DSP56303VL100 - Freescale Semiconductor

Technical Da ta

DSP56303/D

Rev. 7, 1/2002

24-Bit Digital Signal

Processor

Figure 1. DSP56303 Block Diagram

PLL OnCE™

Clock

Generator

Internal

Data

Bus

Switch

YAB

XAB

PAB

YDB

XDB

PDB

GDB

MODB/IRQB

MODC/IRQC

External

Data Bus

Switch

MODD/IRQD

DSP56300

616

24-Bit

DDB

DAB

Peripheral

Core

YM_EB

XM_EB

PM_EB

PIO_EB

Expansion Area

JTAG 5

RESET

MODA/IRQA

PINIT/NMI

Bootstrap

ROM

EXTAL

XTAL

Address

Control

Data

Address

Generation

Unit

Six-Channel

DMA Unit

Program

Interrupt

Controller

Program

Decode

Controller

Program

Address

Generator

Data ALU

24 × 24 + 56 → 56-bit MAC

Two 56-bit Accumulators

56-bit Barrel Shifter

Power

Management

External

Bus

Interface

and Inst.

Cache

Control

External

Address

Bus

Switch

Memory Expansion Area

X Data

RAM

2048 × 24

bits

(default)

Y Data

RAM

2048 × 24

bits

(default)

Triple

Timer HI08 ESSI SCI PrograM

4096 × 24

bits

(default)

RAM

The DSP56303 is

intended for use in

telecommunication

applicat io n s, such as

multi-line voice/data/

fax processing, video

conferencing, audio

applicat ions, cont r ol,

and general digital

signal processing.

The DSP56303 is a member of the DSP56300

core family of programmable CMOS Digital

Signal Processors (DSPs). This family uses a

high-performance, single clock cycle per

instruction engine providing a twofold

perfor mance i ncreas e over Motorola ’s popul ar

DSP56000 core family while retaining code

compatibility.

Significant architectural features of the

DSP56300 core family include a barrel shifter,

24-bit addressing, instruction cache, and

DMA. The DSP56303 offers 100 MIPS using

an internal 100 MHz clock at 3.0–3.6 volts.

The DSP56300 core family offe rs a rich

instruction set and low power dissipation, as

well as increasing levels of speed and power

to enable wireless, telecommunications, and

multimedia products.

ii  
  
Table of Contents
DSP56303 Features............................................................................................................................................ iii
Target Applic at ion s......................... .... .................. .... ... .................. .... .................. .... .................. .................. .... .. iv
Product Documentation...................................................................................................................................... iv
Chapter 1 Signal/ Connection Descriptions
1.1 Signal Groupings..............................................................................................................................................1-1
1.2 Power................................................................................................................................................................ 1-3
1.3 Ground.............................................................................................................................................................. 1-3
1.4 Clock................................................................................................................................................................1-4
1.5 PLL...................................................................................................................................................................1-4
1.6 External Memory Expansion Port (Port A)......................................................................................................1-5
1.7 Interrupt and Mode Control .............................................................................................................................1-8
1.8 Host Interface (HI08).......................................................................................................................................1-9
1.9 Enhanced Synchronous Serial Interface 0 (ESSI0)........................................................................................ 1-13
1.10 Enhanced Synchronous Serial Interface 1 (ESSI1)........................................................................................ 1-14
1.11 Serial Communication Interface (SCI)........................................................................................................... 1-16
1.12 Timers............................................................................................................................................................. 1-17
1.13 JTAG and OnCE Interface.................. ... ................... ... .... .................. .... .................. ... ...................................1-18
Chapter 2 Specifications
2.1 Introduction......................................................................................................................................................2-1
2.2 Maximum Ratings............................................................................................................................................2-1
2.4 Thermal Cha ra cte ristic s ....... .... ... ................... ... .... .................. .... .................. ... ...................... .... .... ... ...............2-2
2.5 DC Electrical Characteristics...........................................................................................................................2-3
2.6 AC Electrical Characteristics...........................................................................................................................2-4
Chapter 3 Packaging
3.1 Pin-Out and Package Information....................................................................................................................3-1
3.2 TQFP Packa ge Description.............................................................................................................................. 3-2
3.3 TQFP Packa ge Mechanical Drawing...............................................................................................................3-9
3.4 MAP-BGA Packa ge Description ...................................................................................................................3-10
3.5 MAP-BGA Packa ge Mechanical Drawing ....................................................................................................3-19
Chapter 4 Design Considerations
4.1 Thermal Design  Consid era tio n s...... .................. .... .................. .... .................. ... .... .................. ...................... ....4-1
4.2 Electrical Design Considerations.....................................................................................................................4-2
4.3 Power Consumption Considerations................................................................................................................4-4
4.4 PLL Performance Issues ..................................................................................................................................4-5
4.5 Input (EXTAL) Jitter Requirements.................................................................................................................4-5
Appendix A Power Consumption Benchmark
Index
Data Sheet Conventions
OVERBAR Used to indicate a signal that is active when pulled low (For example, the RE SE T pin is active when low.)
“asserted” Means that a high true ( active high) signal is high or that a low true (active low) signal is low
“deasserted” Means that a high true ( active high) signal is low or that a low true (active low) signal is high
Examples: Signal/Symbol Logic State Signal State Voltage
PIN True Asserted VIL/VOL
PIN False Deasserted VIH/VOH
PIN True Asserted VIH/VOH
PIN False Deasserted VIL/VOL
Note: Values for VIL, VOL, VIH, and VOH are defined by individual product specifications.

iii

DSP56303 Fea tures

High-Performance DSP56300 Core

• 100 million instru ctions per second (MIP S) with a 100 MHz clock at 3.3 V nominal

• Object code compatible with the DSP56000 core with highly parallel instruction set

• Data Arithmetic Logic Unit (Data ALU) with fully pipelined 24 × 24-bit parallel

Multiplier-Accumulator (MAC ), 56-bit parallel barrel shifter (fast shift and normalization; bit stream

generation and parsing), conditional ALU instructions, and 24-bit or 16-bit arithmetic support under

software control

• Program Control Unit (P CU) with Position Independent Code (PIC) support, addres sing modes

optimized for DSP applications (including immediate offsets), on-chip instruction cache controller,

on-chip memor y-expand able har dware stack, nested har dware DO loop s, and fas t auto-r eturn in terrup ts

• Direct Memory Access (DMA) with six DMA channels supporting internal and external accesses;

one-, two-, and three-dimensional transfers (including circular buffering); end-of-block-transfer

interrupts; and triggering from interrupt lines and all pe ripherals

• Phase Lock Loop (PLL) allows change of low-power Divide Factor (DF) without loss of lock and

output clock with skew elimination

• Hardware debugging support including On-Chip Emulation (OnCE) module, Joint Test Actio n

Group (JTAG) Test Access Port (TAP)

On-C hip Peri pherals

• Enhanced DSP56000-like 8-bit parallel ho st interface (HI08) supports a variety of buses (for example,

ISA) and provides glueless connection to a number of industry-standard microcomputers,

microprocessors, and DSPs

• Two enhanced synchronous serial interfaces (ESSI), each with one receiver and three transmitters

(allows six-channel home theater)

• Serial communications interface (SCI) with baud rate generator

• Triple timer module

• Up to thirty-four programmable general-purpose input/output (GPIO) pins, depending on which

peripherals are enabled

On-Chip Memories

•192 × 24-bit bootstrap ROM

• 128 K RAM total

• Program RAM, Instruction Cache, X data RAM, and Y data RAM sizes are programmable:

Program RAM

Size Instruction

Cache Size X Data RAM

Size Y Data RAM

Size Instruction

Cache Switch Mode

4096 × 24-bit 0 2048 × 24-bit 2048 × 24-bit disabled disabled

3072 × 24-bit 1024 × 24-bit 2048 × 24-bit 2048 × 24-bit enabled disabled

2048 × 24-bit 0 3072 × 24-bit 3072 × 24-bit disabled enabled

1024 × 24-bit 1024 × 24-bit 3072 × 24-bit 3072 × 24-bit enabled enabled

Off-Chip Memory Expansion

• Data memory expansion to two 256 K × 24-bit word memory spaces using the standard external

address lines

• Program memory expansion to one 256 K × 24-bit words memory space using the standard external

address lines

• External memory expansion port

• Chip Select Logic for glueless interface to static random access memory (SRAMs)

• On-chip DRAM Controller for glueless interface to dynamic random access memory (DRAMs)

Reduced Power Dissipation

• Ver y low-power CMOS design

• Wait and Stop low-power standby modes

• Fully static design specified to operate down to 0 Hz (dc)

• Optimized power management circuitry (instruction-dependent, peripheral-dependent, and

mode-dependent)

Packaging

The DSP56303 is available in a 144-pin TQFP package or a 196-pin MAP-BGA package.

Target Applications

• Multi-line voice/da ta/fax processing

• Video conferencing

• Audio applications

• Control

Product Documentation

The three documents listed in the following table are required for a complete description of the

DSP56303 and are necessary to design properly with the part. Documentation is available fr om the

following sources. (See the back cover for details.)

• A local Motorola distributo r

• A Motorola semiconductor sales office

• A Motorola Literature Distribu tion Center

• The World Wide Web (WWW)

Table 1. DSP56303 Documentation

Name Descriptio n Order Numbe r

DSP56300 Family

Manual

Detailed description of the DSP56300 family processor core and

instruction set DSP56300FM/AD

DSP56303 User’s

Manual

Detailed functional description of the DSP56303 memory

configuration, operation, and register programming DSP56303UM/D

DSP56303

Technical Data

DSP56303 features list and physical, electrical, timing, and

package specifications DSP56303/D

1-1

Chapter 1

Signal/

Connection

Descriptions

1.1 Signal Gr oupings

The DSP56303 input and output sig nals ar e organized in to functional groups as show n in Table 1-1.

Figure 1-1 diagrams the DSP56303 signal s by fun cti o nal grou p. The remai n der of thi s chapt er descr i bes

the signal pins in each functional group.

Note: This chapter refers to a number of configuration registers used to select individual multiplexed

signal functio nality. Refer to the DSP56303 User’s Manual for details on these configuration

registers.

Table 1-1. DSP56303 Functional Signal Groupings

Functional Group

Number of Signals

TQFP MAP-

BGA

Power (VCC)18 18

Ground (GND) 19 66

Clock 22

PLL 33

Address bus

Port A1

18 18

Data bus 24 24

Bus control 13 13

Interrupt and mode control 5 5

Host interface (HI08) Port B216 16

Enhanced synchronous serial interface (ESSI) Ports C and D312 12

Serial communication interface (SCI) Port E433

Timer 33

OnCE/JTAG Port 66

Notes: 1. Port A signals define the external memory interface port, including the external address bus, data

bus, and control signals.

2. Port B signals are the HI08 port signals multiplexed with the GPIO signals.

3. Port C and D signals are the two ESSI port signals multiplexed with the GPIO signals.

4. Port E signals are the SCI port signals multiplexed with the GPIO signals.

5. There are 2 signal connections in the TQFP package and 7 signal connections in the MAP-BGA

package that are not used. These are designated as no connect (NC) in the package description

(see Chapter 3).

1-2

Signal Groupings

Figure 1-1. Signals Identified by Functional Group

Notes: 1. The HI08 port supports a non-multiplexed or a multiplexed bus, single or double Data Strobe (DS), and single or

double Host Request (HR) configurations. Since each of these modes is configured independently, any combination

of these modes is possible. These HI08 signals can also be configured alternatively as GP IO signals (PB [0–15]).

Signals with dual designations (for ex ample, HAS/HAS) have configurable polarity.

2. The ESSI0, ESSI1, and SCI signals are multiplexed with the Port C GPIO signals (PC[0–5]), Port D GPIO signals

(PD[0–5]), and Port E GPIO signals (PE[0–2]), respectively.

3. TIO[0–2] can be configured as GPIO signals.

4. Ground connections shown in this figure are for the TQFP pack age. In the MAP-BGA package, in addition to the

GNDP and GNDP1 connections, there are 64 GND connections to a common internal package ground plane.

DSP56303

18 External

Address Bus

External

Data Bus

External

Bus

Control

Enhanced

Synchronous Serial

Interface Por t 0

(ESSI0)2

Timers3

PLL

OnCE/

JTAG Port

Power Inputs:

PLL

Internal Logic

Address Bus

Data Bus

Bus Control

HI08

ESSI/SCI/Timer

A[0–17]

D[0–23]

AA0/RAS0–

AA3/RAS3

CAS

BCLK

TCK

TDI

TDO

TMS

TRST

CLKOUT

PCAP

After

Reset

NMI

VCCP

VCCQ

VCCA

VCCD

VCCC

VCCH

VCCS

Serial

Communications

Interface (SC I) Port 2

Grounds4:

PLL

Internal Logic

Address Bus

Data Bus

Bus Control

HI08

ESSI/SCI/Timer

GNDP

GNDP1

GNDQ

GNDA

GNDD

GNDC

GNDH

GNDS

Interrupt/

Mode Control

MODA

MODB

MODC

MODD

RESET

Host

Interface

(HI08) Port1

Non-Multiplexed

Bus

H[0–7]

HA0

HA1

HA2

HCS/HCS

Single DS

HRW

HDS/HDS

Single HR

HREQ/HREQ

HACK/HACK

RXD

TXD

SCLK

SC0[0–2]

SCK0

SRD0

STD0

TIO0

TIO1

TIO2

EXTAL

XTAL Clock

Enhanced

Synchronous Serial

Interface Por t 1

(ESSI1)2

SC1[0–2]

SCK1

SRD1

STD1

Multiplexed

Bus

HAD[0–7]

HAS/HAS

HA8

HA9

HA10

Double DS

HRD/HRD

HWR/HWR

Double HR

HTRQ/HTRQ

HRRQ/HRRQ

Port B

GPIO

PB[0–7]

PB8

PB9

PB10

PB13

PB11

PB12

PB14

PB15

Port E GPIO

PE0

PE1

PE2

Port C GPIO

PC[0–2]

PC3

PC4

PC5

Port D GPIO

PD[0–2]

PD3

PD4

PD5

Timer GPIO

TIO0

TIO1

TIO2

Port A

IRQA

IRQB

IRQC

IRQD

PINIT

RESET

During Reset After Reset

Reset

During

1-3

Power

1.2 Power

1.3 Ground

Table 1-2. Power Inputs

Power Name Description

VCCP PL L Power —VCC dedicated for PLL use. The voltage should be well-regulated and the input

should be provided with an extremely low impedance path to the VCC power rail.

VCCQ Quiet Power— An isolated power for the core processing logic. This input m ust be isolated

externally from all other chip power inputs.

VCCA Address Bus Power—An isolated power for sections of the address bus I/O drivers. This

input must be tied externally to all other chip power inputs,

except

VCCQ.

VCCD Data Bus Power—An isolated power for sections of the data bus I/O drivers. This input must

be tied externally to all other chip power inputs,

except

VCCQ.

VCCC Bus Control Power — An isolated power for the bus control I/O drivers. This input m ust be

tied externally to all other chip power inputs,

except

VCCQ.

VCCH Host Power—An isolated power for the HI08 I/O drivers. This input must be tied externally to

all other chip power inputs,

except

VCCQ.

VCCS ESSI, SCI, and Timer Power—An isolated power for the ESSI, SCI, and timer I/O drivers.

This input must be tied externally to all other chip power inputs,

except

VCCQ.

Note: The user must provide adequate external decoupling capacitors for all powe r connections.

Table 1-3. Grounds1

Ground

Name Description

GNDPPLL Ground—Ground-dedicated for PLL use. The connection s hould be provided with an extremely

low-impedance path to ground. VCCP should be bypassed to GNDP by a 0.47 µF capacitor located as

close as possible to the chip package.

GNDP1 PLL Ground 1—Ground-dedicated for PLL use. The connection should be provided with an extremely

low-impedance path to ground.

GNDQ2Quiet Ground—An isolated ground for the internal processing logic. This connection must be tied

externally to all other chip ground connections, except GNDP and GNDP1. The user must provide

adequate external decoupling capacitors.

GNDA2Address Bus Ground—An isolated ground for sections of the address bus I/O drivers. This

connection must be tied externally to all other chip ground connections, except GNDP and GNDP1. The

user must provide adequate external decoupling capacitors.

GNDD2Data Bus Ground—An isolated ground for sections of the data bus I/O drivers. This connection must

be tied externally to all other chip ground connections, except GNDP and GNDP1. The user must

provide adequate external decoupling capacitors.

GNDC2Bus Control Ground—An isolated ground for the bus control I /O drivers. This connection must be tied

externally to all other chip ground connections, except GNDP and GNDP1. The user must provide

adequate external decoupling capacitors.

GNDH2Host Ground—An isolated ground for the H I08 I/O drivers. This connection must be tied externally to

all other chip ground connections, except GNDP and GNDP1. The user must provide adequate external

decoupling capacitors.

GNDS2ESSI, SCI, and Timer Ground—An isolated ground for the ESSI, SCI, and timer I/O drivers. This

connection must be tied externally to all other chip ground connections, except GNDP and GNDP1. The

user must provide adequate external decoupling capacitors.

GND3Ground—Connected to an internal device ground plane.

Notes: 1. The user must provide adequate external decoupling capacitors for all GND connections.

2. These connections are only used on the TQFP package.

3. These connections are common grounds used on the MAP-BGA package.

1-4

Clock

1.4 Clock

1.5 PLL

Table 1-4. Clock Signals

Signal

Name Type State

During

Reset Signal Description

EXTAL Input Input External Clock/Crystal Input—Interfaces the internal crystal oscillator

input to an external crystal or an external clock.

XTAL Output Chip-driven Crystal Output—Connects the internal crystal oscillator output to an

external crystal. If an external clock is used, leave XTAL unconnected.

Table 1-5. Phas e-Lo ck ed Loo p Sign al s

Signal

Name Type State During

Reset Signal Description

CLKOUT Output Chip-driven Clock Output—Provides an output clock synchronized to the

internal core clock phase.

If the PLL is enabled and both the multiplication and division

factors equal one, then CLKOUT is also synchronized to EXTAL.

If the PLL is disabled, the CLKOUT frequency is half the

frequency of EXTAL.

PCAP Input Input PLL Capacitor—An input connecting an off-chip capacitor to the

PLL filter. Connect one capacitor terminal to PCAP and the other

terminal to VCCP.

If the PLL is not used, PCAP can be tied to VCC, GND, or left

floating.

PINIT

NMI

Input

Input PLL Initial —During assertion of RESET, the value of PINIT is

written into the PLL enable (PEN) bit of the PLL control (PCTL)

Nonmaskable Interrupt—After RESET deassertion and during

normal instruction processing, this Schmitt-trigger input is the

negative-edge-triggered NMI request internally synchronized to

CLKOUT.

Note: PINIT/ NMI can tolerate 5 V.

1-5

External Memory Expansion Port (Port A)

1.6 External Memory Expansion Port (Port A)

Note: When the DSP56303 enters a low-power standby mode (stop o r wait), it releases bus mastership

and tri-states the relevant Port A signals: A[0–17], D[0–23], AA0/RAS0–AA3/RAS3, RD, WR, BB,

CAS.

1.6.1 External Address Bus

1.6.2 External Data Bus

Table 1-6. External Address Bus Signals

Signal

Name Type State During

Reset, Stop, or

Wait Signal Desc ription

A[0–17] Output Tri-stated Address Bus—When the DSP is the bus master, A[0–17] are

active-high outputs that specify the address for ex ter nal

program and data memory accesses. Otherwise, the signals

are tri-stated. To m inimize power dissipation, A[0–17] do not

change state when external memory spaces are not being

accessed.

Table 1-7. External Data Bus Signals

Signal

Name Type State

During

Reset

State

During

Stop or

Wait

Signal Description

D[0–23] I nput/ Output Ignored

Input Last state:

Input

Ignored

Output

Tri-stated

Data Bus—When the DSP is the bus master, D[0–23] are

active-high, bidirectional input/outputs that provide the

bidirectional data bus for external program and data memory

accesses. Otherwise, D[0–23] are tri-stated.

1-6

External Memory Expansion Port (Port A)

1.6.3 External Bus Control

Table 1-8. External Bus Control Signals

Signal

Name Type State During

Reset, Stop, or

Wait Signal Description

AA[0–3]

RAS[0–3]

Output

Tri-stated Address Attribute—When defined as AA, these signals can be used as

chip selects or additional address lines. The default use defines a

priority scheme under which only one AA signal can be asserted at a

time. Setting the AA priority disable (APD) bit (Bit 14) of the Operating

Mode Register, the priority mechanism is disabled and the lines can be

used together as four external lines that can be decoded externally into

16 chip select signals.

Row Address Strobe—When defined as RAS, these signals can be

used as RAS for DRAM interface. These signals are tri-statable outputs

with programmable polarity.

RD Output Tri-stated Read Enable—When the DSP is the bus master, RD is an active-low

output that is asserted to read external memory on the data bus

(D[0–23]). Otherwise, RD is tri-stated.

WR Output Tri-stated Write Enable — W hen the DSP is the bus master, WR is an ac tive-low

output that is asserted to write external memory on the data bus

(D[0–23]). Otherwise, the signals are tri-stated.

TA Input Ignored Input Transfer Acknowledge—If the DSP56303 is the bus master and there

is no external bus activity, or the DSP56303 is not the bus master, the

TA input is ignored. The TA input is a data transfer acknowledge

(DTACK) function that can extend an external bus cycle indefinitely. Any

number of wait states (1, 2. . .infinity) can be added to the wait states

inserted by the bus control register (BCR) by keeping TA deasserted. In

typical operation, TA is deasserted at the start of a bus cycle, is asserted

to enable completion of the bus cycle, and is deasserted before the next

bus cycle. The current bus cycle completes one clock period after TA is

asserted synchronous to CLKOUT. The number of wait states is

determined by the TA input or by the BCR, whichever is longer. The

BCR can be used to set the m inimum numbe r of wait states in external

bus cycles.

To use the TA functionality, the BCR must be programmed to at least

one wait state. A zero wait state access cannot be extended by TA

deassertion; otherwise, improper operation may result. TA can operate

synchronously or asynchronously depending on the setting of the TAS

bit in the Operating Mode Register. TA functionality cannot be used

during DRAM type accesses; otherwise improper operation may result.

BR Output Reset: Output

(deasserted)

State during

Stop/Wait depends

on BRH bit setting:

• BRH = 0: Output,

deasserted

• BRH = 1: Maintains

last state (that is, if

asserted, rem ain s

asserted)

Bus Request—Asserted when the DSP requests bus mastership. BR is

deasserted when the DSP no longer needs the bus. B R may be

asserted or deasserted independently of whether the DSP 56303 is a

bus master or a bus slave. Bus “parking” allows BR to be deasserted

even though the DSP56303 is the bus master. (S ee the description of

bus “parking” in the BB signal description.) The bus request hold (BRH)

bit in the B CR allows BR to be asserted under software control even

though the DSP does not need the bus. BR is typically sent to an

external bus arbitrator that controls the priority, parking, and tenure of

each master on the same external bus. BR is affected only by DSP

requests for the external bus, nev er for the internal bus. During

hardware reset, BR is deasserted and the arbitration is reset to the bus

slave state.

1-7

External Memory Expansion Port (Port A)

BG Input Ignored Input Bus Grant—Asserted by an external bus arbitration circuit when the

DSP56303 becomes the next bus master. When BG is asserted, the

DSP56303 must wait until BB is deasserted before taking bus

mastership. When BG is deasserted, bus mastership is typically given

up at the end of t he current bus cycle. This may occur in the middle of an

instruction that requires more than one external bus cycle for execution.

The default operation of this bit requires a setup and hold time as

specified in Table 2-14. An alternate mode can be invoked: set the

asynchronous bus arbitration enable (ABE) bit (Bit 13) in the Operating

Mode Register. When this bit is set, BG and BB are synchronized

internally. This eliminates the respective setup and hold time

requirements but adds a required delay between the deassertion of an

initial BG input and the assertion of a subsequent BG input.

BB Input/

Output Ignored Input Bus Busy—Indicates that the bus is active. Only after BB is deasserted

can the pending bus master become the bus master (and then assert

the signal again). The bus master may keep BB asserted after ceasing

bus activity regardless of whether BR is asserted or deasserted. Called

“bus parking,” this allows the current bus master to reuse the bus

without rearbitration until another device requires the bus. BB is

deasserted by an “active pull-up” method (that is, BB is driven high and

then released and held high by an external pull-up resistor).

The default operation of this s ignal requires a setup and hold time as

specified in Table 2-14. An alternative mode can be invoked by s etting

the ABE bit (Bit 13) in the Operating Mode Register. When this bit i s set,

BG and BB are synchronized internally. See BG for additional

information.

Note: BB requires an external pull-up resistor.

CAS Output Tri-stated Column Address Strobe—When the DSP is the bus master, CAS is an

active-low output used by DRAM to strobe the column address.

Otherwise, if the Bus Mastership Enable (BME) bit in the DRAM control

BCLK Output Tri-stated Bus Clock

When the DSP is the bus master, BCLK is active when the Operating

Mode Register Address Trace Enable bit is set. When BCLK is active

and synchronized to CLKOUT by the internal PLL, BCLK precedes

CLKOUT by one-fourth of a clock cycle.

BCLK Output Tri-stated Bus Clock Not

When the DSP is the bus master, BCLK is the inverse of the BCLK

signal. Otherwise, the signal is tri-stated.

Table 1-8. External Bus Control Signals (Continued)

Signal

Name Type State During

Reset, Stop, or

Wait Signal Description

1-8

Interrupt and Mode Control

1.7 Interrupt and Mode Control

The interrupt and mode control signals select the chip operating mode as it comes out of hardware reset.

After RESET is deasserted, these inputs are hardware interrupt request lines.

Table 1-9. Interrupt and Mode Control

Signal Name Type State During

Reset Signal Description

RESET Input Schmitt-trigger

Input Reset—Places the chip in the Reset state and res ets the internal

phase generator. The Schmitt-trigger input allows a slowly rising

input (such as a capacitor charging) to reset the chip reliably.

When the RESET signal is deasserted, the initial chip operating

mode is latched from the MODA, MODB, MODC, and MODD

inputs. The RESET signal must be asserted after powerup.

MODA

IRQA

Input

Schmitt-trigger

Input Mode Select A—MODA, MODB, MODC, and MODD select one

of 16 initial ch ip operating modes, latched into the Operating

Mode Register when the RESET signal is deasserted.

External Interrupt Req uest A—After reset, this input becomes a

level-sensitive or negative-edge-triggered, maskable interrupt

request input during normal instruction processing. If the

processor is in the STOP or WAIT standby state and IRQA is

asserted, the processor exits the STOP or WAIT state.

MODB

IRQB

Input

Schmitt-trigger

Input Mode Select B—MODA, MODB, MODC, and MODD select one

of 16 initial ch ip operating modes, latched into the Operating

Mode Register when the RESET signal is deasserted.

External Interrupt Req uest B—After reset, this input becomes a

level-sensitive or negative-edge-triggered, maskable interrupt

request input during normal instruction processing. If the

processor is in the WAIT standby state and IRQB i s asserted, the

processor exits the WAIT state.

MODC

IRQC

Input

Schmitt-trigger

Input Mode Select C—MODA, MODB, MODC, and MODD select one

of 16 initial ch ip operating modes, latched into the Operating

Mode Register when the RESET signal is deasserted.

External Interrupt Req uest C—After reset, this input becomes a

level-sensitive or negative-edge-triggered, maskable interrupt

request input during normal instruction processing. If the

processor is in the WAIT standby state and IRQC is asserted, the

processor exits the WAIT state.

MODD

IRQD

Input

Schmitt-trigger

Input Mode Select D—MODA, MODB, MODC, and MODD select one

of 16 initial ch ip operating modes, latched into the Operating

Mode Register when the RESET signal is deasserted.

External Interrupt Req uest D—After reset, this input becomes a

level-sensitive or negative-edge-triggered, maskable interrupt

request input during normal instruction processing. If the

processor is in the WAIT standby state and IRQD is asserted, the

processor exits the WAIT state.

Note: These signals are all 5 V tolerant.

1-9

Host Interface (HI08)

1.8 Host Interface (HI0 8)

The HI08 pr ovides a fast, 8-bit, parallel data por t that connects di rectly to t he host bus . The HI08 supp orts

a variety of standard buses and connects directly to a number of industry-standard microcomputers,

microprocessors, DSPs, and DMA hardware.

1.8.4 Host Port Usage Considerations

Careful synchronization is required when the system reads multiple-bit registers that are written by

another asynchr onous system. This is a common pr oblem when two asynchr onous systems are connected

(as they are in the Host port). The considerations for proper operation are discussed in Table 1-10.

1.8.5 Host Port Configuration

HI08 signal functions vary according t o the programmed configuration of the interf ace as determined by

the 16 bits in th e HI08 Port Cont rol Register.

Table 1-10. Host Port Usage Considerations

Action Description

Asynchronous read of receive

byte registers When reading the receive byte registers, Receive register High (RXH), Receive

programmer should use interrupts or poll the Receive register Data Full (RXDF) flag

that indicates data is available. This assures that the data in the receive byte

registers is valid.

Asynchronous write to transmit

byte registers The host interface programmer should not write to the transmit byte registers,

Transmit register High (TXH), Transmit register Middle (TXM), or Transmit register

Low (TXL), unless the Transmit register Data Empty (TXDE) bit is set indicating that

the transmit byte registers are empty. This guarantees that the transmit byte

registers transfer valid data to the Host Receive (HRX) register.

Asynchronous write to host

vector The host interface programmer must change the Host Vector (HV) register only

when the Host Command bit (HC) is clear. This practice guarantees that the DSP

interrupt control logic receives a stable vector.

Table 1-11. Host Interface

Signal Name Type State During

Reset1,2 Signal Description

H[0–7]

HAD[0–7]

PB[0–7]

Input/Output

Input or Output

Ignored Input Host Data—When the HI08 is programmed to interface with a

non-multiplexed host bus and the HI function is selected, these

signals are lines 0–7 of the bidirectional Data bus.

Host Address—When the HI08 is programmed to interface with a

multiplexed host bus and the HI function is selected, these signals

are lines 0–7 of the bidirectional multiplexed Address/Data bus.

Port B 0–7—When the HI08 is configured as GPIO through the

HI08 Port Control Register, these signals are individually

programmed as inputs or outputs through the HI08 Data Directio n

1-10

Host Interface (HI08)

HA0

HAS/HAS

PB8

Input

Input or Output

Ignored Input Host Address Input 0—When the HI08 is programmed to

interface with a nonmultiplexed host bus and the HI function is

selected, this signal is line 0 of the host address input bus.

Host Address Strobe—When the HI08 is programmed to

interface with a multiplexed host bus and the HI function is

selected, this signal is the host address strobe (HAS)

Schmitt-trigger input. The polarity of the address strobe is

programmable but is configured active-low (HAS) following reset.

Port B 8—When the HI08 is configured as GPIO through the HI08

Port Control Register, this signal is individually programmed as an

input or output through the HI08 Data D irection Register.

HA1

HA8

PB9

Input

Input or Output

Ignored Input Host Address Input 1—When the HI08 is programmed to

interface with a nonmultiplexed host bus and the HI function is

selected, this signal is line 1 of the host address (HA1) input bus.

Host Address 8—When the HI08 is programmed to interface with

a multiplexed host bus and the HI function is selected, this signal

is line 8 of the host address (HA8) input bus.

Port B 9—When the HI08 is configured as GPIO through the HI08

Port Control Register, this signal is individually programmed as an

input or output through the HI08 Data D irection Register.

HA2

HA9

PB10

Input

Input or Output

Ignored Input Host Address Input 2—When the HI08 is programmed to

interface with a nonmultiplexed host bus and the HI function is

selected, this signal is line 2 of the host address (HA2) input bus.

Host Address 9—When the HI08 is programmed to interface with

a multiplexed host bus and the HI function is selected, this signal

is line 9 of the host address (HA9) input bus.

Port B 10—When the HI08 is configured as GPIO through the

HI08 Port Control Register, this signal is individually programmed

as an input or output through the HI08 Data Direction Register.

HCS/HCS

HA10

PB13

Input

Input or Output

Ignored Input Host Chip Select—When the HI08 is programmed to interface

with a nonmultiplexed host bus and the HI function is selected, this

signal is the host chip select (HCS) input. The polarity of the chip

select is programmable but is configured active-low (HCS) aft er

reset.

Host Address 10—When the HI08 is programme d to interface

with a multiplexed host bus and the HI function is selected, this

signal is line 10 of the host address (HA10) input bus.

Port B 13—When the HI08 is configured as GPIO through the

HI08 Port Control Register, this signal is individually programmed

as an input or output through the HI08 Data Direction Register.

Table 1-11. Host Interface (Continued)

Signal Name Type State During

Reset1,2 Signal Description

1-11

Host Interface (HI08)

HRW

HRD/HRD

PB11

Input

Input or Output

Ignored Input Host Read/Write—When the HI08 is programmed to interface

with a single-data-strobe host bus and the HI function is selected,

this signal is the Host Read/Write (HRW) input.

Host Read Data—When the HI08 is programmed to interface wit h

a double-data-strobe host bus and the HI function is selected, this

signal is the HRD strobe Schmitt-trigger input. The polarity of the

data strobe is programmable but is configured as active-low (HRD)

after reset.

Port B 11—When the HI08 is configured as GPIO through the

HI08 Port Control Register, this signal is individually programmed

as an input or output through the HI08 Data Direction Register.

HDS/HDS

HWR/HWR

PB12

Input

Input or Output

Ignored Input Host Data Strobe—When the HI08 is programmed to interface

with a single-data-strobe host bus and the HI function is selected,

this signal is the host data strobe (HDS) Schmitt-trigger input. The

polarity of the data strobe is programmable but is configured as

active-low (HDS) following reset.

Host Write Data—When the HI08 is programmed to interface with

a double-data-strobe host bus and the HI function is selected, this

signal is the host write data strobe (HWR) Schmitt-trigger input.

The polarity of the data strobe is programmable but is configured

as active-low (HWR) following reset.

Port B 12—When the HI08 is configured as GPIO through the

HI08 Port Control Register, this signal is individually programmed

as an input or output through the HI08 Data Direction Register.

HREQ/HREQ

HTRQ/HTRQ

PB14

Output

Input or Output

Ignored Input Host Request—When the HI08 is programmed to interface with a

single host request host bus and the HI function is selected, this

signal is the host request (HREQ) output. The polarity of the host

request is programmable but is configured as active-low (HREQ)

following reset. The host request may be programmed as a driven

or open-drain output.

Transmit Host Request—When the HI08 is programmed to

interface with a double host request host bus and t he HI function is

selected, this signal is the transmit host request (HTRQ) output.

The polarity of the host request is programmable but is configured

as active-low (HTRQ) following reset. The host request may be

programmed as a driven or open-drain output.

Port B 14—When the HI08 is configured as GPIO through the

HI08 Port Control Register, this signal is individually programmed

as an input or output through the HI08 Data Direction Register.

Table 1-11. Host Interface (Continued)

Signal Name Type State During

Reset1,2 Signal Description

1-12

Host Interface (HI08)

HACK/HACK

HRRQ/HRRQ

PB15

Input

Output

Input or Output

Ignored Input Host Acknowledge—When the HI08 is programmed to interface

with a single host request host bus and the HI function is selected,

this signal is the host acknowledge (HACK) Schmitt-trigger input.

The polarity of the host acknowledge is programmable but is

configured as active-low (HACK) after reset.

Receive Host Request—When the HI08 is programmed to

interface with a double host request host bus and t he HI function is

selected, this signal is the receive host request (HRRQ) output.

The polarity of the host request is programmable but is configured

as active-low (HRRQ) after reset. The host request may be

programmed as a driven or open-drain output.

Port B 15—When the HI08 is configured as GPIO through the

HI08 Port Control Register, this signal is individually programmed

as an input or output through the HI08 Data Direction Register.

Notes: 1. In the Stop state, the signal maintains the last state as follows:

• If the last state is input, the signal is an ignored input.

• If the last state is output, the signal is tri-stated.

2. The Wait processing state does not affect the signal state.

3. All inputs are 5 V tolerant.

Table 1-11. Host Interface (Continued)

Signal Name Type State During

Reset1,2 Signal Description

1-13

Enhanced Synchronous Serial Interface 0 (ESSI0)

1.9 Enhanced Synchronous Serial Interface 0 (ESSI0)

Two synchronous serial interfaces (ESSI0 and ESSI1) provide a full-duplex serial port for serial

communication with a variety of serial devices, including one or more industry-standard codecs, other

DSPs, microprocessors, and peripherals that implement the Motorola serial peripheral interface (SPI).

Table 1-12. Enhanced Synchronous Serial Interface 0

Signal Name Type State During

Reset1,2 Signal Description

SC00

PC0

Input or Output

Ignored Input Serial Control 0—For asynchronous mode, this signal is used for

the receive clock I/O (Schmitt-trigger input). For synchronous

mode, this signal is used either for transmitter 1 output or f or serial

I/O flag 0.

Port C 0—The default configuration following reset is GPIO input

PC0. When configured as PC0, signal direction is controlled

through the Port C Direction Register. The signal can be

configured as ESSI signal SC00 through the Port C Control

SC01

PC1

Input/Output

Input or Output

Ignored Input Serial Control 1—For asynchronous mode, this signal is the

receiver frame sync I/O. For synchronous mode, this signal is

used either for transmitter 2 output or for serial I/O flag 1.

Port C 1—The default configuration following reset is GPIO input

PC1. When configured as PC1, signal direction is controlled

through the Port C Direction Register. The signal can be

configured as an ESSI signal SC01 through the Port C Control

SC02

PC2

Input/Output

Input or Output

Ignored Input Serial Control S ignal 2—The frame sync for both the transmitter

and receiver in synchronous mode, and for the trans mitter only in

asynchronous mode. When configured as an output, this signal is

the internally generated frame sync signal. When configured as an

input, this signal rec eives an external frame sync signal for the

transmitter (and the receiver in synchronous operation).

Port C 2—The default configuration following reset is GPIO input

PC2. When configured as PC2, signal direction is controlled

through the Port C Direction Register. The signal can be

configured as an ESSI signal SC02 through the Port C Control

SCK0

PC3

Input/Output

Input or Output

Ignored Input Serial Clock—Provides the serial bit r ate clock for the ESSI. The

SCK0 is a clock input or output, used by both the transmitter and

receiver in synchronous modes or by the transmitter in

asynchronous modes.

Although an external serial clock can be independent of and

asynchronous to the DSP system clock, it must exceed the

minimum clock cycle time of 6T (that is, the sy stem clock

frequency must be at least three times the external ESSI clock

frequency). The ESSI needs at least three DSP phases inside

each half of the serial clock.

Port C 3—The default configuration following reset is GPIO input

PC3. When configured as PC3, signal direction is controlled

through the Port C Direction Register. The signal can be

configured as an ESSI signal SCK0 through the Port C Control

1-14

Enhanced Synchronous Serial Interface 1 (ESSI1)

1.10 Enhanced Synchronous Serial Interface 1 (ESSI1)

SRD0

PC4

Input

Input or Output

Ignored Input Serial Receive Data—Receives serial data and transfers the data

to the ESSI Receive Shift Register. SRD0 is an input when data is

received.

Port C 4—The default configuration following reset is GPIO input

PC4. When configured as PC4, signal direction is controlled

through the Port C Direction Register. The signal can be

configured as an ESSI signal SRD0 through the Port C Control

STD0

PC5

Output

Input or Output

Ignored Input Serial Transmit Data—Transmits data from the Serial Transmit

Shift Register. STD0 is an output when data is transmitted.

Port C 5—The default configuration following reset is GPIO input

PC5. When configured as PC5, signal direction is controlled

through the Port C Direction Register. The signal can be

configured as an ESSI signal STD0 through the Port C Control

Notes: 1. In the Stop state, the signal maintains the last state as follows:

• If the last state is input, the signal is an ignored input.

• If the last state is output, the signal is tri-stated.

2. The Wait processing state does not affect the signal state.

3. All inputs are 5 V tolerant.

Table 1-13. Enhanced Serial Synchronous Interface 1

Signal Name Type State During

Reset1,2 Signal Description

SC10

PD0

Input or Output

Ignored Input Serial Control 0—For asynchronous mode, this signal is used for

the receive clock I/O (Schmitt-trigger input). For synchronous

mode, this signal is used either for transmitter 1 output or f or serial

I/O flag 0.

Port D 0—The default configuration following reset is GPIO input

PD0. When configured as PD0, signal direction is controlled

through the Port D Direction Register. The signal can be

configured as an ESSI signal SC10 through the Port D Control

SC11

PD1

Input/Output

Input or Output

Ignored Input Serial Control 1—For asynchronous mode, this signal is the

receiver frame sync I/O. For synchronous mode, this signal is

used either for Transmitter 2 output or for Serial I/O Flag 1.

Port D 1—The default configuration following reset is GPIO input

PD1. When configured as PD1, signal direction is controlled

through the Port D Direction Register. The signal can be

configured as an ESSI signal SC11 through the Port D Control

Table 1-12. Enhanced Synchronous Serial Interface 0 (Continued)

Signal Name Type State During

Reset1,2 Signal Description

1-15

Enhanced Synchronous Serial Interface 1 (ESSI1)

SC12

PD2

Input/Output

Input or Output

Ignored Input Serial Control S ignal 2—The frame sync for both the transmitter

and receiver in synchronous mode and for the transmitter only in

asynchronous mode. When configured as an output, this signal is

the internally generated frame sync signal. When configured as an

input, this signal rec eives an external frame sync signal for the

transmitter (and the receiver in synchronous operation).

Port D 2—The default configuration following reset is GPIO input

PD2. When configured as PD2, signal direction is controlled

through the Port D Direction Register. The signal can be

configured as an ESSI signal SC12 through the Port D Control

SCK1

PD3

Input/Output

Input or Output

Ignored Input Serial Clock—Provides the serial bit r ate clock for the ESSI. The

SCK1 is a clock input or output u sed by both the transmitter and

receiver in synchronous modes or by the transmitter in

asynchronous modes.

Although an external serial clock can be independent of and

asynchronous to the DSP system clock, it must exceed the

minimum clock cycle time of 6T (that is, the sy stem clock

frequency must be at least three times the external ESSI clock

frequency). The ESSI needs at least three DSP phases inside

each half of the serial clock.

Port D 3—The default configuration following reset is GPIO input

PD3. When configured as PD3, signal direction is controlled

through the Port D Direction Register. The signal can be

configured as an ESSI signal SCK1 through the Port D Control

SRD1

PD4

Input

Input or Output

Ignored Input Serial Receive Data—Receives serial data and transfers the data

to the ESSI Receive Shift Register. SRD1 is an input when data is

being received.

Port D 4—The default configuration following reset is GPIO input

PD4. When configured as PD4, signal direction is controlled

through the Port D Direction Register. The signal can be

configured as an ESSI signal SRD1 through the Port D Control

STD1

PD5

Output

Input or Output

Ignored Input Serial Transmit Data—Transmits data from the Serial Transmit

Shift Register. STD1 is an output when data is being transmitted.

Port D 5—The default configuration following reset is GPIO input

PD5. When configured as PD5, signal direction is controlled

through the Port D Direction Register. The signal can be

configured as an ESSI signal STD1 through the Port D Control

Notes: 1. In the Stop state, the signal maintains the last state as follows:

• If the last state is input, the signal is an ignored input.

• If the last state is output, the signal is tri-stated.

2. The Wait processing state does not affect the signal state.

3. All inputs are 5 V tolerant.

Table 1-13. Enhanced Serial Synchronous Interface 1 (Continued)

Signal Name Type State During

Reset1,2 Signal Description

1-16

Serial Communication Interface (SCI)

1.11 Serial Communication Interfac e (SCI)

The SCI provides a full duplex port for serial communication with other DSPs, microprocessors, or

peripherals such as modems.

Table 1-14. Serial Communication Interface

Signal Name Type State During

Reset1,2 Signal Description

RXD

PE0

Input

Input or Output

Ignored Input Serial Receive Data—Receives byte-oriented serial data and

transfers it to the SCI Receive Shift Register.

Port E 0—The default configuration following reset is GPIO input

PE0. When configured as PE0, signal direction is controlled

through the Port E Direction Register. The signal can be

configured as an SCI signal RXD through the Por t E Control

TXD

PE1

Output

Input or Output

Ignored Input Serial Transmit Data—Transmits data from the SCI Transmit

Data Register.

Port E 1—The default configuration following reset is GPIO input

PE1. When configured as PE1, signal direction is controlled

through the Port E Direction Register. The signal can be

configured as an SCI signal TXD through the Port E Control

SCLK

PE2

Input/Output

Input or Output

Ignored Input Serial Clock—Provides the input or output clock used by the

transmitter and/or the receiver.

Port E 2—The default configuration following reset is GPIO input

PE2. When configured as PE2, signal direction is controlled

through the Port E Direction Register. The signal can be

configured as an SCI signal SCLK through the Port E Control

Notes: 1. In the Stop state, the signal maintains the last state as follows:

• If the last state is input, the signal is an ignored input.

• If the last state is output, the signal is tri-stated.

2. The Wait processing state does not affect the signal state.

3. All inputs are 5 V tolerant.

1-17

Timers

1.12 Timers

The DSP56303 has three identical and independent timers. Each timer can use internal or external

clocking and can either interrupt the DSP56303 after a specified number of events (clocks) or signal an

external device after counting a specific number of internal events.

Table 1-15. Triple Timer Signals

Signal Name Type State During

Reset1,2 Signal Description

TIO0 Input or Output Ignored Input Timer 0 Schmitt-T rigger Input/Output— When Timer 0 functions

as an external event counter or in measurement mode, TIO0 is

used as input. When Timer 0 functions in watchdog, timer, or pulse

modulation mode, TIO0 is used as output.

The default mode after reset is GPIO input. TIO0 can be changed

to output or configured as a timer I/O through the Timer 0

Control/Status Register (TCSR0).

TIO1 Input or Output Ignored Input Timer 1 Schmitt-T rigger Input/Output— When Timer 1 functions

as an external event counter or in measurement mode, TIO1 is

used as input. When Timer 1 functions in watchdog, timer, or pulse

modulation mode, TIO1 is used as output.

The default mode after reset is GPIO input. TIO1 can be changed

to output or configured as a timer I/O through the Timer 1

Control/Status Register (TCSR1).

TIO2 Input or Output Ignored Input Timer 2 Schmitt-T rigger Input/Output— When Timer 2 functions

as an external event counter or in measurement mode, TIO2 is

used as input. When Timer 2 functions in watchdog, timer, or pulse

modulation mode, TIO2 is used as output.

The default mode after reset is GPIO input. TIO2 can be changed

to output or configured as a timer I/O through the Timer 2

Control/Status Register (TCSR2).

Notes: 1. In the Stop state, the signal maintains the last state as follows:

• If the last state is input, the signal is an ignored input.

• If the last state is output, the signal is tri-stated.

2. The Wait processing state does not affect the signal state.

3. All inputs are 5 V tolerant.

1-18

JTAG and OnCE Interface

1.13 JTAG and OnCE Interface

The DSP56300 family and in particular the DSP56303 support circuit-board test strategies based on the

IEEE 1149.1 Standard Test Access Port and Boundary Scan Architecture, the industry standard

developed under the sponsorship of the Test Technology Committee of IEEE and the JTAG.

The OnCE module provides a means to interface nonintrusi vely with the DSP56300 core and its

peripherals so that you can examine registers, memory, or on-chip peripherals. Functions of the OnCE

module are provided through the JTAG TAP signals.

For programming models, see the chapter on debugging support in the DSP56300 Family Manual.

Table 1-16. JTAG/OnCE Interface

Signal

Name Type State

During

Reset Signal Description

TCK Input Input Test Clock—A test clock input signal to synchronize the JTAG

test logic.

TDI Input Input Test Data Input— A test data serial input signal for test

instructions and data. TDI is sampled on the r ising edge of TCK

and has an internal pull-up resistor.

TDO Output Tri-stated Test Data Output—A test data serial output signal for test

instructions and data. TDO is actively driven in the shift-IR and

shift-DR controller states. TDO changes on the falling edge of

TCK.

TMS Input Input Test Mode Select—Sequences the test controller’s state

machine. TMS is sampled on the rising edge of TCK and has an

internal pull-up resistor.

TRST Input Input Test Reset—Initializes the test controller asynchronously. TRST

has an internal pull-up resistor. TRST must be asserted after

powerup.

DE Input/ Output

(open-drain) Input Debug Event—As an input, initiates Debug mode from an

external command controller, and, as an open-drain output,

acknowledges that the chip has entered Debug mode. As an

input, DE causes the DSP56300 core to finish executing the

current instruction, save the instruction pipeline information,

enter Debug mode, and wait for commands to be entered from

the debug serial input line. This signal is asserted as an output

for three clock cycles when the chip enters Debug mode as a

result of a debug request or as a result of meeting a breakpoint

condition. The DE has an internal pull-up resistor.

This signal is not a standard part of the JTAG TAP controller.

The signal connects directly to the OnCE module to initiate

debug mode directly or to provide a direct external indication that

the chip has entered Debug mode. All other interface with the

OnCE module must occur through the JTAG port.

Note: All inputs are 5 V tolerant.

2-1

Chapter 2

Specifications

2.1 Introduction

The DSP56303 is fabricated in high-density CMOS with Transistor-Transistor Logic (TTL) compatible

inputs and outputs.

2.2 Maximum Ratings

Note: In th e calculation of timing requirements, adding a maximum value of one specification to a

minimum value of another specification does not yield a reasonable sum. A maximum

specification is calculated using a worst case variation of process parameter values in one

direction. The minimum specification is calculated u sing the worst case for the same p arameters

in the opposite direction. Therefore, a “maximum” value for a specification never occurs in the

same device that has a “minimum” value for another specification; adding a maximum to a

minimum represents a condition that can never exist.

CAUTION

This device contains circuitry protecting

against damage due to high static voltage or

electrical fields; however, norm al precautions

should be taken to avoid exceeding maximum

voltage ratings. Reliability is enhanced if

unused inputs are tied to an appropriate logic

voltage lev el (for example, either GND or VCC).

2-2

Absolute Maximum Ratings

2.3 Absolute Maximum Ratings

2.4 Thermal Characte ristics

Table 2-1. Absolute Max im um Ratings1

Rating Symbol Value Unit

Supply Voltage VCC −0.3 to +4.0 V

All input voltages excluding “5 V tolerant” inputs VIN GND − 0.3 to V CC + 0.3 V

All “5 V tolerant” input voltages2VIN5 GND − 0.3 to 5.5 V

Current drain per pin excluding VCC and GND I 10 mA

Operating temperature range TJ−40 to +100 °C

Storage temperature TSTG −55 to +150 °C

Notes: 1. Abs olute maximum ratings are stress ratings only, and functional operation at the maximum is not

guaranteed. Stress beyond the maximum rating may affect device reliability or cause permanent

damage to the device.

2. At power-up, ensure that the voltage difference between the 5 V tolerant pins and the chip VCC never

exceeds 3.5 V.

Table 2-2. Therm al Char acter i st ic s

Characteristic Symbol TQFP Value MAP-BGA3

Value MAP-BGA4

Value Unit

Junction-to-ambient thermal resistance1RθJA or θJA 56 57 28 °C/W

Junction-to-case thermal resistance2RθJC or θJC 11 15 —°C/W

Thermal characterization parameter ΨJT 78—°C/W

Notes: 1. Junction-to-ambient thermal resistance is based on measurements on a horizontal single-sided printed

circuit board per JEDEC Specification JESD51-3.

2. Junction-to-case thermal resistance is based on measurements using a cold plate per S EM I G30-88,

with the exception that the cold plate temperature is used for the case temperature.

3. These are simulated values. See note 1 for test board conditions.

4. These are simulated values. The test board has two 2-ounc e signal layers and two 1-ounce solid

ground planes internal to the test board.

2-3

DC Electrical Characteristics

2.5 DC Electrical Character istics

Table 2-3. DC Electrical Characteristics6

Characteristics Symbol Min Typ Max Unit

Supply voltage VCC 3.0 3.3 3.6 V

Input high voltage

• D[0–23], BG, BB, TA

•MOD

1/IRQ1, RESET, PINIT/ N MI and all

JTAG/ES SI /SC I/ Timer/H I08 pins

• EXTAL8

VIH

VIHP

VIHX

2.0

0.8 × VCC

—

VCC

5.25

VCC

Input low voltage

• D[0–23], BG, BB, TA, MOD1/IRQ1, RESET, PINIT

• All JTAG/ESSI/SCI/Timer/HI08 pins

• EXTAL8

VIL

VILP

VILX

–0.3

—

0.8

0.2 × VCC

Input leakage current IIN –10 — 10 µA

High impedance (off-state) input c urrent (@ 2.4 V / 0.4 V) ITSI –10 — 10 µA

Output high voltage

•TTL (I

OH = –0.4 mA)5,7

• CMOS (IOH = –10 µA)5

VOH 2.4

VCC – 0.01 —

——

—V

Output low voltage

•TTL (I

OL = 1.6 mA, open-drain pins IOL = 6.7 m A)5,7

• CMOS (IOL = 10 µA)5

VOL —

——

—0.4

0.01 V

Internal supply current2:

• In Normal mode

• In Wait mode3

• In Stop mode4

ICCI

ICCW

ICCS

—

127

7.5

100

—

µA

PLL supply current — 1 2.5 mA

Input capacitance5CIN — — 10 pF

Notes: 1. Refers to MODA/IRQA, MODB/IRQB, MODC/IRQC, and MODD/IRQD pins.

2. Power Consumption Consideratio ns on page Section 4-3 provides a formula to c ompute the

estimated current requirements in Normal mode. In order to obtain these results, all inputs must be

terminated (that is, not allowed to float). Measurements are based on synthetic intensive DSP

benchmarks (see Appendix A). The power consumption numbers in this specification are 90 percent

of the measured results of this benchmark. This reflec ts typical DSP applications. Typical internal

supply current is measured with VCC = 3.3 V at TJ = 100°C.

3. In order to obtain these results, all inputs must be terminated (that is, not allowed to float).

4. In order to obtain these results, all inputs that are not disconnected at Stop mode must be terminated

(that is, not allowed to float) . PLL and XTAL signals are disabled during Stop state.

5. Periodically sampled and not 100 percent tested.

6. VCC = 3.3 V ± 0.3 V; TJ = –40°C to +100 °C, CL = 50 pF

7. This characteristic does not apply to XTAL and PCAP.

8. Driving EXTAL to the low VIHX or the high VILX value may cause additional power consumption (DC

current). To minimize power consumption, the minimum VIHX should be no lower than

0.9 × VCC and the maximum VILX should be no higher than 0.1 × VCC.

2-4

AC Electrical Characteristics

2.6 AC Electrical Character istics

The timing waveforms shown in the AC electrical characteristics section are tested with a V IL maxi mum

of 0.3 V and a VIH m inimum of 2.4 V for all pins except EXTAL, which is tested using the inp ut levels

shown in Note 6 of the previous table. AC timing specifications, which are referenced to a device input

signal, are measured in production with respect to the 50 percent point of t he respective input signal

transition. DSP56303 outpu t levels are measured with th e production test machine VOL and VOH

reference levels set at 0.4 V and 2.4 V, respectively.

Note: Although the minimum value for the frequency of EXTAL is 0 MHz, the device AC test

conditions are 15 MHz and rated speed.

2.6.1 Internal Clocks Table 2-4. Internal Clocks, CLKOUT

Characteristics Symbol Expression1, 2

Min Typ Max

Internal operation frequency and

CLKOUT with PLL enabled f— (Ef × MF)/

(PDF × DF) —

Internal operation frequency and

CLKOUT with PLL disabled f — Ef/2 —

Internal clock and CLKOUT high

period

• With PLL disabled

• With PLL enabled and MF ≤ 4

• With PLL enabled and MF > 4

TH—

0.49 × ETC ×

PDF × DF/MF

0.47 × ETC ×

PDF × DF/MF

ETC

—

0.51 × ETC ×

PDF × DF/MF

0.53 × ETC ×

PDF × DF/MF

Internal clock and CLKOUT low

period

• With PLL disabled

• With PLL enabled and MF ≤ 4

• With PLL enabled and MF > 4

TL—

0.49 × ETC ×

PDF × DF/MF

0.47 × ETC ×

PDF × DF/MF

ETC

—

0.51 × ETC ×

PDF × DF/MF

0.53 × ETC ×

PDF × DF/MF

Internal clock and CLKOUT cycle

time with PLL enabled TC —ET

C × PDF ×

DF/MF —

Internal clock and CLKOUT cycle

time with PLL dis abled TC —2 × ETC—

Instruction cycle time ICYC —T

C—

Notes: 1. DF = Division Factor; Ef = External frequency; ETC = External clock cycle; MF = Multi plication Factor;

PDF = Predivision Factor; TC = internal clock cycle

2. See the PLL and Clock Generation section in the

DSP56300 Family Manual

for a detailed disc ussion

of the PLL.

2-5

AC Electrical Characteristics

2.6.2 External Clock Operation

The DSP56303 system cloc k is derived from the on -chip oscillator or is externally supplied. To use the

on-chip oscillator, connect a crystal and associated resistor/capacitor components to EXTAL and XTAL;

examples are shown in Figure 2-1.

If an externally-supplied square wave voltage source is used, disable the internal oscillator circuit during

bootup by settin g XTLD (PCTL Register bit 16 = 1—s ee the DSP56303 User’s Manual). The external

square wave source connects to EXTAL; XTAL is not physically connected to the board or socket. Figure

2-2 shows the relationship between the EXTAL input and the internal clock and CLKOUT.

Figure 2-1. Crystal Oscillator Circuits

Figure 2-2. External Clock Timing

Suggested Component Values:

fOSC = 4 MHz

R = 680 kΩ ± 10%

C = 56 pF ± 20%

Calculations are for a 4/20 MHz crystal with the

following parameters:

■ CLof 30/20 pF,

■ C0 of 7/6 pF,

■ series resistance of 100/20 Ω, and

■ drive level of 2 mW.

Suggested Component Values:

fOSC = 32.768 kHz

R1 = 3.9 MΩ ± 10 %

C = 22 pF ± 20%

R2 = 200 kΩ ± 10%

Calculations are for a 32.768 kHz crystal with the

following parameters:

■ load capacitance (CL) of 12.5 pF,

■ shunt capacitance (C0) of 1.8 pF,

■ series resistance of 40 kΩ, and

■ drive level of 1 µW.

XTAL1

C C

Fundamental Frequency

Fork Crystal Oscillator

XTALEXTAL

XTAL1

Fundamental Frequency

Crystal Oscillator

XTALEXTAL

fOSC = 20 MHz

R = 680 kΩ ± 10%

C = 22 pF ± 20%

Note: Ensure that in

the PCTL Register:

■ XTLD (bit 16) = 0

■ If fOSC ≤ 200 kHz,

XTLR (bit 15) = 1

Note: Ensure that in

the PCTL Register:

■ XTLD (bit 16) = 0

■ If fOSC > 200 kHz,

XTLR (bit 15) = 0

EXTAL

VILX

VIHX

Midpoint

Note: The midpoint is

0.5 (VIHX + VILX).

ETHETL

ETC

CLKOUT with

PLL disabled

CLKOUT with

PLL enabled

2-6

AC Electrical Characteristics

2.6.3 Phase Lock Loop (PLL) Characteristics

Table 2-5. Clock Operation

No. Characteristics Symbol 100 MHz

Min Max

1 Frequency of EXTAL (EXTAL Pin Frequency)

The rise and fall time of this external clock should be 3 ns maximum . Ef 0 100.0

2 EXTAL input high1, 2

• With PLL disabled (46.7%–53.3% duty cycle6)

• With PLL enabled (42.5%–57.5% duty cycle6) ETH 4.67 ns

4.25 ns ∞

157.0 µs

3 EXTAL input low1, 2

• With PLL disabled (46.7%–53.3% duty cycle6)

• With PLL enabled (42.5%–57.5% duty cycle6) ETL 4.67 ns

4.25 ns ∞

157.0 µs

4 EXTAL cycle time 2

• With PLL disabled

• With PLL enabled ETC 10 .00 ns

10.00 ns ∞

273.1 µs

5 Internal clock change from EXTAL fall with PLL disabled 4.3 ns 11.0 ns

6 a.Internal clock rising edge from EXTAL rising edge with PLL enabled

(MF = 1 or 2 or 4, PDF = 1, Ef > 15 MHz)3,5

b. Internal clock falling edge from EXTAL falling edge with PLL enabled

(MF ≤ 4, PDF ≠ 1, Ef / PDF > 15 MHz)3,5

0.0 ns

1.8 ns

7 Instruction cycle time = ICYC = TC4

(see Table 2-4) (46.7%–53.3% duty cycle)

• With PLL disabled

• With PLL enabled

ICYC

20.0 ns

10.00 ns ∞

8.53 µs

Notes: 1. Measured at 50 percent of the input transition.

2. The maximum value for PLL enabled is given for minimum VCO frequency (see Table 2-4) and

maximum MF.

3. Periodically sampled and not 100 percent tested.

4. The maximum value for PLL enabled is given for minimum VCO frequency and maximum DF.

5. The skew is not guaranteed for any other MF value.

6. The indicated duty cycle is for the specified maximum frequency for which a part is rated. The minimum

clock high or low time required for correction operation, however, remains the same at lower operating

frequencies; therefore, when a lower clock frequency is used, the signal symmetry may vary from the

specified duty cycle as long as the minimum high time and low time requirements are met.

Table 2-6. PLL Characteristics

Characteristics 100 MHz Unit

Min Max

Voltage Controlled Oscillator (VCO) frequency when PLL enabled

(MF × Ef × 2/PDF) 30 200 MHz

PLL external capacitor (PCAP pin to VCCP) (CPCAP1)

• @ MF ≤ 4

• @ MF > 4 (580 × MF) − 100

830 × MF (780 × MF) − 140

1470 × MF pF

Note: CPCAP is the value of the PLL capacitor (connected between the PCAP pin and VCCP) computed using the

appropriate expression listed above.

2-7

AC Electrical Characteristics

2.6.4 Reset, Stop, Mode Select, and Interrupt Timing

Table 2-7. Reset, Stop, Mode Select, and Interrupt Timing6

No. Characteristics Expression 100 MHz Unit

Min Max

8 Delay from RESET assertion to all pins at reset value3——26.0ns

9 Required RESET duration4

• Power on, external clock generator, PLL disabled

• Power on, external clock generator, PLL enabled

• Power on, internal oscillator

• During STOP, XTAL disabled (PCTL Bit 16 = 0)

• During STOP, XTAL enabled (PCTL Bit 16 = 1)

• During normal operation

50 × ETC

1000 × ETC

75000 × ETC

2.5 × TC

500.0

10.0

0.75

25.0

—

µs

10 Delay from asynchronous RESET deassertion to first external address

output (internal reset deassertion)5

• Minimum

• Maximum 3.25 × TC + 2.0

20.25 × TC + 10 34.5

——

212.5 ns

11 Synchronous reset set-up time from RESET deassertion to CLKOUT

Transition 1

• Minimum

• Maximum TC5.9

——

10.0 ns

12 Synchronous reset deasserted, delay time from the CLKOUT Transition 1

to the first external address output

• Minimum

• Maximum 3.25 × TC + 1.0

20.25 × TC + 1.0 33.5

——

203.5 ns

13 Mode select setup time 30.0 — ns

14 Mode select hold time 0.0 — ns

15 Minimum edge-triggered interrupt request assertion width 6.6 — ns

16 Minimum edge-triggered interrupt request deassertion width 6.6 — ns

17 Delay from IRQA, IRQB, IRQC, IRQD, NM I assertion to external memory

access address out valid

• Caused by first interrupt instruction fetch

• Caused by first interrupt instruction execution 4.25 × TC + 2.0

7.25 × TC + 2.0 44.5

74.5 —

—ns

18 Delay from IRQA, IRQB, IRQC , IR Q D , NMI assertion to general-purpose

transfer output valid caused by first interrupt instruction execution 10 × TC + 5.0 105 .0 — ns

19 Delay from address output valid caused by first interrupt instruction

execute to interrupt request deassertion for level sensitive fast interrupts1,

7, 8

(WS + 3.75) × TC – 10.94 — Note 8 ns

20 Delay from RD assertion to interrupt request deassertion for level

sensitive fast interrupts1, 7, 8 (WS + 3.25) × TC – 10.94 — Note 8 ns

21 Delay from WR assertion to interrupt request deassertion for level

sensitive fast interrupts1, 7, 8

• DRAM for all WS

•SRAM WS = 1

• SRAM WS = 2, 3

•SRAM WS ≥ 4

(WS + 3.5) × TC – 10.94

(WS + 3) × TC – 10.94

(WS + 2.5) × TC – 10.94

—

Note 8

22 Synchronous interrupt set-up time from IRQA, IR QB, IR QC, IRQD, NMI

assertion to the CLKOUT Transition 2 5.9 TCns

23 Synchronous interrupt delay time from the CLKOUT Transition 2 to the

first external address output valid caused by the first instruction fetch af ter

coming out of Wait Processing state

• Minimum

• Maximum 8.25 × TC + 1.0

24.75 × TC + 5.0 83.5

——

252.5 ns

24 Duration for IRQA assertion to recover from Stop state 5.9 — ns

2-8

AC Electrical Characteristics

25 Delay from IRQA assertion to fetch of first instruction (when exiting

Stop)2, 3

• PLL is not active during Stop (PCTL Bit 17 = 0) and Stop delay is

enabled (Operating Mode Register Bit 6 = 0)

• PLL is not active during Stop (PCTL Bit 17 = 0) and Stop delay is not

enabled (Operating Mode Register Bit 6 = 1)

• PLL is active during Stop (PCTL Bit 17 = 1) (Implies No Stop Delay)

PLC × ETC × PDF + (128 K −

PLC/2) × TC

PLC × ETC × PDF + (23.75 ±

0.5) × TC

(8.25 ± 0.5) × TC

1.3

232.5 ns

87.5

9.1

12.3 ms

97.5

26 Duration of level sensitive IRQA assertion to ensure interrupt service

(when exiting Stop)2, 3

• PLL is not active during Stop (PCTL Bit 17 = 0) and Stop delay is

enabled (Operating Mode Register Bit 6 = 0)

• PLL is not active during Stop (PCTL Bit 17 = 0) and Stop delay is not

enabled (Operating Mode Register Bit 6 = 1)

• PLL is active during Stop (PCTL Bit 17 = 1) (implies no Stop delay)

PLC × ET C × PDF + (128K −

PLC/2) × TC

PLC × ETC × PDF +

(20.5 ± 0.5) × TC

5.5 × TC

13.6

12.3

55.0

—

27 Interrupt Requests Rate

• HI08 , ESSI, SCI, Timer

•DMA

•IRQ

, NMI (edge trigger)

•IRQ

, NMI (level trigger)

Maximum:

12 × TC

8 × TC

12 × TC

—

120.0

80.0

120.0

28 DMA Reques ts Rate

• Data read from HI08, ESSI, SCI

• Data write to HI08, ESSI, SCI

• Timer

•IRQ

, NMI (edge trigger)

Maximum:

6 × TC

7 × TC

2 × TC

3 × TC

—

60.0

70.0

20.0

30.0

29 Delay from IRQA, IRQB, IRQC, IRQD, NMI assertion t o external memory

(DMA source) access address out valid Minimum:

4.25 × TC + 2.0 30.3 — ns

Table 2-7. Reset, Stop, Mode Select, and Interrupt Timing6 (Conti nu ed)

No. Characteristics Expression 100 MHz Unit

Min Max

2-9

AC Electrical Characteristics

Notes: 1. When fast interrupts are used and IRQA, IRQB , IRQC , and IRQD are defined as level-sensitive, timings 19 through 21 apply to

prevent multiple interrupt service. To avoid these timing restrictions, the deasserted Edge-triggered mode is recommended when

fast interrupts are used. Long interrupts are recommended for Level-sensitive mode.

2. This timing depends on several settings:

• For PLL disable, using internal oscillator (PLL Control Register (PCTL) Bit 16 = 0) and oscillator disabled during Stop (PCTL Bit

17 = 0), a stabilization delay is required to assure that the oscillator is stable before program s are executed. Resetting the Stop

delay (Operating Mode Register Bit 6 = 0) provides the proper delay. While Operating Mode Register Bit 6 = 1 can be set, it is not

recommended, and these specifications do not guarantee timings for that case.

• For PLL disable, using internal oscillator ( PCTL Bit 16 = 0) and oscillator enabled dur ing Stop (PCTL Bit 17=1), no stabilization

delay is required and recovery is minimal (Operating Mode Register Bit 6 setting is ignored).

• For PLL disable, using external clock (PCTL Bit 16 = 1), no stabilization delay is required and recovery time is defined by the

PCTL Bit 17 and Operating Mode Register Bit 6 settings.

• For PLL enable, if PCTL B it 17 is 0, the PLL is shutdown during Stop. Recovering from Stop requires the PLL to get locked. The

PLL lock procedure duration, PLL Lock Cycles (PLC), may be in the range of 0 to 1000 cycles. This procedure occurs in parallel

with the stop delay counter, and stop recovery ends when the last of these two events occurs. The stop delay counter completes

count or PLL lock procedure completion.

• PLC value for PLL disable is 0.

• The maximum value for ET C is 4096 (maximum MF) divided by the desired internal frequency (that is, for 66 MHz it is 4096/66

MHz = 62 µs). During the stabilization period, TC, TH, and TL is not constant, and their width may vary, so timing may vary as well.

3. Periodically sampled and not 100 percent tested.

4. Value depends on clock source:

• For an external clock generator, RESET duration is measured while RESET is asserted, VCC is valid, and the EXTAL input is

active and valid.

• For an internal oscillator, RESET duration is measured while RESET is asserted and VCC is valid. The specified timing reflects

the crystal oscillator stabilization time after power-up. This number is affected both by the specifications of the crystal and other

components connected to the oscillator and reflects worst case conditions.

• When the VCC is valid, but the other “required RESET duration” conditions (as specified above) have not been yet met, the

device circuitry is in an uninitialized state that can result in significant powe r consum ption and heat-up. Designs should minimize

this state to the shortest possible duration.

5. If PLL does not lose lock.

6. VCC = 3.3 V ± 0.3 V; TJ = –40°C to +100°C, CL = 50 pF.

7. WS = number of wait states (measured in clock cycles, number of TC).

8. Use the expression to compute a maximum value.

Figure 2-3. Reset Timing

Table 2-7. Reset, Stop, Mode Select, and Interrupt Timing6 (Conti nu ed)

No. Characteristics Expression 100 MHz Unit

Min Max

VIH

RESET

Reset Value

First Fetch

All Pins

A[0–17]

910

2-10

AC Electrical Characteristics

Figure 2-4. Synchronous Reset Timing

Figure 2-5. External Fast Interrupt Timing

CLKOUT

RESET

A[0–17]

a) First Interrupt Instruction Execution

General

Purpose

I/O

IRQA, IRQB,

IRQC, IRQD,

NMI

b) General-Purpose I/O

IRQA, IRQB,

IRQC, IRQD,

NMI

1917

First Interrupt Instruction

Execution/Fetch

2-11

AC Electrical Characteristics

Figure 2-6. External Interrupt Timing (Negative Edge-Triggered)

Figure 2-7. Synchronous Interrupt from Wait State Timing

Figure 2-8. Operati ng Mod e Sele ct Ti mi ng

IRQA, IRQB,

IRQC, IRQD, N M I

IRQA, IRQB,

IRQC, IRQD, N M I

CLKOUT

IRQA, IRQB,

IRQC, IRQ D ,

NMI

A[0–17]

VIH

VIL

VIH

VIL

IRQA, IRQB ,

IRQC, IRQD , NMI

RESET

MODA, MO DB ,

MODC, MODD,

PINIT

2-12

AC Electrical Characteristics

Figure 2-9. Recovery from Stop State Using IRQA

Figure 2-10. Recovery from Stop State Using IRQA Interrupt Service

Figure 2-11. External Memory Access (DMA Source) Timing

First Instruction Fetch

IRQA

A[0–17]

IRQA

A[0–17] First IR Q A Interrupt

Instru ct ion Fetch

DMA Source Address

First Interrupt Instruction Execution

A[0–17]

IRQA, IR QB,

IRQC, IRQ D ,

NMI

2-13

AC Electrical Characteristics

2.6.5 External Memory Expansion Port (Port A)

2.6.5.1 SRAM Timing

Table 2-8. SRAM Read and Write Accesses

No. Characteristics Symbol Expression1100 MHz Unit

Min Max

100 Address valid and AA assertion pulse width2tRC, t WC (WS + 1) × TC − 4.0

[1 ≤ WS ≤ 3]

(WS + 2) × TC − 4.0

[4 ≤ WS ≤ 7]

(WS + 3) × TC − 4.0

[WS ≥ 8]

16.0

56.0

106.0

—

101 Addr ess and AA valid to WR assertion tAS 0.25 × TC − 2.0

[WS = 1]

0.75 × TC − 2.0

[2 ≤ WS ≤ 3]

1.25 × TC − 2.0

[WS ≥ 4]

0.5

5.5

10.5

—

102 WR assertion pulse width tWP 1. 5 × TC − 4.0

[WS = 1]

WS × TC − 4.0

[2 ≤ WS ≤ 3]

(WS − 0.5) × TC − 4.0

[WS ≥ 4]

11.0

16.0

31.0

—

103 WR deassertion to address not valid tWR 0.25 × TC − 2.0

[1 ≤ WS ≤ 3]

1.25 × TC − 4.0

[4 ≤ WS ≤ 7]

2.25 × TC − 4.0

[WS ≥ 8]

0.5

8.5

18.5

—

104 Address and AA valid to input data valid tAA, tAC (W S + 0.75) × TC − 5.0

[WS ≥ 1] — 12.5 ns

105 RD assertion to input d ata valid tOE (WS + 0.25) × TC – 5.0

[WS ≥ 1] —7.5ns

106 RD deassertion to data not valid ( data hold

time) tOHZ 0.0 — ns

107 Addr ess valid to WR deass ertion2tAW (WS + 0.75) × TC − 4.0

[WS ≥ 1] 13.5 — ns

108 Data valid to WR deassertion (data setup

time) tDS (tDW)(WS − 0.25) × TC − 3.0

[WS ≥ 1] 4.5 — ns

109 Data hold time from WR deassertion tDH 0.25 × TC − 2.0

[1 ≤ WS ≤ 3]

1.25 × TC − 2.0

[4 ≤ WS ≤ 7]

2.25 × TC − 2.0

[WS ≥ 8]

0.5

10.5

20.5

—

110 WR assertion to data active — 0.75 × TC − 3.7

[WS = 1]

0.25 × TC – 3.7

[2 ≤ WS ≤ 3]

–0.25 × TC − 3.7

[WS ≥ 4]

3.8

–1.2

–6.2

—

2-14

AC Electrical Characteristics

111 WR deassertion to data high impedance — 0.25 × TC + 0.2

[1 ≤ WS ≤ 3]

1.25 × TC + 0.2

[4 ≤ WS ≤ 7]

2.25 × TC + 0.2

[WS > 8]

—

2.7

12.7

22.7

112 Previous RD deassertion to data active (write) — 1.25 × TC – 4.0

[1 ≤ WS ≤ 3]

2.25 × TC – 4.0

[4 ≤ WS ≤ 7]

3.25 × TC – 4.0

[WS > 8]

8.5

18.5

28.5

—

113 RD deassertion time — 0.75 × TC − 4.0

[1 ≤ WS ≤ 3]

1.75 × TC − 4.0

[4 ≤ WS ≤ 7]

2.75 × TC − 4.0

[WS ≥ 8]

3.5

13.5

23.5

—

114 WR deassertion time — 0.5 × TC − 4.0

[WS = 1]

TC − 4.0

[2 ≤ WS ≤ 3]

2.5 × TC − 4.0

[4 ≤ WS ≤ 7]

3.5 × TC − 4.0

[WS ≥ 8]

1.0

6.0

21.0

31.0

—

115 Addr ess valid to RD assertion — 0.5 × TC − 4.0 1.0 — ns

116 RD assertion pulse width — (WS + 0.25) × TC −4.0 8.5 — ns

117 RD deassertion to address not valid — 0.25 × TC − 2.0

[1 ≤ WS ≤ 3]

1.25 × TC − 2.0

[4 ≤ WS ≤ 7]

2.25 × TC − 2.0

[WS ≥ 8]

0.5

10.5

20.5

—

118 TA setup before RD or WR deassertion4— 0.25 × TC + 2.0 4.5 — ns

119 TA hold after RD or WR deassertion — — 0 — ns

Notes: 1. WS is the number of wait states specified in the BCR. An expression is used to compute the number

listed as the minimum or maximum value, as appropriate.

2. Timings 100, 107 are guaranteed by design, not tested.

3. All timings for 100 MHz are measured from 0.5 × Vcc to 0.5 × Vcc.

4. Timing 118 is relative to the deassertion edge of RD or WR even if TA remains asserted.

5. VCC = 3.3 V ± 0.3 V; TJ = –40°C to +100°C, CL = 50 pF

Table 2-8. SRA M Read and Wr it e Acces ses (C onti nue d)

No. Characteristics Symbol Expression1100 MHz Unit

Min Max

2-15

AC Electrical Characteristics

Figure 2-12. SRAM R ead Access

Figure 2-13. SRAM Write Access

A[0–17]

D[0–23]

AA[0–3]

105 106

113

104

116 117

100

118

Data

119

Note: Address lines A[0–17] hold their state after a

read or write operation. A A[0–3] do not hold their

state after a read or write operation.

A[0–17]

Data

Out

D[0–23]

AA[0–3]

100

102101

107

114

108 109

103

118 119

Note: Address lines A[0–17] hold their state after a

read or write operation. AA[0–3] do not hold their

state after a read or write operation.

2-16

AC Electrical Characteristics

2.6.5.2 DRAM Timing

The selection guides in Figure 2-14 and Figure 2-17 are for primary selection only. Final selection

should be based on the timing in the following tables. For example, the selection guide suggests that four

wait states must be used for 100 MH z operation with Page Mode DRAM. However, consulting the

appropriate table, a designer can evaluate whether fewer wait states might suffice by determining which

timing prevents operation at 100 MHz, running the chip at a slightly lower frequency (for example, 95

MHz), using faster DRAM (if it becomes available), and manipulating control factors such as capacitive

and resistive load to improv e overall system performance.

Figure 2-14. DRAM Page Mode Wait State Selection Guide

Chip frequency

(MHz)

DRAM type

(tRAC ns)

100

40 66 80 100

1 Wait states

2 Wait states

3 Wait states

4 Wait states

Note: This figure should be used for primary selection. For exact

and detailed timings, see the following tables.

50 120

2-17

AC Electrical Characteristics

Table 2-9. DRAM Page Mode Timings, Three Wait States1,2,3

No. Characteristics Symbol Expression4100 MHz Unit

Min Max

131 Page mode cycle time for two consecutive accesses of the

same direction

Page mode cycle time for mixed (read and write) accesses tPC

4 × TC

3.5 × TC

40.0

35.0

—

132 CAS assertion to data valid (read) tCAC 2 × TC − 5.7 — 14.3 ns

133 Column address valid to data valid (read) tAA 3 × TC − 5.7 — 24.3 ns

134 CAS deassertion to data not valid (read hold time) tOFF 0.0 — ns

135 Last CAS assertion to RAS deassertion tRSH 2.5 × TC − 4.0 21.0 — ns

136 Prev ious CAS deassertion to RAS deassertion tRHCP 4.5 × TC − 4.0 41.0 — ns

137 CAS assertion pulse width tCAS 2 × TC − 4.0 16.0 — ns

138 Last CAS deassertion to RAS assertion5

• BRW[1–0] = 00, 01—not applicable

• BRW[1–0] = 10

• BRW[1–0] = 11

tCRP —

4.75 × TC − 6.0

6.75 × TC − 6.0

—

41.5

61.5

—

139 CAS deassertion pulse width tCP 1.5 × TC − 4.0 11.0 — ns

140 Column addres s valid to CAS assertion tASC TC − 4.0 6.0 — ns

141 CAS assertion to column address not valid tCAH 2.5 × TC − 4.0 21.0 — ns

142 Last column address valid to RAS deassertion tRAL 4 × TC − 4.0 36.0 — ns

143 WR deassertion to CAS assertion tRCS 1.25 × TC − 4.0 8.5 — ns

144 CAS deassertion to WR assertion tRCH 0.75 × TC − 4.0 3.5 — ns

145 CAS assertion to WR deass ertion tWCH 2.25 × TC − 4.2 18.3 — ns

146 WR assertion pulse width tWP 3.5 × TC − 4.5 30.5 — ns

147 Last WR assertion to RAS deassertion tRWL 3.75 × TC − 4.3 33.2 — ns

148 WR assertion to CAS deassertion tCWL 3.25 × TC − 4.3 28.2 — ns

149 Data valid to CAS assertion (write) tDS 0.5 × TC – 4.5 0.5 — ns

150 CAS assertion to data not valid (write) tDH 2.5 × TC − 4.0 21.0 — ns

151 WR assertion to CAS assertion tWCS 1.25 × TC − 4.3 8.2 — ns

152 Last RD assertion to RAS deassertion tROH 3.5 × TC − 4.0 31.0 — ns

153 RD assertion to data valid t GA 2.5 × TC − 5.7 — 19.3 ns

154 RD deassertion to data not valid6 t

GZ 0.0 — ns

155 WR assertion to data active 0.75 × TC – 1.5 6.0 — ns

156 WR deassertion to data high impedance 0.25 × TC—2.5ns

Notes: 1. The number of wait states for Page mode access is specified in the DRAM Control Register.

2. The refresh period is specified in the DRAM Control Register.

3. The asynchronous delays specified in the expressions are valid for the DSP56303.

4. All the timings are calculated for the worst case. Some of the timings are better for specific cases (for

example, tPC equals 4 × TC for read -after-rea d or write-after-wr ite sequences). An expr ession is used to

compute the number listed as the minimum or maximum value listed, as appropriate.

5. BRW[1–0] (DRAM control register bits) defines the number of wait states that should be inserted in each

DRAM out-of page-access.

6. RD deassertion always occurs after CAS deassertion; therefore, the restricted timing is tOFF and not tGZ.

2-18

AC Electrical Characteristics

Table 2-10. DRAM Page Mode Timings, Four Wait States1,2,3

No. Characteristics Symbol Expression4100 MHz Unit

Min Max

131 Page mode cycle time for two consecutive accesses of the

same direction

Page mode cycle time for mixed (read and write) accesses tPC

5 × TC

4.5 × TC

50.0

45.0

—

132 CAS assertion to data valid (read) tCAC 2.75 × TC − 5.7 — 21.8 ns

133 Column address valid to data valid (read) tAA 3.75 × TC − 5.7 — 31.8 ns

134 CAS deassertion to data not valid (read hold time) tOFF 0.0 — ns

135 Last CAS assertion to RAS deassertion tRSH 3.5 × TC − 4.0 31.0 — ns

136 Prev ious CAS deassertion to RAS deassertion tRHCP 6 × TC − 4.0 56.0 — ns

137 CAS assertion pulse width tCAS 2. 5 × TC − 4.0 21.0 — ns

138 Last CAS deassertion to RAS assertion5

• BRW[1–0] = 00, 01—Not a pplicable

• BRW[1–0] = 10

• BRW[1–0] = 11

tCRP —

5.25 × TC − 6.0

7.25 × TC − 6.0

—

46.5

66.5

—

139 CAS deassertion pulse width tCP 2 × TC − 4.0 16.0 — ns

140 Column addres s valid to CAS assertion tASC TC − 4.0 6.0 — ns

141 CAS assertion to column address not valid tCAH 3.5 × TC − 4.0 31.0 — ns

142 Last column address valid to RAS deassertion tRAL 5 × TC − 4.0 46.0 — ns

143 WR deassertion to CAS assertion tRCS 1.25 × TC − 4.0 8.5 — ns

144 CAS deassertion to WR assertion tRCH 1.25 × TC – 3.7 8.8 — ns

145 CAS assertion to WR deass ertion tWCH 3.25 × TC − 4.2 28.3 — ns

146 WR assertion pulse width tWP 4.5 × TC − 4.5 40.5 — ns

147 Last WR assertion to RAS deassertion tRWL 4.75 × TC − 4.3 43.2 — ns

148 WR assertion to CAS deassertion tCWL 3.75 × TC − 4.3 33.2 — ns

149 Data valid to CAS assertion (write) tDS 0.5 × TC – 4.5 0.5 — ns

150 CAS assertion to data not valid (write) tDH 3.5 × TC − 4.0 31.0 — ns

151 WR assertion to CAS assertion tWCS 1.25 × TC − 4.3 8.2 — ns

152 Last RD assertion to RAS deassertion tROH 4.5 × TC − 4.0 41.0 — ns

153 RD assertion to data valid t GA 3.25 × TC − 5.7 — 26.8 ns

154 RD deassertion to data not valid6tGZ 0.0 — ns

155 WR assertion to data active 0.75 × TC – 1.5 6.0 — ns

156 WR deassertion to data high impedance 0.25 × TC—2.5ns

Notes: 1. The number of wait states for Page mode access is specified in the DRAM Control Register.

2. The refresh period is specified in the DRAM Control Register.

3. The asynchronous delays specified in the expressions are valid for the DSP56303.

4. All the timings are calculated for the worst case. Some of the timings are better for specific cases (for

example, tPC equals 3 × TC for read-after-read or write-after-write sequences). An expressions is used to

calculate the maximum or minimum value listed, as appropriate.

5. BRW[1–0] (DRAM control register bits) defines the number of wait states that should be inserted in each

DRAM out-of-page access.

6. RD deassertion always occurs after CAS deassertion; therefore, the restricted timing is tOFF and not tGZ.

2-19

AC Electrical Characteristics

Figure 2-15. DRAM Page Mode Write Accesses

Figure 2-16. DRAM Page Mode Read Acces ses

RAS

CAS

A[0–17]

D[0–23]

Column

Row

Data Out D ata Out Data Out

Last ColumnColumn

Add Address Address Address

136

135131

139

141

137 140 142

147

144151

148146

155 156

150

138

145

149

RAS

CAS

A[0–17]

D[0–23]

Column Last Column

Column

Row

Data In Data InData In

Add Address Address Address

136

135131

137

140 141 142

143

152

133

153

132

138139

134

154

2-20

AC Electrical Characteristics

Figure 2-17. DRAM Out-of-Page Wait State Selection Guide

Table 2-11. DRAM Out-of-Page and Refresh Timings, Eleven Wait States1,2

No. Characteristics Symbol Expression3100 MHz Unit

Min Max

157 Random read or write cycle time tRC 12 × TC120.0 —ns

158 RAS assertion to data valid (read) tRAC 6.25 × TC − 7.0 — 55.5 ns

159 CAS assertion to data valid (read) tCAC 3.75 × TC − 7.0 — 30.5 ns

160 Column address valid to data valid (read) tAA 4.5 × TC − 7.0 — 38.0 ns

161 CAS deassertion to data not valid (read hold time) tOFF 0.0 — ns

162 RAS deassertion to RAS assertion tRP 4.25 × TC − 4.0 38.5 — ns

163 RAS assertion pulse width tRAS 7.75 × TC − 4.0 73.5 — ns

164 CAS assertion to RAS deassertion tRSH 5.25 × TC − 4.0 48.5 — ns

165 RAS assertion to CAS deassertion tCSH 6.25 × TC − 4.0 58.5 — ns

166 CAS assertion pulse width tCAS 3.75 × TC − 4.0 33.5 — ns

167 RAS assertion to CAS assertion tRCD 2.5 × TC ± 4.0 21.0 29.0 ns

168 RAS assertion to column address valid tRAD 1.75 × TC ± 4.0 13.5 21.5 ns

169 CAS deassertion to RAS assertion tCRP 5.75 × TC − 4.0 53.5 — ns

170 CAS deassertion pulse width tCP 4.25 × TC – 6.0 36.5 — ns

Chip Frequency

(MHz)

DRAM Type

(tRAC ns)

100

50 66 80 100

4 Wait States

8 Wait States

11 Wait States

15 Wait States

Note: This figure should be used for primary selection. For exact and

detailed timings, see the following tables.

40 120

2-21

AC Electrical Characteristics

171 Row address valid to RAS assertion tASR 4.25 × TC − 4.0 38.5 —ns

172 RAS assertion to row address not valid tRAH 1.75 × TC − 4.0 13.5 — ns

173 Column addres s valid to CAS assertion tASC 0.75 × TC − 4.0 3.5 — ns

174 CAS assertion to column address not valid tCAH 5.25 × TC − 4.0 48.5 — ns

175 RAS assertion to column address not valid tAR 7.75 × TC − 4.0 73.5 — ns

176 Column addres s valid to RAS deassertion tRAL 6 × TC − 4.0 56.0 — ns

177 WR deassertion to CAS assertion tRCS 3.0 × TC − 4.0 26.0 — ns

178 CAS deassertion to WR4 assertion tRCH 1.75 × TC – 3.7 13.8 — ns

179 RAS deassertion to WR4 assertion tRRH 0.25 × TC − 2.0 0.5 — ns

180 CAS assertion to WR deass ertion tWCH 5 × TC − 4.2 45.8 — ns

181 RAS assertion to WR deass ertion tWCR 7.5 × TC − 4.2 70.8 — ns

182 WR assertion pulse width tWP 11.5 × TC − 4.5 110.5 — ns

183 WR assertion to RAS deasse rtion tRWL 11.75 × TC − 4.3 113.2 — ns

184 WR assertion to CAS deassertion tCWL 10.25 × TC − 4.3 98.2 — ns

185 Data valid to CAS assertion (write) tDS 5.75 × TC − 4.0 53.5 — ns

186 CAS assertion to data not valid (write) tDH 5.25 × TC − 4.0 48.5 — ns

187 RAS assertion to data not valid (write) tDHR 7.75 × TC − 4.0 73.5 — ns

188 WR assertion to CAS assertion tWCS 6.5 × TC − 4.3 60.7 — ns

189 CAS assertion to RAS assertion (refresh) tCSR 1.5 × TC − 4.0 11.0 — ns

190 RAS deassertion to CAS assertion (refresh) tRPC 2.75 × TC − 4.0 23.5 — ns

191 RD assertion to RAS deass ertion tROH 11.5 × TC − 4.0 111.0 — ns

192 RD assertion to data valid tGA 10 × TC − 7.0 — 93.0 ns

193 RD deassertion to data not valid5tGZ 0.0 — ns

194 WR assertion to data active 0.75 × TC – 1.5 6.0 — ns

195 WR deassertion to data high impedance 0.25 × TC—2.5ns

Notes: 1. The number of wait states for an out-of-page access is specified in the DRAM Control Register.

2. The refresh period is specified in the DRAM Control Register.

3. Use the expression to compute the maximum or minimum value listed (or both if the expression includes ±).

4. Either tRCH or tRRH must be satisfied for read cycles.

5. RD deassertion always occurs after CAS deassertion; therefore, the restricted timing is tOFF and not tGZ.

Table 2-11. DRAM Out-of-Page and Refresh Timings, Eleven Wait States1,2 (Continued)

No. Characteristics Symbol Expression3100 MHz Unit

Min Max

2-22

AC Electrical Characteristics

Table 2-12. DRAM Out-of-Page and Refresh Timings, Fifteen Wait States1,2

No. Characteristics Symbol Expression3100 MHz Unit

Min Max

157 Random read or write cycle time tRC 16 × TC160.0 —ns

158 RAS assertion to data valid (read) tRAC 8.25 × TC − 5.7 — 76.8 ns

159 CAS assertion to data valid (read) tCAC 4.75 × TC − 5.7 — 41.8 ns

160 Column address valid to data valid (read) tAA 5.5 × TC − 5.7 — 49.3 ns

161 CAS deassertion to data not valid (read hold time) tOFF 0.0 0.0 — ns

162 RAS deassertion to RAS assertion tRP 6.25 × TC − 4.0 58.5 — ns

163 RAS assertion pulse width tRAS 9.75 × TC − 4.0 93.5 — ns

164 CAS assertion to RAS deassertion tRSH 6.25 × TC − 4.0 58.5 — ns

165 RAS assertion to CAS deassertion tCSH 8.25 × TC − 4.0 78.5 — ns

166 CAS assertion pulse width tCAS 4.75 × TC − 4.0 43.5 — ns

167 RAS assertion to CAS assertion tRCD 3.5 × TC ± 2 33.0 37.0 ns

168 RAS assertion to column address valid tRAD 2.75 × TC ± 2 25.5 29.5 ns

169 CAS deassertion to RAS assertion tCRP 7.75 × TC − 4.0 73.5 — ns

170 CAS deassertion pulse width tCP 6.25 × TC – 6.0 56.5 — ns

171 Row address valid to RAS assertion tASR 6.25 × TC − 4.0 58.5 — ns

172 RAS assertion to row address not valid tRAH 2.75 × TC − 4.0 23.5 — ns

173 Column addres s valid to CAS assertion tASC 0.75 × TC − 4.0 3.5 — ns

174 CAS assertion to column address not valid tCAH 6.25 × TC − 4.0 58.5 — ns

175 RAS assertion to column address not valid tAR 9.75 × TC − 4.0 93.5 — ns

176 Column addres s valid to RAS deassertion tRAL 7 × TC − 4.0 66.0 — ns

177 WR deassertion to CAS assertion tRCS 5 × TC − 3.8 46.2 — ns

178 CAS deassertion to WR4 assertion tRCH 1.75 × TC – 3.7 13.8 — ns

179 RAS deassertion to WR4 assertion tRRH 0.25 × TC − 2.0 0.5 — ns

180 CAS assertion to WR deass ertion tWCH 6 × TC − 4.2 55.8 — ns

181 RAS assertion to WR deass ertion tWCR 9.5 × TC − 4.2 90.8 — ns

182 WR assertion pulse width tWP 15.5 × TC − 4.5 150.5 — ns

183 WR assertion to RAS deasse rtion tRWL 15.75 × TC − 4.3 153.2 — ns

184 WR assertion to CAS deassertion tCWL 14.25 × TC − 4.3 138.2 — ns

185 Data valid to CAS assertion (write) tDS 8.75 × TC − 4.0 83.5 — ns

186 CAS assertion to data not valid (write) tDH 6.25 × TC − 4.0 58.5 — ns

187 RAS assertion to data not valid (write) tDHR 9.75 × TC − 4.0 93.5 — ns

188 WR assertion to CAS assertion tWCS 9.5 × TC − 4.3 90.7 — ns

189 CAS assertion to RAS assertion (refresh) tCSR 1.5 × TC − 4.0 11.0 — ns

190 RAS deassertion to CAS assertion (refresh) tRPC 4.75 × TC − 4.0 43.5 — ns

191 RD assertion to RAS deass ertion tROH 15.5 × TC − 4.0 151.0 — ns

192 RD assertion to data valid tGA 14 × TC − 5.7 — 134.3 ns

193 RD deassertion to data not valid5tGZ 0.0 — ns

194 WR assertion to data active 0.75 × TC – 1.5 6.0 — ns

195 WR deassertion to data high impedance 0.25 × TC—2.5ns

2-23

AC Electrical Characteristics

Notes: 1. The number of wait states for an out-of-page access is specified in the DRAM Control Register.

2. The refresh period is specified in the DRAM Control Register.

3. Use the expression to compute the maximum or minimum value listed (or both if the expression includes ±).

4. Either tRCH or tRRH must be satisfied for read cycles.

5. RD deassertion always occurs after CAS deassertion; therefore, the restricted timing is tOFF and not tGZ.

Figure 2-18. DRAM Out-of-Page Read Access

Table 2-12. DRAM Out-of-Page and Refresh Timings, Fifteen Wait States1,2 (Continued)

No. Characteristics Symbol Expression3100 MHz Unit

Min Max

RAS

CAS

A[0–17]

D[0–23] Data

Row Address Column Address

157

163

165

162

169

170

171

168

167 164

166

173 174

175

172

177

176

191

160 178

159

193

161

192

158

179

2-24

AC Electrical Characteristics

Figure 2-19. DRAM Out-of-Page Write Access

Figure 2-20. DRAM Refresh Access

RAS

CAS

A[0–17]

D[0–23] Data Out

Column AddressRow Address

162 163

165

162

157

169

170

167

168

164

166

171 173 174

176

172

181

175

180188

182

184

183

187

185

194

186 195

RAS

CAS

157

163 162

162

190

170 165

189

177

2-25

AC Electrical Characteristics

2.6.5.3 Synchronous Timi ngs

Table 2-13. External Bus Synchronous Timings1,2

No. Characteristics Expression3,4,5 100 MHz Unit

Min Max

198 CLKOUT high to address, and AA valid60.25 × TC + 4.0 —6.5 ns

199 CLKOUT high to address, and AA invalid60.25 × TC2.5 — ns

200 TA valid to CLKOUT high (set-up time) 4.0 — ns

201 CLKOUT high to TA invalid (hold tim e) 0.0 — ns

202 CLKOUT high to data out active 0.25 × TC2.5 — ns

203 CLKOUT high to data out valid 0.25 × TC + 4.0 — 6.5 ns

204 CLKOUT high to data out invalid 0.25 × TC2.5 — ns

205 CLKOUT high to data out high impedance 0.25 × TC—2.5 ns

206 Data in valid to CLKOUT high (set-up) 4.0 — ns

207 CLKOUT high to data in invalid (hold) 0.0 — ns

208 CLKOUT high to RD ass ertion maximum: 0.75 × TC + 2.5 6.7 10.0 ns

209 CLKOUT high to RD deassertion 0.0 4.0 ns

210 CLKOUT high to WR assertion2 maximum: 0.5 × TC + 4.3

for WS = 1 or WS ≥ 4

for 2 ≤ WS ≤ 3

5.0

0.0

9.3

4.3

211 CLKOUT high to WR deasse rtion 0.0 3.8 ns

Notes: 1. Use external bus synchronous timings only for reference to the clock and

not

for relative timings.

2. Synchronous Bus Arbitration is not recommended. Use Asynchronous mode whenever possible.

3. WS is the number of wait states specified in the BCR.

4. If WS > 1, WR assertion refers to the next rising edge of CLKOUT.

5. Use the expression to compute the maximum or minimum value listed, as appropriate. For timing

210, the minimum is an absolute value.

6. T198 and T199 are valid for Address Trace mode if the ATE bit in the Operating Mode Register is set.

when this mode is enabled, use the status of BR (See T212) to determine whether the access

referenced by A[0–17] is internal or ex tern al.

2-26

AC Electrical Characteristics

Figure 2-21. Synchronous Bus Timings 1 WS (BCR Controlled)

Figure 2-22. Synchronous Bus Timings 2 WS (TA Controlled)

Data Out

D[0–23]

CLKOUT

Data In

D[0–23]

A[0–17]

AA[0–3] 199

201

211

210

208

209

207

198

205

204

203

202

206

Note: Address lines A[0–17] hold their state after a read or write operation. AA[0–3] do not hold their state

after a read or write operation.

A[0–17]

Data Out

D[0–23]

AA[0–3]

CLKOUT

Data In

D[0–23]

198

199

201

200

201

211

209

207

208

210

200

203

202

205

204

206

Note: Address lines A[0–17] hold their state after a read or write operation. AA[0–3] do not hold their

state after a read or write operation.

2-27

AC Electrical Characteristics

2.6.5.4 Arbitration Timin gs

Table 2-14. Arbitration Bus Timings1

No. Characteristics Expression2100 MHz Unit

Min Max

212 CLKOUT high to BR assertion/deassertion30.0 4.0 ns

213 BG asserted/deasserted to CLKOUT high

(setup) 4.0 —ns

214 CLKOUT high to BG deasserted/asserted

(hold) 0.0 — ns

215 BB deassertion to CLKOUT high (input set-up) 4.0 — ns

216 CLKOUT high to BB assertion (input hold) 0.0 — ns

217 CLKOUT high to BB assertion (output) 0.0 4.0 ns

218 CLKOUT high to BB deassertion (output) 0.0 4.0 ns

219 BB high to BB high impedance (output) — 4.5 ns

220 CLKOUT high to address and controls active 0.25 × TC2.5 — ns

221 CLKOUT high to address and controls high

impedance 0.75 × TC—7.5 ns

222 CLKOUT high to AA active 0.25 × TC2.5 — ns

223 CLKOUT high to AA deassertion maximum: 0.25 × TC + 4.0 2.0 6.5 ns

224 CLKOUT high to AA high impedance 0.75 × TC—7.5 ns

Notes: 1. Synchronous Bus Arbitration is not recommended. Use Asynchronous mode whenever possible.

2. An expression is used to compute the maximum or minimum value listed, as appropriate. For timing

223, the minimum is an absolute value.

3. T212 is valid for Address Trace mode when the ATE bit in the Operating Mode Register is set. BR is

deasserted for internal accesses and asserted for external accesses.

2-28

AC Electrical Characteristics

Figure 2-23. Bus Acquisition Timings

Figure 2-24. Bus Release Timings Case 1 (BRT Bit in Operating Mode Register Cleared)

A[0–17]

AA[0–3]

CLKOUT

RD, WR

212 214

216

215

220

217

213

222

Note: Address lines A[0–17] hold their state after a read or write operation. AA[0–3] do not hold their

state after a read or write operation.

A[0–17]

AA[0–3]

CLKOUT

RD, WR

212 214

218

221

224

223

213

219

Note: Address lines A[0–17] hold their state after a read or write operation. AA[0–3] do not hold their

state after a read or write operation.

2-29

AC Electrical Characteristics

Figure 2-25. Bus Release Timings Case 2 (BRT Bit in Operating Mode Register Set)

A[0–17]

AA[0–3]

CLKOUT

RD, WR

223

218 219

214

212

213

221

224

Note: Address lines A[0–17] hold their state after a read or write operation. AA[0–3] do not hold their

state after a read or write operation.

2-30

AC Electrical Characteristics

2.6.5.5 Asynchronous Bus Arbitration Timings

The asynchronous bus arbitration is enabled by internal synchronization circuits on BG and BB inputs.

These synch ronizatio n circuits add del ay from the exte rnal signa l until it is exposed to internal logi c. As a

result of this delay, a DSP56300 part may assume mastership and assert BB, for some time after BG is

deasserted. This is the reason for timing 250.

Once BB is asserted, there is a synchronization delay from BB assertion to the time this assertion is

exposed to other DSP56300 components that are potential masters on the same bus. If BG input is

asserted before that time, and BG is asserted and BB is deasserted, another DSP56300 compon ent may

assume mastership at the same time. Therefore, some non-overlap perio d between one BG input active to

another BG input active is required. Timing 251 ensures that overlaps are avoided.

Table 2-15. Asynchr onou s Bus Timin gs 1, 2

No. Characteristics Expression3100 MHz4

Unit

Min Max

250 BB assertion window from BG input deassertion52.5 × Tc + 5 —30ns

251 Delay from BB assertion to BG assertion52 × Tc + 5 25 — ns

Notes: 1. Bit 13 in the Operating Mode Register must be set to enter Asynchronous Arbitration mode.

2. If Asynchronous Arbitration mode is active, none of the timings in Table 2-14 is required.

3. An expression is used to compute the maximum or minimum value listed, as appropriate.

4. Asynchronous Arbitration mode is recommended for operation at 100 MHz.

5. In order to guarantee timings 250, and 251, BG inputs must be asserted to different DSP56300

devices on the same bus in the non-overlap manner shown in Figure 2-26.

Figure 2-26. Asynchronous Bus Arbitration Timing

BG1

251

BG2

250

250+251

2-31

AC Electrical Characteristics

2.6.6 Host Interface Timing

Table 2-16. Host Interface Timings1,2,12

No. Characteristic10 Expression 100 MHz Unit

Min Max

317 Read data strobe assertion width5

HACK assertion width TC + 9.9 19.9 —ns

318 Read data strobe deassertion width5

HACK deassertion width 9.9 — ns

319 Read data strobe deassertion width5 after “Las t Data Register”

reads8,11, or between two consec utive CVR, ICR, or ISR reads3

HACK deassertion width after “Last Data Register” reads8,11

2.5 × TC + 6.6 31.6 — ns

320 W rite data strobe assertion width613.2 —ns

321 W rite data strobe deassertion width8

HACK write deassertion width

• after ICR, CVR and “ Last Data Register” writes

• after IVR writes, or

after TXH:TXM:TXL writes (with HLEND= 0), or

after TXL:TXM:TXH writes (with HLEND = 1)

2.5 × TC + 6.6 31.8

16.5

—

322 HAS assertion width 9.9 — ns

323 HAS deassertion to data strobe assertion40.0 — ns

324 Host data input setup time before write data strobe deassertion69.9 — ns

325 Host data input hold time after write data strobe deassertion63.3 — ns

326 Read data strobe assertion to output data active from high

impedance5

HACK assertion to output data active from high impedance

3.3 — ns

327 Read data strobe assertion to output data valid5

HACK assertion to output data valid — 24.5 ns

328 Read data strobe deassertion to output data high impedance5

HACK deassertion to output data high impedance —9.9ns

329 Output data hold time after read data strobe deassertion5

Output data hold time after HACK deassertion 3.3 — ns

330 HCS assertion to read data strobe deassertion5TC + 9.9 19.9 — ns

331 HCS assertion to write data strobe deassertion69.9 — ns

332 HCS assertion to output data valid — 19.3 ns

333 HCS hold time after data strobe deassertion40.0 — ns

334 Addr ess (HAD[0–7]) setup time before HAS deassertion

(HMUX=1) 4.6 — ns

335 Address (HAD[0–7]) hold time after HAS deassertion (HMU X=1) 3.3 — ns

336 HA[8–10] (HMUX=1) , HA[0–2] (HMUX=0), HR/W setup time

before data strobe assertion4

• Read

•Write 0

4.6 —

—ns

337 HA[8–10] (HMUX=1) , HA[0–2] (HMUX=0), HR/W hold time after

data strobe deassertion43.3 — ns

2-32

AC Electrical Characteristics

338 Delay from read data strobe deassertion to host request assertion

for “Last Data Register” read5, 7, 8 TC + 5.3 15.3 — ns

339 Delay from write data strobe deassertion to host request assertion

for “Last Data Register” write6, 7, 8 1.5 × TC + 5.3 20.3 — ns

340 Delay from data strobe assertion to host request deassertion for

“Last Data Register” read or write (HROD=0)4, 7, 8 — 19.3 ns

341 Delay from data strobe assertion to host request deassertion for

“Last Data Register” read or write (HROD=1, open drain host

request)4, 7, 8, 9

— 300.0 ns

Notes: 1. See the Programme r’s Mode l section in the chapter on the HI08 in the

DSP56303User’s Manual

2. In the timing diagrams below, the controls pins are drawn as active low. The pin polar ity is

programmable.

3. This timing is applicable only if two consecutive reads from one of these registers are executed.

4. The data strobe is Host Read (HRD) or Host Write (HWR) in the Dual Data Strobe mode and Host

Data Strobe (HDS) in the Single Data Strobe mode.

5. The read data strobe is HRD in the Dual Data Strobe mode and HDS in the Single Data Strobe mode.

6. The write data strobe is HWR in the Dual Data Strobe mode and HDS in the Single Data Strobe mode.

7. The host request is HREQ in t he Single Host Request mode and HRRQ and HTRQ in the Double Host

Request mode.

8. The “Last Data Register” is the register at address $7, which is the last location to be read or written in

data transfers. This is RXL/TXL in the Big Endian mode (HLEND = 0; HLEND is the Interface Control

9. In this calculation, the host request signal is pulled up by a 4.7 kΩ resistor in the Open-drain mode.

10. VCC = 3.3 V ± 0.3 V; TJ = –40°C to +100 °C, CL = 50 pF

11. This timing is applicable only if a read from the “Last Data Register” is followed by a read from the

RXL, RXM, or RXH registers without first polling RXDF or HREQ bits, or waiting for the assertion of the

HREQ signal.

12. After the external host wr ites a new value to the ICR, the HI08 is ready for operation after three DSP

clock cycles (3 × Tc).

Figure 2-27. Host Interrupt Vector Register (IVR) Read Timing Diagram

Table 2-16. Host Interface Timings1,2,12 (Continued)

No. Characteristic10 Expression 100 MHz Unit

Min Max

HACK

H[0–7]

HREQ

329

317 318

328

326

327

Note: The IVR is only read by an MC680xx host processor using non-multiplexed mode.

2-33

AC Electrical Characteristics

Figure 2-28. Read Timing Diagram, Non-Multiplexed Bus, Single Data Strobe

Figure 2-29. Read Timing Diagram, Non-Multiplexed Bus, Double Data Strobe

2-34

AC Electrical Characteristics

Figure 2-30. Write Timing Diagram, Non-Multiplexed Bus, Single Data Strobe

Figure 2-31. Write Timing Dia gram, Non-Multiplexed Bus, Double Data Strobe

HDS

HA[2–0]

HCS

H[7–0]

324

321

320

331

337336

339

341 340

333

HREQ (single host request)

HRW

336 337

HTRQ (double host request)

325

HWR

HA[2–0]

HCS

H[7–0]

324

321

320

331

325

337336

339

341 340

333

HREQ (single host request)

HTRQ (double host request)

2-35

AC Electrical Characteristics

Figure 2-32. Read Timing Diagram, Multiplexed Bus, Single Data Strobe

Figure 2-33. Read Timing Diagram, Multiplexed Bus, Double Data Strobe

HDS

HA[10–8]

HAS

HAD[7–0]

HREQ (single host request)

Address Data

317

318

319

328

329

327

326

335

336 337

334

341

340 338

323

322

HRRQ (double host request)

HRW

336 337

HRD

HA[10–8]

HAS

HAD[7–0] Address Data

317

318

319

328

329

327

326

335

336 337

334

341

340 338

323

322

HREQ (single host request)

HRRQ (double host request)

2-36

AC Electrical Characteristics

Figure 2-34. Write Timing Diagram, Multiplexed Bus, Single Data Strobe

Figure 2-35. Write Timing Diagram, Multiplexed Bus, Double Data Strobe

HDS

HA[10–8]

HREQ (single host request)

HAS

HAD[7–0] Address Data

320

321

325

324

335

341 339

336

334

340

322

323

HRW

336 337

HTRQ (double host request)

337

HWR

HA[10–8]

HAS

HAD[7–0] Address Data

320

321

325

324

335

341 339

336

334

340

322

323

HREQ (single host request)

HTRQ (double host request)

337

2-37

AC Electrical Characteristics

2.6.7 SCI Timing

Table 2-17. SCI Timings

No. Characteristics1Symbol Expression 100 MHz Unit

Min Max

400 Synchronous clock cycle tSCC28 × TC53.3 —ns

401 Clock low period tSCC/2 − 10.0 16.7 — ns

402 Clock high period tSCC/2 − 10.0 16.7 — ns

403 Output data setup to clock falling edge

(internal clock) tSCC/4 + 0.5 × TC −17.0 8.0 — ns

404 Output data hold after clock rising edge

(internal clock) tSCC/4 − 0.5 × TC 15.0 — ns

405 Input data setup time before clock rising

edge (internal clock) tSCC/4 + 0.5 × TC + 25.0 50.0 — ns

406 Input data not valid before clock rising

edge (internal clock) tSCC/4 + 0.5 × TC − 5.5 — 19.5 ns

407 Clock falling edge to output data valid

(external clock) — 32.0 ns

408 Output data hold after clock rising edge

(external clock) TC + 8.0 18.0 — ns

409 Input data setup time before clock rising

edge (external clock) 0.0 — ns

410 Input data hold time after clock rising edge

(external clock) 9.0 — ns

411 Asynchronous clock cyc le tACC364 × TC640.0 — ns

412 Clock low period tACC/2 − 10.0 310.0 — ns

413 Clock high period tACC/2 − 10.0 310.0 — ns

414 Output data setup to clock rising edge

(internal clock) tACC/2 − 30.0 290.0 — ns

415 Output data hold after clock rising edge

(internal clock) tACC/2 − 30.0 290.0 — ns

Notes: 1. VCC = 3.3 V ± 0.3 V; TJ = −40°C to +100 °C, CL = 50 pF.

2. tSCC = synchronous clock cycle time (for internal clock, tSCC is determined by the SCI clock control

3. tACC = asynchronous clock cycle time; value given for 1X Clock mode (for internal clock, tACC is

determined by the SCI clock control register and TC).

4. An expression is used to compute the nu mber listed as the minimum or maximum value as

appropriate.

2-38

AC Electrical Characteristics

Figure 2-36. SCI Synchronous Mode Timing

Figure 2-37. SCI Asynchronous Mode Timing

a) Internal Clock

Data Valid

Data

Valid

b) External Clock

Data Valid

SCLK

(Output)

TXD

RXD

SCLK

(Input)

TXD

RXD

Data Valid

400

402

404

401

403

405

406

400

402

401

407

409 410

408

1X SCLK

(Output)

TXD Data Valid

413

411

412

414 415

2-39

AC Electrical Characteristics

2.6.8 ESSI0/ESSI1 Timing

Table 2-18. ESSI Timings

No. Characteristics4, 5, 7 Symbol Expression9100 MH z Cond-

ition5Unit

Min Max

430 Clock cycle1tSSICC 3 × TC

4 × TC

30.0

40.0 —

—x ck

i ck ns

431 Clock high period

• For internal clock

• For external clock 2 × TC - 10.0

1.5 × TC

10.0

15.0 —

—ns

432 Clock low period

• For internal clock

• For external clock 2 × TC − 10.0

1.5 × TC

10.0

15.0 —

—ns

433 RXC rising edge to FSR out (bit-length) high —

—37.0

22.0 x ck

i ck a ns

434 RXC rising edge to FSR out (bit-length) low —

—37.0

22.0 x ck

i ck a ns

435 RXC rising edge to FSR out (word-length-relative)

high2—

—39.0

37.0 x ck

i ck a ns

436 RXC rising edge to FSR out (word-length-relative)

low2—

—39.0

37.0 x ck

i ck a ns

437 RXC rising edge to FSR out (word-length) high —

—36.0

21.0 x ck

i ck a ns

438 RXC rising edge to FSR out (word-length) low —

—37.0

22.0 x ck

i ck a ns

439 Data in setup time before RXC (SCK in

Synchronous mode) falling edge 10.0

19.0 —

—x ck

i ck ns

440 Data in hold time after RXC falling edge 5.0

3.0 —

—x ck

i ck ns

441 FSR input (bl, wr) high before RXC falling edge21.0

23.0 —

—x ck

i ck a ns

442 FSR input (wl) high before RXC falling edge 3. 5

23.0 —

—x ck

i ck a ns

443 FSR input hold time after RXC falling edge 3.0

0.0 —

—x ck

i ck a ns

444 Flags input setup before RXC falling edge 5.5

19.0 —

—x ck

i ck s ns

445 Flags input hold time after RXC falling edge 6.0

0.0 —

—x ck

i ck s ns

446 TXC rising edge to FST out (bit-length) high —

—29.0

15.0 x ck

i ck ns

447 TXC rising edge to FST out (bit-length) low —

—31.0

17.0 x ck

i ck ns

448 TXC rising edge to FST out (word-length-relative)

high2 —

—31.0

17.0 x ck

i ck ns

449 TXC rising edge to FST out (word-length-relative)

low2 —

—33.0

19.0 x ck

i ck ns

2-40

AC Electrical Characteristics

450 TXC rising edge to FST out (word-length) high —

—30.0

16.0 x ck

i ck ns

451 TXC rising edge to FST out (word-length) low —

—31.0

17.0 x ck

i ck ns

452 TXC rising edge to data out enable from high

impedance —

—31.0

17.0 x ck

i ck ns

453 TXC rising edge to Transmitter #0 drive enable

assertion —

—34.0

20.0 x ck

i ck ns

454 TXC rising edge to data out valid —

—20.08

10.0 x ck

i ck ns

455 TXC rising edge to data out high impedance3—

—31.0

16.0 x ck

i ck ns

456 TXC rising edge to Transmitter #0 drive enable

deassertion3—

—34.0

20.0 x ck

i ck ns

457 FST input (bl, wr) setup time before TXC falling

edge22.0

21.0 —

—x ck

i ck ns

458 FST input (wl) to data out enable from high

impedance — 27.0 — ns

459 FST input (wl) to Transmitter #0 drive enable

assertion — 31.0 — ns

460 FST input (wl) setup time before TXC falling edge 2.5

21.0 —

—x ck

i ck ns

461 FST input hold time after TXC falling edge 4.0

0.0 —

—x ck

i ck ns

462 Flag output valid after TXC rising edge —

—32.0

18.0 x ck

i ck ns

Notes: 1. For the internal clock, the external clock cycle is defined by Icyc (see Timing 7) and the ESSI Control

2. The word-length-relative frame sync signal waveform operates the same way as the bit-length frame

sync signal waveform, but spreads from one serial clock before the first bit clock (same as the Bit

Length Frame Sync signal) until the one before last bit clock of the first word in the frame.

3. Periodically sampled and not 100 percent tested

4. VCC = 3.3 V ± 0.3 V; TJ = −40°C to +100 °C, CL = 50 pF

5. TXC (SCK Pin) = Transmit Clock

RXC (SC0 or SCK Pin) = Receive Clock

FST (SC2 Pin) = Transmit Frame Sync

FSR (SC1 or SC2 Pin) Receive Frame Sync

6. i ck = Internal Clock

x ck = External Clock

i ck a = Internal Clock, Asynchronous Mode

(asynchronous implies that TXC and RXC are two different clocks)

i ck s = Internal Clock, Synchronous Mode

(synchronous implies that TXC and RXC are the same clock)

7. bl = bit length; wl = word length; wr = word length relative

8. If the DSP core writes to the transmit register during the last cycle before causing an underrun error,

the delay is 20 ns + ( 0.5 × TC).

9. An expression is used to compute the nu mber listed as the minimum or maximum value as

appropriate.

Table 2-18. ESSI Timing s (C onti nue d)

No. Characteristics4, 5, 7 Symbol Expression91 00 MH z Cond-

ition5Unit

Min Max

2-41

AC Electrical Characteristics

Figure 2-38. ESSI Transmitter Timing

Last

See Note

Note: In Network mode, output flag transitions can occur at the start of each time slot within the

frame. In Normal mode, the output flag state is asserted for the entire frame period.

First

430 432

446 447

450 451

455

454454

452

459

456453

461

457

458 460 461

462

431

TXC

(Input/

Output)

FST (Bit)

Out

FST (Word)

Out

Data Out

Transmitter

#0 Drive

Enable

FST (Bit) In

FST (Word)

Flags Out

2-42

AC Electrical Characteristics

Figure 2-39. ESSI Receiver Timing

Last Bit

First Bit

430

432

433

437 438

440

439

443

441

442 443

445444

431

434

RXC

(Input/

Output)

FSR (Bit)

Out

FSR

(Word)

Out

Data In

FSR (Bit)

FSR

(Word)

Flags In

2-43

AC Electrical Characteristics

2.6.9 Timer Timing

Table 2-19. Timer Timing1

No. Characteristics Expression2100 MHz Unit

Min Max

480 TIO Low 2 × TC + 2.0 22.0 —ns

481 TIO High 2 × TC + 2.0 2 2.0 — ns

482 Timer set-up time from TIO ( Input) assertion

to CLKOUT rising edge 9.0 10.0 ns

483 Synchronous timer delay time from CLKOUT

rising edge to the external memory acces s

address out valid caused by first interrupt

instruction execution

10.25 × TC + 1.0 103.5 — ns

484 CLKOUT rising edge to TIO (Output)

assertion

• Minimum

• Maximum

0.5 × TC + 0.5

0.5 × TC + 19.8 5.5

——

24.8 ns

485 CLKOUT rising edge to TIO (Output)

deassertion

• Minimum

• Maximum

0.5 × TC + 0.5

0.5 × TC + 19.8 5.5

——

24.8 ns

Notes: 1. VCC = 3.3 V ± 0.3 V; TJ = −40°C to +100 °C, CL = 50 pF

2. An expression is used to compute the nu mber listed as the minimum or maximum value as

appropriate.

Figure 2-40. TIO Timer Event Input Restrictions

Figure 2-41. Timer Interrupt Generation

Figure 2-42. External Pulse Generation

TIO 481

480

CLKOUT

TIO (Input)

First Interrupt Instruction Execution

Address

482

483

CLKOUT

TIO (Output)

484 485

2-44

AC Electrical Characteristics

2.6.10 GPIO Timing

Table 2-20. G PI O Timing

No. Characteristics Expression 100 MHz Unit

Min Max

490 CLKOUT edge to GPIO out valid (GPIO out delay time) —8.5ns

491 CLKOUT edge to GPIO out not valid (GPIO out hold time) 0.0 — ns

492 GPIO In valid to CLKOUT edge (GPIO in set-up time) 8.5 — ns

493 CLKOUT edge to GPIO in not valid (GPIO in hold time) 0.0 — ns

494 Fetch to CLKOUT edge before GPIO change Minimum: 6.75 × TC67.5 — ns

Note: VCC = 3.3 V ± 0.3 V; TJ = −40°C to +100 °C, CL = 50 pF

Figure 2-43. GPIO Timing

Valid

GPIO

(Input)

GPIO

(Output)

CLKOUT

(Output)

Fetch the instruction MOVE X0,X:(R0); X0 contains the new value of GPIO

and R0 contains the address of the GPIO data register.

A[0–17]

490

491

492

494

493

2-45

AC Electrical Characteristics

2.6.11 JTAG Timing

Table 2-21. JTAG Timing

No. Characteristics All frequencies Unit

Min Max

500 TCK frequency of operation 0.0 22.0 MHz

501 TCK cycle time in Crystal mode 45.0 —ns

502 TCK clock pulse width measured at 1.5 V 20.0 — ns

503 TCK rise and fall times 0.0 3.0 ns

504 Boundary scan input data setup time 5.0 — ns

505 Boundary scan input data hold time 24.0 — ns

506 TCK low to output data valid 0.0 40.0 ns

507 TCK low to output high impedance 0.0 40.0 ns

508 TMS, TDI data setup time 5.0 — ns

509 TMS, TDI data hold time 25.0 — ns

510 TCK low to TDO data valid 0.0 44.0 ns

511 TCK low to TDO high impedance 0.0 44.0 ns

512 TRST assert time 100.0 — ns

513 TRST setup time to TCK low 40.0 — ns

Notes: 1. VCC = 3.3 V ± 0.3 V; TJ = –40°C to +100 °C, CL = 50 pF

2. All timings apply to OnCE module data transfers because it uses the J TAG port as an interface.

Figure 2-44. Test Clock Input Timing Diagram

TCK

(Input) VM

VIH VIL

501

502 502

503503

2-46

AC Electrical Characteristics

Figure 2-45. Boundary Scan (JTAG) Timing Diagram

Figure 2-46. Test Ac cess Port Timing Diagram

Figure 2-47. TRST Timing Diagram

TCK

(Input)

Data

Inputs

Data

Outputs

Data

Outputs

Data

Outputs

VIH

VIL

Input Data Valid

Output Data Valid

505504

506

507

506

TCK

(Input)

TDI

(Input)

TDO

(Output)

TDO

(Output)

TDO

(Output)

VIH

VIL

Input Data Valid

Output Data Valid

TMS

508 509

510

511

510

TCK

(Input)

TRST

(Input)

513

512

2-47

AC Electrical Characteristics

2.6.12 OnCE Module TimIng

Table 2-22. OnCE Module Timing

No. Characteristics Expression Min Max Unit

500 TCK frequency of operation Max 22.0 MHz 0.0 22.0 M Hz

514 DE assertion time in order to enter Debug mode 1.5 × TC + 10.0 20.0 —ns

515 Response time when DSP56303 is executing NOP

instructions from internal memory 5.5 × TC + 30.0 — 67.0 ns

516 Debug acknowledge assertion time 3 × TC + 5.0 25.0 — ns

Note: VCC = 3.3 V ± 0.3 V, VCC = 1.8 V ± 0.1 V; TJ = –40°C to +100 °C, CL = 50 pF

Figure 2-48. OnCE—Debug Request

516515

514

2-48

AC Electrical Characteristics

3-1

Chapter 3

Packaging

3.1 Pin-Out and Package Infor mation

This section includes diagrams of the DSP56303 package pin-outs and tables showing how the

signals described in Chapter 1 are allocated for each package.

The DSP56303 is available in two package types:

• 144-pin Thin Quad Flat Pack (TQFP)

• 196-pin Molded Array Process-Ball Grid Array (MAP-BGA)

3-2

TQFP Package Description

3.2 TQFP Package Description

Top and bottom views of the TQFP package are shown in Figure 3-1 and Figure 3-2 with their pin-outs.

Figure 3-1. DSP56303 Thin Quad Flat Pack (TQFP), Top View

SRD1

STD1

SC02

SC01

PINIT

SRD0

VCCS

GNDS

STD0

SC10

SC00

RXD

TXD

SCLK

SCK1

SCK0

VCCQ

GNDQ

HDS

HRW

HACK

HREQ

VCCS

GNDS

TIO2

TIO1

TIO0

HCS

HA9

HA8

HAS

HAD7

HAD6

HAD5

HAD4

VCCH

GNDH

HAD3

HAD2

HAD1

HAD0

RESET

VCCP

PCAP

GNDP

GNDP1

AA3

AA2

CAS

XTAL

GNDQ

EXTAL

VCCQ

VCCC

GNDC

CLKOUT

BCLK

VCCC

GNDC

AA1

AA0

VCCD

GNDD

D10

D11

D12

D13

D14

VCCD

GNDD

D15

D16

D17

D18

D19

VCCQ

GNDQ

D20

VCCD

GNDD

D21

D22

D23

TRST

TDO

TDI

TCK

TMS

SC12

SC11

109 (Top View)

Orientation Mark

VCCA

GNDA

VCCA

GNDA

VCCA

GNDA

A10

A11

GNDQ

VCCQ

A12

A13

A14

VCCA

GNDA

A15

A16

A17

VCCD

GNDD

MODD

MODC

MODB

MODA

Notes: Because of size constraints in this figure, only one name is shown for multiplexed pins. Refer to Table 3-1 and Table

3-2 for detailed information about pin functions and signal names.

3-3

TQFP Package Description

Figure 3-2. DSP56303 Thin Quad Flat Pack (TQFP), Bottom View

SRD1

STD1

SC02

SC01

PINIT

SRD0

VCCS

GNDS

STD0

SC10

SC00

RXD

TXD

SCLK

SCK1

SCK0

VCCQ

GNDQ

HDS

HRW

HACK

HREQ

VCCS

GNDS

TIO2

TIO1

TIO0

HCS

HA9

HA8

HAS

HAD7

HAD6

HAD5

HAD4

VCCH

GNDH

HAD3

HAD2

HAD1

HAD0

RESET

VCCP

PCAP

GNDP

GNDP1

AA3

AA2

CAS

XTAL

GNDQ

EXTAL

VCCQ

VCCC

GNDC

CLKOUT

BCLK

VCCC

GNDC

AA1

AA0

A0 D7

VCCD

GNDD

D10

D11

D12

D13

D14

VCCD

GNDD

D15

D16

D17

D18

D19

VCCQ

GNDQ

D20

VCCD

GNDD

D21

D22

D23

MODD

MODC

MODB

MODA

TRST

TDO

TDI

TCK

TMS

SC12

SC11

109

(Bottom View)

VCCA

GNDA

VCCA

GNDA

VCCA

GNDA

A10

A11

GNDQ

VCCQ

A12

A13

A14

VCCA

GNDA

A15

A16

A17

VCCD

GNDD

Orientation Mark

(on top side)

Notes: Because of size constraints in this figure, only one name is shown for multiplexed pins. Refer to Table 3-1 and Table

3-2 for detailed inform ation about pin functions and signal names.

3-4

TQFP Package Description

Table 3-1. DSP56303 TQFP Signal Identification by Pin Number

No. Signal Name Pin

No. Signal Name

1 S RD1 or PD4 26 GNDS51 AA2/RAS2

2 STD1 or PD5 27 TIO2 52 CAS

3 SC02 or PC2 28 TIO1 53 XTAL

4 SC01 or PC1 29 TIO0 54 GNDQ

5DE 30 HCS/HCS, HA10, or PB13 55 EXTAL

6 PINIT/NMI 31 HA2, HA9, or PB10 5 6 VCCQ

7 S RD0 or PC4 32 HA1, HA8, or PB9 57 VCCC

CCS 33 HA0, HAS/HAS, or PB8 58 GNDC

9GND

S34 H7, HAD7, or PB7 59 CLKOUT

10 STD0 or PC5 35 H6, HAD6, or PB6 60 BCLK

11 SC10 or PD0 36 H5, HAD5, or PB5 61 BCLK

12 SC00 or PC0 37 H4, HAD4, or PB4 62 TA

13 RXD or PE0 38 VCCH 63 BR

14 TXD or PE1 39 GNDH64 BB

15 SCLK or PE2 40 H3, HAD3, or PB3 65 VCCC

16 SCK1 or PD3 41 H2, HAD2, or PB2 66 GNDC

17 SCK0 or PC3 42 H1, HAD1, or PB1 67 WR

18 VCCQ 43 H0, HAD0, or PB0 68 RD

19 GNDQ44 RESET 69 AA1/RAS1

20 Not Connected (NC), reserved 45 VCCP 70 AA0/RAS0

21 HDS/HDS, HWR/HWR, or

PB12 46 PCAP 71 BG

22 HRW, HRD/HRD, or PB11 4 7 GNDP72 A0

23 HACK/HACK,

HRRQ/HRRQ, or PB15 48 GNDP1 73 A1

24 HREQ/HREQ,

HTRQ/HTRQ, or PB14 49 Not Connected (NC), reserved 74 VCCA

25 VCCS 50 AA3/RAS3 75 GNDA

3-5

TQFP Package Description

76 A2 99 A17 122 D16

77 A3 100 D0 123 D17

78 A4 101 D1 124 D18

79 A5 102 D2 125 D19

80 VCCA 103 VCCD 126 VCCQ

81 GNDA104 GNDD127 GNDQ

82 A6 105 D3 128 D20

83 A7 106 D4 129 VCCD

84 A8 107 D5 130 GNDD

85 A9 108 D6 131 D21

86 VCCA 109 D7 132 D22

87 GNDA110 D8 133 D23

88 A10 111 VCCD 134 MODD/IRQD

89 A11 112 GNDD135 MODC/IRQC

90 GNDQ113 D9 136 MODB/IRQB

91 VCCQ 114 D10 137 MODA/IRQA

92 A12 115 D11 138 TRST

93 A13 116 D12 139 TDO

94 A14 117 D13 140 TDI

95 VCCA 118 D14 141 TCK

96 GNDA119 VCCD 142 TMS

97 A15 120 GNDD143 SC12 or PD2

98 A16 121 D15 144 SC11 or PD1

Notes: Signal names are based on configured functionality. Most pins supply a single signal. Some pins provide a

signal with dual functionality, such as the MODx/IRQx pins that select an operating mode after RESET is

deasserted but act as interrupt lines during oper ation. Some signals have configurable polarity; these

names are shown with and without overbars, such as HAS/HAS. Some pins have two or more configurable

functions; names assigned to these pins indicate the function for a specific configuration. For example, Pin

34 is data line H7 in non-multiplexed bus mode, data/address line HAD7 i n multiplexed bus mode, or GPIO

line PB7 when the GPIO function is enabled for this pin.

Table 3-1. DSP56303 TQFP Signal Identification by Pin Number (Continued)

No. Signal Name Pin

No. Signal Name

3-6

TQFP Package Description

Table 3-2. DSP56303 TQFP Signal Identification by Name

Signal Name Pin

No. Signal Name Pin

No.

A0 72 BG 71 D7 109

A1 73 BR 63 D8 110

A10 88 CAS 52 D9 113

A11 89 CLKOUT 59 DE 5

A12 92 D0 100 EXTAL 55

A13 93 D1 101 GNDA75

A14 94 D10 114 GNDA81

A15 97 D11 115 GNDA87

A16 98 D12 116 GNDA96

A17 99 D13 117 GNDC58

A2 76 D14 118 GNDC66

A3 77 D15 121 GNDD104

A4 78 D16 122 GNDD112

A5 79 D17 123 GNDD120

A6 82 D18 124 GNDD130

A7 83 D19 125 GNDH39

A8 84 D2 102 GNDP47

A9 85 D20 128 GNDP1 48

AA0 70 D21 131 GNDQ19

AA1 69 D22 132 GNDQ54

AA2 51 D23 133 GNDQ90

AA3 50 D3 105 GNDQ127

BB 64 D4 106 GNDS9

BCLK 60 D5 107 GNDS26

BCLK 61 D6 108 H0 43

3-7

TQFP Package Description

H1 42 HRD/HRD 22 PB2 41

H2 41 HREQ/HREQ 24 PB3 40

H3 40 HRRQ/HRRQ 23 PB4 37

H4 37 HRW 22 PB5 36

H5 36 HTRQ/HTRQ 24 PB6 35

H6 35 HWR/HWR 21 PB7 34

H7 34 IRQA 137 PB8 33

HA0 33 IRQB 136 PB9 32

HA1 32 IRQC 135 PC0 12

HA10 30 IRQD 134 PC1 4

HA2 31 MODA 137 PC2 3

HA8 32 MODB 136 PC3 17

HA9 31 MODC 135 PC4 7

HACK/HACK 23 MODD 134 PC5 10

HAD0 43 NC 20 PCAP 46

HAD1 42 NMI 6 PD0 11

HAD2 41 NC 49 PD1 144

HAD3 40 PB0 43 PD2 143

HAD4 37 PB1 42 PD3 16

HAD5 36 PB10 31 PD4 1

HAD6 35 PB11 22 PD5 2

HAD7 34 PB12 21 PE0 13

HAS/HAS 33 PB13 30 PE1 14

HCS/HCS 30 PB14 24 PE2 15

HDS/HDS 21 PB15 23 PINIT 6

Table 3-2. DSP56303 TQFP Signal Identification by Name (Continued)

Signal Name Pin

No. Signal Name Pin

No.

3-8

TQFP Package Description

RAS0 70 SRD1 1 VCCC 57

RAS1 69 STD0 10 VCCC 65

RAS2 51 STD1 2 VCCD 103

RAS3 50 TA 62 VCCD 111

RD 68 TCK 141 VCCD 119

RESET 44 TDI 140 VCCD 129

RXD 13 TDO 139 VCCH 38

SC00 12 TIO0 29 VCCP 45

SC01 4 TIO1 28 VCCQ 18

SC02 3 TIO2 27 VCCQ 56

SC10 11 TMS 142 VCCQ 91

SC11 144 TRST 138 VCCQ 126

SC12 143 TXD 14 VCCS 8

SCK0 17 VCCA 74 VCCS 25

SCK1 16 VCCA 80 WR 67

SCLK 15 VCCA 86 XTAL 53

SRD0 7 VCCA 95

Table 3-2. DSP56303 TQFP Signal Identification by Name (Continued)

Signal Name Pin

No. Signal Name Pin

No.

3-9

TQFP Package Mechanical Drawing

3.3 TQFP Package Mechanical Drawing

Figure 3-3. DSP56303 Mechanical Information, 144-pin TQFP Package

Seating

plane

0.1 T144X

C2θ

View AB

2θT

Plating

FAA

DBase

metal

Section J1-J1

(rotated 90)

144 PL

0.08 NTL-M

N0.20 T L-M

144

109

108

4X 4X 36 TIPS

Pin 1

ident

View Y

B1 V1

N0.20 T L-M

P4X

140X

View Y

X=L, M or N

Gage pl a ne

0.05

(Z)

(Y)

(K)

C1 1θ

0.25

View AB

DIM MIN MAX

Millimeters

A20.00 BSC

A1 10.00 BSC

B20.00 BSC

B1 10.00 BSC

C1.40 1.60

C1 0.05 0.15

C2 1.35 1.45

D0.17 0.27

E0.45 0.75

F0.17 0.23

G0.50 BSC

J0.09 0.20

K0.50 REF

P0.25 BSC

R1 0.13 0.20

R2 0.13 0.20

S22.00 BSC

S1 11.00 BSC

V22.00 BSC

V1 11.00 BSC

Y0.25 REF

Z1.00 REF

AA 0.09 0.16

θ0°

θ 0°7°

θ 11°13°

Notes:

1. Dimensions and tolerancing per ASME

Y14.5, 1994.

2. Dimensions in millimeter s.

3. Datums L, M and N to be dete rmined at the

seating plane, datum T.

4. Dimensions S and V to be determined at

the seating plane, datum T.

5. Dimensions A and B do not include mold

protrusion. Allowable protrusion is 0.25 per

side. Dimen sions A and B do includ e mold

mismatch and are determined at datum

plane H.

6. Dimension D does not include dambar

protrusion. Al lowable dambar protrusion

shall not cause the D dimension to excee d

0.35.

CASE 918-03

—

ISSUE C

3-10

MAP-BGA Package Description

3.4 MAP-BGA Package Description

Top and bottom views of the MAP-BGA package are shown in Figure 3-4 and Figu re 3-5 wi th their

pin-outs.

Figure 3-4. DSP56303 Molded Array Process-Ball Grid Array (MAP-BGA), Top View

1342567810 141312119

HACK

HREQ

HA0

HRW HDS

HCS

MODD

H5 NC

HA1 HA2

VCCD

VCCQ

MODA

D19

D18 VCCD

VCCD

VCCQ

VCCS

VCCA

GND GND GND GND GND

GND

GNDGNDGNDGND

GND

GND GND

GND

GNDGNDGNDGND

GND GNDGND

GNDGNDGND

GND GND GND

VCCA

VCCC

VCCA

VCCP

VCCH

VCCS

VCCQ

GND

VCCD

MODC

H4H6 VCCQ

D12

D11

D15

A17 A16

A1 A2

PB0

TIO1

RXD

TIO2

TIO0

SCK1 TXD

SC12

SC11

STD1

SCK0

SRD0

SRD1

STD0

SC02

SC01

TDOTMS

TDI

TCK

A15

A12

GNDP

PINIT

AA0

TRST

SCLK

VCCC

AMODB D23

D22

D21 D20 D17

D16 D14

D13 D10 D8

D6 D4

D2D1

A14

A13

A11A10

A9A8

A4A3

AA1

BCLK

CLK

OUT

XTAL

CASAA3

AA2GNDP1

PCAP

RESET

SC00SC10

GND GND

GND

GND GND

GND

GND GND

GNDGND

EXTAL

Top View

3-11

MAP-BGA Package Description

Figure 3-5. DSP56303 Molded Array Process-Ball Grid Array (MAP-BGA), Bottom View

Bottom View 134256781014 13 12 11 9

HACK

HREQ

HA0

HRWHDS

HCS

MODD

H5NC

HA1HA2

VCCD

VCCQ MODA

D19

D18VCCD

VCCD

VCCQ

VCCS

VCCA GNDGNDGNDGNDGND

GND

GND GND GND GND

GND

GNDGND

GND

GND GND GND GND

GNDGND GND

GND GND GND

GNDGNDGND

VCCA

VCCC

VCCA

VCCP VCCH

VCCS

VCCQ

GND

VCCD

MODC

H4 H6VCCQ

D12

D11

D15

A17A16

A1A2

PB0

TIO1

RXD

TIO2

TIO0

SCK1TXD

SC12

SC11

STD1

SCK0

SRD0

SRD1

STD0

SC02

SC01

TDO TMS

TDI

TCK

A15

A12

GNDP

PINIT

AA0

TRST

SCLK

VCCC

MODBD23

D22

D21D20D17

D16D14

D13D10D8

D6D4

D2 D1

A14

A13

A11 A10

A9 A8

A4 A3

AA1

RD WR

BCLK

CLK

OUT

XTAL

CAS AA3

AA2 GNDP1 PCAP

RESET

SC00 SC10

GNDGND

GND

GNDGND

GND

GNDGND

GND GND

EXTAL

3-12

MAP-BGA Package Description

Table 3-3. DSP56303 MAP-BGA Signal Identification by Pin Number

No. Signal Name Pin

No. Signal Name

A1 Not Connected (NC), reserved B12 D8 D9 GND

A2 SC11 or PD1 B13 D5 D10 GND

A3 TMS B14 NC D11 GND

A4 TDO C1 SC02 or PC2 D12 D1

A5 MODB/IRQB C2 STD1 or PD5 D13 D2

A6 D23 C3 TCK D14 VCCD

A7 VCCD C4 MODA/IRQA E1 STD0 or PC5

A8 D19 C5 MODC/IRQC E2 VCCS

A9 D16 C6 D22 E3 SRD0 or PC4

A10 D14 C7 VCCQ E4 GND

A11 D11 C8 D18 E5 GND

A12 D9 C9 VCCD E6 GND

A13 D7 C10 D12 E7 GND

A14 NC C11 VCCD E8 GND

B1 SRD1 or PD4 C12 D6 E9 GND

B2 SC12 or PD2 C13 D3 E10 GND

B3 TDI C14 D4 E11 GND

B4 TRST D1 PINIT/NMI E12 A17

B5 MODD/IRQD D2 SC01 or PC1 E13 A16

B6 D21 D3 DE E14 D0

B7 D20 D4 GND F1 RXD or PE0

B8 D17 D5 GND F2 SC10 or PD0

B9 D15 D6 GND F3 SC00 or PC0

B10 D13 D7 GND F4 GND

B11 D10 D8 GND F5 GND

3-13

MAP-BGA Package Description

F6 GND H3 SCK0 or PC3 J14 A9

F7 GND H4 GND K1 VCCS

F8 GND H5 GND K2 HREQ/HREQ,

HTRQ/HTRQ, or PB14

F9 GND H6 GND K3 TIO2

F10 GND H7 GND K4 GND

F11 GND H8 GND K5 GND

F12 VCCA H9 GND K6 GND

F13 A14 H10 GND K7 GND

F14 A15 H11 GND K8 GND

G1 SCK1 or PD3 H12 VCCA K9 GND

G2 SCLK or PE2 H13 A 10 K10 GND

G3 TXD or PE1 H14 A11 K11 GND

G4 GND J1 HACK/HACK,

HRRQ/HRRQ, or PB15 K12 VCCA

G5 GND J2 HRW, HRD/HRD, or PB11 K13 A5

G6 GND J3 HDS/HDS, HWR/HWR, or

PB12 K14 A6

G7 GND J4 GND L1 HCS/HCS, HA10, or PB13

G8 GND J5 GND L2 TIO1

G9 GND J6 GND L3 TIO0

G10 GND J7 GND L4 GND

G11 GND J8 GND L5 GND

G12 A13 J9 GND L6 GND

G13 VCCQ J10 GND L7 GND

G14 A12 J11 GND L8 GND

H1 NC J12 A8 L9 GND

H2 VCCQ J13 A7 L10 GND

L11 GND M13 A1 P1 NC

L12 VCCA M14 A2 P2 H5, HAD5, or PB5

L13 A3 N1 H6, HAD6, or PB6 P3 H3, HAD3, or PB3

Table 3-3. DSP56303 MAP-BGA Signal Identification by Pin Number (Continued)

No. Signal Name Pin

No. Signal Name

3-14

MAP-BGA Package Description

L14 A4 N2 H7, HAD7, or PB7 P4 H1, HAD1, or PB1

M1 HA1, HA8, or PB9 N3 H4, HAD4, or PB4 P5 PCAP

M2 HA2, HA9, or PB10 N4 H2, HAD2, or PB2 P6 GNDP1

M3 HA0, HAS/HAS, or PB8 N5 RESET P7 AA2/RAS2

M4 VCCH N6 GNDPP8 XTAL

M5 H0, HAD0, or PB0 N7 AA3/RAS3 P9 VCCC

M6 VCCP N8 CAS P10 TA

M7 NC N9 VCCQ P11 BB

M8 EXTAL N10 BCLK P12 AA1/RAS1

M9 CLKOUT N11 BR P13 BG

M10 BCLK N12 VCCC P14 NC

M11 WR N13 AA0/RAS0

M12 RD N14 A0

Notes: Signal names are based on configured functionality. Most connections supply a single signal.

Some connections provide a signal with dual functionality, such as the MODx/IRQx pins that

select an op erat ing m ode after RESET is d eas se rted bu t a ct as in terru pt l ine s during operati on .

Some signals have configurable polarity; these names are shown with and without overbars,

such as HAS/HAS. Some connections have two or more configurable functions; names

assigned to these connections indicate the function for a specific configuration. For example,

connection N2 is data line H7 in non-multiplexed bus mode, data/address line HAD7 in

multipl ex ed bus mode, or GPIO line PB7 when th e GPI O fun ct ion is en abl ed fo r t his pin . Un lik e

in the TQFP package, most of the GND pins are connected internally in the center of the

connec tio n a rray an d ac t a s hea t s ink fo r the c hip . Th eref ore, ex ce pt fo r G N D P an d G ND P1 that

support the PLL, other GND signals do not support individual subsystems in the chip.

Table 3-3. DSP56303 MAP-BGA Signal Identification by Pin Number (Continued)

No. Signal Name Pin

No. Signal Name

3-15

MAP-BGA Package Description

Table 3-4. DSP56303 MAP-BGA Signal Identification by Name

Signal Name Pin

No. Signal Name Pin

No.

A0 N14 BG P13D7A13

A1 M13 BR N11 D8 B12

A10 H13 CAS N8 D9 A12

A11 H14 CLKOUT M9 DE D3

A12 G14 D0 E14 EXTAL M8

A13 G12 D1 D12 GND D4

A14 F13 D10 B11 GND D5

A15 F14 D11 A11 GND D6

A16 E13 D12 C10 GND D7

A17 E12 D13 B10 GND D8

A2 M14 D14 A10 GND D9

A3 L13 D15 B9 GND D10

A4 L14 D16 A9 GND D11

A5 K13 D17 B8 GND E4

A6 K14 D18 C8 GND E5

A7 J13 D19 A8 GND E6

A8 J12 D2 D13 GND E7

A9 J14 D20 B7 GND E8

AA0 N13 D21 B6 GND E9

AA1 P12 D22 C6 GND E10

AA2 P7 D23 A6 GND E11

AA3 N7 D3 C13 GND F4

BB P11 D4 C14 GND F5

BCLK M10 D5 B13 GND F6

BCLK N10 D6 C12 GND F7

3-16

MAP-BGA Package Description

GND F8 GND J9 H4 N3

GND F9 GND J10 H5 P2

GND F10 GND J11 H6 N1

GND F11 GND K4 H7 N2

GND G4 GND K5 HA0 M3

GND G5 GND K6 HA1 M1

GND G6 GND K7 HA10 L1

GND G7 GND K8 HA2 M2

GND G8 GND K9 HA8 M1

GND G9 GND K10 HA9 M2

GND G10 GND K11 HACK/HACK J1

GND G11 GND L4 HAD0 M5

GND H4 GND L5 HAD1 P4

GND H5 GND L6 HAD2 N4

GND H6 GND L7 HAD3 P3

GND H7 GND L8 HAD4 N3

GND H8 GND L9 HAD5 P2

GND H9 GND L10 HAD6 N1

GND H10 GND L11 HAD7 N2

GND H11 GNDPN6 HAS/HAS M3

GND J4 GNDP1 P6 HCS/HCS L1

GND J5 H0 M5 HDS/HDS J3

GND J6 H1 P4 HRD/HRD J2

GND J7 H2 N4 HREQ/HREQ K2

GND J8 H3 P3 HRRQ/HRRQ J1

Table 3-4. DSP56303 MAP-BGA Signal Identification by Name (Continued)

Signal Name Pin

No. Signal Name Pin

No.

3-17

MAP-BGA Package Description

HRW J2 PB14 K2 PE2 G2

HTRQ/HTRQ K2 PB15 J1 PINIT D1

HWR/HWR J3 PB2 N4 RAS0 N13

IRQA C4 PB3 P3 RAS1 P12

IRQB A5 PB4 N3 RAS2 P7

IRQC C5 PB5 P2 RAS3 N7

IRQD B5 PB6 N1 RD M12

MODA C4 PB7 N2 RESET N5

MODB A5 PB8 M3 RXD F1

MODC C5 PB9 M1 SC00 F3

MODD B5 PC0 F3 SC01 D2

NC A1 PC1 D2 SC02 C1

NC A14 PC2 C1 SC10 F2

NC B14 PC3 H3 SC11 A2

NC H1 PC4 E3 SC12 B2

NC M7 PC5 E1 SCK0 H3

NC P1 PCAP P5 SCK1 G1

NC P14 PD0 F2 SCLK G2

NMI D1 PD1 A2 SRD0 E3

PB0 M5 PD2 B2 SRD1 B1

PB1 P4 PD3 G1 STD0 E1

PB10 M2 PD4 B1 STD1 C2

PB11 J2 PD5 C2 TA P10

PB12 J3 PE0 F1 TCK C3

PB13 L1 PE1 G3 TDI B3

Table 3-4. DSP56303 MAP-BGA Signal Identification by Name (Continued)

Signal Name Pin

No. Signal Name Pin

No.

3-18

MAP-BGA Package Description

TDO A4 VCCA K12 VCCP M6

TIO0 L3 VCCA L12 VCCQ C7

TIO1 L2 VCCC N12 VCCQ G13

TIO2 K3 VCCC P9 VCCQ H2

TMS A3 VCCD A7 VCCQ N9

TRST B4 VCCD C9 VCCS E2

TXD G3 VCCD C11 VCCS K1

VCCA F12 VCCD D14 WR M11

VCCA H12 VCCH M4 XTAL P8

Table 3-4. DSP56303 MAP-BGA Signal Identification by Name (Continued)

Signal Name Pin

No. Signal Name Pin

No.

3-19

MAP-BGA Package Mechanical Drawing

3.5 MAP-BGA Package Mechanical Drawing

Figure 3-6. DSP56303 Mechanical Information, 196-pin MAP-BGA Package

3-20

MAP-BGA Package Mechanical Drawing

4-1

Chapter 4

Design

Considerations

4.1 Thermal Design Considerations

An estimate of the chip junction temperature, TJ, in °C can be obtained from

this equati on:

Equation 1:

Where:

TA = ambient temperature °C

RθJA = package junction-to-ambient thermal resistance °C/W

PD = p ow er dissipation in package

Historically, thermal resistance has been expressed as the sum of a

junction-to-case thermal resistance and a case-to-ambient thermal resistance,

as in this equa tion:

Equation 2:

Where:

RθJA = package junction-to-ambient thermal resistance °C/W

RθJC = package junction-to-case thermal resistance °C/W

RθCA = package case-to-ambient thermal resistance °C/W

RθJC is device-related and cannot be influenced by the user. The user controls

the thermal environment to change the case-to-ambient thermal resistance,

RθCA. For example, the user can change the air flow around the device, add a

heat sink, change the mounting arrangement on the printed circuit board

(PCB) or otherwise change the thermal dissipation capability of the area

surrounding the device on a PCB. This model is most useful for ceramic

packages with heat sinks; some 90 percent of the heat flow is dissipated

through the cas e to the heat sink and out to the ambient environm ent. For

ceramic packages, in situations where the heat flow is split between a path to

the case and an alternate path through the PCB, analysis of the device thermal

performance may need the additio nal modeling cap ability of a system-level

thermal simulation tool.

The thermal performance of plastic packages is more dependent on the

temperature of the PCB to which the package is mounted. Again, if the

estimates obtained from RθJA do not satisfactorily answer whether the thermal

performance is adequate, a system-level model may be appropriate.

TJTAPDRθJA

×()+=

RθJA RθJC RθCA

4-2

Electrical Design Considerations

A complicating factor is the existence of three common ways to det e rmin e the junction-to-case th ermal

resistance in plastic packages.

• To minimize temperature variation across the surface, the thermal resistance is measured from the

junction to the outside surface o f the package (case) closest to the chip mo unting area when that surface

has a proper heat sink.

• To define a value approximately equal to a junction-to-board thermal resistance, the thermal resistance

is measured from the junction t o the point at which the leads attach to the case.

• If the temperature of the package case (TT) is determined by a thermocouple, thermal res istance is

computed from the value obtained by the equation (TJ – TT)/PD.

As noted earlier, the junction-to-case thermal resistances quoted in this data sheet are determined using

the first definition. From a practical stan dpoint, that value is also suitab le to determine the junction

temperature from a case therm ocouple reading in fo rced convection environments. I n natural convection,

the use of the junct ion-to-case thermal resistance to estimate junction temperature from a thermocouple

reading on the case of the package will yield an estimate of a jun c tion temperature slightly higher than

actual temperature. Hence, the new thermal metric, thermal characterization parameter or ΨJT, has been

defined to be (TJ – TT)/PD. This value gives a better estimate of the junction temperature in natu ral

convection when the surface temperature of the package is used. Remember that surface temperature

readings of package s are subject to significant errors caused by inadequate attachment of the sensor to the

surface and to errors caused by heat loss to the sensor. The recommended technique is to attach a

40-gauge thermocouple wire and bead to the top center of the package with thermally conductive epoxy.

4.2 Electrical Design Considerations

CAUTION

This device contains protective circuitry to

guard against damage due to high static

voltage or electrical fields. However, normal

precautions are advised to avoid application

of any voltages higher than maximum rated

voltages to this high-impedance circuit.

Reliability of operation is enhanced if unused

inputs are tied to an appropriate logic voltage

level (for example, either GND or VCC).

4-3

Electrical Design Considerations

Use the following list of recommendations to ensure correct DSP operation.

• Provide a low-impedance path from the board power supply to each VCC pin on the DSP and from the

board ground to each GND pin.

• Use at least six 0.01–0.1 µF bypass capacitors positioned as close as possible to the four sides of the

package to connect the VCC power source to GND.

• Ensure that capacitor leads and associated pri nted circuit traces that connect to the chip VCC and GND

pins are less than 0.5 inch per capacitor lead.

• Use at least a four-layer PCB with two inner layers for VCC and GND.

• Because the DSP output signals have fast rise and fall times, PCB trace lengths should be minimal.

This recommendation particularly applies to the address and dat a buses as well as the IRQA, IRQB,

IRQC, IRQD, TA, and BG pins. Maximum PCB trace lengths on the order of 6 inches are

recommended.

• Consider all device loads as well as parasitic capacitance due to PCB traces when you calculate

capacitance. This is especially critical in systems with higher capacitive loads that co uld create higher

transient currents in the VCC and GND circuits.

• All inputs must be terminated (that is, not allowed to float) by CMOS levels except for the three pins

with internal pull-up resisto rs (TRST, TMS, DE).

• Take special care to minimize noise levels on the VCCP, GNDP, and GNDP1 pins.

• The following pins must be asserted after power-up: RESET and TRST.

• If multiple DSP devices are on the same board, check for cross-talk or excessive spikes on the supplies

due to synchronous op erat i on of th e devices.

•RESET must be asserted when the chip is pow ered up. A stable EXTAL signal should be supplied

before deassertion of RESET.

• At power-up, ens ure that the voltage difference between the 5 V tolerant pins and the chip VCC never

exceeds 3.5 V.

4-4

Power Consumption Considerations

4.3 Power Consumption Considerations

Power dissipation is a key issue in po rtable DSP applications. Some of the factors affecting current

consumption are described in this section. Most of the current consumed by CMOS devices is alternating

current (ac), which is charging and discharging the capacitances of the pins and internal nodes.

Current consumption is descri bed by this form ula:

Equation 3:

Where:

C = node/pin cap acitance

V = voltage swing

f = frequency of node/pin toggle

Equation 4:

The maximum intern al current (ICCImax) value reflects the typ ical possible switchin g of the internal

buses on best-case operation conditions—not necessarily a real application case. The typical internal

current (ICCItyp) value reflects the average switching of the internal buses on typical operating conditions.

Perform the following steps for applications that require very low current consumptio n:

1. Set the EBD bit when you are not accessing external memory.

2. Minimize external memory access es, and use internal memory accesses.

3. Minimize the number of pins that are switching.

4. Minimize the capacitive load on the pins.

5. Connect the unused inputs to pull-up or pull-down resistors.

6. Disable unused peripherals.

7. Disable unused pin activity (for example, CLKOUT, XTAL).

One way to evaluate power cons umption is to use a current-per-MIPS measurement methodology to

minimize specific board effects (that is, to compensate for measured board current not caused by the

DSP). A benchm ark power consump tion test algorithm is listed in Appendix A. Use the test algorithm,

specific test current measurements, and the following equation to derive the current-per-MIPS value.

Equation 5:

Where:

ItypF2 = current at F2

ItypF1 = current at F1

F2 = high frequency (any s pecified operating frequency)

F1 = low frequency (any specified operating frequency lower than F2)

Note: F1 should be significantly less than F2. For example, F2 could be 66 MHz and F1 could be 33

MHz. The degree of difference between F1 and F2 determines the amount of precision wi th

which the current rating can be determined for an application.

Example 4-1. Current Consumption

For a Port A address pin loaded with 50 pF capacitance, operating at 3.3 V, with a 66 MHz clock, toggling at its

maximum possible rate (33 MHz), the current consumption is expressed in Equation 4.

ICVf××=

I50 10 12–

×3.3×33×106

×5.48 mA==

IMIPS⁄IMHz⁄ItypF2 ItypF1

–()F2 F1–()⁄==

4-5

PLL Performance Issues

4.4 PLL Performance Issues

The following explanations shou ld be considered as general observations on expected PLL behavior.

There is no test that replicates these exact numbers. These observations were measured on a limited

number of parts and were not verified over the entire temperature and voltage ranges.

4.4.1 Phase Skew Performance

The phase skew of the PLL is defined as the time difference between the falling edges of EXTAL and

CLKOUT for a given capacitive load on CLKOUT, over the entire process, temperature and voltage

ranges. As defined in Figure 2-2, External Clock Timing, on page 2-5 for input frequencies greater than

15 MHz and the MF ≤4, this skew is greater than or equal to 0.0 ns and less than 1.8 ns; otherwise, this

skew is not guaranteed. H owever, for MF < 10 and input frequencies greater than 10 MHz, this skew is

between −1.4 ns and +3.2 ns.

4.4.2 Phase Jitter Performance

The phase jitter of the PLL is defined as the v a riations in the skew between the falling edges of EXTAL

and CLKOUT for a given device in specific temperature, voltage, input frequency, MF, and capacitive

load on CLKOUT. These variations are a result of the PLL locking mechanism. For input frequencies

greater than 15 MHz and MF ≤ 4, this jitter is les s th an ±0.6 ns; otherwise, this jitter is not guaranteed.

However, for MF < 10 and input frequencies greater than 10 MHz, this jitter is less than ±2 ns.

4.4.3 Frequency Jitter Performance

The frequency jitter of the PLL is defined as the variation of the frequency of CLKOUT. For small MF

(MF < 10) this jitter is smaller than 0.5 percent. For mid-range MF (10 < MF < 500) this jitter is between

0.5 percent and appr oximately 2 percent. Fo r large MF (MF > 500), the frequency jitter is 2–3 percent.

4.5 Input (EXTAL) Jitter Requirements

The allowed jitter on the freq uency of EXTAL is 0.5 percent. If the rate of change of the frequency of

EXTAL is slow (that is, it does not jump between the minimum and ma ximum values in o ne cycle) or the

frequency of the jitter is fast (that is, it does not stay at an extreme value for a long time), then the allowed

jitter can be 2 percent. The phase and frequency jitter performance results are valid only if the input jitter

is less than the pres cribed values.

4-6

Input (EXTAL) Jitter Requirements

A-1

Appendix A

Power

Consumption

Benchmark

The following benchmark pr ogram evaluates DSP56303 power use in a test situation. It enables the PLL,

disables the external clock, and us es repeat ed multiply-accumulate (MAC) instructions with a set of

synthetic DSP application data to emulate intensive sustained DSP operation.

;**************************************************************************

;* *

;* CHECKS Typical Power Consumption *

;* *

;**************************************************************************

page 200,55,0,0,0

nolist

I_VEC EQU $000000; Interrupt vectors for program debug only

START EQU $8000; MAIN (external) program starting address

INT_PROG EQU $100 ; INTERNAL program memory starting address

INT_XDAT EQU $0; INTERNAL X-data memory starting address

INT_YDAT EQU $0; INTERNAL Y-data memory starting address

INCLUDE "ioequ.asm"

INCLUDE "intequ.asm"

list

org P:START

;movep #$0243FF,x:M_BCR ;; BCR: Area 3 = 2 w.s (SRAM)

; Default: 2w.s (SRAM)

;movep #$0d0000,x:M_PCTL ; XTAL disable

; PLL enable

; CLKOUT disable

;

; Load the program

;move #INT_PROG,r0

move #PROG_START,r1

do #(PROG_END-PROG_START),PLOAD_LOOP

move p:(r1)+,x0

move x0,p:(r0)+

nop

PLOAD_LOOP

;

; Load the X-data

;move #INT_XDAT,r0

move #XDAT_START,r1

do #(XDAT_END-XDAT_START),XLOAD_LOOP

move p:(r1)+,x0

move x0,x:(r0)+

XLOAD_LOOP

;

; Load the Y-data

;move #INT_YDAT,r0

move #YDAT_START,r1

do #(YDAT_END-YDAT_START),YLOAD_LOOP

move p:(r1)+,x0

move x0,y:(r0)+

YLOAD_LOOP

;

jmp INT_PROG

PROG_START

move #$0,r0

move #$0,r4

move #$3f,m0

move #$3f,m4

;clr a

A-2

Power Consumption Benchmark

clr b

move #$0,x0

move #$0,x1

move #$0,y0

move #$0,y1

bset #4,omr ; ebd

;

sbr dor #60,_end

mac x0,y0,a x:(r0)+,x1 y:(r4)+,y1

mac x1,y1,a x:(r0)+,x0 y:(r4)+,y0

add a,b

mac x0,y0,a x:(r0)+,x1

mac x1,y1,a y:(r4)+,y0

move b1,x:$ff

_end bra sbr

nop

PROG_END

nop

XDAT_START

; org x:0

dc $262EB9

dc $86F2FE

dc $E56A5F

dc $616CAC

dc $8FFD75

dc $9210A

dc $A06D7B

dc $CEA798

dc $8DFBF1

dc $A063D6

dc $6C6657

dc $C2A544

dc $A3662D

dc $A4E762

dc $84F0F3

dc $E6F1B0

dc $B3829

dc $8BF7AE

dc $63A94F

dc $EF78DC

dc $242DE5

dc $A3E0BA

dc $EBAB6B

dc $8726C8

dc $CA361

dc $2F6E86

dc $A57347

dc $4BE774

dc $8F349D

dc $A1ED12

dc $4BFCE3

dc $EA26E0

dc $CD7D99

dc $4BA85E

dc $27A43F

dc $A8B10C

dc $D3A55

dc $25EC6A

dc $2A255B

dc $A5F1F8

dc $2426D1

dc $AE6536

dc $CBBC37

dc $6235A4

dc $37F0D

dc $63BEC2

dc $A5E4D3

dc $8CE810

dc $3FF09

dc $60E50E

dc $CFFB2F

dc $40753C

dc $8262C5

dc $CA641A

A-3

Power Consumption Benchmark

dc $EB3B4B

dc $2DA928

dc $AB6641

dc $28A7E6

dc $4E2127

dc $482FD4

dc $7257D

dc $E53C72

dc $1A8C3

dc $E27540

XDAT_END

YDAT_START

; org y:0

dc $5B6DA

dc $C3F70B

dc $6A39E8

dc $81E801

dc $C666A6

dc $46F8E7

dc $AAEC94

dc $24233D

dc $802732

dc $2E3C83

dc $A43E00

dc $C2B639

dc $85A47E

dc $ABFDDF

dc $F3A2C

dc $2D7CF5

dc $E16A8A

dc $ECB8FB

dc $4BED18

dc $43F371

dc $83A556

dc $E1E9D7

dc $ACA2C4

dc $8135AD

dc $2CE0E2

dc $8F2C73

dc $432730

dc $A87FA9

dc $4A292E

dc $A63CCF

dc $6BA65C

dc $E06D65

dc $1AA3A

dc $A1B6EB

dc $48AC48

dc $EF7AE1

dc $6E3006

dc $62F6C7

dc $6064F4

dc $87E41D

dc $CB2692

dc $2C3863

dc $C6BC60

dc $43A519

dc $6139DE

dc $ADF7BF

dc $4B3E8C

dc $6079D5

dc $E0F5EA

dc $8230DB

dc $A3B778

dc $2BFE51

dc $E0A6B6

dc $68FFB7

dc $28F324

dc $8F2E8D

dc $667842

dc $83E053

dc $A1FD90

dc $6B2689

dc $85B68E

dc $622EAF

dc $6162BC

dc $E4A245

YDAT_END

;**************************************************************************

A-4

Power Consumption Benchmark

;

; EQUATES for DSP56303 I/O registers and ports

;

; Last update: June 11 1995

;

;**************************************************************************

page 132,55,0,0,0

opt mex

ioequ ident 1,0

;------------------------------------------------------------------------

;

; EQUATES for I/O Port Programming

;

;------------------------------------------------------------------------

; Register Addresses

M_HDR EQU $FFFFC9 ; Host port GPIO data Register

M_HDDR EQU $FFFFC8 ; Host port GPIO direction Register

M_PCRC EQU $FFFFBF ; Port C Control Register

M_PRRC EQU $FFFFBE ; Port C Direction Register

M_PDRC EQU $FFFFBD ; Port C GPIO Data Register

M_PCRD EQU $FFFFAF ; Port D Control register

M_PRRD EQU $FFFFAE ; Port D Direction Data Register

M_PDRD EQU $FFFFAD ; Port D GPIO Data Register

M_PCRE EQU $FFFF9F ; Port E Control register

M_PRRE EQU $FFFF9E ; Port E Direction Register

M_PDRE EQU $FFFF9D ; Port E Data Register

M_OGDB EQU $FFFFFC ; OnCE GDB Register

;------------------------------------------------------------------------

;

; EQUATES for Host Interface

;

;------------------------------------------------------------------------

; Register Addresses

M_HCR EQU $FFFFC2 ; Host Control Register

M_HSR EQU $FFFFC3 ; Host Status Register

M_HPCR EQU $FFFFC4 ; Host Polarity Control Register

M_HBAR EQU $FFFFC5 ; Host Base Address Register

M_HRX EQU $FFFFC6 ; Host Receive Register

M_HTX EQU $FFFFC7 ; Host Transmit Register

; HCR bits definition

M_HRIE EQU $0 ; Host Receive interrupts Enable

M_HTIE EQU $1 ; Host Transmit Interrupt Enable

M_HCIE EQU $2 ; Host Command Interrupt Enable

M_HF2 EQU $3 ; Host Flag 2

M_HF3 EQU $4 ; Host Flag 3

; HSR bits definition

M_HRDF EQU $0 ; Host Receive Data Full

M_HTDE EQU $1 ; Host Receive Data Empty

M_HCP EQU $2 ; Host Command Pending

M_HF0 EQU $3 ; Host Flag 0

M_HF1 EQU $4 ; Host Flag 1

; HPCR bits definition

M_HGEN EQU $0 ; Host Port GPIO Enable

M_HA8EN EQU $1 ; Host Address 8 Enable

M_HA9EN EQU $2 ; Host Address 9 Enable

M_HCSEN EQU $3 ; Host Chip Select Enable

M_HREN EQU $4 ; Host Request Enable

M_HAEN EQU $5 ; Host Acknowledge Enable

M_HEN EQU $6 ; Host Enable

M_HOD EQU $8 ; Host Request Open Drain mode

M_HDSP EQU $9 ; Host Data Strobe Polarity

M_HASP EQU $A ; Host Address Strobe Polarity

M_HMUX EQU $B ; Host Multiplexed bus select

M_HD_HS EQU $C ; Host Double/Single Strobe select

M_HCSP EQU $D ; Host Chip Select Polarity

M_HRP EQU $E ; Host Request Polarity

M_HAP EQU $F ; Host Acknowledge Polarity

A-5

Power Consumption Benchmark

;------------------------------------------------------------------------

;

; EQUATES for Serial Communications Interface (SCI)

;

;------------------------------------------------------------------------

; Register Addresses

M_STXH EQU $FFFF97 ; SCI Transmit Data Register (high)

M_STXM EQU $FFFF96 ; SCI Transmit Data Register (middle)

M_STXL EQU $FFFF95 ; SCI Transmit Data Register (low)

M_SRXH EQU $FFFF9A ; SCI Receive Data Register (high)

M_SRXM EQU $FFFF99 ; SCI Receive Data Register (middle)

M_SRXL EQU $FFFF98 ; SCI Receive Data Register (low)

M_STXA EQU $FFFF94 ; SCI Transmit Address Register

M_SCR EQU $FFFF9C ; SCI Control Register

M_SSR EQU $FFFF93 ; SCI Status Register

M_SCCR EQU $FFFF9B ; SCI Clock Control Register

; SCI Control Register Bit Flags

M_WDS EQU $7 ; Word Select Mask (WDS0-WDS3)

M_WDS0 EQU 0 ; Word Select 0

M_WDS1 EQU 1 ; Word Select 1

M_WDS2 EQU 2 ; Word Select 2

M_SSFTD EQU 3 ; SCI Shift Direction

M_SBK EQU 4 ; Send Break

M_WAKE EQU 5 ; Wakeup Mode Select

M_RWU EQU 6 ; Receiver Wakeup Enable

M_WOMS EQU 7 ; Wired-OR Mode Select

M_SCRE EQU 8 ; SCI Receiver Enable

M_SCTE EQU 9 ; SCI Transmitter Enable

M_ILIE EQU 10 ; Idle Line Interrupt Enable

M_SCRIE EQU 11 ; SCI Receive Interrupt Enable

M_SCTIE EQU 12 ; SCI Transmit Interrupt Enable

M_TMIE EQU 13 ; Timer Interrupt Enable

M_TIR EQU 14 ; Timer Interrupt Rate

M_SCKP EQU 15 ; SCI Clock Polarity

M_REIE EQU 16 ; SCI Error Interrupt Enable (REIE)

; SCI Status Register Bit Flags

M_TRNE EQU 0 ; Transmitter Empty

M_TDRE EQU 1 ; Transmit Data Register Empty

M_RDRF EQU 2 ; Receive Data Register Full

M_IDLE EQU 3 ; Idle Line Flag

M_OR EQU 4 ; Overrun Error Flag

M_PE EQU 5 ; Parity Error

M_FE EQU 6 ; Framing Error Flag

M_R8 EQU 7 ; Received Bit 8 (R8) Address

; SCI Clock Control Register

M_CD EQU $FFF ; Clock Divider Mask (CD0-CD11)

M_COD EQU 12 ; Clock Out Divider

M_SCP EQU 13 ; Clock Prescaler

M_RCM EQU 14 ; Receive Clock Mode Source Bit

M_TCM EQU 15 ; Transmit Clock Source Bit

;------------------------------------------------------------------------

;

; EQUATES for Synchronous Serial Interface (SSI)

;

;------------------------------------------------------------------------

;

; Register Addresses Of SSI0

M_TX00 EQU $FFFFBC ; SSI0 Transmit Data Register 0

M_TX01 EQU $FFFFBB ; SSIO Transmit Data Register 1

M_TX02 EQU $FFFFBA ; SSIO Transmit Data Register 2

M_TSR0 EQU $FFFFB9 ; SSI0 Time Slot Register

M_RX0 EQU $FFFFB8 ; SSI0 Receive Data Register

M_SSISR0 EQU $FFFFB7 ; SSI0 Status Register

M_CRB0 EQU $FFFFB6 ; SSI0 Control Register B

M_CRA0 EQU $FFFFB5 ; SSI0 Control Register A

M_TSMA0 EQU $FFFFB4 ; SSI0 Transmit Slot Mask Register A

M_TSMB0 EQU $FFFFB3 ; SSI0 Transmit Slot Mask Register B

M_RSMA0 EQU $FFFFB2 ; SSI0 Receive Slot Mask Register A

M_RSMB0 EQU $FFFFB1 ; SSI0 Receive Slot Mask Register B

A-6

Power Consumption Benchmark

; Register Addresses Of SSI1

M_TX10 EQU $FFFFAC ; SSI1 Transmit Data Register 0

M_TX11 EQU $FFFFAB ; SSI1 Transmit Data Register 1

M_TX12 EQU $FFFFAA ; SSI1 Transmit Data Register 2

M_TSR1 EQU $FFFFA9 ; SSI1 Time Slot Register

M_RX1 EQU $FFFFA8 ; SSI1 Receive Data Register

M_SSISR1 EQU $FFFFA7 ; SSI1 Status Register

M_CRB1 EQU $FFFFA6 ; SSI1 Control Register B

M_CRA1 EQU $FFFFA5 ; SSI1 Control Register A

M_TSMA1 EQU $FFFFA4 ; SSI1 Transmit Slot Mask Register A

M_TSMB1 EQU $FFFFA3 ; SSI1 Transmit Slot Mask Register B

M_RSMA1 EQU $FFFFA2 ; SSI1 Receive Slot Mask Register A

M_RSMB1 EQU $FFFFA1 ; SSI1 Receive Slot Mask Register B

; SSI Control Register A Bit Flags

M_PM EQU $FF ; Prescale Modulus Select Mask (PM0-PM7)

M_PSR EQU 11 ; Prescaler Range

M_DC EQU $1F000 ; Frame Rate Divider Control Mask (DC0-DC7)

M_ALC EQU 18 ; Alignment Control (ALC)

M_WL EQU $380000 ; Word Length Control Mask (WL0-WL7)

M_SSC1 EQU 22 ; Select SC1 as TR #0 drive enable (SSC1)

; SSI Control Register B Bit Flags

M_OF EQU $3 ; Serial Output Flag Mask

M_OF0 EQU 0 ; Serial Output Flag 0

M_OF1 EQU 1 ; Serial Output Flag 1

M_SCD EQU $1C ; Serial Control Direction Mask

M_SCD0 EQU 2 ; Serial Control 0 Direction

M_SCD1 EQU 3 ; Serial Control 1 Direction

M_SCD2 EQU 4 ; Serial Control 2 Direction

M_SCKD EQU 5 ; Clock Source Direction

M_SHFD EQU 6 ; Shift Direction

M_FSL EQU $180 ; Frame Sync Length Mask (FSL0-FSL1)

M_FSL0 EQU 7 ; Frame Sync Length 0

M_FSL1 EQU 8 ; Frame Sync Length 1

M_FSR EQU 9 ; Frame Sync Relative Timing

M_FSP EQU 10 ; Frame Sync Polarity

M_CKP EQU 11 ; Clock Polarity

M_SYN EQU 12 ; Sync/Async Control

M_MOD EQU 13 ; SSI Mode Select

M_SSTE EQU $1C000 ; SSI Transmit enable Mask

M_SSTE2 EQU 14 ; SSI Transmit #2 Enable

M_SSTE1 EQU 15 ; SSI Transmit #1 Enable

M_SSTE0 EQU 16 ; SSI Transmit #0 Enable

M_SSRE EQU 17 ; SSI Receive Enable

M_SSTIE EQU 18 ; SSI Transmit Interrupt Enable

M_SSRIE EQU 19 ; SSI Receive Interrupt Enable

M_STLIE EQU 20 ; SSI Transmit Last Slot Interrupt Enable

M_SRLIE EQU 21 ; SSI Receive Last Slot Interrupt Enable

M_STEIE EQU 22 ; SSI Transmit Error Interrupt Enable

M_SREIE EQU 23 ; SI Receive Error Interrupt Enable

; SSI Status Register Bit Flags

M_IF EQU $3 ; Serial Input Flag Mask

M_IF0 EQU 0 ; Serial Input Flag 0

M_IF1 EQU 1 ; Serial Input Flag 1

M_TFS EQU 2 ; Transmit Frame Sync Flag

M_RFS EQU 3 ; Receive Frame Sync Flag

M_TUE EQU 4 ; Transmitter Underrun Error FLag

M_ROE EQU 5 ; Receiver Overrun Error Flag

M_TDE EQU 6 ; Transmit Data Register Empty

M_RDF EQU 7 ; Receive Data Register Full

; SSI Transmit Slot Mask Register A

M_SSTSA EQU $FFFF ; SSI Transmit Slot Bits Mask A (TS0-TS15)

; SSI Transmit Slot Mask Register B

M_SSTSB EQU $FFFF ; SSI Transmit Slot Bits Mask B (TS16-TS31)

; SSI Receive Slot Mask Register A

M_SSRSA EQU $FFFF ; SSI Receive Slot Bits Mask A (RS0-RS15)

; SSI Receive Slot Mask Register B

M_SSRSB EQU $FFFF ; SSI Receive Slot Bits Mask B (RS16-RS31)

A-7

Power Consumption Benchmark

;------------------------------------------------------------------------

;

; EQUATES for Exception Processing

;

;------------------------------------------------------------------------

; Register Addresses

M_IPRC EQU $FFFFFF ; Interrupt Priority Register Core

M_IPRP EQU $FFFFFE ; Interrupt Priority Register Peripheral

; Interrupt Priority Register Core (IPRC)

M_IAL EQU $7 ; IRQA Mode Mask

M_IAL0 EQU 0 ; IRQA Mode Interrupt Priority Level (low)

M_IAL1 EQU 1 ; IRQA Mode Interrupt Priority Level (high)

M_IAL2 EQU 2 ; IRQA Mode Trigger Mode

M_IBL EQU $38 ; IRQB Mode Mask

M_IBL0 EQU 3 ; IRQB Mode Interrupt Priority Level (low)

M_IBL1 EQU 4 ; IRQB Mode Interrupt Priority Level (high)

M_IBL2 EQU 5 ; IRQB Mode Trigger Mode

M_ICL EQU $1C0 ; IRQC Mode Mask

M_ICL0 EQU 6 ; IRQC Mode Interrupt Priority Level (low)

M_ICL1 EQU 7 ; IRQC Mode Interrupt Priority Level (high)

M_ICL2 EQU 8 ; IRQC Mode Trigger Mode

M_IDL EQU $E00 ; IRQD Mode Mask

M_IDL0 EQU 9 ; IRQD Mode Interrupt Priority Level (low)

M_IDL1 EQU 10 ; IRQD Mode Interrupt Priority Level (high)

M_IDL2 EQU 11 ; IRQD Mode Trigger Mode

M_D0L EQU $3000 ; DMA0 Interrupt priority Level Mask

M_D0L0 EQU 12 ; DMA0 Interrupt Priority Level (low)

M_D0L1 EQU 13 ; DMA0 Interrupt Priority Level (high)

M_D1L EQU $C000 ; DMA1 Interrupt Priority Level Mask

M_D1L0 EQU 14 ; DMA1 Interrupt Priority Level (low)

M_D1L1 EQU 15 ; DMA1 Interrupt Priority Level (high)

M_D2L EQU $30000 ; DMA2 Interrupt priority Level Mask

M_D2L0 EQU 16 ; DMA2 Interrupt Priority Level (low)

M_D2L1 EQU 17 ; DMA2 Interrupt Priority Level (high)

M_D3L EQU $C0000 ; DMA3 Interrupt Priority Level Mask

M_D3L0 EQU 18 ; DMA3 Interrupt Priority Level (low)

M_D3L1 EQU 19 ; DMA3 Interrupt Priority Level (high)

M_D4L EQU $300000 ; DMA4 Interrupt priority Level Mask

M_D4L0 EQU 20 ; DMA4 Interrupt Priority Level (low)

M_D4L1 EQU 21 ; DMA4 Interrupt Priority Level (high)

M_D5L EQU $C00000 ; DMA5 Interrupt priority Level Mask

M_D5L0 EQU 22 ; DMA5 Interrupt Priority Level (low)

M_D5L1 EQU 23 ; DMA5 Interrupt Priority Level (high)

; Interrupt Priority Register Peripheral (IPRP)

M_HPL EQU $3 ; Host Interrupt Priority Level Mask

M_HPL0 EQU 0 ; Host Interrupt Priority Level (low)

M_HPL1 EQU 1 ; Host Interrupt Priority Level (high)

M_S0L EQU $C ; SSI0 Interrupt Priority Level Mask

M_S0L0 EQU 2 ; SSI0 Interrupt Priority Level (low)

M_S0L1 EQU 3 ; SSI0 Interrupt Priority Level (high)

M_S1L EQU $30 ; SSI1 Interrupt Priority Level Mask

M_S1L0 EQU 4 ; SSI1 Interrupt Priority Level (low)

M_S1L1 EQU 5 ; SSI1 Interrupt Priority Level (high)

M_SCL EQU $C0 ; SCI Interrupt Priority Level Mask

M_SCL0 EQU 6 ; SCI Interrupt Priority Level (low)

M_SCL1 EQU 7 ; SCI Interrupt Priority Level (high)

M_T0L EQU $300 ; TIMER Interrupt Priority Level Mask

M_T0L0 EQU 8 ; TIMER Interrupt Priority Level (low)

M_T0L1 EQU 9 ; TIMER Interrupt Priority Level (high)

;------------------------------------------------------------------------

;

; EQUATES for TIMER

;

;------------------------------------------------------------------------

; Register Addresses Of TIMER0

M_TCSR0 EQU $FFFF8F ; Timer 0 Control/Status Register

A-8

Power Consumption Benchmark

M_TLR0 EQU $FFFF8E ; TIMER0 Load Reg

M_TCPR0 EQU $FFFF8D ; TIMER0 Compare Register

M_TCR0 EQU $FFFF8C ; TIMER0 Count Register

; Register Addresses Of TIMER1

M_TCSR1 EQU $FFFF8B ; TIMER1 Control/Status Register

M_TLR1 EQU $FFFF8A ; TIMER1 Load Reg

M_TCPR1 EQU $FFFF89 ; TIMER1 Compare Register

M_TCR1 EQU $FFFF88 ; TIMER1 Count Register

; Register Addresses Of TIMER2

M_TCSR2 EQU $FFFF87 ; TIMER2 Control/Status Register

M_TLR2 EQU $FFFF86 ; TIMER2 Load Reg

M_TCPR2 EQU $FFFF85 ; TIMER2 Compare Register

M_TCR2 EQU $FFFF84 ; TIMER2 Count Register

M_TPLR EQU $FFFF83 ; TIMER Prescaler Load Register

M_TPCR EQU $FFFF82 ; TIMER Prescalar Count Register

; Timer Control/Status Register Bit Flags

M_TE EQU 0 ; Timer Enable

M_TOIE EQU 1 ; Timer Overflow Interrupt Enable

M_TCIE EQU 2 ; Timer Compare Interrupt Enable

M_TC EQU $F0 ; Timer Control Mask (TC0-TC3)

M_INV EQU 8 ; Inverter Bit

M_TRM EQU 9 ; Timer Restart Mode

M_DIR EQU 11 ; Direction Bit

M_DI EQU 12 ; Data Input

M_DO EQU 13 ; Data Output

M_PCE EQU 15 ; Prescaled Clock Enable

M_TOF EQU 20 ; Timer Overflow Flag

M_TCF EQU 21 ; Timer Compare Flag

; Timer Prescaler Register Bit Flags

M_PS EQU $600000 ; Prescaler Source Mask

M_PS0 EQU 21

M_PS1 EQU 22

; Timer Control Bits

M_TC0 EQU 4 ; Timer Control 0

M_TC1 EQU 5 ; Timer Control 1

M_TC2 EQU 6 ; Timer Control 2

M_TC3 EQU 7 ; Timer Control 3

;------------------------------------------------------------------------

;

; EQUATES for Direct Memory Access (DMA)

;

;------------------------------------------------------------------------

; Register Addresses Of DMA

M_DSTR EQU FFFFF4 ; DMA Status Register

M_DOR0 EQU $FFFFF3 ; DMA Offset Register 0

M_DOR1 EQU $FFFFF2 ; DMA Offset Register 1

M_DOR2 EQU $FFFFF1 ; DMA Offset Register 2

M_DOR3 EQU $FFFFF0 ; DMA Offset Register 3

; Register Addresses Of DMA0

M_DSR0 EQU $FFFFEF ; DMA0 Source Address Register

M_DDR0 EQU $FFFFEE ; DMA0 Destination Address Register

M_DCO0 EQU $FFFFED ; DMA0 Counter

M_DCR0 EQU $FFFFEC ; DMA0 Control Register

; Register Addresses Of DMA1

M_DSR1 EQU $FFFFEB ; DMA1 Source Address Register

M_DDR1 EQU $FFFFEA ; DMA1 Destination Address Register

M_DCO1 EQU $FFFFE9 ; DMA1 Counter

M_DCR1 EQU $FFFFE8 ; DMA1 Control Register

; Register Addresses Of DMA2

M_DSR2 EQU $FFFFE7 ; DMA2 Source Address Register

A-9

Power Consumption Benchmark

M_DDR2 EQU $FFFFE6 ; DMA2 Destination Address Register

M_DCO2 EQU $FFFFE5 ; DMA2 Counter

M_DCR2 EQU $FFFFE4 ; DMA2 Control Register

; Register Addresses Of DMA4

M_DSR3 EQU $FFFFE3 ; DMA3 Source Address Register

M_DDR3 EQU $FFFFE2 ; DMA3 Destination Address Register

M_DCO3 EQU $FFFFE1 ; DMA3 Counter

M_DCR3 EQU $FFFFE0 ; DMA3 Control Register

; Register Addresses Of DMA4

M_DSR4 EQU $FFFFDF ; DMA4 Source Address Register

M_DDR4 EQU $FFFFDE ; DMA4 Destination Address Register

M_DCO4 EQU $FFFFDD ; DMA4 Counter

M_DCR4 EQU $FFFFDC ; DMA4 Control Register

; Register Addresses Of DMA5

M_DSR5 EQU $FFFFDB ; DMA5 Source Address Register

M_DDR5 EQU $FFFFDA ; DMA5 Destination Address Register

M_DCO5 EQU $FFFFD9 ; DMA5 Counter

M_DCR5 EQU $FFFFD8 ; DMA5 Control Register

; DMA Control Register

M_DSS EQU $3 ; DMA Source Space Mask (DSS0-Dss1)

M_DSS0 EQU 0 ; DMA Source Memory space 0

M_DSS1 EQU 1 ; DMA Source Memory space 1

M_DDS EQU $C ; DMA Destination Space Mask (DDS-DDS1)

M_DDS0 EQU 2 ; DMA Destination Memory Space 0

M_DDS1 EQU 3 ; DMA Destination Memory Space 1

M_DAM EQU $3f0 ; DMA Address Mode Mask (DAM5-DAM0)

M_DAM0 EQU 4 ; DMA Address Mode 0

M_DAM1 EQU 5 ; DMA Address Mode 1

M_DAM2 EQU 6 ; DMA Address Mode 2

M_DAM3 EQU 7 ; DMA Address Mode 3

M_DAM4 EQU 8 ; DMA Address Mode 4

M_DAM5 EQU 9 ; DMA Address Mode 5

M_D3D EQU 10 ; DMA Three Dimensional Mode

M_DRS EQU $F800; DMA Request Source Mask (DRS0-DRS4)

M_DCON EQU 16 ; DMA Continuous Mode

M_DPR EQU $60000; DMA Channel Priority

M_DPR0 EQU 17 ; DMA Channel Priority Level (low)

M_DPR1 EQU 18 ; DMA Channel Priority Level (high)

M_DTM EQU $380000; DMA Transfer Mode Mask (DTM2-DTM0)

M_DTM0 EQU 19 ; DMA Transfer Mode 0

M_DTM1 EQU 20 ; DMA Transfer Mode 1

M_DTM2 EQU 21 ; DMA Transfer Mode 2

M_DIE EQU 22 ; DMA Interrupt Enable bit

M_DE EQU 23 ; DMA Channel Enable bit

; DMA Status Register

M_DTD EQU $3F ; Channel Transfer Done Status MASK (DTD0-DTD5)

M_DTD0 EQU 0 ; DMA Channel Transfer Done Status 0

M_DTD1 EQU 1 ; DMA Channel Transfer Done Status 1

M_DTD2 EQU 2 ; DMA Channel Transfer Done Status 2

M_DTD3 EQU 3 ; DMA Channel Transfer Done Status 3

M_DTD4 EQU 4 ; DMA Channel Transfer Done Status 4

M_DTD5 EQU 5 ; DMA Channel Transfer Done Status 5

M_DACT EQU 8 ; DMA Active State

M_DCH EQU $E00; DMA Active Channel Mask (DCH0-DCH2)

M_DCH0 EQU 9 ; DMA Active Channel 0

M_DCH1 EQU 10 ; DMA Active Channel 1

M_DCH2 EQU 11 ; DMA Active Channel 2

;------------------------------------------------------------------------

;

; EQUATES for Enhanced Filter Co-Processor (EFCOP)

;

;------------------------------------------------------------------------

M_FDIR EQU $FFFFB0 ; EFCOP Data Input Register

M_FDOR EQU $FFFFB1 ; EFCOP Data Output Register

M_FKIR EQU $FFFFB2 ; EFCOP K-Constant Register

M_FCNT EQU $FFFFB3 ; EFCOP Filter Counter

M_FCSR EQU $FFFFB4 ; EFCOP Control Status Register

M_FACR EQU $FFFFB5 ; EFCOP ALU Control Register

A-10

Power Consumption Benchmark

M_FDBA EQU $FFFFB6 ; EFCOP Data Base Address

M_FCBA EQU $FFFFB7 ; EFCOP Coefficient Base Address

M_FDCH EQU $FFFFB8 ; EFCOP Decimation/Channel Register

;------------------------------------------------------------------------

;

; EQUATES for Phase Locked Loop (PLL)

;

;------------------------------------------------------------------------

; Register Addresses Of PLL

M_PCTL EQU $FFFFFD ; PLL Control Register

; PLL Control Register

M_MF EQU $FFF : Multiplication Factor Bits Mask (MF0-MF11)

M_DF EQU $7000 ; Division Factor Bits Mask (DF0-DF2)

M_XTLR EQU 15 ; XTAL Range select bit

M_XTLD EQU 16 ; XTAL Disable Bit

M_PSTP EQU 17 ; STOP Processing State Bit

M_PEN EQU 18 ; PLL Enable Bit

M_PCOD EQU 19 ; PLL Clock Output Disable Bit

M_PD EQU $F00000; PreDivider Factor Bits Mask (PD0-PD3)

;------------------------------------------------------------------------

;

; EQUATES for BIU

;

;------------------------------------------------------------------------

; Register Addresses Of BIU

M_BCR EQU $FFFFFB; Bus Control Register

M_DCR EQU $FFFFFA; DRAM Control Register

M_AAR0 EQU $FFFFF9; Address Attribute Register 0

M_AAR1 EQU $FFFFF8; Address Attribute Register 1

M_AAR2 EQU $FFFFF7; Address Attribute Register 2

M_AAR3 EQU $FFFFF6; Address Attribute Register 3

M_IDR EQU $FFFFF5 ; ID Register

; Bus Control Register

M_BA0W EQU $1F ; Area 0 Wait Control Mask (BA0W0-BA0W4)

M_BA1W EQU $3E0; Area 1 Wait Control Mask (BA1W0-BA14)

M_BA2W EQU $1C00; Area 2 Wait Control Mask (BA2W0-BA2W2)

M_BA3W EQU $E000; Area 3 Wait Control Mask (BA3W0-BA3W3)

M_BDFW EQU $1F0000 ; Default Area Wait Control Mask (BDFW0-BDFW4)

M_BBS EQU 21 ; Bus State

M_BLH EQU 22 ; Bus Lock Hold

M_BRH EQU 23 ; Bus Request Hold

; DRAM Control Register

M_BCW EQU $3 ; In Page Wait States Bits Mask (BCW0-BCW1)

M_BRW EQU $C ; Out Of Page Wait States Bits Mask (BRW0-BRW1)

M_BPS EQU $300 ; DRAM Page Size Bits Mask (BPS0-BPS1)

M_BPLE EQU 11 ; Page Logic Enable

M_BME EQU 12 ; Mastership Enable

M_BRE EQU 13 ; Refresh Enable

M_BSTR EQU 14 ; Software Triggered Refresh

M_BRF EQU $7F8000; Refresh Rate Bits Mask (BRF0-BRF7)

M_BRP EQU 23 ; Refresh prescaler

; Address Attribute Registers

M_BAT EQU $3 ; Ext. Access Type and Pin Def. Bits Mask (BAT0-BAT1)

M_BAAP EQU 2 ; Address Attribute Pin Polarity

M_BPEN EQU 3 ; Program Space Enable

M_BXEN EQU 4 ; X Data Space Enable

M_BYEN EQU 5 ; Y Data Space Enable

M_BAM EQU 6 ; Address Muxing

M_BPAC EQU 7 ; Packing Enable

M_BNC EQU $F00 ; Number of Address Bits to Compare Mask (BNC0-BNC3)

M_BAC EQU $FFF000; Address to Compare Bits Mask (BAC0-BAC11)

A-11

Power Consumption Benchmark

; control and status bits in SR

M_CP EQU $c00000; mask for CORE-DMA priority bits in SR

M_CA EQU 0 ; Carry

M_V EQU 1 ; Overflow

M_Z EQU 2 ; Zero

M_N EQU 3 ; Negative

M_U EQU 4 ; Unnormalized

M_E EQU 5 ; Extension

M_L EQU 6 ; Limit

M_S EQU 7 ; Scaling Bit

M_I0 EQU 8 ; Interupt Mask Bit 0

M_I1 EQU 9 ; Interupt Mask Bit 1

M_S0 EQU 10 ; Scaling Mode Bit 0

M_S1 EQU 11 ; Scaling Mode Bit 1

M_SC EQU 13 ; Sixteen_Bit Compatibility

M_DM EQU 14 ; Double Precision Multiply

M_LF EQU 15 ; DO-Loop Flag

M_FV EQU 16 ; DO-Forever Flag

M_SA EQU 17 ; Sixteen-Bit Arithmetic

M_CE EQU 19 ; Instruction Cache Enable

M_SM EQU 20 ; Arithmetic Saturation

M_RM EQU 21 ; Rounding Mode

M_CP0 EQU 22 ; bit 0 of priority bits in SR

M_CP1 EQU 23 ; bit 1 of priority bits in SR

; control and status bits in OMR

M_CDP EQU $300 ; mask for CORE-DMA priority bits in OMR

M_MA equ0 ; Operating Mode A

M_MB equ1 ; Operating Mode B

M_MC equ2 ; Operating Mode C

M_MD equ3 ; Operating Mode D

M_EBD EQU 4 ; External Bus Disable bit in OMR

M_SD EQU 6 ; Stop Delay

M_MS EQU 7 ; Memory Switch bit in OMR

M_CDP0 EQU 8 ; bit 0 of priority bits in OMR

M_CDP1 EQU 9 ; bit 1 of priority bits in OMR

M_BEN EQU 10 ; Burst Enable

M_TAS EQU 11 ; TA Synchronize Select

M_BRT EQU 12 ; Bus Release Timing

M_ATE EQU 15 ; Address Tracing Enable bit in OMR.

M_XYS EQU 16 ; Stack Extension space select bit in OMR.

M_EUN EQU 17 ; Extensed stack UNderflow flag in OMR.

M_EOV EQU 18 ; Extended stack OVerflow flag in OMR.

M_WRP EQU 19 ; Extended WRaP flag in OMR.

M_SEN EQU 20 ; Stack Extension Enable bit in OMR.

;*************************************************************************

;

; EQUATES for DSP56303 interrupts

;

; Last update: June 11 1995

;

;*************************************************************************

page 132,55,0,0,0

opt mex

intequ ident 1,0

if @DEF(I_VEC)

;leave user definition as is.

else

I_VEC EQU $0

endif

;------------------------------------------------------------------------

; Non-Maskable interrupts

;------------------------------------------------------------------------

I_RESET EQU I_VEC+$00 ; Hardware RESET

I_STACK EQU I_VEC+$02 ; Stack Error

I_ILL EQU I_VEC+$04 ; Illegal Instruction

I_DBG EQU I_VEC+$06 ; Debug Request

A-12

Power Consumption Benchmark

I_TRAP EQU I_VEC+$08 ; Trap

I_NMI EQU I_VEC+$0A ; Non Maskable Interrupt

;------------------------------------------------------------------------

; Interrupt Request Pins

;------------------------------------------------------------------------

I_IRQA EQU I_VEC+$10 ; IRQA

I_IRQB EQU I_VEC+$12 ; IRQB

I_IRQC EQU I_VEC+$14 ; IRQC

I_IRQD EQU I_VEC+$16 ; IRQD

;------------------------------------------------------------------------

; DMA Interrupts

;------------------------------------------------------------------------

I_DMA0 EQU I_VEC+$18 ; DMA Channel 0

I_DMA1 EQU I_VEC+$1A ; DMA Channel 1

I_DMA2 EQU I_VEC+$1C ; DMA Channel 2

I_DMA3 EQU I_VEC+$1E ; DMA Channel 3

I_DMA4 EQU I_VEC+$20 ; DMA Channel 4

I_DMA5 EQU I_VEC+$22 ; DMA Channel 5

;------------------------------------------------------------------------

; Timer Interrupts

;------------------------------------------------------------------------

I_TIM0C EQU I_VEC+$24 ; TIMER 0 compare

I_TIM0OF EQU I_VEC+$26 ; TIMER 0 overflow

I_TIM1C EQU I_VEC+$28 ; TIMER 1 compare

I_TIM1OF EQU I_VEC+$2A ; TIMER 1 overflow

I_TIM2C EQU I_VEC+$2C ; TIMER 2 compare

I_TIM2OF EQU I_VEC+$2E ; TIMER 2 overflow

;------------------------------------------------------------------------

; ESSI Interrupts

;------------------------------------------------------------------------

I_SI0RD EQU I_VEC+$30 ; ESSI0 Receive Data

I_SI0RDE EQU I_VEC+$32 ; ESSI0 Receive Data w/ exception Status

I_SI0RLS EQU I_VEC+$34 ; ESSI0 Receive last slot

I_SI0TD EQU I_VEC+$36 ; ESSI0 Transmit data

I_SI0TDE EQU I_VEC+$38 ; ESSI0 Transmit Data w/ exception Status

I_SI0TLS EQU I_VEC+$3A ; ESSI0 Transmit last slot

I_SI1RD EQU I_VEC+$40 ; ESSI1 Receive Data

I_SI1RDE EQU I_VEC+$42 ; ESSI1 Receive Data w/ exception Status

I_SI1RLS EQU I_VEC+$44 ; ESSI1 Receive last slot

I_SI1TD EQU I_VEC+$46 ; ESSI1 Transmit data

I_SI1TDE EQU I_VEC+$48 ; ESSI1 Transmit Data w/ exception Status

I_SI1TLS EQU I_VEC+$4A ; ESSI1 Transmit last slot

;------------------------------------------------------------------------

; SCI Interrupts

;------------------------------------------------------------------------

I_SCIRD EQU I_VEC+$50 ; SCI Receive Data

I_SCIRDE EQU I_VEC+$52 ; SCI Receive Data With Exception Status

I_SCITD EQU I_VEC+$54 ; SCI Transmit Data

I_SCIIL EQU I_VEC+$56 ; SCI Idle Line

I_SCITM EQU I_VEC+$58 ; SCI Timer

;------------------------------------------------------------------------

; HOST Interrupts

;------------------------------------------------------------------------

I_HRDF EQU I_VEC+$60 ; Host Receive Data Full

I_HTDE EQU I_VEC+$62 ; Host Transmit Data Empty

I_HC EQU I_VEC+$64 ; Default Host Command

;-----------------------------------------------------------------------

; EFCOP Filter Interrupts

;-----------------------------------------------------------------------

I_FDIIE EQU I_VEC+$68 ; EFilter input buffer empty

I_FDOIE EQU I_VEC+$6A ; EFilter output buffer full

;------------------------------------------------------------------------

; INTERRUPT ENDING ADDRESS

;------------------------------------------------------------------------

I_INTEND EQU I_VEC+$FF ; last address of interrupt vector space

Index
Index-1
A
ac electrical characteristics 2-4
address bus 1-1
Address Trace mode 2-25, 2-27
applications iv
arbitration bus timings 2-27
B
benchmark test algorithm A-1
block diagram i
bootstrap ROM i ii
Boundary Scan (JTAG Port) timing diagram 2-46
bus acquisition timings 2-28
address 1-2
control 1-1
data 1-2
external address 1-5
external data 1-5
multiplexed 1-2
non-multiplexed 1-2
release timings 2-28, 2-29
C
clock 1-1, 1-4
external 2-4
clocks
internal 2-4
crystal oscillato r ci rcu its 2-5
D
data bus 1-1
data memory expansi on iv
Data Strobe (DS) 1-2
dc electrical characteristics 2-3
DE signal 1-18
Debug Event signal (DE signal) 1-18
Debug mode
entering 1-18
external indication 1-18
Debug support iii
design considerations
electrical 4-2, 4-3
PLL 4-5
power consumption 4-4
thermal 4-1
documentation list iv
Double Data Strobe 1-2
DRAM
controller iv
out of page
read access 2-23
wait states selection guide 2-20
write access 2-24
Page mode
read accesses 2-19
wait states selection guide 2-16
write accesses 2-19
refresh access 2-24
DSP56300
Family Manual iv
DSP56303
block diagram i
Technical Data iv
User’s Manual iv
E
EFCOP
interrupts A-12
electrical
design considerations 4-2, 4-3
Enhanced Synchrono us Serial Interface (ESSI) iii , 
1-1, 1-2, 1-13, 1-14
receiver timing 2-42
transmitter timing 2 -41
external address bus 1-5
external bus control 1-5, 1-6, 1-7
external bus sy nchronous timi ngs (SRAM 
access) 2-25
external clock operation 2-4
external data bus 1-5
external interrupt timing (negative 
edge-triggered) 2-11
external level-sensiti ve fast interrupt timing 2-10
external memory access (DMA Source) 
timing 2-12
External Memory Expansion Port 2-13
external memory expansion port 1-5
F
functi on al groups 1-2
functional signal groups 1-1
G
General-Purpose Input/O utput (G PIO ) iii, 1-2
ground 1-1, 1-3
PLL 1-3

Index
Index-2
H
Host Interface (HI08) iii, 1-1, 1-2, 1-9, 1-10, 
1-11, 1-12
Host Port Control R egister (HPCR) 1-10, 
1-12
host por t
configuration 1-9
usage considerations 1-9
Host Port Control R egister (HPCR) 1-10, 1-12
Host Request
Double 1-2
Single 1-2
Host Request (HR) 1-2
I
information sou rces iv
instruction cache iii
internal clocks 2-4
inter rup t and mode cont ro l 1-1, 1-8
inter rupt control 1-8
interrupt timing 2-7
external level-sensitiv e fast 2-10
external negative edge-triggered 2-11
synchronous from Wait state 2 -11
interrupts
EFCOP A-12
J
Joint Test Action Group (JTAG)
interface 1-18
JTAG iii
JTAG Port
reset timing diag ram 2-46
timing 2-46
JTAG/OnCE Interface signals
Debug Event signal (DE signal) 1-18
JTAG/OnCE port 1-1, 1-2
M
MAP-BGA 3-1
ball list by name 3-15
ball list by number 3-12
mechanical drawing 3-19
molded array process-ball grid drawing 
(bottom) 3-11
molded array process-ball grid drawing 
(top) 3-10
maximum rati ngs 2-1, 2-2
memory expansion port iii
mode control 1-8
Mode sel ect ti ming 2-7
multiplexed bus 1-2
multiplexed bu s timings
read 2-35
write 2-36
N
non-multiplexed bus 1-2
non-multiplexed bus timings
read 2-33
write 2-34
O
off-chip memory iii
OnCE module iii
Debug request 2-47
on-chip DRAM controller iv
On-Chip Emulation (OnCE) module
interface 1-18
On-Chip Em ulation module iii
on-chip memory iii
operating mode s elect timing 2-11
P
package
144-pin TQFP 3-1
196-pin MAP-BGA 3-1
MAP- BGA desc ripti on 3-10, 3-11, 3-12, 
3-15, 3-19
TQFP description 3-2, 3-3, 3-4, 3-6, 3-9
Phase-Lock Loop (PLL) 1-1, 2-6
design considerations 4-5
performance issues 4-5
PLL 1-4
Port A 1-1, 1-5, 2-13
Port B 1-1, 1-2, 1-11
Port C 1-1, 1-2, 1-13
Port D 1-1, 1-2, 1-14
Port E 1-1
power 1-1, 1-2, 1-3
power consumption
design considerations 4-4
power consumption benchmark test A-1
power management iv
program memory expansion iv
program RAM iii
R
recovery from Stop state using IRQA 2-12
resetcloc k sign als 1-4

Index
Index-3
inter rupt  si gn al s 1- 8
JTAG signals 1-18
mode control 1-8
OnCE signals 1-18
PLL signals 1-4
Reset timing 2-7, 2-9
synchronous 2-10
ROM, bootstrap iii
S
Serial Communication Interface (SCI) iii, 1-1, 
1-2, 1-16
Asynchronous mode timing 2-38
Synchronous mode timing 2- 38
signal groupings 1-1
signals 1-1
functi on al grouping 1-2
Single Data Strobe 1-2
SRAM
read access 2-15
support iv
write access 2-15
Stop mod e iv
Stop stat e
recovery from 2-12
Stop timing 2-7
supply voltage 2 -2
Switch mode iii
synchronous bus timings
SRAM
2 wait states 2-26
SRAM 1 wait state (BCR controlled) 2-26
synchronous interrupt from Wait state timing 2-11
synchronous Rese t timing 2-10
T
target applications iv
Test Access Port (TAP) iii
timing diag ram 2-46
Test Clock (TCLK) in put timing diagram 2-45
thermal
design cons iderations 4-1
Timer
event input restrictions 2-43
Timers 1-1, 1-2, 1-17
inter rupt  generation 2-43
TQFP 3-1
mechanical drawing 3-9
pin lis t by name 3-6
pin lis t by number 3-4
pin-out dra wing (bo ttom) 3-3
pin-out dr awing (top) 3-2
W
Wait mode iv
World Wide Web iv
X
X-data RAM iii
Y
Y-data RAM iii

DSP56303/D

HOW TO REACH US:

USA/EUROPE/LOC ATIONS NOT LISTED:

Motorola Literature Distribution;

P.O. Box 5405, Denver, Colorado 80217

1-303-675-2140 or 1-800-441-2447

JAPAN:

Motorola Japan Ltd.; SPS, Technical Information Center,

3-20-1, Minami-Azabu Minato-ku, Tokyo 106-8573 Japan

81-3-3440-3569

ASIA/PACIFIC:

Motorola Semiconductors H.K. Ltd.; Silicon Harbour

Centre, 2 Dai King Street, Tai Po Industrial Estate,

Tai Po, N.T., Hong Kong

852-26668334

TECHNICAL INFORMATION CENTER:

1-800-521-6274

HOME PAGE:

http://www.motorola.com/semiconductors

Information in this document is provided solely to enable system and software implementers to use

Motorola products. There are no express or implied copyright licenses granted hereunder to design

or fabricate any integrated circuits or integrated circuits based on the information in this document.

Motorola reserves the right to make changes without further notice to any products herein. Motorola

makes no warranty, representation or guarantee regarding the suitability of its products for any

particular purpose, nor does Motorola assume any liability arising out of the application or use of any

product or circuit, and specifically disclaims any and all liability, including without limitation

consequential or incidental damages. “Typical” parameters which may be provided in Motorola data

sheets and/or specifications can and do vary in different applications and actual performance may

vary over time. All operating parameters, including “Typicals” must be validated for each customer

application by customer’s technical experts. Motorola does not convey any license under its patent

rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as

components in systems intended for surgical implant into the body, or other applications intended to

support or sustain life, or for any other application in which the failure of the Motorola product could

create a situation where personal injury or death may occur . Should Buyer purchase or use Motorola

products for any such unintended or unauthorized application, Buyer shall indemnify and hold

Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all

claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or

indirectly, any claim of personal injury or death associated with such unintended or unauthorized use,

even if such cl aim all eges that Motoro la was neg ligent rega rding the design or manufac ture of the p art.

Motorola and the Stylized M Logo are registered in the U.S. Patent and Trademark Office. OnCE and

digital dna are trademarks of Motorola, Inc. All other product or service names are the property of their

respective owners. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.

Orderi ng Infor mat ion

Consult a Motorola Semiconductor sales office or authorized distributor to determine product availability and place an order.

Part Supply

Voltage Package Type Pin

Count

Core

Frequency

(MHz) Order Number

DSP56303 3.3 V I/ O Thin Quad Flat Pack (TQFP) 144 100 DSP56303PV100

Molded Array Process-B all Grid Array (MAP -BG A ) 196 100 DSP 56303VF 100