LM7805C, LM7812C, LM7815C
www.ti.com
SNOSBR7D MAY 2000REVISED APRIL 2013
LM78XX Series Voltage Regulators
Check for Samples: LM7805C,LM7812C,LM7815C
The LM78XX series is available in an aluminum TO-3
1FEATURES package which will allow over 1.0A load current if
2 Output Current in Excess of 1A adequate heat sinking is provided. Current limiting is
Internal Thermal Overload Protection included to limit the peak output current to a safe
value. Safe area protection for the output transistor is
No External Components Required provided to limit internal power dissipation. If internal
Output Transistor Safe Area Protection power dissipation becomes too high for the heat
Internal Short Circuit Current Limit sinking provided, the thermal shutdown circuit takes
over preventing the IC from overheating.
Available in the Aluminum TO-3 Package Considerable effort was expanded to make the
DESCRIPTION LM78XX series of regulators easy to use and
The LM78XX series of three terminal regulators is minimize the number of external components. It is not
available with several fixed output voltages making necessary to bypass the output, although this does
them useful in a wide range of applications. One of improve transient response. Input bypassing is
these is local on card regulation, eliminating the needed only if the regulator is located far from the
distribution problems associated with single point filter capacitor of the power supply.
regulation. The voltages available allow these For output voltage other than 5V, 12V and 15V the
regulators to be used in logic systems, LM117 series provides an output voltage range from
instrumentation, HiFi, and other solid state electronic 1.2V to 57V.
equipment. Although designed primarily as fixed
voltage regulators these devices can be used with VOLTAGE RANGE
external components to obtain adjustable voltages
and currents. LM7805C: 5V
LM7812C: 12V
LM7815C: 15V
Connection Diagrams
Figure 1. Metal Can Package Figure 2. Plastic Package
TO-3 TO-220 (NDE)
Aluminum Top View
Bottom View See Package Number NDE0003B
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2000–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LM7805C, LM7812C, LM7815C
SNOSBR7D MAY 2000REVISED APRIL 2013
www.ti.com
SCHEMATIC DIAGRAM
2Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM7805C LM7812C LM7815C
LM7805C, LM7812C, LM7815C
www.ti.com
SNOSBR7D MAY 2000REVISED APRIL 2013
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS(1)(2)
Input Voltage (VO= 5V, 12V and 15V) 35V
Internal Power Dissipation(3) Internally Limited
Operating Temperature Range (TA) 0°C to +70°C
(TO-3 Package) 150°C
Maximum Junction Temperature (NDE Package) 150°C
Storage Temperature Range 65°C to +150°C
TO-3 Package 300°C
Lead Temperature (Soldering, 10 sec.) TO-220 Package NDE 230°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. For ensured specifications and the test
conditions, see Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) Thermal resistance of the TO-3 package is typically 4°C/W junction to case and 35°C/W case to ambient. Thermal resistance of the TO-
220 package (NDE) is typically 4°C/W junction to case and 50°C/W case to ambient.
ELECTRICAL CHARACTERISTICS LM78XXC(1)
0°C TJ125°C unless otherwise noted.
Output Voltage 5V 12V 15V
Input Voltage (unless otherwise noted) 10V 19V 23V Units
Symbol Parameter Conditions Min Typ Max Min Typ Max Min Typ Max
VOOutput Voltage Tj = 25°C, 5 mA IO1A 4.8 5 5.2 11.5 12 12.5 14.4 15 15.6 V
PD15W, 5 mA IO1A 4.75 5.25 11.4 12.6 14.2 15.7 V
5 5
VMIN VIN VMAX (7.5 VIN 20) (14.5 VIN 27) (17.5 VIN 30) V
ΔVOLine Regulation IO= 500 Tj = 25°C 3 50 4 120 4 150 mV
mA ΔVIN (7 VIN 25) 14.5 VIN 30) (17.5 VIN 30) V
0°C Tj +125°C 50 120 150 mV
ΔVIN (8 VIN 20) (15 VIN 27) (18.5 VIN 30) V
IO1A Tj = 25°C 50 120 150 mV
ΔVIN (7.5 VIN 20) (14.6 VIN 27) (17.7 VIN 30) V
0°C Tj +125°C 25 60 75 mV
ΔVIN (8 VIN 12) (16 VIN 22) (20 VIN 26) V
ΔVOLoad Regulation Tj = 25°C 5 mA IO1.5A 10 50 12 120 12 150 mV
250 mA IO750 25 60 75 mV
mA
5 mA IO1A, 0°C Tj 50 120 150 mV
+125°C
IQQuiescent Current IO1A Tj = 25°C 8 8 8 mA
0°C Tj +125°C 8.5 8.5 8.5 mA
ΔIQQuiescent Current 5 mA IO1A 0.5 0.5 0.5 mA
Change Tj = 25°C, IO1A 1.0 1.0 1.0 mA
VMIN VIN VMAX (7.5 VIN 20) (14.8 VIN27) (17.9 VIN 30) V
IO500 mA, 0°C Tj +125°C 1.0 1.0 1.0 mA
VMIN VIN VMAX (7 VIN 25) (14.5 VIN30) (17.5 VIN 30) V
(1) All characteristics are measured with capacitor across the input of 0.22 μF, and a capacitor across the output of 0.1μF. All
characteristics except noise voltage and ripple rejection ratio are measured using pulse techniques (tw10 ms, duty cycle 5%).
Output voltage changes due to changes in internal temperature must be taken into account separately.
Copyright © 2000–2013, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: LM7805C LM7812C LM7815C
LM7805C, LM7812C, LM7815C
SNOSBR7D MAY 2000REVISED APRIL 2013
www.ti.com
ELECTRICAL CHARACTERISTICS LM78XXC(1) (continued)
0°C TJ125°C unless otherwise noted.
Output Voltage 5V 12V 15V
Input Voltage (unless otherwise noted) 10V 19V 23V Units
Symbol Parameter Conditions Min Typ Max Min Typ Max Min Typ Max
VNOutput Noise TA=25°C, 10 Hz f100 kHz 40 75 90 μV
Voltage
Ripple Rejection f = 120 Hz IO1A, Tj = 25°C 62 80 55 72 54 70 dB
or
ΔVIN/ΔIO500 mA 62 55 54 dB
VOUT 0°C Tj +125°C
VMIN VIN VMAX (8 VIN 18) (15 VIN 25) (18.5 VIN 28.5) V
RODropout Voltage Tj = 25°C, IOUT = 1A 2.0 2.0 2.0 V
Output Resistance f = 1 kHz 8 18 19 mΩ
Short-Circuit Current Tj = 25°C 2.1 1.5 1.2 A
Peak Output Current Tj = 25°C 2.4 2.4 2.4 A
Average TC of VOUT 0°C Tj +125°C, IO= 5 mA 0.6 1.5 1.8 mV/°C
VIN Input Voltage
Required to Tj = 25°C, IO1A 7.5 14.6 17.7 V
Maintain
Line Regulation
4Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM7805C LM7812C LM7815C
LM7805C, LM7812C, LM7815C
www.ti.com
SNOSBR7D MAY 2000REVISED APRIL 2013
TYPICAL PERFORMANCE CHARACTERISTICS
Maximum Average Power Dissipation Maximum Average Power Dissipation
Figure 3. Figure 4.
Peak Output Current Output Voltage (Normalized to 1V at TJ= 25°C)
Figure 5. Figure 6.
Ripple Rejection Ripple Rejection
Figure 7. Figure 8.
Copyright © 2000–2013, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Links: LM7805C LM7812C LM7815C
LM7805C, LM7812C, LM7815C
SNOSBR7D MAY 2000REVISED APRIL 2013
www.ti.com
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Output Impedance Dropout Voltage
Figure 9. Figure 10.
Dropout Characteristics Quiescent Current
Figure . Figure 11.
Quiescent Current
Figure 12.
6Submit Documentation Feedback Copyright © 2000–2013, Texas Instruments Incorporated
Product Folder Links: LM7805C LM7812C LM7815C
LM7805C, LM7812C, LM7815C
www.ti.com
SNOSBR7D MAY 2000REVISED APRIL 2013
REVISION HISTORY
Changes from Revision C (April 2013) to Revision D Page
Changed layout of National Data Sheet to TI format ............................................................................................................ 6
Copyright © 2000–2013, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Links: LM7805C LM7812C LM7815C
PACKAGE OPTION ADDENDUM
www.ti.com 11-Feb-2015
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM7805CT ACTIVE TO-220 NDE 3 45 TBD Call TI Call TI 0 to 70 LM340T5
7805 P+
LM7805CT/NOPB ACTIVE TO-220 NDE 3 45 Pb-Free (RoHS
Exempt) CU SN Level-1-NA-UNLIM 0 to 70 LM340T5
7805 P+
LM7815CT/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS
& no Sb/Br) CU SN Level-1-NA-UNLIM 0 to 70 LM340T15
7815 P+
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
PACKAGE OPTION ADDENDUM
www.ti.com 11-Feb-2015
Addendum-Page 2
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
MECHANICAL DATA
NDE0003B
www.ti.com
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
Mouser Electronics
Authorized Distributor
Click to View Pricing, Inventory, Delivery & Lifecycle Information:
Texas Instruments:
LM7815CT/NOPB