Sample & Buy Product Folder Technical Documents Support & Community Tools & Software Reference Design LM78L05, LM78L09 LM78L12, LM78L15, LM78L62 SNVS754K - JANUARY 2000 - REVISED DECEMBER 2016 LM78Lxx 100-mA Fixed Output Linear Regulator 1 Features 3 Description * * The LM78Lxx series of three terminal positive regulators is available with several fixed output voltages, making them useful in a wide range of applications. Used as a Zener-diode and resistor combination replacement, the LM78Lxx usually provides an effective output impedance improvement of two orders of magnitude and lower quiescent current. These regulators can provide local, on-card regulation, eliminating distribution problems associated with single-point regulation. The available voltages allow the LM78Lxx to be used in logic systems, instrumentation, HiFi, and other solid-state electronic equipment. 1 * * * * * * * * Input Voltage up to 30 V Output Voltage Tolerances of 5% Over the Temperature Range Available Output Voltages: 5 V, 6.2 V, 8.2 V, 9 V, 12 V, and 15 V Output Current of 100 mA Output Transistor Safe Area Protection Internal Thermal Overload Protection Internal Short-Circuit Current Limit No External Components Available in Tiny DSBGA Package Available in 3-Pin TO-92 and 8-Pin SOIC Low Profile Packages 2 Applications * * * * Battery Chargers Portable Instrumentation LED Lighting Low Wattage Power Supplies Package Options See AN-1112 DSBGA Wafer Level Chip Scale Package (SNVA009) for DSBGA Considerations. For more information on the TO-92 package, see TO-92 Packing Options / Ordering Instructions (SNOA072). DSBGA 8-Pin 1 The LM78Lxx is available in the plastic TO-92 (LP) package, the SOIC (D) package, and a chip-sized package (8-Bump DSBGA) using TI's DSBGA package technology. With adequate heat sinking, the regulator can deliver 100-mA output current. Current limiting is included to limit the peak output current to a safe value. Safe area protection for the output transistors is provided to limit internal power dissipation. If internal power dissipation is too high for the heat sinking provided, the thermal shutdown circuit prevents the IC from overheating. Device Information(1) 3 2 PART NUMBER 1 LM78L05, LM78L09 SOIC 8-Pin TO-92 3-Pin Not to scale 1 PACKAGE DSBGA (8) BODY SIZE (NOM) 1.30 mm x 1.30 mm LM78L05, LM78L12, SOIC (8) LM78L15 3.90 mm x 4.90 mm LM78L05, LM78L12, TO-92 (3) LM78L15, LM78L62 3.70 mm x 4.70 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Fixed Output Regulator Circuit 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LM78L05, LM78L09 LM78L12, LM78L15, LM78L62 SNVS754K - JANUARY 2000 - REVISED DECEMBER 2016 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 4 6.1 6.2 6.3 6.4 6.5 6.6 6.7 6.8 6.9 6.10 4 4 4 4 5 5 6 6 7 8 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics -- LM78L05 ...................... Electrical Characteristics -- LM78L09 ...................... Electrical Characteristics -- LM78L12 ...................... Electrical Characteristics -- LM78L15 ...................... Electrical Characteristics -- LM78L62 ...................... Typical Characteristics ............................................ Detailed Description ............................................ 10 7.1 Overview ................................................................. 10 7.2 Functional Block Diagram ....................................... 10 7.3 Feature Description................................................. 11 7.4 Device Functional Modes........................................ 11 8 Application and Implementation ........................ 12 8.1 Application Information............................................ 12 8.2 Typical Applications ................................................ 12 9 Power Supply Recommendations...................... 16 10 Layout................................................................... 16 10.1 Layout Guidelines ................................................. 16 10.2 Layout Example .................................................... 16 11 Device and Documentation Support ................. 17 11.1 11.2 11.3 11.4 11.5 11.6 11.7 Documentation Support ........................................ Related Links ........................................................ Receiving Notification of Documentation Updates Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 17 17 17 17 17 17 17 12 Mechanical, Packaging, and Orderable Information ........................................................... 18 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision J (December 2013) to Revision K Page * Added Applications section, Device Information table, Pin Configuration and Functions section, ESD Ratings table, Recommended Operating Conditions table, Detailed Description section, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .................................................................................................. 1 * Deleted LM78L82 from the data sheet ................................................................................................................................... 1 * Added Thermal Information table. .......................................................................................................................................... 1 * Deleted Lead temperature (soldering) information ................................................................................................................. 4 * Changed RJA values for D (SOIC) From: 180 To: 128.8, LP (TO-92) from 230 to 158.7, and YPB (DSBGA) From: 230.9 To 108.4 ....................................................................................................................................................................... 4 * Changed RJC values for LP (TO-92) From: 60 To 75.2......................................................................................................... 4 Changes from Revision I (April 2013) to Revision J * 2 Page Added the AI suffix ................................................................................................................................................................. 5 Submit Documentation Feedback Copyright (c) 2000-2016, Texas Instruments Incorporated Product Folder Links: LM78L05 LM78L09 LM78L12 LM78L15 LM78L62 LM78L05, LM78L09 LM78L12, LM78L15, LM78L62 www.ti.com SNVS754K - JANUARY 2000 - REVISED DECEMBER 2016 5 Pin Configuration and Functions YPB Package 8-Pin DSBGA Top View A 3 2 D Package 8-Pin SOIC Top View B VOUT C NC VOUT 1 8 VIN GND 2 7 GND GND 3 6 GND NC 4 5 NC GND VOUT GND Not to scale 1 VIN VIN NC Not to scale LP Package 3-Pin TO-92 Bottom View 3 VIN 2 GND 1 VOUT Not to scale Pin Functions PIN TO-92 I/O DESCRIPTION NAME DSBGA SOIC GND C2, C3 2, 3, 6, 7 2 -- Ground NC B3, C1 4, 5 -- -- No connection VIN A1, B1 8 3 I Input supply voltage pin VOUT A2, A3 1 1 O Output voltage pin Copyright (c) 2000-2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM78L05 LM78L09 LM78L12 LM78L15 LM78L62 3 LM78L05, LM78L09 LM78L12, LM78L15, LM78L62 SNVS754K - JANUARY 2000 - REVISED DECEMBER 2016 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT 35 V Input voltage Power dissipation Internally limited Operating junction temperature, TJ LM78LxxACZ (TO-92) 0 125 LM78LxxACM (SOIC) 0 125 LM78LxxAIM (SOIC) -40 125 LM78LxxITP (thin DSBGA) -40 85 -65 150 Storage temperature, Tstg (1) (2) C C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. 6.2 ESD Ratings V(ESD) (1) Electrostatic discharge Human-body model (HBM), VALUE UNIT 1000 V (1) Human body model, 1.5 k in series with 100 pF. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM Input voltage Continuous output current LM78LxxACZ (TO-92) TJ LM78LxxACM (SOIC) Junction temperature MAX UNIT 30 V 100 mA 0 125 0 125 LM78LxxAIM (SOIC) -40 125 LM78LxxITP (DSBGA) -40 85 C 6.4 Thermal Information LM78Lxx THERMAL METRIC (1) D (SOIC) LP (TO-92) YPB (DSBGA) 8 PINS 3 PINS 8 PINS UNIT 128.8 158.7 108.4 C/W RJA Junction-to-ambient thermal resistance RJC(top) Junction-to-case (top) thermal resistance 76 75.2 1.3 C/W RJB Junction-to-board thermal resistance 69.3 n/a 31.4 C/W JT Junction-to-top characterization parameter 26.3 30.2 4.5 C/W JB Junction-to-board characterization parameter 68.8 138.2 31.4 C/W RJC(bot) Junction-to-case (bottom) thermal resistance -- -- -- C/W (1) 4 For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. Submit Documentation Feedback Copyright (c) 2000-2016, Texas Instruments Incorporated Product Folder Links: LM78L05 LM78L09 LM78L12 LM78L15 LM78L62 LM78L05, LM78L09 LM78L12, LM78L15, LM78L62 www.ti.com SNVS754K - JANUARY 2000 - REVISED DECEMBER 2016 6.5 Electrical Characteristics -- LM78L05 Typical values apply for TJ = 25C, Minimum and Maximum limits apply for the entire operating temperature range of the package (1) (2), IO = 40 mA, CI = 0.33 F, CO = 0.1 F, VIN = 10 V (unless otherwise noted). PARAMETER TEST CONDITIONS TJ = 25C VO Output voltage Line regulation VO Load regulation IQ Quiescent current IQ Quiescent current change Vn Output noise voltage MIN TYP MAX 4.8 5 5.2 VIN = 7 V to 20 V, IO = 1 mA to 40 mA (3) 4.75 5.25 IO = 1 mA to 70 mA (3) 4.75 5.25 VIN = 7 V to 20 V, TJ = 25C 18 75 VIN = 8 V to 20 V, TJ = 25C 10 54 IO = 1 mA to 100 mA, TJ = 25C 20 60 IO = 1 mA to 40 mA, TJ = 25C 5 30 TJ = 25C 3 5 VIN = 8 V to 20 V f = 120 Hz, VIN = 8 V to 16 V, TJ = 25C mV mA mA 0.1 40 47 V 62 dB 140 mA IPK Peak output current VO/T Average output voltage temperature coefficient IO = 5 mA -0.65 VIN(MIN) Minimum value of input voltage required to maintain line regulation TJ = 25C 6.7 (1) (2) (3) (4) V 1 IO = 1 mA to 40 mA f = 10 Hz to 100 kHz (4) VIN/VO Ripple rejection UNIT mV/C 7 V For the operating ranges of each package, see Absolute Maximum Ratings. Limits are ensured by production testing or correlation techniques using standard Statistical Quality Control (SQC) methods. Power dissipation 0.75 W. Recommended minimum load capacitance of 0.01 F to limit high-frequency noise. 6.6 Electrical Characteristics -- LM78L09 Typical values apply for TJ = 25C, Minimum and Maximum limits apply for the entire operating temperature range of the package (1) (2), IO = 40 mA, CI = 0.33 F, CO = 0.1 F, VIN = 15 V (unless otherwise noted). PARAMETER VO TEST CONDITIONS Output voltage VO Load regulation Quiescent current MAX TJ = 25C 8.64 9 9.36 VIN = 11.5 V to 24 V, IO = 1 mA to 40 mA (3) 8.55 9.45 IO = 1 mA to 70 mA (3) 8.55 9.45 100 200 VIN = 13 V to 24 V, TJ = 25C 90 150 IO = 1 mA to 100 mA, TJ = 25C 20 90 IO = 1 mA to 40 mA, TJ = 25C 10 45 2 5.5 TJ = 25C IQ Quiescent current change Vn Output noise voltage VIN = 11.5 V to 24 V 1.5 IO = 1 mA to 40 mA 0.1 70 VIN/VO Ripple rejection f = 120 Hz, VIN = 15 V to 25 V, TJ = 25C IPK Peak output current VO/T Average output voltage temperature coefficient VIN(MIN) Minimum value of input voltage required to maintain line regulation (1) (2) (3) TYP VIN = 11.5 V to 24 V, TJ = 25C Line regulation IQ MIN 38 IO = 5 mA UNIT V mV mA mA V 44 dB 140 mA -0.9 mV/C 10.7 V For the operating ranges of each package, see Absolute Maximum Ratings. Limits are ensured by production testing or correlation techniques using standard Statistical Quality Control (SQC) methods. Power dissipation 0.75 W. Copyright (c) 2000-2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM78L05 LM78L09 LM78L12 LM78L15 LM78L62 5 LM78L05, LM78L09 LM78L12, LM78L15, LM78L62 SNVS754K - JANUARY 2000 - REVISED DECEMBER 2016 www.ti.com 6.7 Electrical Characteristics -- LM78L12 Typical values apply for TJ = 25C, Minimum and Maximum limits apply for the entire operating temperature range of the package (1) (2), IO = 40 mA, CI = 0.33 F, CO = 0.1 F, VIN = 19 V (unless otherwise noted). PARAMETER VO TEST CONDITIONS Output voltage Line regulation VO Load regulation IQ Quiescent current IQ Quiescent current change Vn Output noise voltage TYP MAX 11.5 12 12.5 VIN = 14.5 V to 27 V, IO = 1 mA to 40 mA (3) 11.4 12.6 IO = 1 mA to 70 mA (3) 11.4 12.6 VIN = 14.5 V to 27 V, TJ = 25C 30 180 VIN = 16 V to 27 V, TJ = 25C 20 110 IO = 1 mA to 100 mA, TJ = 25C 30 100 IO = 1 mA to 40 mA, TJ = 25C 10 50 3 5 TJ = 25C VIN = 16 V to 27 V UNIT V mV mA 1 IO = 1 mA to 40 mA mA 0.1 80 VIN/VO Ripple rejection f = 120 Hz, VIN = 15 V to 25 V, TJ = 25C IPK Peak output current VO/T Average output voltage temperature coefficient VIN(MIN) Minimum value of input voltage required to maintain line regulation (1) (2) (3) MIN TJ = 25C 40 V 54 dB 140 mA IO = 5 mA -1 mV/C TJ = 25C 13.7 14.5 V For the operating ranges of each package, see Absolute Maximum Ratings. Limits are ensured by production testing or correlation techniques using standard Statistical Quality Control (SQC) methods. Power dissipation 0.75 W. 6.8 Electrical Characteristics -- LM78L15 Typical values apply for TJ = 25C, Minimum and Maximum limits apply for the entire operating temperature range of the package (1) (2), IO = 40 mA, CI = 0.33 F, CO = 0.1 F, VIN = 23 V (unless otherwise noted). PARAMETER TEST CONDITIONS TJ = 25C VO Output voltage Line regulation VO Load regulation IQ Quiescent current IQ Quiescent current change Vn Output noise voltage MAX 15 15.6 VIN = 17.5 V to 30 V, IO = 1 mA to 40 mA (3) 14.25 15.75 IO = 1 mA to 70 mA (3) 14.25 15.75 VIN = 17.5 V to 30 V, TJ = 25C 37 250 VIN = 20 V to 30 V, TJ = 25C 25 140 IO = 1 mA to 100 mA, TJ = 25C 35 150 IO = 1 mA to 40 mA, TJ = 25C 12 75 3 5 VIN =20 V to 30 V 1 IO = 1 mA to 40 mA 0.1 90 f = 120 Hz, VIN = 18.5 V to 28.5 V, TJ = 25C IPK Peak output current VO/T Average output voltage temperature coefficient VIN(MIN) Minimum value of input voltage required to maintain line regulation 6 TYP TJ = 25C VIN/VO Ripple rejection (1) (2) (3) MIN 14.4 37 UNIT V mV mA mA V 51 dB 140 mA IO = 5 mA -1.3 mV/C TJ = 25C 16.7 17.5 V For the operating ranges of each package, see Absolute Maximum Ratings. Limits are ensured by production testing or correlation techniques using standard Statistical Quality Control (SQC) methods. Power dissipation 0.75 W. Submit Documentation Feedback Copyright (c) 2000-2016, Texas Instruments Incorporated Product Folder Links: LM78L05 LM78L09 LM78L12 LM78L15 LM78L62 LM78L05, LM78L09 LM78L12, LM78L15, LM78L62 www.ti.com SNVS754K - JANUARY 2000 - REVISED DECEMBER 2016 6.9 Electrical Characteristics -- LM78L62 Typical values apply for TJ = 25C, Minimum and Maximum limits apply for the entire operating temperature range of the package (1) (2), IO = 40 mA, CI = 0.33 F, CO = 0.1 F, VIN = 12 V (unless otherwise noted). PARAMETER TEST CONDITIONS TJ = 25C VO Output voltage Line regulation VO Load regulation IQ Quiescent current IQ Quiescent current change Vn Output noise voltage TYP MAX 6.2 6.45 VIN = 8.5 V to 20 V, IO = 1 mA to 40 mA (3) 5.9 6.5 IO = 1 mA to 70 mA (3) 5.9 6.5 VIN = 8.5 V to 20 V, TJ = 25C 65 175 VIN = 9 V to 20 V, TJ = 25C 55 125 IO = 1 mA to 100 mA, TJ = 25C 13 80 IO = 1 mA to 40 mA, TJ = 25C 6 40 TJ = 25C 2 5.5 VIN = 8 V to 20 V 1.5 IO = 1 mA to 40 mA 0.1 f = 10 Hz to 100 kHz (4) VIN/VO Ripple rejection f = 120 Hz, VIN = 10 V to 20 V, TJ = 25C IPK Peak output current VO/T Average output voltage temperature coefficient VIN(MIN) Minimum value of input voltage required to maintain line regulation (1) (2) (3) (4) MIN 5.95 50 40 IO = 5 mA UNIT V mV mA mA V 46 dB 140 mA -0.75 7.9 mV/C V For the operating ranges of each package, see Absolute Maximum Ratings. Limits are ensured by production testing or correlation techniques using standard Statistical Quality Control (SQC) methods. Power dissipation 0.75 W. Recommended minimum load capacitance of 0.01 F to limit high-frequency noise. Copyright (c) 2000-2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM78L05 LM78L09 LM78L12 LM78L15 LM78L62 7 LM78L05, LM78L09 LM78L12, LM78L15, LM78L62 SNVS754K - JANUARY 2000 - REVISED DECEMBER 2016 www.ti.com 6.10 Typical Characteristics LP Package 8 Figure 1. Maximum Average Power Dissipation Figure 2. Peak Output Current Figure 3. Dropout Voltage Figure 4. Ripple Rejection Figure 5. Output Impedance Figure 6. Quiescent Current Submit Documentation Feedback Copyright (c) 2000-2016, Texas Instruments Incorporated Product Folder Links: LM78L05 LM78L09 LM78L12 LM78L15 LM78L62 LM78L05, LM78L09 LM78L12, LM78L15, LM78L62 www.ti.com SNVS754K - JANUARY 2000 - REVISED DECEMBER 2016 Typical Characteristics (continued) Figure 7. Quiescent Current Copyright (c) 2000-2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM78L05 LM78L09 LM78L12 LM78L15 LM78L62 9 LM78L05, LM78L09 LM78L12, LM78L15, LM78L62 SNVS754K - JANUARY 2000 - REVISED DECEMBER 2016 www.ti.com 7 Detailed Description 7.1 Overview The LM78Lxx series of positive regulators is available in the following fixed output voltages: 5 V, 6.2 V, 8.2 V, 9 V, 12 V, and 15 V. The regulator can be configured to an adjustable output by connecting the GND pin to the center of a resistive voltage divider as shown in Figure 10. In this configuration, the fixed output voltage acts as the reference voltage across R1 allowing the output to be adjusted by changing the resistor. 7.2 Functional Block Diagram 10 Submit Documentation Feedback Copyright (c) 2000-2016, Texas Instruments Incorporated Product Folder Links: LM78L05 LM78L09 LM78L12 LM78L15 LM78L62 LM78L05, LM78L09 LM78L12, LM78L15, LM78L62 www.ti.com SNVS754K - JANUARY 2000 - REVISED DECEMBER 2016 7.3 Feature Description 7.3.1 Load Regulation These devices regulate the voltage between the VOUT and GND pins, and can be made adjustable by using a resistive voltage divider. The output voltage tolerance is 5% over temperature. 7.3.2 Protection The LM78Lxx series of regulators has internal thermal overload protection that automatically shuts off the device if the operating temperature becomes too high. There is also internal short-circuit current limit and output transistor safe area protection that shuts down the device if the output current becomes too high. 7.4 Device Functional Modes 7.4.1 Normal Operation The VOUT pin sources current necessary to set the voltage on VOUT at a fixed voltage above the GND pin. See Specifications for VO of each device. 7.4.2 Shutdown The device automatically shuts down if the output current or its internal temperature becomes too high. Copyright (c) 2000-2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM78L05 LM78L09 LM78L12 LM78L15 LM78L62 11 LM78L05, LM78L09 LM78L12, LM78L15, LM78L62 SNVS754K - JANUARY 2000 - REVISED DECEMBER 2016 www.ti.com 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI's customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information These devices are versatile and high-performance regulators with a wide temperature range and tight line and load regulation. An input capacitor is required if the regulator is placed more than 3 inches from the power supply filter. TI recommends a minimum load capacitance of 0.01 F to limit high frequency. 8.2 Typical Applications 8.2.1 Fixed Output Regulator *Required if the regulator is located more than 3 inches from the power supply filter. **Recommended minimum load capacitance of 0.01 F to limit high-frequency noise. Figure 8. Fixed Output Regulator Circuit 8.2.1.1 Design Requirements The device component count is very minimal. No external components are usually required. However, TI recommends input or output capacitors depending on the distance between the device and the power supply and if extra filtering is needed at the output. The output voltage is set based on the selection of the two resistors (R1 and R2), as shown in Figure 14. 8.2.1.2 Detailed Design Procedure 8.2.1.2.1 Input Capacitor An input capacitor is required if the regulator is placed more than 3 inches from the power supply filter. A 0.33-F capacitor on the input is suitable for most applications. 8.2.1.2.2 Output Capacitor TI recommends a minimum load capacitance of 0.01 F to limit high-frequency noise. 12 Submit Documentation Feedback Copyright (c) 2000-2016, Texas Instruments Incorporated Product Folder Links: LM78L05 LM78L09 LM78L12 LM78L15 LM78L62 LM78L05, LM78L09 LM78L12, LM78L15, LM78L62 www.ti.com SNVS754K - JANUARY 2000 - REVISED DECEMBER 2016 Typical Applications (continued) 8.2.1.3 Application Curve Input - Output Differential (V) 1.9 1.8 1.7 1.6 1.5 1.4 1.3 25qC 1.2 0 20 40 60 Load Current (mA) 80 100 Figure 9. LM78Lxx Dropout 8.2.2 Other Application Circuits Figure 10 to Figure 14 show application circuit examples using the LM78Lxx devices. Customers must fully validate and test these circuits before implementing a design based on these examples. Unless otherwise noted, the design procedures in Fixed Output Regulator are applicable to these designs. VO = 5 V + (5 V / R1 + IQ) x R2* * The 5 V represents the fixed output voltage of the LM78L05. If using one of the other LM78Lxx devices, use that fixed output voltage value when calculating VO. IQ < 5 V / (3 x R1) Load regulation (LR) of LM78L05 (R1 + R2) / R1 Figure 10. Adjustable Output Regulator Circuit Copyright (c) 2000-2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM78L05 LM78L09 LM78L12 LM78L15 LM78L62 13 LM78L05, LM78L09 LM78L12, LM78L15, LM78L62 SNVS754K - JANUARY 2000 - REVISED DECEMBER 2016 www.ti.com Typical Applications (continued) IOUT = (VO / R1) + IQ IQ = 1.5 mA over line and load changes Figure 11. Current Regulator Circuit *Solid tantalum **Heat sink Q1 ***Optional: Improves ripple rejection and transient response. Load Regulation = 0.6%, IL = 0 mA to 250 mA pulsed with tON = 50 ms. Figure 12. 5-V, 500-mA Regulator With Short-Circuit Protection Circuit 14 Submit Documentation Feedback Copyright (c) 2000-2016, Texas Instruments Incorporated Product Folder Links: LM78L05 LM78L09 LM78L12 LM78L15 LM78L62 LM78L05, LM78L09 LM78L12, LM78L15, LM78L62 www.ti.com SNVS754K - JANUARY 2000 - REVISED DECEMBER 2016 Typical Applications (continued) *Solid tantalum Figure 13. 15-V, 100-mA Dual Power Supply Circuit *Solid tantalum VO = VG + 5 V, R1 = (-VIN / IQ(LM78L05)) VO = 5 V (R2 / R4) for (R2 + R3) = (R4 + R5) A 0.5-V output will correspond to (R2 / R4) = 0.1, (R3 / R4) = 0.9 Figure 14. Variable Output Regulator Circuit (0.5 V to 18 V) Copyright (c) 2000-2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM78L05 LM78L09 LM78L12 LM78L15 LM78L62 15 LM78L05, LM78L09 LM78L12, LM78L15, LM78L62 SNVS754K - JANUARY 2000 - REVISED DECEMBER 2016 www.ti.com 9 Power Supply Recommendations The linear regulator input supply must be well regulated and kept at a voltage level to not exceed the maximum input to output voltage differential allowed by the device. The minimum dropout voltage (VIN - VO) must be met with extra headroom when possible to keep the output well regulated. A 0.33-F or higher capacitor must be placed at the input to bypass noise. 10 Layout 10.1 Layout Guidelines For the best overall performance, some layout guidelines may be disregarded. Place all circuit components on the same side of the circuit board and as near as practical to the respective linear regulator pins. Traces must be kept short and wide to reduce the amount of parasitic elements in the system. The actual width and thickness of traces depends on the current carrying capability and heat dissipation required by the end system. 10.2 Layout Example GND U1 C1 C2 VOUT VIN Figure 15. LM78Lxx Example Circuit Layout 16 Submit Documentation Feedback Copyright (c) 2000-2016, Texas Instruments Incorporated Product Folder Links: LM78L05 LM78L09 LM78L12 LM78L15 LM78L62 LM78L05, LM78L09 LM78L12, LM78L15, LM78L62 www.ti.com SNVS754K - JANUARY 2000 - REVISED DECEMBER 2016 11 Device and Documentation Support 11.1 Documentation Support 11.1.1 Related Documentation For related documentation see the following: * AN-1112 DSBGA Wafer Level Chip Scale Package (SNVA009) * TO-92 Packing Options / Ordering Instructions (SNOA072). 11.2 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 1. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY LM78L05 Click here Click here Click here Click here Click here LM78L09 Click here Click here Click here Click here Click here LM78L12 Click here Click here Click here Click here Click here LM78L15 Click here Click here Click here Click here Click here LM78L62 Click here Click here Click here Click here Click here 11.3 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 11.4 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2ETM Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 11.5 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 11.6 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 11.7 Glossary SLYZ022 -- TI Glossary. This glossary lists and explains terms, acronyms, and definitions. Copyright (c) 2000-2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM78L05 LM78L09 LM78L12 LM78L15 LM78L62 17 LM78L05, LM78L09 LM78L12, LM78L15, LM78L62 SNVS754K - JANUARY 2000 - REVISED DECEMBER 2016 www.ti.com 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 18 Submit Documentation Feedback Copyright (c) 2000-2016, Texas Instruments Incorporated Product Folder Links: LM78L05 LM78L09 LM78L12 LM78L15 LM78L62 PACKAGE OPTION ADDENDUM www.ti.com 14-Jul-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) LM78L05ACM NRND SOIC D 8 95 TBD Call TI Call TI 0 to 125 LM78L 05ACM LM78L05ACM/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 125 LM78L 05ACM LM78L05ACMX NRND SOIC D 8 2500 TBD Call TI Call TI 0 to 125 LM78L 05ACM LM78L05ACMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 125 LM78L 05ACM LM78L05ACZ/LFT1 ACTIVE TO-92 LP 3 2000 Green (RoHS & no Sb/Br) CU SN N / A for Pkg Type 0 to 125 LM78L 05ACZ LM78L05ACZ/LFT3 ACTIVE TO-92 LP 3 2000 Green (RoHS & no Sb/Br) CU SN N / A for Pkg Type 0 to 125 LM78L 05ACZ LM78L05ACZ/LFT4 ACTIVE TO-92 LP 3 2000 Green (RoHS & no Sb/Br) CU SN N / A for Pkg Type 0 to 125 LM78L 05ACZ LM78L05ACZ/LFT7 ACTIVE TO-92 LP 3 2000 Green (RoHS & no Sb/Br) CU SN N / A for Pkg Type 0 to 125 LM78L 05ACZ LM78L05ACZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) CU SN N / A for Pkg Type 0 to 125 LM78L 05ACZ LM78L05AIM/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LM78L 05AM LM78L05AIMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LM78L 05AM LM78L05ITP/NOPB ACTIVE DSBGA YPB 8 250 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 P 03 LM78L05ITPX/NOPB ACTIVE DSBGA YPB 8 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 P 03 LM78L09ITPX/NOPB ACTIVE DSBGA YPB 8 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 P 02 LM78L12ACM NRND SOIC D 8 95 TBD Call TI Call TI 0 to 125 LM78L 12ACM LM78L12ACM/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 125 LM78L 12ACM LM78L12ACMX NRND SOIC D 8 2500 TBD Call TI Call TI 0 to 125 LM78L 12ACM Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com Orderable Device 14-Jul-2016 Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) LM78L12ACMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 125 LM78L 12ACM LM78L12ACZ/LFT3 ACTIVE TO-92 LP 3 2000 Green (RoHS & no Sb/Br) CU SN N / A for Pkg Type 0 to 125 LM78L 12ACZ LM78L12ACZ/LFT4 ACTIVE TO-92 LP 3 2000 Green (RoHS & no Sb/Br) CU SN N / A for Pkg Type 0 to 125 LM78L 12ACZ LM78L12ACZ/LFT7 ACTIVE TO-92 LP 3 2000 Green (RoHS & no Sb/Br) CU SN N / A for Pkg Type 0 to 125 LM78L 12ACZ LM78L12ACZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) CU SN N / A for Pkg Type 0 to 125 LM78L 12ACZ LM78L15ACM NRND SOIC D 8 95 TBD Call TI Call TI 0 to 125 LM78L 15ACM LM78L15ACM/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 125 LM78L 15ACM LM78L15ACMX NRND SOIC D 8 2500 TBD Call TI Call TI 0 to 125 LM78L 15ACM LM78L15ACMX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 125 LM78L 15ACM LM78L15ACZ/LFT4 ACTIVE TO-92 LP 3 2000 Green (RoHS & no Sb/Br) CU SN N / A for Pkg Type 0 to 125 LM78L 15ACZ LM78L15ACZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) CU SN N / A for Pkg Type 0 to 125 LM78L 15ACZ LM78L62ACZ/NOPB ACTIVE TO-92 LP 3 1800 Green (RoHS & no Sb/Br) CU SN N / A for Pkg Type 0 to 125 LM78L 62ACZ (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 14-Jul-2016 Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2016 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM78L05ACMX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM78L05ACMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM78L05AIMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM78L05ITP/NOPB DSBGA YPB 8 250 178.0 8.4 1.5 1.5 0.66 4.0 8.0 Q1 LM78L05ITPX/NOPB DSBGA YPB 8 3000 178.0 8.4 1.5 1.5 0.66 4.0 8.0 Q1 LM78L09ITPX/NOPB DSBGA YPB 8 3000 178.0 8.4 1.5 1.5 0.66 4.0 8.0 Q1 LM78L12ACMX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM78L12ACMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM78L15ACMX SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM78L15ACMX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2016 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM78L05ACMX SOIC D 8 2500 367.0 367.0 35.0 LM78L05ACMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM78L05AIMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM78L05ITP/NOPB DSBGA YPB 8 250 210.0 185.0 35.0 LM78L05ITPX/NOPB DSBGA YPB 8 3000 210.0 185.0 35.0 LM78L09ITPX/NOPB DSBGA YPB 8 3000 210.0 185.0 35.0 LM78L12ACMX SOIC D 8 2500 367.0 367.0 35.0 LM78L12ACMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM78L15ACMX SOIC D 8 2500 367.0 367.0 35.0 LM78L15ACMX/NOPB SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 PACKAGE OUTLINE YPB0008 DSBGA - 0.575 mm max height SCALE 9.000 DIE SIZE BALL GRID ARRAY B A E BALL A1 CORNER D 0.575 MAX C SEATING PLANE 0.15 0.11 BALL TYP 0.05 C 1 TYP C 1 TYP SYMM B D: Max = 1.337 mm, Min =1.276 mm 0.5 TYP E: Max = 1.337 mm, Min =1.276 mm A 8X 0.015 0.18 0.16 C A B 1 2 3 0.5 TYP SYMM 4215100/B 07/2016 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. www.ti.com EXAMPLE BOARD LAYOUT YPB0008 DSBGA - 0.575 mm max height DIE SIZE BALL GRID ARRAY (0.5) TYP 8X ( 0.16) 1 3 2 A (0.5) TYP SYMM B C SYMM LAND PATTERN EXAMPLE SCALE:40X ( 0.16) METAL 0.05 MAX METAL UNDER SOLDER MASK 0.05 MIN ( 0.16) SOLDER MASK OPENING SOLDER MASK OPENING NON-SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED SOLDER MASK DETAILS NOT TO SCALE 4215100/B 07/2016 NOTES: (continued) 3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. See Texas Instruments Literature No. SNVA009 (www.ti.com/lit/snva009). www.ti.com EXAMPLE STENCIL DESIGN YPB0008 DSBGA - 0.575 mm max height DIE SIZE BALL GRID ARRAY (0.5) TYP (R0.05) TYP 8X ( 0.3) 1 2 3 A (0.5) TYP SYMM B METAL TYP C SYMM SOLDER PASTE EXAMPLE BASED ON 0.125mm THICK STENCIL SCALE:50X 4215100/B 07/2016 NOTES: (continued) 4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. www.ti.com IMPORTANT NOTICE FOR TI DESIGN INFORMATION AND RESOURCES Texas Instruments Incorporated (`TI") technical, application or other design advice, services or information, including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, "TI Resources") are intended to assist designers who are developing applications that incorporate TI products; by downloading, accessing or using any particular TI Resource in any way, you (individually or, if you are acting on behalf of a company, your company) agree to use it solely for this purpose and subject to the terms of this Notice. TI's provision of TI Resources does not expand or otherwise alter TI's applicable published warranties or warranty disclaimers for TI products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections, enhancements, improvements and other changes to its TI Resources. You understand and agree that you remain responsible for using your independent analysis, evaluation and judgment in designing your applications and that you have full and exclusive responsibility to assure the safety of your applications and compliance of your applications (and of all TI products used in or for your applications) with all applicable regulations, laws and other applicable requirements. You represent that, with respect to your applications, you have all the necessary expertise to create and implement safeguards that (1) anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and take appropriate actions. You agree that prior to using or distributing any applications that include TI products, you will thoroughly test such applications and the functionality of such TI products as used in such applications. TI has not conducted any testing other than that specifically described in the published documentation for a particular TI Resource. You are authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. TI RESOURCES ARE PROVIDED "AS IS" AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING TI RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY YOU AGAINST ANY CLAIM, INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. You agree to fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of your noncompliance with the terms and provisions of this Notice. This Notice applies to TI Resources. Additional terms apply to the use and purchase of certain types of materials, TI products and services. These include; without limitation, TI's standard terms for semiconductor products http://www.ti.com/sc/docs/stdterms.htm), evaluation modules, and samples (http://www.ti.com/sc/docs/sampterms.htm). Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2017, Texas Instruments Incorporated Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Texas Instruments: LM78L62ACZ LM78L62ACZ/LFT1 LM78L62ACZ/LFT3