MAX2205EBS+T10 - Maxim Integrated Products, Inc.

General Description

The MAX2205–MAX2208 wideband (800MHz to 2GHz)

power detectors are ideal for GSM/EDGE (MAX2206),

TDMA (MAX2207), and CDMA (MAX2205/MAX2208)

applications. The MAX2206/MAX2207/MAX2208 take an

RF signal from a directional coupler at the input, and out-

put a highly repeatable voltage. The output voltage

increases monotonically with increasing input power. The

output is compensated for temperature and process

shifts, reducing the worst-case variation to less than

±1dB at full power and ±2.5dB at the lowest power.

The MAX2206 features 40dB dynamic range, making

it ideally suited to GSM/EDGE applications. The

MAX2207 offers reduced current consumption for TDMA

applications. The MAX2205/MAX2208 each have an inte-

grated filter to allow for average power detection of

CDMA signals over a 25dB dynamic range. The

MAX2206/MAX2207/MAX2208 offer internal 50Ωtermina-

tion for interfacing with a directional coupler. The

MAX2205 has a high-impedance input to provide a low-

loss resistive tap in CDMA applications. All devices allow

the user to control the averaging time constant externally.

The MAX2205–MAX2208 come in a space-saving 2 ✕ 2,

0.5mm-pitch UCSP™ and require only three external

components.

Applications

Dual-Band GSM/EDGE Handsets

Dual-Band CDMA/TDMA Handsets

WCDMA Handsets

PA Modules

Features

♦Space-Saving 2 ✕ 2 UCSP Occupies Only 1mm2

♦Internal Temperature Compensation Gives ±0.3dB

Detection Accuracy

♦No External Filter or Op Amp Required

♦Power-Detection Range

40dB (MAX2206)

25dB (MAX2205/MAX2207/2208)

MAX2205–MAX2208

RF Power Detectors in UCSP

________________________________________________________________ Maxim Integrated Products 1

TOP VIEW

GND

(B1)

OUT

(B2)

TEMPERATURE-

COMPENSATED

PEAK

DETECTOR

SHUTDOWN

LOGIC

UCSP

TO ADC

10kΩ (MAX2205)

240Ω (MAX2206/MAX2207/MAX2208)

27pF

680Ω (MAX2205)

10Ω (MAX2206)

0Ω (MAX2207/MAX2208)

47pF

FROM

COUPLER/TAP

(MAX2206/MAX2207/MAX2208)

SHDN LOGIC INPUT

RFIN/

SHDN

(A1)

VCC

(A2)

VCC

CFILTER

(OPTIONAL)

FROM PA

OUTPUT

(MAX2205)

MAX2205

MAX2206

MAX2207

MAX2208

Pin Configuration/Functional

Diagram/Typical Operating Circuit

19-2015; Rev 4; 2/06

For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at

1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.

EVALUATION KIT

AVAILABLE

Ordering Information

UCSP is a trademark of Maxim Integrated Products, Inc.

*Requires solder temperature profile described in the Absolute

Maximum Ratings section.

PART TEMP RANGE BUMP-PACKAGE

MAX2205EBS -40°C to +85°C 2 × 2 UCSP*

MAX2205EBS+ -40°C to +85°C 2 × 2 UCSP*

MAX2206EBS -40°C to +85°C 2 × 2 UCSP*

MAX2206EBS+ -40°C to +85°C 2 × 2 UCSP*

MAX2207EBS -40°C to +85°C 2 × 2 UCSP*

MAX2208EBS -40°C to +85°C 2 × 2 UCSP*

MAX2208EBS+ -40°C to +85°C 2 × 2 UCSP*

2 ✕ 2 UCSP

1.01 mm ✕1.01 mm

+Indicates lead-free package.

The lead-free UCSP package used for the MAX2205–MAX2208

family of parts is only qualified to withstand 500 temperature

cycles of -40°C to +125°C. The package meets all other Maxim

standard package qualification criteria. Customers with qualifica-

tion criteria beyond that stated here should contact Maxim’s head-

quarters for additional information before ordering. The Maxim

reliability guarantee only applies to the conditions stated above.

MAX2205–MAX2208

RF Power Detectors in UCSP

2 _______________________________________________________________________________________

ABSOLUTE MAXIMUM RATINGS

DC ELECTRICAL CHARACTERISTICS (MAX2205–MAX2208)

(VCC = +2.7V to +5.0V, SHDN = +2.0V, no RF signal applied, TA= -40°C to +85°C. Typical values are at VCC = +2.85V and

TA= +25°C, unless otherwise noted.) (Note 2)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

VCC to GND...........................................................-0.3V to +6.5V

RFIN/SHDN to GND....................................-0.3V to (VCC + 0.3V)

RF Input Power (800MHz)

(MAX2206/MAX2207/MAX2208) .................................+20dBm

RF Input Power (2GHz)

(MAX2206/MAX2207/MAX2208) .................................+17dBm

RF Input Voltage (800MHz) (MAX2205)..............................1.5VP

RF Input Voltage (2GHz) (MAX2205) ..................................0.8VP

Continuous Power Dissipation (TA= +70°C)

2 ✕2 UCSP (derate 3.8mW/°C above +70°C) ............303mW

Operating Temperature Range ...........................-40°C to +85°C

Junction Temperature......................................................+150°C

Storage Temperature Range .............................-65°C to +160°C

Bump Temperature (soldering) (Note 1)

Infrared (15s) ..............................................................+220°C

Vapor Phase (60s) ......................................................+215°C

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

Supply Voltage VCC 2.7 5.0 V

MAX2206 3.5 5.5

Idle Supply Current IIDLE MAX2205/MAX2207/MAX2208 2 3.5 mA

Shutdown Supply Current I SHDN SHDN = 0V 0.5 10 µA

OUT Voltage During Shutdown VOUT SHDN = 0V 0.01 V

Logic-High Threshold VH2.0 V

Logic-Low Threshold VL0.6 V

IIH SHDN = +2.0V -1 +10

SHDN Input Current IIL SHDN = +0.6V -1 +1 µA

Output Current Source Capability MAX2206/MAX2207, VOUT = +2.5V 400 µA

Output Current Sink Capability MAX2206/MAX2207, VOUT = 0V 300 µA

AC ELECTRICAL CHARACTERISTICS (MAX2205)

(MAX2205 EV kit, VCC = +2.7V to +5.0V, SHDN = +2.0V, fRF = 800MHz to 2GHz, 50Ωsystem, TA= -40°C to +85°C. Typical values

are at VCC = +2.85V and TA= +25°C, unless otherwise noted.) (Note 2)

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

RF Input Frequency fRF 800 2000 MHz

Turn-On Time tON 2µs

Response Time tR(Note 3) 15 µs

High input power

(Note 4) ±0.3 ±1

Variation Due to Temperature VCC = +2.85V,

TA = -40°C to +85°CLow input power

(Note 5) ±1.3 ±2.5

MAX2205–MAX2208

RF Power Detectors in UCSP

_______________________________________________________________________________________ 3

Note 1: This device is constructed using a unique set of packaging techniques that imposes a limit on the thermal profile the device

can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles recom-

mended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow.

Preheating is required. Hand or wave soldering is not allowed.

Note 2: Specifications over TA= -40°C to +85°C are guaranteed by design. Production tests are performed at TA= +25°C.

Note 3: Response time is taken from the time the RF signal is applied to 90% of the final value of VOUT.

Note 4: At 800MHz, output voltage is held at a value that nominally results from the final value of +31dBm input power. Deviation from

+31dBm is specified. At 2GHz, output voltage is held at a value that nominally results from +28dBm input power. Deviation

from +28dBm is specified.

Note 5: At 2GHz, output voltage is held 22dB lower than specified in Note 4. At 800MHz, output voltage is held 25dB lower than spec-

ified in Note 4.

Note 6: At 800MHz, output voltage is held at a value that nominally results from +15dBm input power. Deviation from +15dBm is

specified. At 2GHz, output voltage is held at a value that nominally results from +13dBm input power. Deviation from +13dBm

is specified.

Note 7: For MAX2206, the output voltage is held at 40dB lower input power than specified in Note 6; for MAX2207/MAX2208, output

voltage is held at a value that nominally results from 25dB lower input power than specified in Note 6. Deviation from the

nominal input power is specified.

AC ELECTRICAL CHARACTERISTICS (MAX2206/MAX2207/MAX2208)

(MAX2206/MAX2207/MAX2208 EV kit, VCC = +2.7V to +5.0V, SHDN = 2.0V, fRF = 800MHz to 2GHz, 50Ωsystem, TA= -40°C to

+85°C. Typical values are at VCC = +2.85V and TA= +25°C, unless otherwise noted.) (Note 2)

PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS

RF Input Frequency fRF 800 2000 MHz

RF Input VSWR VSWR 2:1

Turn-On Time tON 2µs

MAX2206/MAX2207 300 ns

Response Time (Note 3) tRMAX2208 15 µs

H i g h i np ut p ow er ( N ote 6) ±0.3 ±1

Variation Due to Temperature VCC = +2.85V,

TA = -40°C to +85°C Low i np ut p ow er ( N ote 7) ±1.3 ±2.5 dB

Typical Operating Characteristics

(MAX2206/MAX2207/MAX2208 EV kit, TA = +25°C, unless otherwise noted.)

0.4

0.2

0.8

0.6

1.2

1.0

1.4

1.8

1.6

2.0

-25 -15 -10-20 -5 0 5 10 15

MAX2206

OUTPUT VOLTAGE vs. INPUT POWER

MAX2205/06/07/08 toc01

POWER (dBm)

OUTPUT VOLTAGE (V)

VCC = +2.7V to +3.5V

fRF = 800MHz

TA = -40°C TO +85°C

VCC = +3.5V

TA = +85°C

VCC = +2.7V

TA = -40°C

0.4

0.2

0.8

0.6

1.0

1.2

1.4

1.6

-25 -15 -10-20 -5 0 5 10 15

MAX2206

OUTPUT VOLTAGE vs. INPUT POWER

MAX2205/06/07/08 toc02

POWER (dBm)

OUTPUT VOLTAGE (V)

VCC = +2.7V to +3.5V

fRF = 2GHz

TA = -40°C TO +85°C

VCC = +3.5V

TA = +85°C

VCC = +2.7V

TA = -40°C

265

270

275

280

285

290

295

300

305

310

315

320

-40 -15 10 35 60 85

MAX2206

RESPONSE TIME vs. TEMPERATURE

MAX2205/06/07/08 toc03

TEMPERATURE (°C)

RESPONSE TIME (ns)

VCC = +2.7V

VCC = +3.5V VCC = +3.0V

fRF = 900MHz

PIN = +15dBm

MAX2205–MAX2208

RF Power Detectors in UCSP

4 _______________________________________________________________________________________

0.5

1.5

1.0

2.0

2.5

-10 0-5 5 10 15

MAX2207/MAX2208

OUTPUT VOLTAGE vs. INPUT POWER

MAX2205/06/07/08 toc04

POWER (dBm)

OUTPUT VOLTAGE (V)

VCC = +2.7V to +3.5V

fRF = 800MHz

TA = -40°C TO +85°C

VCC = +3.5V

TA = +85°C

VCC = +2.7V

TA = -40°C

0.4

0.2

1.0

0.8

0.6

1.6

1.4

1.2

1.8

-10 0-5 5 10 15

MAX2207/MAX2208

OUTPUT VOLTAGE vs. INPUT POWER

MAX2205/06/07/08 toc05

POWER (dBm)

OUTPUT VOLTAGE (V)

VCC = +2.7V to +3.5V

fRF = 2GHz

TA = -40°C TO +85°C

VCC = +3.5V

TA = +85°C

VCC = +2.7V

TA = -40°C

275

285

280

295

290

305

300

310

-40 10-15 35 60 85

MAX2207

RESPONSE TIME vs. TEMPERATURE

MAX2205/06/07/08 toc06

TEMPERATURE (°C)

RESPONSE TIME (ns)

fRF = 900MHz

PIN = +15dBm

VCC = +3.5V

VCC = +3.0V

VCC = +2.7V

-40 10-15 356085

MAX2205/MAX2208

RESPONSE TIME vs. TEMPERATURE

MAX2205/06/07/08 toc07

TEMPERATURE (°C)

RESPONSE TIME (µs)

fRF = 900MHz

PIN = +15dBm (MAX2208)

PIN = +31dBm (MAX2205)

VCC = +2.7V

VCC = +3.0V

VCC = +3.5V

0.5

1.5

1.0

2.0

2.5

61611 21 26 31

MAX2205

OUTPUT VOLTAGE vs. INPUT POWER

MAX2205/06/07/08 toc08

INPUT POWER (dBm)

OUTPUT VOLTAGE (V)

VCC = +2.7V to +3.5V

fRF = 836MHz

TA = -40°C to +85°C

MAX2205 EV KIT

VCC = +3.5V

TA = +85°C

VCC = +2.7V

TA = -40°C

0.3

0.2

0.1

0.5

0.4

0.6

0.7

0.8

6141810 22 26

MAX2205

OUTPUT VOLTAGE vs. INPUT POWER

MAX2205/06/07/08 toc09

INPUT POWER (dBm)

OUTPUT VOLTAGE (V)

VCC = +2.7V to +3.5V

fRF = 1880MHz

TA = -40°C to +85°C

MAX2205 EV KIT

VCC = +3.5V

TA = +85°C

VCC = +2.7V

TA = -40°C

Typical Operating Characteristics (continued)

(MAX2206/MAX2207/MAX2208 EV kit, TA = +25°C, unless otherwise noted.)

Pin Description

PIN NAME FUNCTION

A1 RFIN/SHDN RF Input and Shutdown Logic Input. AC-couple the RF input to this pin and apply the shutdown logic

input through a resistor. Drive low to turn the part off, drive high, or connect to VCC to turn the part on.

A2 VCC Power-Supply Pin. Bypass to GND with a capacitor as close to the bump as possible.

B1 GND

Ground Connection. Multiple ground vias placed as close to the IC as possible should be used to

connect the ground pin to the ground plane. Connect to PC board ground plane with as low

inductance as possible.

B2 OUT Detector Output

Applications Information

The MAX2205–MAX2208 have internal termination

resistors for use with directional couplers. The applica-

tion circuit is shown in Figure 1. The output of the

detector goes to an op amp in an analog GSM power-

control scheme, or to an ADC in other systems such as

TDMA or discrete-time GSM power control.

The MAX2205 has high-input impedance for use with

high-value resistive tapping from a CDMA power ampli-

fier. This coupling method is the lowest cost and lowest

loss when used with an isolator. The application circuit

is shown in Figure 2. Connect CFILTER from the

MAX2205 output to GND to reduce residual amplitude

ripple. For IS98A reverse channel signal with peak-to-

avg ratio of 3.9dB, a 1.5nF capacitor gives 43mVP-P rip-

ple at 28dBm PA output and 390µs response time. For

CDMA2000 (pilot + DCCH) with peak-to-avg ratio of

5.4dB, the ripple is about 65mVP-P at 26dBm PA output.

The MAX2205 input impedance is listed in Table 1.

Layout

As with any RF circuit, the layout of the MAX2205–

MAX2208 circuits affects performance. Use a short

50Ωline at the input with multiple ground vias along the

length of the line. The input capacitor and resistor

should be placed as close to the IC as possible. The

VCC input should be bypassed as close as possible to

the IC with multiple vias connecting the capacitor to

ground. Refer to the MAX2205–MAX2208 EV kit data

sheet for a sample layout and details.

UCSP Reliability

The UCSP is a unique package that greatly reduces

board space compared to other packages. UCSP relia-

bility is integrally linked to the user’s assembly methods,

circuit board material, and usage environment. The user

should closely review these areas when considering

using a UCSP. This form factor might not perform equally

to a packaged product through traditional mechanical

reliability tests. Performance through operating life test

and moisture resistance remains uncompromised, as it

is determined primarily by the wafer-fabrication process.

Mechanical stress performance is a greater considera-

tion for a UCSP. UCSP solder-joint contact integrity must

be considered because the package is attached through

direct solder contact to the user’s PC board. Testing

done to characterize the UCSP reliability performance

shows that it is capable of performing reliably through

environmental stresses. Results of environmental stress

tests and additional usage data and recommendations

are detailed in the UCSP application note, which can be

found on Maxim’s website, www.maxim-ic.com.

Chip Information

TRANSISTOR COUNT: 344

MAX2205–MAX2208

RF Power Detectors in UCSP

_______________________________________________________________________________________ 5

TO ANT

CFILTER

TO ADC

ISOLATOR/

CIRCULATOR

PEAK

DETECTOR

47pF

680Ω

MAX2205

TO ANT

TO ADC

OR OP AMP

50Ω

PEAK

DETECTOR

COUPLER

MAX2206

MAX2207

MAX2208

Figure 2. MAX2205 Typical Application Circuit

Figure 1. MAX2206/MAX2207/MAX2208 Typical Application

Circuit

MAX2205–MAX2208

RF Power Detectors in UCSP

6 _______________________________________________________________________________________

DEVICE CODE

MAX2205EBS AFR

MAX2206EBS AFO

MAX2207EBS AFP

MAX2208EBS AFQ

Table 2. MAX2205–MAX2208 Device

Marking Codes

PIN = -30dBm PIN = +5dBm

FREQUENCY (GHz) REAL IMAG REAL IMAG

0.8 189.9 -51.7 199.4 -54.0

0.9 177.3 -47.4 185.5 -49.4

1.0 165.8 -43.6 175.2 -45.7

1.1 155.2 -40.3 167.0 -42.5

1.2 146.4 -37.6 158.8 -39.8

1.3 138.8 -35.0 150.9 -37.3

1.4 131.5 -32.9 144.0 -35.1

1.5 123.3 -30.7 139.4 -33.3

1.6 115.0 -29.1 131.6 -31.8

1.7 107.2 -27.5 132.0 -30.9

1.8 110.7 -26.7 126.6 -29.3

1.9 105.3 -25.2 120.3 -27.9

2.0 94.7 -23.6 111.4 -26.7

Table 1. MAX2205 Input Impedance (R || jX, PC Board De-Embedded)

Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are

implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.

Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 _____________________ 7

RF Power Detectors in UCSP

4L, UCSP 2x2.EPS

21-0117

PACKAGE OUTLINE, 2x2 UCSP

Package Information

(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,

go to www.maxim-ic.com/packages.)