PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
JM38510/10901BPA ACTIVE CDIP JG 8 1 None A42 SNPB Level-NC-NC-NC
NE555D ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
NE555DR ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
NE555P ACTIVE PDIP P 8 50 Pb-Free
(RoHS) CU NIPDAU Level-NC-NC-NC
NE555PSLE OBSOLETE SO PS 8 None Call TI Call TI
NE555PSR ACTIVE SO PS 8 2000 Pb-Free
(RoHS) CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
NE555PW ACTIVE TSSOP PW 8 150 Pb-Free
(RoHS) CU NIPDAU Level-1-250C-UNLIM
NE555PWR ACTIVE TSSOP PW 8 2000 Pb-Free
(RoHS) CU NIPDAU Level-1-250C-UNLIM
NE555Y OBSOLETE 0 None Call TI Call TI
SA555D ACTIVE SOIC D 8 75 Pb-Free
(RoHS) CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
SA555DR ACTIVE SOIC D 8 2500 Pb-Free
(RoHS) CU NIPDAU Level-2-260C-1 YEAR/
Level-1-235C-UNLIM
SA555P ACTIVE PDIP P 8 50 Pb-Free
(RoHS) CU NIPDAU Level-NC-NC-NC
SE555D ACTIVE SOIC D 8 75 None CU NIPDAU Level-1-220C-UNLIM
SE555DR ACTIVE SOIC D 8 2500 None CU NIPDAU Level-1-220C-UNLIM
SE555FKB ACTIVE LCCC FK 20 1 None POST-PLATE Level-NC-NC-NC
SE555JG ACTIVE CDIP JG 8 1 None A42 SNPB Level-NC-NC-NC
SE555JGB ACTIVE CDIP JG 8 1 None A42 SNPB Level-NC-NC-NC
SE555N OBSOLETE PDIP N 8 None Call TI Call TI
SE555P ACTIVE PDIP P 8 50 None Call TI Level-NC-NC-NC
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
PACKAGE OPTION ADDENDUM
www.ti.com 18-Feb-2005
Addendum-Page 1