5-2
Absolute Maximum Ratings TC = 25oC, Unless Otherwise Specified
RFM18N08 RFM18N10 RFP18N08 RFP18N10 UNITS
Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . VDSS 80 100 80 100 V
Drain to Gate Voltage (RGS = 20kΩ) (Note 1) . . . . . . . . . . . . . . VDGR 80 100 80 100 V
Continuous Drain Current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ID
Pulsed Drain Current (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . IDM 18
45 18
45 18
45 18
45 A
A
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGS ±20 ±20 ±20 ±20 V
Maximum Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD
Linear Derating Factor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
0.8 100
0.8 75
0.6 75
0.6 W
W/oC
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . .TJ, TSTG -55 to 150 -55 to 150 -55 to 150 -55 to 150 oC
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s . . . . . . . . . . . . . . . .TL
Package Body for 10s, See Techbrief 334 . . . . . . . . . . . . . . . . Tpkg 300
260 300
260 300
260 300
260
oC
oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause per manent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. TJ= 25oC to 125oC.
Electrical Specifications TC = 25oC, Unless Otherwise Specified
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Drain to Source Breakdown Voltage BVDSS ID = 250µA, VGS = 0V
RFM18N08, RFP18N08 80 - - V
RFM18N10, RFP18N10 100 - - V
Gate Threshold Voltage VGS(TH) VGS = VDS, ID = 250µA, (Figure 8) 2 - 4 V
Zero Gate Voltage Drain Current IDSS VDS = Rated BVDSS, VGS = 0V - - 1 µA
VDS = 0.8 x Rated BVDSS, VGS = 0V, TC = 125oC- - 25 µA
Gate to Source Leakage Current IGSS VGS = ±20V, VDS = 0V - - ±100 nA
Drain to Source On Resistance (Note 2) rDS(ON) ID = 18A, VGS = 10V, (Figures 6, 7) - - 0.100 Ω
Drain to Source On Voltage (Note 2) VDS(ON) ID = 18A, VGS = 10V - - 1.8 V
Turn-On Delay Time td(ON) VDD = 50V, ID≈ 9A, RG = 50Ω, VGS = 10V,
RL = 5.5Ω
(Figures 10, 11, 12)
-6090ns
Rise Time tr- 300 450 ns
Turn-Off Delay Time td(OFF) - 150 225 ns
Fall Time tf- 150 225 ns
Input Capacitance CISS VDS = 25V, VGS = 0V, f = 1MHz,
(Figure 9) - - 1700 pF
Output Capacitance COSS - - 750 pF
Reverse-Transfer Capacitance CRSS - - 300 pF
Thermal Resistance Junction to Case RθJC RFM18N08, RFM18N10 - - 1.25 oC/W
RFP18N08, RFP18N10 - - 1.67 oC/W
Source to Drain Diode Specifications
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS
Source to Drain Diode Voltage (Note 2) VSD ISD = 9A - - 1.4 V
Diode Reverse Recovery Time trr ISD = 4A, dISD/dt = 100A/µs - 150 - ns
NOTES:
2. Pulse test: width ≤ 300µs, duty cycle ≤2%.
3. Repetitive rating: pulse width is limited by maximum junction temperature.
RFM18N08, RFM18N10, RFP18N08, RFP18N10