BTA06 B/C
BTB06 B/C
March 1995
STANDARD TRIACS
Symbol Parameter Value Unit
IT(RMS) RMS on-state current
(360°conduction angle) BTA Tc = 100 °C6 A
BTB Tc = 105 °C
ITSM Non repetitive surge peak on-state current
( Tj initial = 25°C) tp = 8.3 ms 63 A
tp = 10 ms 60
I2tI
2
t value tp = 10 ms 18 A2s
dI/dt Critical rate of rise of on-state current
Gate supply : IG= 500mA diG/dt = 1A/µsRepetitive
F = 50 Hz 10 A/µs
Non
Repetitive 50
Tstg
Tj Storage and operating junction temperature range - 40 to + 150
- 40 to + 125 °C
°C
Tl Maximum lead temperature for soldering during 10 s at 4.5 mm
from case 260 °C
.HIGH SURGE CURRENT CAPABILITY
.COMMUTATION : (dV/dt)c> 5 V/µs
.BTAFamily :
INSULATINGVOLTAGE=2500V(RMS)
(ULRECOGNIZED : E81734)
DESCRIPTION
Symbol Parameter BTA / BTB06-... B/C Unit
400 600 700 800
VDRM
VRRM Repetitive peak off-state voltage
Tj = 125 °C400 600 700 800 V
ABSOLUTE RATINGS (limiting values)
FEATURES
The BTA/BTB06 B/C triac family are high perform-
ance glass passivated PNPN devices.
These parts are suitables for general purpose ap-
plications where high surge current capability is re-
quired. Application such as phase control and
static switching on inductive or resistive load.
TO220AB
(Plastic)
A1
A2 G
1/5
GATE CHARACTERISTICS (maximum values)
Symbol Parameter Value Unit
Rth (j-a) Junction to ambient 60 °C/W
Rth (j-c) DC Junction to case for DC BTA 4.4 °C/W
BTB 3.2
Rth (j-c) AC Junction to case for 360°conduction angle
( F= 50 Hz) BTA 3.3 °C/W
BTB 2.4
Symbol Test Conditions Quadrant Suffix Unit
BC
I
GT VD=12V (DC) RL=33Tj=25°C I-II-III MAX 50 25 mA
IV MAX 100 50
VGT VD=12V (DC) RL=33Tj=25°C I-II-III-IV MAX 1.5 V
VGD VD=VDRM RL=3.3kTj=110°C I-II-III-IV MIN 0.2 V
tgt VD=VDRM IG= 500mA
dIG/dt = 3A/µsTj=25°C I-II-III-IV TYP 2 µs
ILIG=1.2 IGT Tj=25°C I-III-IV TYP 40 20 mA
II 70 35
IH*I
T
= 500mA gate open Tj=25°C MAX 50 25 mA
VTM *I
TM= 8.5A tp= 380µs Tj=25°C MAX 1.65 V
IDRM
IRRM VDRM Rated
VRRM Rated Tj=25°C MAX 0.01 mA
Tj=110°C MAX 0.5
dV/dt * Linear slope up to VD=67%VDRM
gate open Tj=110°C MIN 250 100 V/µs
(dV/dt)c * (dI/dt)c = 2.7A/ms Tj=110°C MIN 10 5 V/µs
* For either polarity of electrode A2voltage with reference to electrode A1.
PG (AV) =1W P
GM = 10W (tp = 20 µs) IGM =4A(tp=20µs) VGM = 16V (tp = 20 µs).
ELECTRICAL CHARACTERISTICS
THERMAL RESISTANCES
BTA06 B/C / BTB06 B/C
2/5
ORDERING INFORMATION
Package IT(RMS) VDRM /V
RRM Sensitivity Specification
AV B C
BTA
(Insulated) 6 400 X X
600 X X
700 X X
800 X X
BTB
(Uninsulated) 400 X X
600 X X
700 X X
800 X X
0123456
0
2
4
6
8
10 180O
=180
o
= 120o
=90
o
=60
o
=30
o
T(RMS)
I (A)
P(W)
Fig.1 : Maximum RMS power dissipation versus RMS
on-state current (F=50Hz).
(Curves are cut off by (dI/dt)c limitation)
0 20406080100120140
0
2
4
6
8
10 -95
-100
-105
-110
-115
-120
-125
P(W)
Rth = 0 C/W
2.5 C/W
5C/W
10 C/W
o
o
o
o
Tamb ( C)
o
Tcase ( C)
o
Fig.2 : Correlation between maximum RMS power
dissipation and maximum allowable temperatures (Tamb
and Tcase) for different thermal resistances heatsink +
contact (BTA).
0 102030405060708090100110120130
0
1
2
3
4
5
6
7
= 180o
Tcase( C)
o
BTA BTB
I (A)
T(RMS)
Fig.4 : RMS on-state current versus case temperature.
0 20 40 60 80 100 120 140
0
2
4
6
8
10 -100
-105
-110
-115
-120
-125
P(W)
Tamb ( C)
o
Rth = 0 C/W
2.5 C/W
5C/W
10 C/W
o
o
o
o
Tcase ( C)
o
Fig.3 : Correlation between maximum mean power
dissipation and maximum allowable temperatures (Tamb
and Tcase) for different thermal resistances heatsink +
contact (BTB).
BTA06 B/C / BTB06 B/C
3/5
Fig.6 : Relative variation of gate trigger current and
holding current versus junction temperature.
Fig.7 : Non Repetitive surge peak on-state current
versus number of cycles. Fig.8 : Non repetitive surge peak on-state current for a
sinusoidal pulse with width : t 10ms, and
corresponding value of I2t.
Fig.9 : On-state characteristics (maximum values).
1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2
0.01
0.1
1Zth/Rth
Zth(j-c)
Zth(j-a)
tp(s)
Fig.5 : Relative variation of thermal impedance versus
pulse duration.
BTA06 B/C / BTB06 B/C
4/5
PACKAGE MECHANICAL DATA
TO220AB Plastic
Cooling method : C
Marking : type number
Weight : 2.3 g
Recommended torque value : 0.8 m.N.
Maximum torque value : 1 m.N.
I
==
AG
D
B
C
F
P
N
O
M
L
J
H
REF. DIMENSIONS
Millimeters Inches
Min. Max. Min. Max.
A10.20 10.50 0.401 0.413
B14.23 15.87 0.560 0.625
C12.70 14.70 0.500 0.579
D5.85 6.85 0.230 0.270
F4.50 0.178
G2.54 3.00 0.100 0.119
H4.48 4.82 0.176 0.190
I3.55 4.00 0.140 0.158
J1.15 1.39 0.045 0.055
L0.35 0.65 0.013 0.026
M2.10 2.70 0.082 0.107
N4.58 5.58 0.18 0.22
O0.80 1.20 0.031 0.048
P0.64 0.96 0.025 0.038
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability
for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may
result from its use. No license is granted by implication orotherwise under any patent orpatent rights of SGS-THOMSON Microelectronics.
Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all
information previously supplied.
SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems
without express written approval of SGS-THOMSON Microelectronics.
1995 SGS-THOMSON Microelectronics - Printed in Italy - All rights reserved.
SGS-THOMSON Microelectronics GROUP OF COMPANIES
Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Nether-
lands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A.
BTA06 B/C / BTB06 B/C
5/5