DS36C278
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SNLS096C –JULY 1998–REVISED APRIL 2013
DS36C278 Low Power Multipoint EIA-RS-485 Transceiver
Check for Samples: DS36C278
1FEATURES DESCRIPTION
The DS36C278 is a low power differential bus/line
2• 100% RS-485 Compliant transceiver designed to meet the requirements of RS-
– Guaranteed RS-485 Device Interoperation 485 standard for multipoint data transmission. In
• Low Power CMOS Design: ICC 500 μA Max addition it is compatible with TIA/EIA-422-B.
• Built-In Power Up/Down Glitch-Free Circuitry The CMOS design offers significant power savings
– Permits Live Transceiver over its bipolar and ALS counterparts without
sacrificing ruggedness against ESD damage. The
Insertion/Displacement device is ideal for use in battery powered or power
• PDIP and SOIC Packages Available conscious applications. ICC is specified at 500 μA
• Industrial Temperature Range: −40°C to maximum.
+85°C The driver and receiver outputs feature TRI-STATE
• On-Board Thermal Shutdown Circuitry capability. The driver outputs operate over the entire
– Prevents Damage to the Device in the Event common mode range of −7V to +12V. Bus contention
of Excessive Power Dissipation or fault situations that cause excessive power
dissipation within the device are handled by a thermal
• Wide Common Mode Range: −7V to +12V shutdown circuit, which forces the driver outputs into
• Receiver Open Input Fail-Safe (1) the high impedance state.
• ¼ Unit Load (DS36C278): ≥12 Nodes The receiver incorporates a fail safe circuit which
• ½ Unit Load (DS36C278T): ≥64 Nodes guarantees a high output state when the inputs are
• ESD (Human Body Model): ≥2 kV left open. (1)
• Drop in Replacement for: The DS36C278T is fully specified over the industrial
– LTC485, MAX485, DS75176, DS3695 temperature range (−40°C to +85°C).
(1) Non-terminated, open input only
Connection Diagram
Figure 1. 8-Pin PDIP or SOIC
Package Numbers D0008A and P0008E
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 1998–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
DS36C278
SNLS096C –JULY 1998–REVISED APRIL 2013
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Pin Descriptions
Pin No. Name Description
1 RO Receiver Output: When RE (Receiver Enable) is LOW, the receiver is enabled (ON), if DO/RI ≥DO*/RI* by 200 mV, RO
will be HIGH. If DO/RI ≤DO*/RI* by 200 mV, RO will be LOW. Additionally RO will be HIGH for OPEN (Non-terminated)
Inputs.
2 RE* Receiver Output Enable: When RE* is LOW the receiver output is enabled. When RE* is HIGH, the receiver output is in
TRI-STATE (OFF).
3 DE Driver Output Enable: When DE is HIGH, the driver outputs are enabled. When DE is LOW, the driver outputs are in
TRI-STATE (OFF).
4 DI Driver Input: When DE (Driver Enable) is HIGH, the driver is enabled, if DI is LOW, then DO/RI will be LOW and
DO*/RI* will be HIGH. If DI is HIGH, then DO/RI is HIGH and DO*/RI* is LOW.
5 GND Ground Connection.
6 DO/RI Driver Output/Receiver Input, 485 Bus Pin.
7 DO*/RI* Driver Output/Receiver Input, 485 Bus Pin.
8 VCC Positive Power Supply Connection: Recommended operating range for VCC is +4.75V to +5.25V.
Table 1. Truth Table(1)
DRIVER SECTION
RE* DE DI DO/RI DO*/RI*
X H H H L
X H L L H
X L X Z Z
RECEIVER SECTION
RE* DE RI-RI* RO
L L ≥+0.2V H
L L ≤−0.2V L
H L X Z
L L OPEN (1) H
(1) Non-terminated, open input only
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings(1)(2)
Supply Voltage (VCC) +12V
Input Voltage (DE, RE*, & DI) −0.5V to (VCC +0.5V)
Common Mode (VCM)
Driver Output/Receiver Input ±15V
Input Voltage (DO/RI, DO*/RI*) ±14V
Receiver Output Voltage −0.5V to (VCC +0.5V)
Maximum Package Power Dissipation
@ +25°C
D0008A Package 1190 mW, derate 9.5 mW/°C above +25°C
P0008E Package 744 mW, derate 6.0 mW/°C above +25°C
Storage Temperature Range −65°C to +150°C
Lead Temperature
(Soldering 4 sec) +260°C
(1) “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to
imply that the devices should be operated at these limits. The table of “Electrical Characteristics” specifies conditions of device
operation.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
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Recommended Operating Conditions Min Typ Max Units
Supply Voltage (VCC) +4.75 +5.0 +5.25 V
Bus Voltage −7 +12 V
Operating Free-Air Temperature (TA)
DS36C278T −40 25 +85 °C
DS36C278 0 25 +70 °C
Electrical Characteristics (1) (2)
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified
Parameter Test Conditions Reference Min Typ Max Units
DIFFERENTIAL DRIVER CHARACTERISTICS
VOD1 Differential Output Voltage IO= 0 mA (No Load) 1.5 5.0 V
(422)
VOD0 Output Voltage IO= 0 mA 0 5.0 V
(485)
VOD0* Output Voltage (Output to GND) 0 5.0 V
VOD2 Differential Output Voltage RL= 50Ω(422) Figure 2 2.0 2.8 V
(Termination Load) RL= 27Ω(485) 1.5 2.3 5.0 V
ΔVOD2 Balance of VOD2 RL= 27Ωor 50Ω(3) −0.2 0.1 +0.2 V
|VOD2 −V0D2*| (422, 485)
VOD3 Differential Output Voltage R1 = 54Ω, R2 = 375ΩFigure 3 1.5 2.0 5.0 V
(Full Load) VTEST =−7V to +12V
VOC Driver Common Mode RL= 27Ω(485) 0 3.0 V
Figure 2
Output Voltage RL= 50Ω(422) 0 3.0 V
ΔVOC Balance of VOC RL= 27Ωor (3) −0.2 +0.2 V
|VOC −VOC*| RL= 50Ω(422, 485)
IOSD Driver Output Short-Circuit VO= +12V (485) 200 +250 mA
Current VO=−7V (485) −190 −250 mA
RECEIVER CHARACTERISTICS
VTH Differential Input High VO= VOH, IO=−0.4V +0.035 +0.2 V
Threshold Voltage −7V ≤VCM ≤+12V (4)
(422, 485)
VTL Differential Input Low VO= VOL, IO= 0.4 mA −0.2 −0.035 V
Threshold Voltage −7V ≤VCM ≤+12V
VHST Hysteresis VCM = 0V (5) 70 mV
RIN Input Resistance −7V ≤VCM ≤+12V DS36C278T 24 68 kΩ
RIN Input Resistance −7V ≤VCM ≤+12V DS36C278 48 68 kΩ
IIN Line Input Current Other Input = 0V, DS36C278 VIN = +12V 0 0.19 0.25 mA
(6) DE = VIL, RE* = VIL, VIN =−7V 0 −0.1 −0.2 mA
VCC= 4.75 to 5.25 DS36C278T VIN = +12V 0 0.19 0.5 mA
or 0V VIN =−7V 0 −0.1 −0.4 mA
IING Line Input Current Glitch Other Input = 0V, DS36C278 VIN = +12V 0 0.19 0.25 mA
(6) DE = VIL, RE* = VIL, VIN =−7V 0 −0.1 −0.2 mA
VCC = +3.0V or 0V, DS36C278T VIN = +12V 0 0.19 0.5 mA
TA= 25°C VIN =−7V 0 −0.1 −0.4 mA
IBInput Balance Test RS = 500Ω(422) (7) ±400 mV
(1) Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground
except VOD1 and VOD2.
(2) All typicals are given for: VCC = +5.0V, TA= + 25°C.
(3) Delta |VOD2| and Delta |VOC| are changes in magnitude of VOD2 and VOC, respectively, that occur when input changes state.
(4) Threshold parameter limits specified as an algebraic value rather than by magnitude.
(5) Hysteresis defined as VHST = VTH −VTL.
(6) IIN includes the receiver input current and driver TRI-STATE leakage current.
(7) For complete details of test, see RS-485.
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Electrical Characteristics (1) (2) (continued)
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified
Parameter Test Conditions Reference Min Typ Max Units
VOH High Level Output Voltage IOH =−4 mA, VID = +0.2V 3.5 4.6 V
RO
Figure 12
VOL Low Level Output Voltage IOL = +4 mA, VID =−0.2V 0.3 0.5 V
IOSR Short Circuit Current VO= GND 7 35 85 mA
RO
IOZR TRI-STATE Leakage Current VO= 0.4V to 2.4V ±1 μA
DEVICE CHARACTERISTICS
VIH High Level Input Voltage 2.0 VCC V
VIL Low Level Input Voltage GND 0.8 V
DE,
IIH High Level Input Current VIH = VCC RE*, 2 μA
DI
IIL Low Level Input Current VCC = 5V −2μA
VIL = 0V
VCC = +3.0V −2μA
ICC Power Supply Current Driver and Receiver ON 200 500 μA
ICCR (No Load) Driver OFF, Receiver ON 200 500 μA
VCC
ICCD Driver ON, Receiver OFF 200 500 μA
ICCZ Driver and Receiver OFF 200 500 μA
Switching Characteristics(1)(2)
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified
Parameter Test Conditions Reference Min Typ Max Units
DRIVER CHARACTERISTICS
tPHLD Differential Propagation RL= 54Ω, CL= 100 pF 10 39 80 ns
Delay High to Low
tPLHD Differential Propagation 10 40 80 ns
Delay Low to High Figure 7
tSKD Differential Skew 0 1 10 ns
|tPHLD −tPLHD|
trRise Time 3 25 50 ns
tfFall Time 3 25 50 ns
tPHZ Disable Time High to Z CL= 15 pF Figure 8,Figure 9 — 80 200 ns
tPLZ Disable Time Low to Z RE * = L Figure 10,Figure 11 — 80 200 ns
tPZH Enable Time Z to High CL= 100 pF Figure 8,Figure 9 — 50 200 ns
tPZL Enable Time Z to Low RE * = L Figure 10,Figure 11 — 65 200 ns
RECEIVER CHARACTERISTICS
tPHL Propagation Delay CL= 15 pF 30 210 400 ns
High to Low
tPLH Propagation Delay Figure 13,Figure 14 30 190 400 ns
Low to High
tSK Skew, |tPHL −tPLH| 0 20 50 ns
tPLZ Output Disable Time CL= 15 pF — 50 150 ns
tPHZ — 55 150 ns
Figure 15,Figure 16,
Figure 17
tPZL Output Enable Time — 40 150 ns
tPZH — 45 150 ns
(1) All typicals are given for: VCC = +5.0V, TA= + 25°C.
(2) CLincludes probe and jig capacitance.
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PARAMETER MEASUREMENT INFORMATION
Figure 2. Driver VOD2 and VOC Figure 3. Driver VOD3
Figure 4. Driver VOH and VOL
Vtest = −7V to +12V
Figure 5. Driver IOSD
Figure 6. Driver Differential Propagation Delay Test Circuit
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Figure 7. Driver Differential Propagation Delays and Differential Rise and Fall Times
Figure 8. TRI-STATE Test Circuit (tPZH , tPHZ)
Figure 9. TRI-STATE Waveforms (tPZH, tPHZ)
Figure 10. TRI-STATE Test Circuit (tPZL, tPLZ)
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SNLS096C –JULY 1998–REVISED APRIL 2013
Figure 11. TRI-STATE Waveforms (tPZL, tPLZ)
Figure 12. Receiver VOH and VOL
Figure 13. Receiver Differential Propagation Delay Test Circuit
Figure 14. Receiver Differential Propagation Delay Waveforms
Figure 15. Receiver TRI-STATE Test Circuit
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Figure 16. Receiver Enable and Disable Waveforms (tPLZ, tPZL)
Figure 17. Receiver Enable and Disable Waveforms (tPHZ, tPZH)
Typical Application Information
Figure 18. Typical RS-485 Bus Interface
Unit Load
A unit load for an RS-485 receiver is defined by the input current versus the input voltage curve. The gray
shaded region is the defined operating range from −7V to +12V. The top border extending from −3V at 0 mA to
+12V at +1 mA is defined as one unit load. Likewise, the bottom border extending from +5V at 0 mA to −7V at
−0.8 mA is also defined as one unit load (see Figure 19). An RS-485 driver is capable of driving up to 32 unit
loads. This allows up to 32 nodes on a single bus. Although sufficient for many applications, it is sometimes
desirable to have even more nodes. For example, an aircraft that has 32 rows with 4 seats per row would benefit
from having 128 nodes on one bus. This would allow signals to be transferred to and from each individual seat to
1 main station. Usually there is one or two less seats in the last row of the aircraft near the restrooms and food
storage area. This frees the node for the main station.
The DS36C278, the DS36C279, and the DS36C280 all have ½ unit load and ¼ unit load (UL) options available.
These devices will allow up to 64 nodes or 128 nodes guaranteed over temperature depending upon which
option is selected. The ½ UL option is available in industrial temperature and the ¼ UL is available in commercial
temperature.
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First, for a ½ UL device the top and bottom borders shown in Figure 19 are scaled. Both 0 mA reference points
at +5V and −3V stay the same. The other reference points are +12V at +0.5 mA for the top border and −7V at
−0.4 mA for the bottom border (see Figure 19). Second, for a ¼ UL device the top and bottom borders shown in
Figure 19 are scaled also. Again, both 0 mA reference points at +5V and −3V stay the same. The other
reference points are +12V at +0.25 mA for the top border and −7V at −0.2 mA for the bottom border (see
Figure 19).
The advantage of the ½ UL and ¼ UL devices is the increased number of nodes on one bus. In a single master
multi-slave type of application where the number of slaves exceeds 32, the DS36C278/279/280 may save in the
cost of extra devices like repeaters, extra media like cable, and/or extra components like resistors.
The DS36C279 and DS36C280 have an additional feature which offers more advantages. The DS36C279 has
an automatic sleep mode function for power conscious applications. The DS36C280 has a slew rate control for
EMI conscious applications. Refer to the sleep mode and slew rate control portion of the application information
section in the corresponding datasheet for more information on these features.
Figure 19. Input Current vs Input Voltage Operating Range
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REVISION HISTORY
Changes from Revision B (April 2013) to Revision C Page
• Changed layout of National Data Sheet to TI format ............................................................................................................ 9
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PACKAGE OPTION ADDENDUM
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Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
DS36C278M/NOPB ACTIVE SOIC D 8 95 Green (RoHS
& no Sb/Br) SN | CU SN Level-1-260C-UNLIM 0 to 70 DS36C
278M
DS36C278MX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) SN | CU SN Level-1-260C-UNLIM 0 to 70 DS36C
278M
DS36C278TM NRND SOIC D 8 95 TBD Call TI Call TI 0 to 70 36C27
8TM
DS36C278TM/NOPB ACTIVE SOIC D 8 95 Green (RoHS
& no Sb/Br) SN | CU SN Level-1-260C-UNLIM 0 to 70 36C27
8TM
DS36C278TMX NRND SOIC D 8 2500 TBD Call TI Call TI 0 to 70 36C27
8TM
DS36C278TMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) SN | CU SN Level-1-260C-UNLIM 0 to 70 36C27
8TM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
PACKAGE OPTION ADDENDUM
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Addendum-Page 2
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
DS36C278MX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
DS36C278TMX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
DS36C278TMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
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Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
DS36C278MX/NOPB SOIC D 8 2500 367.0 367.0 35.0
DS36C278TMX SOIC D 8 2500 367.0 367.0 35.0
DS36C278TMX/NOPB SOIC D 8 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
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Pack Materials-Page 2
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