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MOC3051 / MOC3052
DD93210
DESCRIPTION
The MOC3051 and MOC3052 are optically coupled
isolators consisting of a Gallium Arsenide infrared
emitting diode coupled with a light activated silicon
bilateral switch performing the functions of a triac.
These photocouplers provide random phase control
of high current triacs or thyristors. The MOC3051
and MOC3052 feature greatly enhanced static dv/dt
capability to ensure stable switching performance of
inductive loads.
These devices are mounted in a standard 6 pin
dual-in-line package.
FEATURES
• High Repetitive Peak Off-state Voltage
VDRM : minimum 600V
• High Critical Rate of Rise of Off-state Voltage
dv/dt : minimum 1000V/µs )
• High Isolation Voltage between Input and Output
Viso : 5000Vrms
• Lead Free and RoHS Compliant
• UL File No. E91231
• VDE File No. 40028086
APPLICATIONS
• Solenoid / Valve Controls
• Lamp Ballasts
• Static AC Power Switch
• lnterfacing Microprocessors to 115 and 240Vac
Peripherals
• Solid State Relays
• Incandescent Lamp Dimmers
• Temperature Controls
• Motor Controls
ORDER INFORMATION
• Add Suffix “X” for VDE Approval
• Add G after PN for 10mm lead spacing
• Add SM after PN for Surface Mount
• Add SMT&R after PN for Surface Mount
Tape & Reel
ABSOLUTE MAXIMUM RATINGS (TA = 25°C)
Stresses exceeding the absolute maximum ratings can cause
permanent damage to the device.
Exposure to absolute maximum ratings for long periods of time
can adversely affect reliability.
ISOCOM COMPONENTS 2004 LTD
Unit 25B, Park View Road West, Park View Industrial Estate
Hartlepool, Cleveland, TS25 1PE, United Kingdom
Tel : +44 (0)1429 863 609 Fax : +44 (0)1429 863 581
e-mail : sales@isocom.co.uk
http://www.isocom.com
ISOCOM COMPONENTS ASIA LTD
Hong Kong Office,
Block A, 8/F, Wah Hing Industrial mansion,
36 Tai Yau Street, San Po Kong, Kowloon, Hong Kong.
Tel : +852 2995 9217 Fax : +852 8161 6292
e-mail : sales@isocom.com.hk
1 Anode
2 Cathode
3 NC
4 Main Terminal
5 Substrate
(Do not Connect)
6 Main Terminal
Input
Forward Current 50mA
Reverse Voltage 6V
Power dissipation 100mW
Output
Peak Repetitive Surge Current
(Pulse width = 1ms, 120pps)
1A
Off State Output Terminal Voltage 600V
Power Dissipation 300mW
Isolation Voltage 5000VRMS
Total Power Dissipation 330mW
Operating Temperature -40 to 100 °C
Storage Temperature -55 to 150 °C
Lead Soldering Temperature (10s) 260°C
Total Package
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MOC3051 / MOC3052
DD93210
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise specified)
Note 1 : Test Voltage must be applied within static dv/dt rating.
Note 2 : Guaranteed to trigger at an IF value less than or equal to max IFT,
recommended IF lies between Rated IFT to Absolute Max IF.
Note 3 : Measured with input leads shorted together and output leads shorted together.
Parameter Symbol Test Condition Min Typ. Max Unit
Forward Voltage VF IF = 20mA 1.2 1.5 V
Reverse Current IR V
R = 6V 0.05 10 μA
INPUT
Parameter Symbol Test Condition Min Typ. Max Unit
Peak Off-state Current
Either Direction
IDRM VDRM = 600V
IF = 0mA
Note 1
100 nA
On-State Voltage
Either Direction
VTM I
TM = 100mA (peak)
3.0 V
Critical Rate of
Rise of Off-State
Voltage
dv/dt IF = 0mA
1000 V/μs
OUTPUT
Parameter Symbol Test Condition Min Typ. Max Unit
Input Trigger Current
Either Direction
IFT VTM = 3V
Note 2
mA
MOC3051 15
MOC3052 10
Holding Current
Either Direction
IH 200
μA
COUPLED
Parameter Symbol Test Condition Min Typ. Max Unit
Insulation Voltage VISO AC 1 minute, RH 40 to 60%
Note 3
5000 VRMS
ISOLATION
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MOC3051 / MOC3052
DD93210
Fig 1 Forward Current vs Ambient Temperature Fig 2 On-State Current vs Ambient Temperature
Fig 3 On-State Voltage vs Ambient Temperature Fig 4 On-State Current vs On-State Voltage
Fig 5 Minimum Trigger Current vs
Ambient Temperature
Fig 6 Holding Current vs Ambient Temperature
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MOC3051 / MOC3052
DD93210
Fig 7 Forward Current vs Forward Voltage Fig 8 Repetitive Peak Off-State Current vs
Ambient Temperature
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MOC3051 / MOC3052
DD93210
ORDER INFORMATION
DEVICE MARKING
Example : MOC3052
MOC3052 denotes Device Part Number
Y denotes 1 digit Year code
WW denotes 2 digit Week code
I denotes Isocom
After PN Description Packing quantity
None Standard DIP6 65 pcs per tube
G 10mm Lead Spacing 65 pcs per tube
SM Surface Mount 65 pcs per tube
SMT&R Surface Mount Tape & Reel 1000 pcs per reel
MOC3051 / MOC3052 (UL Approval)
PN
MOC3051, MOC3052
MOC3051G, MOC3052G
MOC3051SM, MOC3052SM
MOC3051SMT&R,
MOC3052SMT&R
After PN Description Packing quantity
None Standard DIP6 65 pcs per tube
G 10mm Lead Spacing 65 pcs per tube
SM Surface Mount 65 pcs per tube
SMT&R Surface Mount Tape & Reel 1000 pcs per reel
MOC3051X / MOC3052X (UL Approval and VDE Approvals)
PN
MOC3051X, MOC3052X
MOC3051XG, MOC3052XG
MOC3051XSM, MOC3052XSM
MOC3051XSMT&R,
MOC3052XSMT&R
MOC3052
I YWW
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MOC3051 / MOC3052
DD93210
PACKAGE DIMENSIONS in mm (inch)
DIP
G Form
SMD
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DD93210
RECOMMENDED PAD LAYOUT FOR SMD (mm)
TAPE AND REEL PACKAGING
Description Symbol Dimension
mm (inch)
Tape Width W 16 ± 0.3 (0.63)
Pitch of Sprocket Holes P0 4 ± 0.1 (0.15)
F 7.5 ± 0.1 (0.295)
P2 2 ± 0.1 (0.079)
Distance of Compartment to Compartment P1 12 ± 0.1 (0.472)
Distance of Compartment to Sprocket Holes
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MOC3051 / MOC3052
DD93210
IR REFLOW SOLDERING TEMPERATURE PROFILE
Note : One Time Reflow Soldering is Recommended.
Do Not Immerse Device Body in Solder Paste.
TIME (s)
TEMP (°C)
25°C
ts Preheat
60s – 120s
Tsmin
Tsmax
260°C
TL 217°C
Time 25°C to Peak Temperature
tP
TP - 5°C
TP
Max Ramp Up Rate
3°C/s
Max Ramp Down Rate
6°C/s
TL
200°C
150°C
Profile Details Conditions
Preheat
- Min Temperature (TSMIN)
- Max Temperature (TSMAX)
- Time TSMIN to TSMAX (ts)
150°C
200°C
60s - 120s
Soldering Zone
- Peak Temperature (TP)
- Time at Peak Temperature
- Liquidous Temperature (TL)
- Time within 5°C of Actual Peak Temperature (TP 5°C)
- Time maintained above TL (tL)
- Ramp Up Rate (TL to TP)
- Ramp Down Rate (TP to TL)
260°C
10s max
217°C
30s max
60s - 100s
3°C/s max
6°C/s max
Average Ramp Up Rate (Tsmax to TP) 3°C/s max
Time 25°C to Peak Temperature 8 minutes max
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DISCLAIMER
DD93210
Isocom Components is continually working to improve the quality and reliability of its products.
Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent
electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer,
when utilizing Isocom Components products, to comply with the standards of safety in making
a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such Isocom Components products could cause loss of human life, bodily injury or damage to
property.
In developing your designs, please ensure that Isocom Components products are used within
specified operating ranges as set forth in the most recent Isocom Components products
specifications.
The Isocom Components products listed in this document are intended for usage in general
electronics applications (computer, personal equipment, office equipment, measuring
equipment, industrial robotics, domestic appliances, etc.). These Isocom Components
products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss
of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy
control instruments, airplane or spaceship instruments, transportation Instruments, traffic
signal instruments, combustion control instruments, medical Instruments, all types of safety
devices, etc... Unintended Usage of Isocom Components products listed in this document
shall be made at the customer’s own risk.
Gallium arsenide (GaAs) is a substance used in the products described in this document.
GaAs dust and fumes are toxic. Do not break, cut or pulverize the product, or use chemicals to
dissolve them. When disposing of the products, follow the appropriate regulations. Do not
dispose of the products with other industrial waste or with domestic garbage.
The products described in this document are subject to the foreign exchange and foreign trade
laws.
The information contained herein is presented only as a guide for the applications of our
products. No responsibility is assumed by Isocom Components for any infringements of
intellectual property or other rights of the third parties which may result from its use. No license
is granted by implication or otherwise under any intellectual property or other rights of Isocom
Components or others.
The information contained herein is subject to change without notice.
