2018 Microchip Technology Inc. DS20005540A-page 1
MIC2039
Features
• ±5% Current-Limit Accuracy
• Input Supply Range from 2.5V to 5.5V
• Low Quiescent Current: 100 µA Typical (Switch
ON)
•75m Typical RDS(ON) at 5V
• 0.2A to 2.5A Adjustable Output Current
• Kickstart: Momentary Secondary Current-Limit
Threshold (120 ms period)
• Soft-Start Functionality
• Undervoltage Lockout (UVLO)
• Fast 10 µs Short-Circuit Response Time
(Non-Kickstart Options)
• Fault Status Output Flag
• Logic Controlled Enable (Active-High, Active-Low)
• Thermal Shutdown
• Pin Compatible with MIC2009/MIC2019
• 6-Pin 2 mm x 2 mm Thin DFN and 6-Pin SOT-23
Packages
• Junction Temperature Range from –40°C to
+125°C
Applications
• USB Peripherals and USB 2.0/3.0-Compatible
• DTV/STB
• Notebooks and Consumer Electronics
• General Purpose Power Distribution
General Description
The MIC2039 is a high-side MOSFET power
distribution switch that provides increased system
reliability by using 5% current-limit accuracy.
The MIC2039 has an operating input voltage range
from 2.5V to 5.5V, is internally current-limited, and has
thermal shutdown to protect the device and system.
The MIC2039 is offered with either active-high or
active-low logic level enable input controls. It has an
open drain fault status output flag with a built-in 32 ms
delay that asserts low during overcurrent or
thermal-shutdown conditions.
The MIC2039 features an adjustable output current
limit that is resistor-programmable from 0.2A to 2.5A.
The MIC2039 also offers a unique, kickstart feature
that allows momentary high-current surges up to the
secondary current limit (ILIMIT_2nd) during startup or
while operating in steady-state. This is useful for
charging loads with high inrush currents, such as
capacitors. After an overcurrent condition is
established, these switches enter into a constant
current-limit mode unless the die temperature exceeds
the thermal-shutdown specification.
The MIC2039 is available in 6-pin SOT-23 and 6-pin
2 mm x 2 mm thin DFN packages. The MIC2039 has
an operating junction temperature range of –40°C to
+125°C.
Package Types
Note 1: Thin DFN = Pin 1 identifier.
MIC2039
SOT-23-6 (M6)
MIC2039
2x2 TDFN (MT) (Note 1)
VIN
FAULT/
ILIMIT
VOUT
GND
4
5
61
2
3
EN
VIN
FAULT/
ILIMIT
VOUT
GND
EP
EN
6
1
2
3
5
4
High-Accuracy, High-Side, Adjustable Current-Limit Power Switch
MIC2039
DS20005540A-page 2 2018 Microchip Technology Inc.
Typica l Application Circuit
Functional Block Diagram
MIC2039
SOT-23-6
VOUT
GND
VIN
ILIMIT
FAULT/
C1
47μF
6.3V
VOUT
5V/1A
VIN
5V
C2
100μF
6.3V
EN
MIC2039-AYM6
R1
1K
R2
287
THERMAL
SENSOR
EN
GND
VOUTVIN
CONTROL
REFERENCE
CURRENT
LIMIT DELAY
UVLO
ILIMIT
SENSE FET
POWER FET
FAULT/
2018 Microchip Technology Inc. DS20005540A-page 3
MIC2039
1.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
VIN to GND................................................................................................................................................... –0.3V to +6V
VOUT to GND..................................................................................................................................................–0.3V to VIN
VILIMIT to GND.................................................................................................................................... –0.3V to VIN + 0.3V
VEN to GND....................................................................................................................................................–0.3V to VIN
VFAULT/ to GND .................................................................................................................................. –0.3V to VIN + 0.3V
FAULT/ Current (IFAULT/) .........................................................................................................................................25 mA
Maximum Power Dissipation (PD).......................................................................................................... Internally Limited
ESD Rating (HBM) (Note 1) ....................................................................................................................................... 3 kV
ESD Rating (MM) (Note 1)........................................................................................................................................300V
Operating Ratings ‡
Supply Voltage (VIN) ................................................................................................................................. +2.5V to +5.5V
VEN.................................................................................................................................................................–0.3V to VIN
VFAULT/ ...................................................................................................................................................... –0.3V to +5.5V
VILIMIT, VOUT ..................................................................................................................................................–0.3V to VIN
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
‡ Notice: The device is not guaranteed to function outside its operating ratings.
Note 1: Devices are ESD sensitive. Handling precautions are recommended. Human body model, 1.5 k in series
with 100 pF.
MIC2039
DS20005540A-page 4 2018 Microchip Technology Inc.
TABLE 1-1: ELECTRICAL CHARACTERISTICS
Electrical Characteristics: VIN = VEN = 5V, CIN = 1 µF; TJ = +25°C, unless noted. Bold values indicate –40°C TJ
+125°C. (Note 1).
Symbol Parameters Min. Typ. Max. Units Conditions
Power Supply Input
VIN Input Voltage Range 2.5 —5.5 V—
VUVLO
Input Supply Undervoltage
Lockout Threshold
2.0 2.25 2.5 VVIN rising
1.9 2.15 2.4 VIN falling
VUVLOHYS
Input Supply Undervoltage
Lockout Threshold Hysteresis —100—mV V
IN rising or VIN falling
IDD Supply Current
—0.75 5µA
Switch OFF; Active-High
Enable (A): VEN = 0V, VIN = 5V,
IOUT = 0A
Switch OFF; Active-Low
Enable (B): VEN = 1.5V, VIN =
5V, IOUT = 0A
—100300 µA
Switch ON; Active-High Enable
(A): VEN = 1.5V, VIN = 5V,
IOUT = 0A
Switch ON; Active-Low Enable
(B): VEN = 0V, VIN = 5V,
IOUT = 0A
Power MOSFET
RDS(ON) Switch On-Resistance
—100177
m
VIN = 2.5V, IOUT = 350 mA
—85145 VIN = 3.3V, IOUT = 350 mA
—75125 VIN = 5V, IOUT = 350 mA
ILKG Output Leakage Current 0.22 15 µA Switch OFF, VOUT = 0V
Current Limit
ILIMIT
Current Limit (Resistor Values
are Standard 0.1% Values)
2.35 2.5 2.65
A
RLIMIT = 115, VIN = 5V,
VOUT = 0.8V × VIN
RLIMIT = 115, VIN = 2.5V,
VOUT = 0V
1.90 2.0 2.10 RLIMIT = 145, VIN = 5V,
VOUT = 0.8V × VIN
0.95 1.0 1.05 RLIMIT = 287, VIN = 5V,
VOUT = 0.8V × VIN
0.475 0.50 0.525 RLIMIT = 576, VIN = 5V,
VOUT = 0.8V × VIN
0.19 0.20 0.21 RLIMIT = 1.45 k, VIN = 5V,
VOUT = 0.8V × VIN
ILIMIT_2ND
Secondary Current Limit
(Kickstart parts only) 2.2 3.2 6.0 A VOUT = 0V
Note 1: Specification for packaged product only.
2: See Timing Diagrams.
3: For dynamic current loads faster than typically 30 mA/ms. Slower current loads will delay the deactivation
of VOUT and the current limitation, allowing FAULT/ to be asserted before these.
2018 Microchip Technology Inc. DS20005540A-page 5
MIC2039
I/O
VEN Enable Voltage ——0.5 VLogic-Low
1.5 — — Logic-High
IEN Enable Input Current — 1 — µA 0V VEN 5V
RFAULT/ FAULT/ Output Resistance — — 25 IOUT = 10 mA
IFAULT/_OFF FAULT/ Off Current — — 10 µA VFAULT/ = VIN
Thermal Protection
TSD Thermal Shutdown Threshold — 157 — °C TJ rising
TSDHYS Thermal Shutdown Hysteresis — 15 — °C —
Timing Specifications (AC Parameters)
tRISE
Output Turn-On Rise Time
(Note 2)—700— µsR
LOAD = 10; COUT = 1 µF
tFALL
Output Turn-Off Fall Time
(Note 2)—32—µsVEN = OFF; RLOAD = 10;
COUT = 1 µF
tON_DLY Output Turn-On Delay (Note 2)— 700 — µs R
LOAD = 10; COUT = 1 µF
tOFF_DLY Output Turn-Off Delay (Note 2)— 5 — µs R
LOAD = 10; COUT = 1 µF
tSC_RESP
Short Circuit Response Time
(Note 2, Note 3)—10—µs V
OUT = 0V (short-circuit)
tFAULT/
Overcurrent Fault Response
Delay Time (Note 2, Note 3)16 32 49 ms Non-kickstart parts.
tKICKSTART
Overcurrent Fault Response
Delay During Kickstart
(Note 2)
64 120 200 ms Kickstart parts only.
TABLE 1-1: ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics: VIN = VEN = 5V, CIN = 1 µF; TJ = +25°C, unless noted. Bold values indicate –40°C TJ
+125°C. (Note 1).
Symbol Parameters Min. Typ. Max. Units Conditions
Note 1: Specification for packaged product only.
2: See Timing Diagrams.
3: For dynamic current loads faster than typically 30 mA/ms. Slower current loads will delay the deactivation
of VOUT and the current limitation, allowing FAULT/ to be asserted before these.
MIC2039
DS20005540A-page 6 2018 Microchip Technology Inc.
TEMPERATURE SPECIFICATIONS
Parameters Sym. Min. Typ. Max. Units Conditions
Te mperature Ranges
Junction Operating Temperature
Range
TJ–40 — +125 °C Note 1
Storage Temperature Range TS–65 — +150 °C —
Lead Temperature — — — +260 °C Soldering, 10s
Package Thermal Resistances
Thermal Resistance SOT-23-6 JA — 177.2 — °C/W —
Thermal Resistance 6-pin 2 mm x
2 mm Thin DFN
JA —90 —°C/W—
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
2018 Microchip Technology Inc. DS20005540A-page 7
MIC2039
2.0 TYPICAL PERFORMANCE CURVES
FIGURE 2-1: Input Supply Current vs.
Temperature.
FIGURE 2-2: VIN OFF Current vs.
Temperature.
FIGURE 2-3: Undervoltage Lockout vs.
Temperature.
FIGURE 2-4: RDS(ON) vs. Temperature.
FIGURE 2-5: RDS(ON) vs. Temperature.
FIGURE 2-6: RDS(ON) vs. Output Current.
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
MIC2039
DS20005540A-page 8 2018 Microchip Technology Inc.
FIGURE 2-7: FAULT/ Response Time vs.
Temperature.
FIGURE 2-8: FAULT/ Response Time vs.
Temperature.
FIGURE 2-9: FAULT/ Response Time vs.
Output Current.
FIGURE 2-10: Output Leakage Current vs.
Temperature.
FIGURE 2-11: VIN - V OUT vs. Output
Current.
FIGURE 2-12: Current Limit Set Resist or
vs. Output Current.
2018 Microchip Technology Inc. DS20005540A-page 9
MIC2039
FIGURE 2-13: Soft-Start Turn-On.
FIGURE 2-14: Soft-Start Turn-Off.
FIGURE 2-15: Enable Turn-O n .
FIGURE 2-16: Enable Turn-Off.
FIGURE 2-17: Turn-On Into Short-Circuit.
FIGURE 2-18: Turn-On Into Short
(Kickstart).
VIN = 5V
ILOAD= 250mA
ILIMIT = 1A
COUT = 1μF
Time (2ms/div)
IIN
(500mA/div)
VIN
(2V/div)
VOUT
(2V/div)
Time (4ms/div)
VIN = 5V
ILOAD= 250mA
ILIMIT = 1A
COUT = 1μF
IIN
(500mA/div)
VIN
(2V/div)
VOUT
(2V/div)
Time (200μs/div)
IIN
(200mA/div)
VEN
(5V/div)
VOUT
(2V/div)
VIN
= 5V
ILOAD= 250mA
ILIMIT
= 1A
COUT
= 1μF
MIC2039AYM6
Time (100μs/div)
VIN = 5V
ILOAD= 250mA
ILIMIT = 1A
COUT = 1μF
IIN
(100mA/div)
VEN
(5V/div)
VOUT
(2V/div)
MIC2039AYM6
Time (4ms/div)
VIN
= 5V
ILOAD= Short Circuit
ILIMIT
= 1A
COUT
= 1μF
IIN
(500mA/div)
VEN
(5V/div)
VOUT
(500mV/div)
VFAULT/
(5V/div)
MIC2039
DS20005540A-page 10 2018 Microchip Technology Inc.
FIGURE 2-19: Current-Limit Response.
FIGURE 2-20: Output Recovery from
Short-Circuit.
FIGURE 2-21: Output Recovery from
Short-Circuit (Kickstart).
FIGURE 2-22: 85 ms Stepped Load Pulse
(Kickstart).
FIGURE 2-23: 160 ms Stepped Load Pulse
(Kickstart).
FIGURE 2-24: Output Thermal Shutdown
and Recovery.
VIN = 5V
ILOAD= MOSFET Load turned on such
that VOUT = (0.8 * VIN)
Time (4ms/div)
IIN
(500mA/div)
VIN
(2V/div)
VOUT
(1V/div)
VFAULT/
(5V/div)
ILIMIT = 1A
COUT= 1μF
S.C. to 500mA, 120ms pulse
ILIMIT = 1A
COUT = 1μF
Time (20ms/div)
IIN
(500mA/div)
VOUT
(2V/div)
VFAULT/
(5V/div) VIN = 5V
ILOAD= 500mA to
VIN
= 3.3V
ILOAD= 500mA to S.C.
to 500mA, 120ms pulse
ILIMIT
= 1A
COUT = 1μF
Time (40ms/div)
IIN
(1A/div)
VOUT
(2V/div)
VFAULT/
(5V/div)
MIC2039FYMT
VIN = 3.3V
ILOAD= 0A to 2A overload
(MOSFET, 85ms Stepped Load)
ILIMIT = 1A
COUT = 1μF
MIC2039FYMT
Time (20ms/div)
IIN
(1A/div)
VOUT
(2V/div)
VFAULT/
(5V/div)
VIN = 3.3V
ILOAD = 0A to 2A
overload (MOSFET,
160ms Stepped Load)
ILIMIT = 1A
COUT = 1μF
Time (40ms/div)
IIN
(1A/div)
VOUT
(2V/div)
VFAULT/
(5V/div)
MIC2039FYMT
VIN = 5V
ILOAD= 500mA to S.C. to 500mA
(MOSFET, 320ms Stepped Load)
ILIMIT = 1A
COUT = 1μF
Time (40ms/div)
IIN
(500mA/div)
VOUT
(2V/div)
VFAULT/
(5V/div)
2018 Microchip Technology Inc. DS20005540A-page 11
MIC2039
FIGURE 2-25: Output Thermal Shutdown
and Recovery (Kickstart).
FIGURE 2-26: 1.5A Ov er loa d Re sp on se .
FIGURE 2-27: 3A Over loa d Resp on se
(Kickstart).
FIGURE 2-28: Turn-On into 12% Overload
- 500 mA ILIMIT.
FIGURE 2-29: Turn-On into 25% Overload
- 1A ILIMIT.
FIGURE 2-30: Turn-On into Minimal
Overload - 1.5A ILIMIT.
VIN = 3.3V
ILOAD = 0A to 3A
overload (MOSFET,
500ms Stepped Load)
ILIMIT = 1A
COUT = 1μF
Time (100ms/div)
IIN
(1A/div)
VOUT
(2V/div)
VFAULT/
(5V/div)
MIC2039FYMT
VIN = 5V
ILOAD = 500mA
to 1.5A overload
ILIMIT = 1A
COUT = 1μF
Time (10ms/div)
IIN
(500mA/div)
VOUT
(2V/div)
VFAULT/
(5V/div)
VIN = 3.3V
ILOAD
= 0A to 3A
overload (MOSFET,
160ms Stepped Load)
Time (20ms/div)
IIN
(1A/div)
VOUT
(2V/div)
VFAULT/
(5V/div)
ILIMIT = 1A
COUT = 1μF
MIC2039FYMT
VIN = 5V
ILOAD = 560mA
(RLOAD = 8.9Ω)
ILIMIT = 1A
COUT = 1μF
Time (4ms/div)
IIN
(500mA/div)
VOUT
(2V/div)
VFAULT/
(5V/div)
VIN = 5V
ILOAD
= 1.25A (RLOAD = 4.0Ω)
ILIMIT = 1A
CIN = COUT = 1μF
Time (4ms/div)
IIN
(500mA/div)
VOUT
(2V/div)
VFAULT/
(5V/div)
VIN = 5V
ILOAD= 1.58A (RLOAD = 3.15Ω)
ILIMIT = 1.5A
CIN = COUT = 1μF
Time (4ms/div)
IIN
(500mA/div)
VOUT
(2V/div)
VFAULT/
(5V/div)
MIC2039
DS20005540A-page 12 2018 Microchip Technology Inc.
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1: PIN FUNCTION TABLE
Pin Number
SOT-23-6L Pin Number
Thin DFN Pin Name Description
16V
IN Input: Power switch and logic supply input.
2 5 GND Ground: Input and output return pin.
3 4 EN Enable (Input): Logic compatible, enable control input that allows
turn-on/off of the switch. Do not leave the EN pin floating.
4 3 FAULT/ Fault Status Flag (Output): Active-low, open-drain output. A
logic-low state indicates an overcurrent or thermal shutdown
condition. An overcurrent condition must last longer than tFAULT/ in
order to assert FAULT/. A pull-up resistor (10 k recommended) to
an external supply is required.
52I
LIMIT Current Limit Set: Current limit adjust setting. Connect a resistor
from this pin to GND to set the current limit, but do not leave the
ILIMIT pin floating.
61V
OUT Switch Output: Power switch output.
— EP ePad Exposed Pad: Exposed pad on bottom side of package. Connect to
electrical ground for optimum thermal dissipation.
2018 Microchip Technology Inc. DS20005540A-page 13
MIC2039
4.0 FUNCTIONAL DESCRIPTION
The MIC2039 is a high-side MOSFET power
distribution switch that provides increased system
reliability by using 5% current-limit accuracy. The
MIC2039 is internally current-limited and has thermal
shutdown, which protects the device and system.
The MIC2039 has a soft-start circuit that minimizes
inrush current by slowing the turn-on time. Additionally,
the MIC2039 has an optional kickstart feature, which
momentarily overrides the normal current-limiting
function to allow higher inrush and/or transient
currents.
4.1 Soft-Start
Soft-start reduces the power supply input surge current
at startup by controlling the output voltage rise time.
The input surge appears while the output capacitor is
charged up. A slower output rise time draws a lower
input surge current.
4.2 Kickstart Inrush Overcurrent Filter
The MIC2039EYxx and MIC2039FYxx are equipped
with a secondary current-limit that allows high inrush
current transients to pass for a set period before the
primary current-limit circuitry becomes active. The
FAULT/ status flag does not assert during the kickstart
period (typically 120 ms), which eliminates any false
(FAULT/) assertions. The kickstart function is active
during initial startup or while operating in steady state.
4.3 Input Capacitor
A 1 µF to 100 µF ceramic input capacitor is
recommended for most applications. Place the input
capacitor on the same side of the board and next to the
MIC2039 to minimize the voltage ringing during
transient and short-circuit conditions. Using two vias for
each end of the capacitor to connect to the power and
ground plane is also recommended.
An X7R or X5R dielectric ceramic capacitors is
recommended because of their temperature
performance. X7R-type capacitors change capacitance
by 15% over their operating temperature range and are
the most stable type of ceramic capacitors. Z5U and
Y5V dielectric capacitors change value by as much as
50% and 60%, respectively, over their operating
temperature ranges. To use a ceramic chip capacitor
with Y5V dielectric, the value must be much higher than
an X7R ceramic or a tantalum capacitor to ensure the
same capacitance value over the operating
temperature range.
4.4 Output Capacitor
The output capacitor type and placement criteria are
the same as the input capacitor.
The exact amount of capacitance depends upon the
specific application. For example, USB applications will
typically use 150 µF, whereas local consumers, such
as microcontrollers, may require as little as 1 µF.
Care must be taken when choosing the output
capacitance for inductive loads. Without sufficient
capacitance or clamping devices, sudden disconnects
or shorts on VOUT can result in stresses beyond the
device's absolute maximum ratings, even for short
cables, which will damage the device.
4.5 Enable
The MIC2039 offers either an active-high or active-low
enable input (EN) that allows ON/OFF control of the
switch output. The current through the device reduces
to near zero when the device is shut down, with only
microamperes of leakage current. The EN input can be
directly tied to VIN or driven by a voltage that is equal to
or less than VIN. Do not leave this pin floating.
Care should be taken to ensure that the EN pin does
not exceed VIN by more than 500 mV at any time. This
includes at power-up and during load transients.
Whenever possible, it is recommended to tie EN to VIN
through a pull-up resistor and use an open-drain or
open-collector device to change the state.
4.6 Adjustable Current-Limit
The MIC2039 current-limit is adjustable from 0.2A to
2.5A by connecting a resistor from the ILIMIT pin to
GND. The following equation determines the resistor:
EQUATION 4-1:
If the output current exceeds the set current-limit, the
MIC2039 switch enters constant current-limit mode.
The maximum allowable current-limit can be less than
the full specified and/or expected current if the
MIC2039 is not mounted on a circuit board with
sufficiently low thermal resistance. Ta b l e 4 - 1 shows
resistor values (1%) for select current-limit settings.
TABLE 4-1: RESISTOR SELECTION FOR
ADJUSTABLE
CURRENT-LIMIT
ILIMIT 0.2A 0.5A 1.0A 2.0A 2.5A
RLIMIT 1.45 k576287145115
RLIMIT 289
ILIMIT
---------------
Where:
ILIMIT Typical current-limit from
Electrical Characteristics table.
MIC2039
DS20005540A-page 14 2018 Microchip Technology Inc.
4.7 Thermal Design
To help reduce the thermal resistance, the ePad
(underneath the IC) should be soldered to the PCB
ground. The placement of thermal vias either
underneath or near the ePad is highly recommended.
Thermal design requires the following
application-specific parameters:
• Maximum ambient temperature (TA)
• Output current (IOUT)
• Input voltage (VIN)
• Current Limit (ILIMIT)
When the MIC2039 is in constant current-limit mode, it
may exceed the overtemperature threshold. If this
occurs, the overtemperature condition will shut down
the MIC2039 switch and the fault status flag will go
active (assert low). After the switch cools down, it will
turn on again. The user can maximize the MIC2039
power dissipation by either lowering the thermal
resistance on the exposed pad (only the DFN package
has an exposed pad) on the printed circuit board, or by
limiting the maximum allowable ambient temperature.
4.8 Thermal Measurements
It is always wise to measure the IC’s case temperature
to make sure that it is within its operating limits.
Although this might seem like an elementary task, it is
very easy to get false results. The most common
mistake is to use the standard thermal couple that
comes with the thermal voltage meter. This thermal
couple wire gauge is large, typically 22 gauge, and
behaves like a heatsink, resulting in a lower case
measurement.
There are two suggested methods for measuring the IC
case temperature: a thermal couple or an infrared
thermometer. If a thermal couple is used, it must be
constructed of 36 gauge wire or higher to minimize the
wire heatsinking effect. In addition, the thermal couple
tip must be covered in either thermal grease or thermal
glue to make sure that the thermal couple junction is
making good contact to the case of the IC. Thermal
couple 5SC TT-K-36-36 from Omega is adequate for
most applications.
To avoid using messy thermal couple grease or glue,
an infrared thermometer is recommended. Most
infrared thermometers’ spot size is too large for an
accurate reading on small form factor ICs. However, an
IR thermometer from Optris has a 1 mm spot size,
which makes it ideal for the 2 mm x 2 mm thin DFN
package. Also, get the optional stand. The stand makes
it easy to hold the beam on the IC for long periods of
time.
2018 Microchip Technology Inc. DS20005540A-page 15
MIC2039
5.0 TIMING DIAGRAMS
FIGURE 5-1: Output Rise/Fall Time.
FIGURE 5-2: Turn-On/Off Delay.
0
0
tRISE
tFALL
t
V
10%
10%
90% 90%
VOUT
EN
0
0
t
ON_DLY
t
OFF_DELAY
t
V
10%
50% 50%
90%
VOUT
EN
MIC2039
DS20005540A-page 16 2018 Microchip Technology Inc.
FIGURE 5-3: Short-Circuit Response Time and Overcurrent Fault Flag Delay (Non-Kickstart).
FIGURE 5-4: Overcurrent Fault Flag Delay (Kickstart).
IOUT
FAULT/
0
0
t
SC_RESP
t
FAULT/
t
V
VOUT
0
I
LIMIT
IOUT
FAULT/
0
0
t
KICKSTART
t
V
VOUT
0
I
LIMIT
2018 Microchip Technology Inc. DS20005540A-page 17
MIC2039
6.0 PACKAGING INFORMATION
6.1 Package Marking Information
6-Pin SOT-23* Example
6-Pin TDFN* Example
XXXX
XXX
NNN
NNN
39AA
943
3A5
668
Legend: XX...X Product code or customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
, , Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar () symbol may not be to scale.
3
e
3
e
MIC2039
DS20005540A-page 18 2018 Microchip Technology Inc.
6-Lead TDFN 2 mm x 2 mm Package Outline and Recommended Land Pattern
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2018 Microchip Technology Inc. DS20005540A-page 19
MIC2039
6-Lead SOT-23 Package Outline and Recommended Land Pattern
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
MIC2039
DS20005540A-page 20 2018 Microchip Technology Inc.
NOTES:
2018 Microchip Technology Inc. DS20005540A-page 21
MIC2039
APPENDIX A: REVISION HISTOR Y
Revision A (March 2018)
• Converted Micrel document MIC2039 to Micro-
chip data sheet DS20005540A.
• Minor text changes throughout.
• Value for C1 corrected in Typical Application Cir-
cuit.
MIC2039
DS20005540A-page 22 2018 Microchip Technology Inc.
NOTES:
2018 Microchip Technology Inc. DS20005540A-page 23
MIC2039
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
Examples:
a) MIC2039AYM6-T5: High-Accuracy, High-Side,
Adjustable Current-Limit
Power Switch, Active-High
Enable, –40°C to +125°C
Temp. Range, SOT-23-6L
Package, 500/Reel
b) MIC2039BYM6-TR: High-Accuracy, High-Side,
Adjustable Current-Limit
Power Switch, Active-Low
Enable, –40°C to +125°C
Temp. Range, SOT-23-6L
Package, 3,000/Reel
c) MIC2039AYMT-TR: High-Accuracy, High-Side,
Adjustable Current-Limit
Power Switch, Active-High
Enable, –40°C to +125°C
Temp. Range, 6-Lead TDFN
Package, 3,000/Reel
d) MIC2039BYMT-T5: High-Accuracy, High-Side,
Adjustable Current-Limit
Power Switch, Active-Low
Enable, –40°C to +125°C
Temp. Range, 6-Lead TDFN
Package, 500/Reel
e) MIC2039EYM6-T5: High-Accuracy, High-Side,
Adjustable Current-Limit
Power Switch, Active-High
Enable with Kickstart, –40°C
to +125°C Temp. Range,
SOT-23-6L Package, 500/
Reel
f) MIC2039FYM6-TR: High-Accuracy, High-Side,
Adjustable Current-Limit
Power Switch, Active-Low
Enable with Kickstart, –40°C
to +125°C Temp. Range,
SOT-23-6L Package, 3,000/
Reel
g) MIC2039EYMT-TR: High-Accuracy, High-Side,
Adjustable Current-Limit
Power Switch, Active-High
Enable with Kickstart, –40°C
to +125°C Temp. Range,
6-Lead TDFN Package,
3,000/Reel
h) MIC2039FYMT-T5: High-Accuracy, High-Side,
Adjustable Current-Limit
Power Switch, Active-Low
Enable with Kickstart, –40°C
to +125°C Temp. Range,
6-Lead TDFN Package, 500/
Reel
PART NO. XX
Package
Device
Device: MIC2039: High-Accuracy, High-Side, Adjustable Cur-
rent-Limit Power Switch
Enable: A = Active-High
B = Active-Low
E = Active-High with Kickstart
F = Active-Low with Kickstart
Temperature: Y = –40°C to +125°C
Package: M6 = SOT-23-6L
MT = 6-Lead 2 mm x 2 mm TDFN (Note 1)
Media Type: T5 = 500/Reel
TR = 3,000/Reel
X
Enable
X
Temperature
Note 1: Thin DFN is a GREEN RoHS-compliant package. Lead finish is
NiPdAu. Mold compound is Halogen Free.
Note 1: Tape and Reel identifier only appears in the
catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the
Tape and Reel option.
–XX
Media
Type
MIC2039
DS20005540A-page 24 2018 Microchip Technology Inc.
NOTES:
2018 Microchip Technology Inc. DS20005540A-page 25
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, AVR,
AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory,
CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ,
KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus,
maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip
Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST
Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
and other countries.
ClockWorks, The Embedded Control Solutions Company,
EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,
mTouch, Precision Edge, and Quiet-Wire are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo,
CodeGuard, CryptoAuthentication, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, Inter-Chip Connectivity, JitterBlocker,
KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF,
MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple
Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI,
SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC,
USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and
ZENA are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
Silicon Storage Technology is a registered trademark of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip Technology
Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2018, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-2798-8
Note the following deta ils of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certif ication for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, micro perip hera ls, n onvolat ile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITYMANAGEMENTS
YSTEM
CERTIFIEDBYDNV
== ISO/TS16949==
DS20005540A-page 26 2018 Microchip Technology Inc.
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10/25/17