie = 0; f = 1MHz −−1.5 pF
Ceemitter cap a citance VEB = 500 mV; IC = Ic = 0; f = 1MHz 11 pF
PNP transistor
VBE base-emitter turn-on voltage VCE = 5 V; IC = 2 mA 600 655 750 mV
Cccollector capacitance VCB = 10 V; IC = Ic = 0; f = 1MHz −−2.2 pF
Ceemitter cap a citance VEB = 500 mV; IE = Ie = 0; f = 1MHz 10 pF
2001 Nov 07 4
NXP Semiconductors Pr oduct data shee t
NPN/PNP general purpose transistor BC847BVN
handbook, halfpage
0
400
600
200
MLD703
101110 I
C
(mA)
hFE
102103
(1)
(3)
(2)
Fig.2 DC current gain as a fu nction of collector
current: ty pical values.
TR1 (NPN); VCE = 5 V.
(1) Tamb = 150 °C.
(2) Tamb = 25 °C.
(3) Tamb = 55 °C.
handbook, halfpage
200
1200
400
600
800
1000
MLD704
1021011IC (mA)
VBE
mV
10 102103
(3)
(2)
(1)
Fig.3 Base-emitter voltage as a function of
collector current; typical values.
TR1 (NPN); VCE = 5 V.
(1) Tamb = 55 °C.
(2) Tamb = 25 °C.
(3) Tamb = 150 °C.
handbook, halfpage
104
103
102
10
MLD705
101110 IC (mA)
VCEsat
(mV)
102103
(2)
(1)
(3)
Fig.4 Collector-emitter saturation voltage as a
function of collector current: typical values.
TR1 (NPN); IC/IB = 20.
(1) Tamb = 150 °C.
(2) Tamb = 25 °C.
(3) Tamb = 55 °C.
handbook, halfpage
200
1200
400
600
800
1000
MLD706
1101IC (mA)
VBEsat
(mV)
10 102103
(1)
(3)
(2)
Fig.5 Base-emitter saturation v oltage as a
function of collector current.
TR1 (NPN); IC/IB = 20.
(1) Tamb = 55 °C.
(2) Tamb = 25 °C.
(3) Tamb = 150 °C.
2001 Nov 07 5
NXP Semiconductors Pr oduct data shee t
NPN/PNP general purpose transistor BC847BVN
handbook, halfpage
0
1000
200
400
600
800
MLD699
102101
(1)
1IC (mA)
hFE
10 102103
(2)
(3)
Fig.6 DC current gain as a fu nction of collector
current: ty pical values.
TR2 (PNP); VCE = 5 V.
(1) Tamb = 150 °C.
(2) Tamb = 25 °C.
(3) Tamb = 55 °C.
handbook, halfpage
200
1200
400
600
800
1000
MLD700
102101
(1)
1IC (mA)
VBE
mV
10 102103
(3)
(2)
Fig.7 Base-emitter voltage as a function of
collector current; typical values.
TR2 (PNP); VCE = 5 V.
(1) Tamb = 55 °C.
(2) Tamb = 25 °C.
(3) Tamb = 150 °C.
handbook, halfpage
104
103
102
10
MLD701
101110 IC (mA)
VCEsat
(mV)
102103
(1)
(2)
(3)
Fig.8 Collector-emitter saturation voltage as a
function of collector current: typical values.
TR2 (PNP); IC/IB = 20.
(1) Tamb = 150 °C.
(2) Tamb = 25 °C.
(3) Tamb = 55 °C.
handbook, halfpage
200
1200
400
600
800
1000
MLD702
1101IC (mA)
VBEsat
(mV)
10 102103
(1)
(3)
(2)
Fig.9 Base-emitter saturation v oltage as a
function of collector current.
TR2 (PNP); IC/IB = 20.
(1) Tamb = 55 °C.
(2) Tamb = 25 °C.
(3) Tamb = 150 °C.
2001 Nov 07 6
NXP Semiconductors Pr oduct data shee t
NPN/PNP general purpose transistor BC847BVN
PACKAGE OUTLINE
UNIT bpcDE e1HELpw
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
01-01-04
01-08-27
IEC JEDEC EIAJ
mm 0.27
0.17 0.18
0.08 1.7
1.5 1.3
1.1 0.5
e
1.0 1.7
1.5 0.1
y
0.1
DIMENSIONS (mm are the original dimensions)
0.3
0.1
SOT666
bp
pin 1 index
D
e1
e
A
Lp
detail X
HE
E
A
S
0 1 2 mm
scale
A
0.6
0.5
c
X
123
456
Plastic surface mounted package; 6 leads SOT66
6
YS
wMA
2001 Nov 07 7
NXP Semiconductors Pr oduct data shee t
NPN/PNP general purpose transistor BC847BVN
DATA SHEET STATUS
Notes
1. Please consult the most recently issued document befor e initiating or co mpleting a design.
2. The product s ta tus of device(s) described in this do cument may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
DOCUMENT
STATUS(1) PRODUCT
STATUS(2) DEFINITION
Objective data sheet Development This document contains data from the objective specification for pro duct
development.
Preliminary data sheet Qualification This document contains data from the preliminary specification.
Product data sheet Production T his document contains the produc t s pecification.
DISCLAIMERS
General Information in this document is believed to be
accurate and reliable . H ow ev er, NXP Semiconductors
does not give any representations or warranties,
expressed or implied, as to the accuracy or completeness
of such information and shall have no liability for the
consequenc es of use of such informa tio n.
Right to make changes NXP Semiconductors
reserves the right to make changes to informa tion
published in this doc ument, including without limitation
specifications and product descriptions, at any time and
without notice. This document supersedes and replaces all
information supplied prior to the publication hereo f.
Suitability for use NXP Semiconductors products are
not designed, au thorized or warran ted to be suitable for
use in medical, military, aircraft, space or life support
equipment, nor in applications where failure or malfunction
of an NXP Semiconductors product can reasonably be
expected to result in pe rs onal injury, death or seve re
property or environmental damage. NXP Semiconductors
accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or
applications and therefor e s uc h inclusion and/or use is at
the customer’s own risk .
Applications Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use witho ut fu rth e r testing or modification.
Limiting values Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC 60134) may cause permanent damage to
the device. Limiting values are stress ratings only and
operation of the device at these or any other conditions
above those given in the Characteristics sections of this
document is not implied. Exposure to limiting values for
extended periods may affect device reliability.
Terms and conditions of sale NXP Semiconductors
products are sold subject to the general terms and
conditions of commercial sale, as published at
http://www.nxp.com/profile/terms, including those
pertaining to warranty, intellectual property rights
infringement and limitation of liability, unless explicitly
otherwise agreed to in writing by NXP Semiconductors. In
case of any incons istency or conflict between information
in this document an d such terms and conditio ns, the latter
will prevail.
No offer to sell or license Nothing in this document
may be interpreted or construed as an offer to sell products
that is open for accept ance or the grant, conveyance or
implication of any license under any copyrights, patents or
other industr i al or inte llectual property ri gh ts.
Export control This document as well as the item(s)
described herein may be subject to export control
regulations. Export might require a prior authorization from
national author ities.
Quick refer ence data The Quick reference data is an
extract of th e product data given in the Limiting values an d
Characteristics sections of this document, and as such is
not complete, exhaus tive or legally binding.
NXP Semiconductors
Contact information
For additional information p lease visit: http://www.nxp.com
For sales offices addresses send e-mail to: salesaddresses@nxp.com
© NXP B.V. 2009
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information pr e sent ed in this document does not form p art of any quotation or co nt ra ct, is b elieve d to be accurate and reliable and may be change d
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other ind ustrial or intellectual property rights.
Customer notification
This data sheet was changed to reflect the new company name NXP Semicon ductors. No changes were
made to the content, except for the legal definitions and disclaimer s.
Printed in The Netherlands 613514/02/pp8 Date of release: 2001 Nov 07 Document orde r number: 9397 750 09039