SN54F74, SN74F74
DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOPS
WITH CLEAR AND PRESET
SDFS046A – MARCH 1987 – REVISED OCT OBER 1993
Copyright 1993, Texas Instruments Incorporated
2–1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
•Package Options Include Plastic
Small-Outline Packages, Ceramic Chip
Carriers, and Standard Plastic and Ceramic
300-mil DIPs
description
These devices contain two independent positive-
edge-triggered D-type flip-flops. A low level at the
preset (PRE) or clear (CLR) inputs sets or resets
the outputs regardless of the levels of the other
inputs. When PRE and CLR are inactive (high),
data at the data (D) input meeting the setup time
requirements is transferred to the outputs on the
positive-going edge of the clock pulse. Clock
triggering occurs at a voltage level and is not
directly related to the rise time of the clock pulse.
Following the hold-time interval, data at the
D input may be changed without affecting the
levels at the outputs.
The SN54F74 is characterized for operation over
the full military temperature range of –55°C to
125°C. The SN74F74 is characterized for
operation from 0°C to 70°C.
FUNCTION TABLE
INPUTS OUTPUTS
PRE CLR CLK D Q Q
L H X X H L
HLXXLH
LLXXH
†
H
†
HH↑HHL
HH↑LLH
HHLXQ
0
Q
0
†
The output levels are not guaranteed to meet the
minimum levels for VOH. Furthermore, this
configuration is nonstable; that is, it will not persist
when PRE or CLR returns to its inactive (high)
level.
SN54F74 ...J PACKAGE
SN74F74 ...D OR N PACKAGE
(TOP VIEW)
SN54F74 . . . FK PACKAGE
(TOP VIEW)
3212019
910111213
4
5
6
7
8
18
17
16
15
14
2D
NC
2CLK
NC
2PRE
1CLK
NC
1PRE
NC
1Q
1D
1CLR
NC
2Q
2Q V
2CLR
1Q
GND
NC CC
NC – No internal connection
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1CLR
1D
1CLK
1PRE
1Q
1Q
GND
VCC
2CLR
2D
2CLK
2PRE
2Q
2Q
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
SN54F74, SN74F74
DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOPS
WITH CLEAR AND PRESET
SDFS046A – MARCH 1987 – REVISED OCT OBER 1993
2–2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
logic symbol†
S
4
3
1CLK
1D
2
1D
R
1
1Q
5
6
C1
10
11
2CLK 12
2D 13
2Q
9
8
1PRE
2PRE
1CLR
2CLR
1Q
2Q
†This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
Pin numbers shown are for the D, J, and N packages.
logic diagram, each flip-flop (positive logic)
TG
C
C
TG
C
C
TG
C
C
C
C
TG
C
C
PRE
CLK
D
CLR
Q
Q
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)‡
Supply voltage range, VCC –0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (see Note 1) –1.2 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input current range –30 mA to 5 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage range applied to any output in the high state –0.5 V to VCC
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Current into any output in the low state 40 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating free-air temperature range: SN54F74 –55°C to 125°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
SN74F74 0°C to 70°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range –65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
‡Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may af fect device reliability.
NOTE 1: The input voltage ratings may be exceeded provided the input current ratings are observed.
SN54F74, SN74F74
DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOPS
WITH CLEAR AND PRESET
SDFS046A – MARCH 1987 – REVISED OCTOBER 1993
2–3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
recommended operating conditions
SN54F74 SN74F74
UNIT
MIN NOM MAX MIN NOM MAX
UNIT
VCC Supply voltage 4.5 5 5.5 4.5 5 5.5 V
VIH High-level input voltage 2 2 V
VIL Low-level input voltage 0.8 0.8 V
IIK Input clamp current –18 –18 mA
IOH High-level output current –1 –1 mA
IOL Low-level output current 20 20 mA
TAOperating free-air temperature –55 125 0 70 °C
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
SN54F74 SN74F74
UNIT
PARAMETER
TEST
CONDITIONS
MIN TYP†MAX MIN TYP†MAX
UNIT
VIK VCC = 4.5 V, II = –18 mA –1.2 –1.2 V
VOH
VCC = 4.5 V, IOH = – 1 mA 2.5 3.4 2.5 3.4
V
V
OH VCC = 4.75 V, IOH = – 1 mA 2.7
V
VOL VCC = 4.5 V, IOL = 20 mA 0.3 0.5 0.3 0.5 V
IIVCC = 5.5 V, VI = 7 V 0.1 0.1 mA
IIH VCC = 5.5 V, VI = 2.7 V 20 20 µA
IIL
Data, CLK
VCC =55V
VI=05V
– 0.6 – 0.6
mA
I
IL PRE or CLR
V
CC =
5
.
5
V
,
V
I =
0
.
5
V
– 1.8 – 1.8
mA
IOS‡VCC = 5.5 V, VO = 0 –60 –150 –60 –150 mA
ICC VCC = 5.5 V, See Note 2 10.5 16 10.5 16 mA
†All typical values are at VCC = 5 V, TA = 25°C.
‡Not more than one output should be shorted at a time, and the duration of the short circuit should not exceed one second.
NOTE 2: ICC is measured with D, CLK, and PRE grounded then with D, CLK, and CLR grounded.
timing requirements over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted)
VCC = 5 V,
TA = 25°CSN54F74 SN74F74
UNIT
′F74 UNIT
MIN MAX MIN MAX MIN MAX
fclock Clock frequency 0 100 0 80 0 100 MHz
t
Pulse duration
CLK high, PRE or CLR low 4 4 4
ns
t
w
P
u
lse
d
u
ration
CLK low 5 6 5
ns
Setup time data before CLK↑
High 2 3 2
tsu
S
e
t
up
ti
me,
d
a
t
a
b
e
f
ore
CLK↑
Low 3 4 3 ns
su
Setup time, inactive-state before CLK↑§PRE or CLR to CLK 2 3 2
th
Hold time data after CLK↑
High 1 2 1
ns
t
h
Hold
time
,
data
after
CLK↑
Low 1 2 1
ns
§Inactive-state setup time is also referred to as recovery time.
SN54F74, SN74F74
DUAL POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOPS
WITH CLEAR AND PRESET
SDFS046A – MARCH 1987 – REVISED OCT OBER 1993
2–4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
switching characteristics (see Note 3)
PARAMETER FROM
(
INPUT
)
TO
(
OUTPUT
)
VCC = 5 V,
CL = 50 pF,
RL = 500 Ω,
TA = 25°C
VCC = 4.5 V to 5.5 V,
CL = 50 pF,
RL = 500Ω,
TA = MIN to MAX†UNIT
(INPUT)
(OUTPUT)
′F74 SN54F74 SN74F74
MIN TYP MAX MIN MAX MIN MAX
fmax 100 145 80 100 MHz
tPLH
CLK
QorQ
34.9 6.8 3.8 8.5 3 7.8
ns
tPHL
CLK
Q
or
Q
3.6 5.8 8 4.4 10.5 3.6 9.2
ns
tPLH
PRE or CLR
QorQ
2.4 4.2 6.1 3.2 8 2.4 7.1
ns
tPHL
PRE
or
CLR
Q
or
Q
2.7 6.6 9 3.5 11.5 2.7 10.5
ns
†For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
NOTE 3: Load circuits and waveforms are shown in Section 1.
PACKAGE OPTION ADDENDUM
www.ti.com 25-Jan-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
5962-9759201Q2A ACTIVE LCCC FK 20 1 TBD Call TI Call TI
5962-9759201QCA ACTIVE CDIP J 14 1 TBD Call TI Call TI
5962-9759201QDA ACTIVE CFP W 14 1 TBD Call TI Call TI
JM38510/34101B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
JM38510/34101BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
JM38510/34101BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
M38510/34101B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
M38510/34101BCA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
M38510/34101BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
SN54F74J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
SN74F74D ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74F74DE4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74F74DG4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74F74DR ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74F74DRE4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74F74DRG4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74F74N ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
SN74F74N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74F74NE4 ACTIVE PDIP N 14 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
SN74F74NSR ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74F74NSRE4 ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74F74NSRG4 ACTIVE SO NS 14 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SNJ54F74FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
PACKAGE OPTION ADDENDUM
www.ti.com 25-Jan-2012
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
SNJ54F74J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
SNJ54F74W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54F74, SN74F74 :
•Catalog: SN74F74
•Military: SN54F74
NOTE: Qualified Version Definitions:
PACKAGE OPTION ADDENDUM
www.ti.com 25-Jan-2012
Addendum-Page 3
•Catalog - TI's standard catalog product
•Military - QML certified for Military and Defense Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74F74DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74F74NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74F74DR SOIC D 14 2500 367.0 367.0 38.0
SN74F74NSR SO NS 14 2000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated
