LM185-1.2-N, LM285-1.2-N, LM385-1.2-N www.ti.com SNVS742E - JANUARY 2000 - REVISED APRIL 2013 LM185-1.2-N/LM285-1.2-N/LM385-1.2-N Micropower Voltage Reference Diode Check for Samples: LM185-1.2-N, LM285-1.2-N, LM385-1.2-N FEATURES 1 * * * * * * 2 * 1% and 2% Initial Tolerance Operating Current of 10A to 20mA 1 Dynamic Impedance Low Temperature Coefficient Low Voltage Reference--1.235V 2.5V Device and Adjustable Device Also Available LM185-2.5 Series and LM185 Series, respectively DESCRIPTION The LM185-1.2-N/LM285-1.2-N/LM385-1.2-N are micropower 2-terminal band-gap voltage regulator diodes. Operating over a 10A to 20mA current range, they feature exceptionally low dynamic impedance and good temperature stability. On-chip trimming is used to provide tight voltage tolerance. Since the LM185-1.2-N band-gap reference uses only transistors and resistors, low noise and good long term stability result. Careful design of the LM185-1.2-N has made the device exceptionally tolerant of capacitive loading, making it easy to use in almost any reference application. The wide dynamic operating range allows its use with widely varying supplies with excellent regulation. The extremely low power drain of the LM185-1.2-N makes it useful for micropower circuitry. This voltage reference can be used to make portable meters, regulators or general purpose analog circuitry with battery life approaching shelf life. Further, the wide operating current allows it to replace older references with a tighter tolerance part. The LM185-1.2-N is rated for operation over a -55C to 125C temperature range while the LM285-1.2-N is rated -40C to 85C and the LM385-1.2-N 0C to 70C. The LM185-1.2-N/LM285-1.2-N are available in a hermetic TO package and the LM285-1.2-N/LM3851.2-N are also available in a low-cost TO-92 molded package, as well as SOIC and SOT-23. CONNECTION DIAGRAM Figure 1. T0-92 Package (LP) (Bottom View) Figure 3. SOIC Package * Pin 3 is attached to the Die Attach Pad (DAP) and should be connected to Pin 2 or left floating. Figure 2. SOT-23 Figure 4. TO Package (NDV) (Bottom View) 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2000-2013, Texas Instruments Incorporated LM185-1.2-N, LM285-1.2-N, LM385-1.2-N SNVS742E - JANUARY 2000 - REVISED APRIL 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ABSOLUTE MAXIMUM RATINGS (1) (2) (3) Reverse Current 30mA Forward Current 10mA Operating Temperature Range (4) LM185-1.2-N -55C to +125C LM285-1.2-N -40C to +85C LM385-1.2-N ESD Susceptibility 0C to 70C (5) 2kV -55C to +150C Storage Temperature Soldering Information TO-92 package: 10 sec. 260C TO package:10 sec. 300C SOIC and SOT-23 Pkg. Vapor phase (60 sec.) 215C Infrared (15 sec.) 220C See AN-450 "Surface Mounting Methods and Their Effect on Product Reliability" for other methods of soldering surface mount devices. (1) (2) (3) (4) (5) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is intended to be functional. For specifications and test conditions, see the Electrical Characteristics. The specifications apply only for the test conditions listed. Refer to RETS185H-1.2 for military specifications. If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications. For elevated temperature operation, see Table 1. The human body model is a 100 pF capacitor discharged through a 1.5 k resistor into each pin. Table 1. TJ(max) for Elevated Temperature Operation 2 Submit Documentation Feedback DEVICE TJ(max) (C) LM185-1.2-N 150 LM285-1.2-N 125 LM385-1.2-N 100 Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N LM185-1.2-N, LM285-1.2-N, LM385-1.2-N www.ti.com SNVS742E - JANUARY 2000 - REVISED APRIL 2013 ELECTRICAL CHARACTERISTICS (1) LM185-1.2-N Parameter Conditions Typ LM185BX-1.2-N LM385B-1.2-N LM185BY-1.2-N LM385BX-1.2-N LM285-1.2-N LM385BY-1.2-N LM385-1.2-N Units (Limit) LM285BX-1.2-N LM285BY-1.2-N Tested Limit (2) (3) Reverse Breakdown TA = 25C, Voltage 10A IR 20mA Minimum Operating Current Reverse Breakdown Voltage Change with Current 1.23 5 Design Limit (4) 1.223 10 Design Limit (4) 1.223 1.247 8 Tested Limit (2) 1 1.5 V(Min) 1.260 15 20 LM385M3-1.2-N 10A IR 1mA Design Limit (4) 1.205 1.247 20 Tested Limit (2) 1 1.5 V(Max) 15 20 A 10 15 (Max) 1 1.5 mV (Max) 1mA IR 20mA 10 20 20 25 20 25 mV (Max) IR = 100A, f = 20Hz 1 Wideband Noise IR = 100A, 60 V (rms) 10Hz f 10kHz Long Term Stability IR = 100A, T = 1000 Hr, 20 ppm Reverse Dynamic Impedance TA = 25C 0.1C Average Temperature Coefficient (5) IR = 100A X Suffix 30 30 ppm/C Y Suffix 50 50 ppm/C All Others 150 150 150 ppm/C (Max) (1) (2) (3) (4) (5) Parameters identified with boldface type apply at temperature extremes. All other numbers apply at TA = TJ = 25C. Production tested. A military RETS electrical specification is available on request. Specified by design. Not production tested. These limits are not used to calculate average outgoing quality levels. The average temperature coefficient is defined as the maximum deviation of reference voltage at all measured temperatures between the operating TMAX and TMIN, divided by TMAX - TMIN. The measured temperatures are -55C, -40C, 0C, 25C, 70C, 85C, 125C. THERMAL CHARACTERISTICS Thermal Resistance JA (junction to ambient) JC (junction to case) Copyright (c) 2000-2013, Texas Instruments Incorporated TO-92 TO SOIC SOT-23 180C/W (0.4 leads) 170C/W (0.125 leads) 440C/W 165C/W 283C/W N/A 80C/W N/A N/A Submit Documentation Feedback Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N 3 LM185-1.2-N, LM285-1.2-N, LM385-1.2-N SNVS742E - JANUARY 2000 - REVISED APRIL 2013 www.ti.com TYPICAL PERFORMANCE CHARACTERISTICS 4 Reverse Characteristics Reverse Characteristics Figure 5. Figure 6. Forward Characteristics Temperature Drift of 3 Representative Units Figure 7. Figure 8. Reverse Dynamic Impedance Reverse Dynamic Impedance Figure 9. Figure 10. Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N LM185-1.2-N, LM285-1.2-N, LM385-1.2-N www.ti.com SNVS742E - JANUARY 2000 - REVISED APRIL 2013 TYPICAL PERFORMANCE CHARACTERISTICS (continued) Noise Voltage Filtered Output Noise Figure 11. Figure 12. Response Time Figure 13. Copyright (c) 2000-2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N 5 LM185-1.2-N, LM285-1.2-N, LM385-1.2-N SNVS742E - JANUARY 2000 - REVISED APRIL 2013 www.ti.com TYPICAL APPLICATIONS Figure 14. Wide Input Range Reference Figure 15. Micropower Reference from 9V Battery Figure 16. Reference from 1.5V Battery *IQ 30A Figure 17. Micropower* 5V Regulator 6 Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N LM185-1.2-N, LM285-1.2-N, LM385-1.2-N www.ti.com SNVS742E - JANUARY 2000 - REVISED APRIL 2013 *IQ 20A standby current Figure 18. Micropower* 10V Reference Figure 19. Copyright (c) 2000-2013, Texas Instruments Incorporated Figure 20. Precision 1A to 1mA Current Sources Submit Documentation Feedback Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N 7 LM185-1.2-N, LM285-1.2-N, LM385-1.2-N SNVS742E - JANUARY 2000 - REVISED APRIL 2013 www.ti.com METER THERMOMETERS Calibration 1. Short LM385-1.2-N, adjust R3 for IOUT= temp at 1A/K 2. Remove short, adjust R2 for correct reading in centigrade IQ at 1.3V500A IQ at 1.6V2.4mA Figure 21. 0C-100C Thermometer Figure 22. *2N3638 or 2N2907 select for inverse HFE 5 Select for operation at 1.3V IQ 600A to 900A Figure 23. Lower Power Thermometer 8 Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N LM185-1.2-N, LM285-1.2-N, LM385-1.2-N www.ti.com SNVS742E - JANUARY 2000 - REVISED APRIL 2013 Calibration 1. Short LM385-1.2-N, adjust R3 for IOUT= temp at 1.8A/K 2. Remove short, adjust R2 for correct reading in F Figure 24. 0F-50F Thermometer Adjustment Procedure 1. Adjust TC ADJ pot until voltage across R1 equals Kelvin temperature multiplied by the thermocouple Seebeck coefficient. 2. Adjust zero ADJ pot until voltage across R2 equals the thermocouple Seebeck coefficient multiplied by 273.2. Figure 25. Micropower Thermocouple Cold Junction Compensator Copyright (c) 2000-2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N 9 LM185-1.2-N, LM285-1.2-N, LM385-1.2-N SNVS742E - JANUARY 2000 - REVISED APRIL 2013 www.ti.com Thermocouple Seebeck R1 R2 Voltage Voltage Type Coefficient () () Across R1 Across R2 @ 25C (mV) (V/C) (mV) J 52.3 523 1.24k 15.60 14.32 T 42.8 432 1k 12.77 11.78 K 40.8 412 953 12.17 11.17 S 6.4 63.4 150 1.908 1.766 Typical supply current 50A Calibration 1. Adjust R1 so that V1 = temp at 1mV/K 2. Adjust V2 to 273.2mV IQ for 1.3V to 1.6V battery voltage = 50A to 150A Figure 26. Centigrade Thermometer 10 Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N LM185-1.2-N, LM285-1.2-N, LM385-1.2-N www.ti.com SNVS742E - JANUARY 2000 - REVISED APRIL 2013 SCHEMATIC DIAGRAM Copyright (c) 2000-2013, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N 11 LM185-1.2-N, LM285-1.2-N, LM385-1.2-N SNVS742E - JANUARY 2000 - REVISED APRIL 2013 www.ti.com REVISION HISTORY Changes from Revision D (April 2013) to Revision E * 12 Page Changed layout of National Data Sheet to TI format .......................................................................................................... 11 Submit Documentation Feedback Copyright (c) 2000-2013, Texas Instruments Incorporated Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N PACKAGE OPTION ADDENDUM www.ti.com 1-Oct-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking TBD Call TI Call TI -55 to 125 ( LM185BYH1.2 ~ LM185BYH1.2) Green (RoHS & no Sb/Br) POST-PLATE Level-1-NA-UNLIM -55 to 125 ( LM185BYH1.2 ~ LM185BYH1.2) TBD Call TI Call TI -55 to 125 ( LM185H1.2 ~ LM185H1.2) (4/5) LM185BYH-1.2 OBSOLETE TO NDU 2 LM185BYH-1.2/NOPB ACTIVE TO NDU 2 LM185H-1.2 OBSOLETE TO NDU 2 LM185H-1.2/NOPB ACTIVE TO NDU 2 1000 Green (RoHS & no Sb/Br) POST-PLATE Level-1-NA-UNLIM -55 to 125 ( LM185H1.2 ~ LM185H1.2) LM285BXM-1.2/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 285BX M1.2 LM285BXMX-1.2/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 285BX M1.2 LM285BXZ-1.2/LFT4 ACTIVE TO-92 LP 3 2000 Green (RoHS & no Sb/Br) CU SN N / A for Pkg Type LM285BXZ-1.2/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) CU SN N / A for Pkg Type -40 to 85 285BX Z-1.2 LM285BYM-1.2/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 285BY M1.2 LM285BYMX-1.2/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 285BY M1.2 LM285H-1.2 OBSOLETE TO NDU 2 TBD Call TI Call TI -40 to 85 ( LM285H1.2 ~ LM285H1.2) LM285H-1.2/NOPB OBSOLETE TO NDU 2 TBD Call TI Call TI -40 to 85 ( LM285H1.2 ~ LM285H1.2) LM285M-1.2/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LM285 M1.2 LM285MX-1.2/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 85 LM285 M1.2 LM285Z-1.2/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) CU SN N / A for Pkg Type -40 to 85 LM28 5Z-1.2 LM385BM-1.2 NRND SOIC D 8 95 TBD Call TI Call TI 0 to 70 LM385 BM1.2 LM385BM-1.2/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM385 BM1.2 1000 Addendum-Page 1 285BX Z-1.2 Samples PACKAGE OPTION ADDENDUM www.ti.com 1-Oct-2016 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) LM385BMX-1.2 NRND SOIC D 8 2500 TBD Call TI Call TI 0 to 70 LM385 BM1.2 LM385BMX-1.2/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM385 BM1.2 LM385BXM-1.2/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 385BX M1.2 LM385BXMX-1.2/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 385BX M1.2 LM385BXZ-1.2/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) CU SN N / A for Pkg Type 0 to 70 385BX Z-1.2 LM385BYM-1.2/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 385BY M1.2 LM385BYMX-1.2/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 385BY M1.2 LM385BYZ-1.2/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) CU SN N / A for Pkg Type 0 to 70 385BY Z-1.2 LM385BZ-1.2/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) CU SN N / A for Pkg Type 0 to 70 LM385 BZ1.2 LM385M-1.2 NRND SOIC D 8 95 TBD Call TI Call TI 0 to 70 LM385 M1.2 LM385M-1.2/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM385 M1.2 LM385M3-1.2 NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI 0 to 70 R11 LM385M3-1.2/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 R11 LM385M3X-1.2 NRND SOT-23 DBZ 3 3000 TBD Call TI Call TI 0 to 70 R11 LM385M3X-1.2/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 R11 LM385MX-1.2/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM385 M1.2 LM385Z-1.2/LFT3 ACTIVE TO-92 LP 3 2000 Green (RoHS & no Sb/Br) CU SN N / A for Pkg Type LM385 Z-1.2 LM385Z-1.2/LFT4 ACTIVE TO-92 LP 3 2000 Green (RoHS & no Sb/Br) CU SN N / A for Pkg Type LM385 Z-1.2 LM385Z-1.2/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) CU SN N / A for Pkg Type Addendum-Page 2 0 to 70 LM385 Z-1.2 Samples PACKAGE OPTION ADDENDUM www.ti.com 1-Oct-2016 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 5-Dec-2014 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM285BXMX-1.2/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM285BYMX-1.2/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM285MX-1.2/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM385BMX-1.2 SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM385BMX-1.2/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM385BXMX-1.2/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM385BYMX-1.2/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM385M3-1.2 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM385M3-1.2/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM385M3X-1.2 SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM385M3X-1.2/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM385MX-1.2/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 5-Dec-2014 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM285BXMX-1.2/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM285BYMX-1.2/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM285MX-1.2/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM385BMX-1.2 SOIC D 8 2500 367.0 367.0 35.0 LM385BMX-1.2/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM385BXMX-1.2/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM385BYMX-1.2/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM385M3-1.2 SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM385M3-1.2/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM385M3X-1.2 SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM385M3X-1.2/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM385MX-1.2/NOPB SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 MECHANICAL DATA NDU0002A H02A (Rev F) www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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