MIC2039 High-Accuracy, High-Side, Adjustable Current-Limit Power Switch Features General Description * 5% Current-Limit Accuracy * Input Supply Range from 2.5V to 5.5V * Low Quiescent Current: 100 A Typical (Switch ON) * 75 m Typical RDS(ON) at 5V * 0.2A to 2.5A Adjustable Output Current * Kickstart: Momentary Secondary Current-Limit Threshold (120 ms period) * Soft-Start Functionality * Undervoltage Lockout (UVLO) * Fast 10 s Short-Circuit Response Time (Non-Kickstart Options) * Fault Status Output Flag * Logic Controlled Enable (Active-High, Active-Low) * Thermal Shutdown * Pin Compatible with MIC2009/MIC2019 * 6-Pin 2 mm x 2 mm Thin DFN and 6-Pin SOT-23 Packages * Junction Temperature Range from -40C to +125C The MIC2039 is a high-side MOSFET power distribution switch that provides increased system reliability by using 5% current-limit accuracy. Applications The MIC2039 is available in 6-pin SOT-23 and 6-pin 2 mm x 2 mm thin DFN packages. The MIC2039 has an operating junction temperature range of -40C to +125C. * * * * USB Peripherals and USB 2.0/3.0-Compatible DTV/STB Notebooks and Consumer Electronics General Purpose Power Distribution The MIC2039 has an operating input voltage range from 2.5V to 5.5V, is internally current-limited, and has thermal shutdown to protect the device and system. The MIC2039 is offered with either active-high or active-low logic level enable input controls. It has an open drain fault status output flag with a built-in 32 ms delay that asserts low during overcurrent or thermal-shutdown conditions. The MIC2039 features an adjustable output current limit that is resistor-programmable from 0.2A to 2.5A. The MIC2039 also offers a unique, kickstart feature that allows momentary high-current surges up to the secondary current limit (ILIMIT_2nd) during startup or while operating in steady-state. This is useful for charging loads with high inrush currents, such as capacitors. After an overcurrent condition is established, these switches enter into a constant current-limit mode unless the die temperature exceeds the thermal-shutdown specification. Package Types MIC2039 SOT-23-6 (M6) MIC2039 2x2 TDFN (MT) (Note 1) VIN 1 6 VOUT GND 2 5 ILIMIT EN 3 4 VOUT 1 ILIMIT 2 FAULT/ 3 EP 6 VIN 5 GND 4 EN FAULT/ Note 1: Thin DFN = Pin 1 identifier. 2018 Microchip Technology Inc. DS20005540A-page 1 MIC2039 Typical Application Circuit MIC2039 SOT-23-6 MIC2039-AYM6 VIN 5V C1 47F 6.3V R1 1K VIN VOUT EN ILIMIT FAULT/ VOUT 5V/1A C2 100F 6.3V R2 287 GND Functional Block Diagram POWER FET VIN VOUT SENSE FET UVLO THERMAL SENSOR CURRENT LIMIT DELAY FAULT / EN CONTROL REFERENCE ILIMIT DS20005540A-page 2 GND 2018 Microchip Technology Inc. MIC2039 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings VIN to GND................................................................................................................................................... -0.3V to +6V VOUT to GND..................................................................................................................................................-0.3V to VIN VILIMIT to GND.................................................................................................................................... -0.3V to VIN + 0.3V VEN to GND....................................................................................................................................................-0.3V to VIN VFAULT/ to GND .................................................................................................................................. -0.3V to VIN + 0.3V FAULT/ Current (IFAULT/) .........................................................................................................................................25 mA Maximum Power Dissipation (PD).......................................................................................................... Internally Limited ESD Rating (HBM) (Note 1) ....................................................................................................................................... 3 kV ESD Rating (MM) (Note 1) ........................................................................................................................................300V Operating Ratings Supply Voltage (VIN) ................................................................................................................................. +2.5V to +5.5V VEN .................................................................................................................................................................-0.3V to VIN VFAULT/ ...................................................................................................................................................... -0.3V to +5.5V VILIMIT, VOUT ..................................................................................................................................................-0.3V to VIN Notice: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. Notice: The device is not guaranteed to function outside its operating ratings. Note 1: Devices are ESD sensitive. Handling precautions are recommended. Human body model, 1.5 k in series with 100 pF. 2018 Microchip Technology Inc. DS20005540A-page 3 MIC2039 TABLE 1-1: ELECTRICAL CHARACTERISTICS Electrical Characteristics: VIN = VEN = 5V, CIN = 1 F; TJ = +25C, unless noted. Bold values indicate -40C TJ +125C. (Note 1). Symbol Parameters Min. Typ. Max. Units Conditions V -- Power Supply Input VIN Input Voltage Range 2.5 -- 5.5 VUVLO Input Supply Undervoltage Lockout Threshold 2.0 2.25 2.5 1.9 2.15 2.4 VUVLOHYS Input Supply Undervoltage Lockout Threshold Hysteresis -- 100 -- -- IDD 0.75 5 V mV A Supply Current -- 100 300 -- 100 177 -- 85 145 -- 75 125 0.22 15 A VIN rising VIN falling VIN rising or VIN falling Switch OFF; Active-High Enable (A): VEN = 0V, VIN = 5V, IOUT = 0A Switch OFF; Active-Low Enable (B): VEN = 1.5V, VIN = 5V, IOUT = 0A Switch ON; Active-High Enable (A): VEN = 1.5V, VIN = 5V, IOUT = 0A Switch ON; Active-Low Enable (B): VEN = 0V, VIN = 5V, IOUT = 0A Power MOSFET RDS(ON) Switch On-Resistance ILKG Output Leakage Current VIN = 2.5V, IOUT = 350 mA m VIN = 3.3V, IOUT = 350 mA VIN = 5V, IOUT = 350 mA A Switch OFF, VOUT = 0V Current Limit ILIMIT ILIMIT_2ND Note 1: 2: 3: Current Limit (Resistor Values are Standard 0.1% Values) Secondary Current Limit (Kickstart parts only) 2.35 2.5 2.65 1.90 2.0 2.10 RLIMIT = 115, VIN = 5V, VOUT = 0.8V x VIN RLIMIT = 115, VIN = 2.5V, VOUT = 0V A RLIMIT = 145, VIN = 5V, VOUT = 0.8V x VIN 0.95 1.0 1.05 RLIMIT = 287, VIN = 5V, VOUT = 0.8V x VIN 0.475 0.50 0.525 RLIMIT = 576, VIN = 5V, VOUT = 0.8V x VIN 0.19 0.20 0.21 RLIMIT = 1.45 k, VIN = 5V, VOUT = 0.8V x VIN 2.2 3.2 6.0 A VOUT = 0V Specification for packaged product only. See Timing Diagrams. For dynamic current loads faster than typically 30 mA/ms. Slower current loads will delay the deactivation of VOUT and the current limitation, allowing FAULT/ to be asserted before these. DS20005540A-page 4 2018 Microchip Technology Inc. MIC2039 TABLE 1-1: ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Characteristics: VIN = VEN = 5V, CIN = 1 F; TJ = +25C, unless noted. Bold values indicate -40C TJ +125C. (Note 1). Symbol Parameters Min. Typ. Max. -- -- 0.5 1.5 -- -- Units Conditions I/O V Logic-Low VEN Enable Voltage IEN Enable Input Current -- 1 -- A 0V VEN 5V RFAULT/ FAULT/ Output Resistance -- -- 25 IOUT = 10 mA IFAULT/_OFF FAULT/ Off Current -- -- 10 A VFAULT/ = VIN Logic-High Thermal Protection TSD Thermal Shutdown Threshold -- 157 -- C TJ rising TSDHYS Thermal Shutdown Hysteresis -- 15 -- C -- Timing Specifications (AC Parameters) tRISE Output Turn-On Rise Time (Note 2) -- 700 -- s RLOAD = 10; COUT = 1 F tFALL Output Turn-Off Fall Time (Note 2) -- 32 -- s VEN = OFF; RLOAD = 10; COUT = 1 F tON_DLY Output Turn-On Delay (Note 2) -- 700 -- s RLOAD = 10; COUT = 1 F tOFF_DLY Output Turn-Off Delay (Note 2) -- 5 -- s RLOAD = 10; COUT = 1 F tSC_RESP Short Circuit Response Time (Note 2, Note 3) -- 10 -- s VOUT = 0V (short-circuit) tFAULT/ Overcurrent Fault Response Delay Time (Note 2, Note 3) 16 32 49 ms Non-kickstart parts. tKICKSTART Overcurrent Fault Response Delay During Kickstart (Note 2) 64 120 200 ms Kickstart parts only. Note 1: 2: 3: Specification for packaged product only. See Timing Diagrams. For dynamic current loads faster than typically 30 mA/ms. Slower current loads will delay the deactivation of VOUT and the current limitation, allowing FAULT/ to be asserted before these. 2018 Microchip Technology Inc. DS20005540A-page 5 MIC2039 TEMPERATURE SPECIFICATIONS Parameters Sym. Min. Typ. Max. Units Conditions Junction Operating Temperature Range TJ -40 -- +125 C Storage Temperature Range TS -65 -- +150 C -- Lead Temperature -- -- -- +260 C Soldering, 10s Thermal Resistance SOT-23-6 JA -- 177.2 -- C/W -- Thermal Resistance 6-pin 2 mm x 2 mm Thin DFN JA -- 90 -- C/W -- Temperature Ranges Note 1 Package Thermal Resistances Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +125C rating. Sustained junction temperatures above +125C can impact the device reliability. DS20005540A-page 6 2018 Microchip Technology Inc. MIC2039 2.0 Note: TYPICAL PERFORMANCE CURVES The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. FIGURE 2-1: Temperature. Input Supply Current vs. FIGURE 2-4: RDS(ON) vs. Temperature. FIGURE 2-2: Temperature. VIN OFF Current vs. FIGURE 2-5: RDS(ON) vs. Temperature. FIGURE 2-3: Temperature. Undervoltage Lockout vs. FIGURE 2-6: RDS(ON) vs. Output Current. 2018 Microchip Technology Inc. DS20005540A-page 7 MIC2039 FIGURE 2-7: Temperature. FAULT/ Response Time vs. FIGURE 2-10: Temperature. Output Leakage Current vs. FIGURE 2-8: Temperature. FAULT/ Response Time vs. FIGURE 2-11: Current. VIN - VOUT vs. Output FIGURE 2-9: Output Current. FAULT/ Response Time vs. FIGURE 2-12: Current Limit Set Resistor vs. Output Current. DS20005540A-page 8 2018 Microchip Technology Inc. MIC2039 VIN = 5V ILOAD= 250mA ILIMIT = 1A COUT = 1F VIN (2V/div) VOUT (2V/div) VEN (5V/div) VOUT (2V/div) IIN (100mA/div) IIN (500mA/div) Time (2ms/div) FIGURE 2-13: Soft-Start Turn-On. VIN = 5V ILOAD= 250mA ILIMIT = 1A COUT = 1F MIC2039AYM6 Time (100s/div) FIGURE 2-16: Enable Turn-Off. VEN (5V/div) VOUT (500mV/div) VIN (2V/div) VOUT (2V/div) VIN = 5V ILOAD= 250mA ILIMIT = 1A COUT = 1F IIN (500mA/div) VFAULT/ (5V/div) IIN (500mA/div) Time (4ms/div) FIGURE 2-14: Soft-Start Turn-Off. VEN (5V/div) VIN = 5V ILOAD= 250mA ILIMIT = 1A COUT = 1F MIC2039AYM6 VOUT (2V/div) IIN (200mA/div) Time (4ms/div) FIGURE 2-17: VEN (5V/div) VOUT (500mV/div) VFAULT/ (5V/div) Turn-On Into Short-Circuit. VIN = 5V ILOAD= Short Circuit ILIMIT = 1A CIN = 1F COUT = 1F MIC2039FYMT IIN (1A/div) Time (200s/div) FIGURE 2-15: VIN = 5V ILOAD= Short Circuit ILIMIT = 1A COUT = 1F Enable Turn-On. 2018 Microchip Technology Inc. Time (40ms/div) FIGURE 2-18: (Kickstart). Turn-On Into Short DS20005540A-page 9 MIC2039 VFAULT/ (5V/div) VOUT (1V/div) VIN (2V/div) IIN (500mA/div) VIN = 5V ILOAD= MOSFET Load turned on such that VOUT = (0.8 * VIN) ILIMIT = 1A COUT= 1F VOUT (2V/div) VFAULT/ (5V/div) Current-Limit Response. IIN (500mA/div) Time (20ms/div) FIGURE 2-22: (Kickstart). VOUT (2V/div) VFAULT/ (5V/div) VOUT (2V/div) VFAULT/ (5V/div) VIN = 5V ILOAD= 500mA to S.C. to 500mA, 120ms pulse ILIMIT = 1A COUT = 1F IIN (1A/div) VOUT (2V/div) VFAULT/ (5V/div) IIN (1A/div) Output Recovery from FIGURE 2-23: (Kickstart). VOUT (2V/div) VIN = 3.3V ILOAD= 500mA to S.C. to 500mA, 120ms pulse ILIMIT = 1A COUT = 1F MIC2039FYMT DS20005540A-page 10 VIN = 3.3V ILOAD = 0A to 2A overload (MOSFET, 160ms Stepped Load) ILIMIT = 1A COUT = 1F MIC2039FYMT 160 ms Stepped Load Pulse VIN = 5V ILOAD= 500mA to S.C. to 500mA (MOSFET, 320ms Stepped Load) ILIMIT = 1A COUT = 1F VFAULT/ (5V/div) IIN (500mA/div) Time (40ms/div) Time (40ms/div) FIGURE 2-21: Output Recovery from Short-Circuit (Kickstart). 85 ms Stepped Load Pulse Time (40ms/div) Time (20ms/div) FIGURE 2-20: Short-Circuit. ILIMIT = 1A COUT = 1F MIC2039FYMT IIN (1A/div) Time (4ms/div) FIGURE 2-19: VIN = 3.3V ILOAD= 0A to 2A overload (MOSFET, 85ms Stepped Load) FIGURE 2-24: and Recovery. Output Thermal Shutdown 2018 Microchip Technology Inc. MIC2039 VFAULT/ (5V/div) VOUT (2V/div) VFAULT/ (5V/div) VIN = 3.3V ILOAD = 0A to 3A overload (MOSFET, 500ms Stepped Load) ILIMIT = 1A COUT = 1F IIN (1A/div) MIC2039FYMT VOUT (2V/div) IIN (500mA/div) Time (4ms/div) Time (100ms/div) FIGURE 2-25: Output Thermal Shutdown and Recovery (Kickstart). FIGURE 2-28: - 500 mA ILIMIT. VFAULT/ (5V/div) VOUT (2V/div) VIN = 5V ILOAD = 500mA to 1.5A overload ILIMIT = 1A COUT = 1F IIN (500mA/div) IIN (500mA/div) 1.5A Overload Response. VIN = 5V ILOAD = 1.25A (RLOAD = 4.0) ILIMIT = 1A CIN = COUT = 1F Time (4ms/div) Time (10ms/div) FIGURE 2-29: - 1A ILIMIT. Turn-On into 25% Overload VFAULT/ (5V/div) VOUT (2V/div) VFAULT/ (5V/div) VIN = 3.3V ILOAD = 0A to 3A overload (MOSFET, 160ms Stepped Load) ILIMIT = 1A COUT = 1F MIC2039FYMT IIN (1A/div) Time (20ms/div) FIGURE 2-27: (Kickstart). Turn-On into 12% Overload VFAULT/ (5V/div) VOUT (2V/div) FIGURE 2-26: VIN = 5V ILOAD = 560mA (RLOAD = 8.9) ILIMIT = 1A COUT = 1F 3A Overload Response 2018 Microchip Technology Inc. VOUT (2V/div) IIN (500mA/div) VIN = 5V ILOAD= 1.58A (RLOAD = 3.15) ILIMIT = 1.5A CIN = COUT = 1F Time (4ms/div) FIGURE 2-30: Turn-On into Minimal Overload - 1.5A ILIMIT. DS20005540A-page 11 MIC2039 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE Pin Number SOT-23-6L Pin Number Thin DFN Pin Name 1 6 VIN 2 5 GND 3 4 EN 4 3 FAULT/ 5 2 ILIMIT 6 1 VOUT Switch Output: Power switch output. -- EP ePad Exposed Pad: Exposed pad on bottom side of package. Connect to electrical ground for optimum thermal dissipation. DS20005540A-page 12 Description Input: Power switch and logic supply input. Ground: Input and output return pin. Enable (Input): Logic compatible, enable control input that allows turn-on/off of the switch. Do not leave the EN pin floating. Fault Status Flag (Output): Active-low, open-drain output. A logic-low state indicates an overcurrent or thermal shutdown condition. An overcurrent condition must last longer than tFAULT/ in order to assert FAULT/. A pull-up resistor (10 k recommended) to an external supply is required. Current Limit Set: Current limit adjust setting. Connect a resistor from this pin to GND to set the current limit, but do not leave the ILIMIT pin floating. 2018 Microchip Technology Inc. MIC2039 4.0 FUNCTIONAL DESCRIPTION The MIC2039 is a high-side MOSFET power distribution switch that provides increased system reliability by using 5% current-limit accuracy. The MIC2039 is internally current-limited and has thermal shutdown, which protects the device and system. The MIC2039 has a soft-start circuit that minimizes inrush current by slowing the turn-on time. Additionally, the MIC2039 has an optional kickstart feature, which momentarily overrides the normal current-limiting function to allow higher inrush and/or transient currents. 4.1 Kickstart Inrush Overcurrent Filter The MIC2039EYxx and MIC2039FYxx are equipped with a secondary current-limit that allows high inrush current transients to pass for a set period before the primary current-limit circuitry becomes active. The FAULT/ status flag does not assert during the kickstart period (typically 120 ms), which eliminates any false (FAULT/) assertions. The kickstart function is active during initial startup or while operating in steady state. The output capacitor type and placement criteria are the same as the input capacitor. The exact amount of capacitance depends upon the specific application. For example, USB applications will typically use 150 F, whereas local consumers, such as microcontrollers, may require as little as 1 F. Care must be taken when choosing the output capacitance for inductive loads. Without sufficient capacitance or clamping devices, sudden disconnects or shorts on VOUT can result in stresses beyond the device's absolute maximum ratings, even for short cables, which will damage the device. 4.5 Input Capacitor A 1 F to 100 F ceramic input capacitor is recommended for most applications. Place the input capacitor on the same side of the board and next to the MIC2039 to minimize the voltage ringing during transient and short-circuit conditions. Using two vias for each end of the capacitor to connect to the power and ground plane is also recommended. An X7R or X5R dielectric ceramic capacitors is recommended because of their temperature performance. X7R-type capacitors change capacitance by 15% over their operating temperature range and are the most stable type of ceramic capacitors. Z5U and Y5V dielectric capacitors change value by as much as 50% and 60%, respectively, over their operating temperature ranges. To use a ceramic chip capacitor with Y5V dielectric, the value must be much higher than an X7R ceramic or a tantalum capacitor to ensure the same capacitance value over the operating temperature range. Enable The MIC2039 offers either an active-high or active-low enable input (EN) that allows ON/OFF control of the switch output. The current through the device reduces to near zero when the device is shut down, with only microamperes of leakage current. The EN input can be directly tied to VIN or driven by a voltage that is equal to or less than VIN. Do not leave this pin floating. Care should be taken to ensure that the EN pin does not exceed VIN by more than 500 mV at any time. This includes at power-up and during load transients. Whenever possible, it is recommended to tie EN to VIN through a pull-up resistor and use an open-drain or open-collector device to change the state. 4.6 4.3 Output Capacitor Soft-Start Soft-start reduces the power supply input surge current at startup by controlling the output voltage rise time. The input surge appears while the output capacitor is charged up. A slower output rise time draws a lower input surge current. 4.2 4.4 Adjustable Current-Limit The MIC2039 current-limit is adjustable from 0.2A to 2.5A by connecting a resistor from the ILIMIT pin to GND. The following equation determines the resistor: EQUATION 4-1: 289 R LIMIT --------------I LIMIT Where: Typical current-limit from Electrical Characteristics table. ILIMIT If the output current exceeds the set current-limit, the MIC2039 switch enters constant current-limit mode. The maximum allowable current-limit can be less than the full specified and/or expected current if the MIC2039 is not mounted on a circuit board with sufficiently low thermal resistance. Table 4-1 shows resistor values (1%) for select current-limit settings. TABLE 4-1: ILIMIT 0.2A RLIMIT 1.45 k 2018 Microchip Technology Inc. RESISTOR SELECTION FOR ADJUSTABLE CURRENT-LIMIT 0.5A 1.0A 2.0A 2.5A 576 287 145 115 DS20005540A-page 13 MIC2039 4.7 Thermal Design To help reduce the thermal resistance, the ePad (underneath the IC) should be soldered to the PCB ground. The placement of thermal vias either underneath or near the ePad is highly recommended. Thermal design requires the following application-specific parameters: * * * * Maximum ambient temperature (TA) Output current (IOUT) Input voltage (VIN) Current Limit (ILIMIT) When the MIC2039 is in constant current-limit mode, it may exceed the overtemperature threshold. If this occurs, the overtemperature condition will shut down the MIC2039 switch and the fault status flag will go active (assert low). After the switch cools down, it will turn on again. The user can maximize the MIC2039 power dissipation by either lowering the thermal resistance on the exposed pad (only the DFN package has an exposed pad) on the printed circuit board, or by limiting the maximum allowable ambient temperature. DS20005540A-page 14 4.8 Thermal Measurements It is always wise to measure the IC's case temperature to make sure that it is within its operating limits. Although this might seem like an elementary task, it is very easy to get false results. The most common mistake is to use the standard thermal couple that comes with the thermal voltage meter. This thermal couple wire gauge is large, typically 22 gauge, and behaves like a heatsink, resulting in a lower case measurement. There are two suggested methods for measuring the IC case temperature: a thermal couple or an infrared thermometer. If a thermal couple is used, it must be constructed of 36 gauge wire or higher to minimize the wire heatsinking effect. In addition, the thermal couple tip must be covered in either thermal grease or thermal glue to make sure that the thermal couple junction is making good contact to the case of the IC. Thermal couple 5SC TT-K-36-36 from Omega is adequate for most applications. To avoid using messy thermal couple grease or glue, an infrared thermometer is recommended. Most infrared thermometers' spot size is too large for an accurate reading on small form factor ICs. However, an IR thermometer from Optris has a 1 mm spot size, which makes it ideal for the 2 mm x 2 mm thin DFN package. Also, get the optional stand. The stand makes it easy to hold the beam on the IC for long periods of time. 2018 Microchip Technology Inc. MIC2039 5.0 TIMING DIAGRAMS V EN 0 tFALL tRISE 90% VOUT 90% 10% 10% 0 t FIGURE 5-1: Output Rise/Fall Time. V 50% 50% EN 0 tON_DLY tOFF_DELAY 90% 10% VOUT 0 t FIGURE 5-2: Turn-On/Off Delay. 2018 Microchip Technology Inc. DS20005540A-page 15 MIC2039 V FAULT/ 0 tFAULT/ VOUT 0 tSC_RESP ILIMIT IOUT 0 FIGURE 5-3: t Short-Circuit Response Time and Overcurrent Fault Flag Delay (Non-Kickstart). V FAULT/ 0 VOUT 0 tKICKSTART ILIMIT IOUT 0 FIGURE 5-4: DS20005540A-page 16 t Overcurrent Fault Flag Delay (Kickstart). 2018 Microchip Technology Inc. MIC2039 6.0 PACKAGING INFORMATION 6.1 Package Marking Information 6-Pin SOT-23* Example XXXX NNN 39AA 943 6-Pin TDFN* Example XXX NNN Legend: XX...X Y YY WW NNN e3 * 3A5 668 Product code or customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week `01') Alphanumeric traceability code Pb-free JEDEC(R) designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. , , Pin one index is identified by a dot, delta up, or delta down (triangle mark). Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. Package may or may not include the corporate logo. Underbar (_) and/or Overbar () symbol may not be to scale. 2018 Microchip Technology Inc. DS20005540A-page 17 MIC2039 6-Lead TDFN 2 mm x 2 mm Package Outline and Recommended Land Pattern Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20005540A-page 18 2018 Microchip Technology Inc. MIC2039 6-Lead SOT-23 Package Outline and Recommended Land Pattern Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2018 Microchip Technology Inc. DS20005540A-page 19 MIC2039 NOTES: DS20005540A-page 20 2018 Microchip Technology Inc. MIC2039 APPENDIX A: REVISION HISTORY Revision A (March 2018) * Converted Micrel document MIC2039 to Microchip data sheet DS20005540A. * Minor text changes throughout. * Value for C1 corrected in Typical Application Circuit. 2018 Microchip Technology Inc. DS20005540A-page 21 MIC2039 NOTES: DS20005540A-page 22 2018 Microchip Technology Inc. MIC2039 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office. PART NO. Device Examples: X X XX Enable Temperature Package -XX Device: MIC2039: Enable: A B E F = = = = Active-High Active-Low Active-High with Kickstart Active-Low with Kickstart Temperature: Y = -40C to +125C Package: M6 = MT = SOT-23-6L 6-Lead 2 mm x 2 mm TDFN (Note 1) Media Type: T5 TR 500/Reel 3,000/Reel Note 1: = = a) MIC2039AYM6-T5: High-Accuracy, High-Side, Adjustable Current-Limit Power Switch, Active-High Enable, -40C to +125C Temp. Range, SOT-23-6L Package, 500/Reel b) MIC2039BYM6-TR: High-Accuracy, High-Side, Adjustable Current-Limit Power Switch, Active-Low Enable, -40C to +125C Temp. Range, SOT-23-6L Package, 3,000/Reel c) MIC2039AYMT-TR: High-Accuracy, High-Side, Adjustable Current-Limit Power Switch, Active-High Enable, -40C to +125C Temp. Range, 6-Lead TDFN Package, 3,000/Reel d) MIC2039BYMT-T5: High-Accuracy, High-Side, Adjustable Current-Limit Power Switch, Active-Low Enable, -40C to +125C Temp. Range, 6-Lead TDFN Package, 500/Reel e) MIC2039EYM6-T5: High-Accuracy, High-Side, Adjustable Current-Limit Power Switch, Active-High Enable with Kickstart, -40C to +125C Temp. Range, SOT-23-6L Package, 500/ Reel f) MIC2039FYM6-TR: High-Accuracy, High-Side, Adjustable Current-Limit Power Switch, Active-Low Enable with Kickstart, -40C to +125C Temp. Range, SOT-23-6L Package, 3,000/ Reel g) MIC2039EYMT-TR: High-Accuracy, High-Side, Adjustable Current-Limit Power Switch, Active-High Enable with Kickstart, -40C to +125C Temp. Range, 6-Lead TDFN Package, 3,000/Reel h) MIC2039FYMT-T5: High-Accuracy, High-Side, Adjustable Current-Limit Power Switch, Active-Low Enable with Kickstart, -40C to +125C Temp. Range, 6-Lead TDFN Package, 500/ Reel Media Type High-Accuracy, High-Side, Adjustable Current-Limit Power Switch Thin DFN is a GREEN RoHS-compliant package. Lead finish is NiPdAu. Mold compound is Halogen Free. Note 1: 2018 Microchip Technology Inc. Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. DS20005540A-page 23 MIC2039 NOTES: DS20005540A-page 24 2018 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: * Microchip products meet the specification contained in their particular Microchip Data Sheet. * Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. * There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. * Microchip is willing to work with the customer who is concerned about the integrity of their code. * Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as "unbreakable." Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company's quality system processes and procedures are for its PIC(R) MCUs and dsPIC(R) DSCs, KEELOQ(R) code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip's quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV Trademarks The Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. ClockWorks, The Embedded Control Solutions Company, EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and Quiet-Wire are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo, CodeGuard, CryptoAuthentication, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. (c) 2018, Microchip Technology Incorporated, All Rights Reserved. ISBN: 978-1-5224-2798-8 == ISO/TS 16949 == 2018 Microchip Technology Inc. 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