1
Rectifier Device Data
Designed for use in switching power supplies, inverters and as free wheeling
diodes, these state–of–the–art devices have the following features:
•Ultrafast 60 Nanosecond Recovery Times
•150°C Operating Junction Temperature
•Epoxy Meets UL94, VO @ 1/8″
•High Temperature Glass Passivated Junction
•Low Leakage Specified @ 150°C Case Temperature
•Current Derating @ Both Case and Ambient Temperatures
•Electrically Isolated. No Isolation Hardware Required.
•UL Recognized File #E69369 (1)
Mechanical Characteristics
•Case: Epoxy, Molded
•Weight: 1.9 grams (approximately)
•Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
•Lead Temperature for Soldering Purposes: 260°C Max. for 10
Seconds
•Shipped 50 units per plastic tube
•Marking: U1660
MAXIMUM RATINGS, PER LEG
Rating Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
600 Volts
Average Rectified Forward Current Per Diode
Total Device, (Rated VR), TC = 150°C Per Device IF(AV) 8
16 Amps
Peak Repetitive Forward Current
(Rated VR, Square Wave, 20 kHz), TC = 150°CIFM 16 Amps
Non–repetitive Peak Surge Current
(Surge applied at rated load conditions halfwave, single phase, 60 Hz) IFSM 100 Amps
Operating Junction and Storage Temperature TJ, Tstg – 65 to +150 °C
RMS Isolation Voltage (t = 1 second, R.H. ≤ 30%, TA = 25°C) (2) Per Figure 3
Per Figure 4 (1)
Per Figure 5
Viso1
Viso2
Viso3
4500
3500
1500
Volts
THERMAL CHARACTERISTICS, PER LEG
Maximum Thermal Resistance, Junction to Case RθJC 3.0 °C/W
Lead Temperature for Soldering
Purposes: 1/8″ from Case for 5 Seconds TL260 °C
(1) UL Recognized mounting method is per Figure 4.
(2) Proper strike and creepage distance must be provided.
SWITCHMODE is a trademark of Motorola, Inc.
This document contains information on a new product. Specifications and information herein are subject to change without notice.
Preferred devices are Motorola recommended choices for future use and best overall value.
Motorola, Inc. 1996
Order this document
by MURF1660CT/D
SEMICONDUCTOR TECHNICAL DATA
21
3
ULTRAFAST RECTIFIER
16 AMPERES
600 VOLTS
CASE 221D–02
ISOLATED TO–220
Motorola Preferred Device
1
3
2
Rev 1
MURF1660CT
2Rectifier Device Data
ELECTRICAL CHARACTERISTICS, PER LEG
Characteristic Symbol Value Unit
Maximum Instantaneous Forward Voltage (3)
(iF = 8.0 Amp, TC = 150°C)
(iF = 8.0 Amp, TC = 25°C)
vF1.20
1.50
Volts
Maximum Instantaneous Reverse Current (3)
(Rated dc Voltage, TC = 150°C)
(Rated dc Voltage, TC = 25°C)
iR500
10
µA
Maximum Reverse Recovery T ime
(IF = 1.0 Amp, di/dt = 50 Amp/µs)
(IF = 0.5 Amp, iR = 1.0 Amp, IREC = 0.25 Amp)
trr 60
50
ns
(3) Pulse Test: Pulse Width = 300 µs, Duty Cycle ≤ 2.0%.
VR, REVERSE VOLTAGE (V)
IR, REVERSE CURRENT ( A)
µ
0.01
0.1
1.0
10
100
10 K
600500400300200100
100
50
20
, INSTANTANEOUS FORW ARD CURRENT (AMPS
)
iF
10
5
2
1
0.5
0.2
0.10.4 0.6 1.0 1.2 1.6 1.8
vF, INSTANTANEOUS VOLTAGE (V)
Figure 1. Typical Forward Voltage, Per Leg
100
°
C
25
°
C
TJ = 150
°
C
0.8 1.4
100
°
C25
°
C
1.0 K
TJ = 150
°
C
Figure 2. Typical Reverse Current, Per Leg*
MURF1660CT
3
Rectifier Device Data
TEST CONDITIONS FOR ISOLATION TESTS*
MOUNTED
FULLY ISOLATED
PACKAGE
LEADS
HEATSINK
0.110
″
MIN
Figure 3. Clip Mounting Position
for Isolation Test Number 1
* Measurement made between leads and heatsink with all leads shorted together.
CLIP
MOUNTED
FULLY ISOLATED
PACKAGE
LEADS
HEATSINK
CLIP 0.107
″
MIN
MOUNTED
FULLY ISOLATED
PACKAGE
LEADS
HEATSINK
0.107
″
MIN
Figure 4. Clip Mounting Position
for Isolation Test Number 2 Figure 5. Screw Mounting Position
for Isolation Test Number 3
MOUNTING INFORMATION**
4–40 SCREW
PLAIN W ASHER
HEATSINK
COMPRESSION W ASHER
NUT
CLIP
HEATSINK
Laboratory tests on a limited number of samples indicate, when using the screw and compression washer mounting technique, a screw torque of 6 to 8 in .lbs is sufficient to provide
maximum power dissipation capability. The compression washer helps to maintain a constant pressure on the package over time and during large temperature excursions.
Destructive laboratory tests show that using a hex head 4–40 screw, without washers, and applying a torque in excess of 20 in .lbs will cause the plastic to crack around the mounting
hole, resulting in a loss of isolation capability.
Additional tests on slotted 4–40 screws indicate that the screw slot fails between 15 to 20 in .lbs without adversely affecting the package. However, in order to positively ensure
the package integrity of the fully isolated device, Motorola does not recommend exceeding 10 in .lbs of mounting torque under any mounting conditions.
Figure 6. Typical Mounting Techniques
6a. Screw–Mounted 6b. Clip–Mounted
**For more information about mounting power semiconductors see Application Note AN1040.
MURF1660CT
4Rectifier Device Data
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM
AMIN MAX MIN MAX
MILLIMETERS
0.621 0.629 15.78 15.97
INCHES
B0.394 0.402 10.01 10.21
C0.181 0.189 4.60 4.80
D0.026 0.034 0.67 0.86
F0.121 0.129 3.08 3.27
G0.100 BSC 2.54 BSC
H0.123 0.129 3.13 3.27
J0.018 0.025 0.46 0.64
K0.500 0.562 12.70 14.27
L0.045 0.060 1.14 1.52
N0.200 BSC 5.08 BSC
Q0.126 0.134 3.21 3.40
R0.107 0.111 2.72 2.81
S0.096 0.104 2.44 2.64
U0.259 0.267 6.58 6.78
–B–
–Y–
G
N
DL
KH
A
F
Q
3 PL
123
M
B
M
0.25 (0.010) Y
SEATING
PLANE
–T–
U
CS
JR
STYLE 3:
PIN 1. ANODE
2. CATHODE
3. ANODE
CASE 221D–02
(ISOLATED T O–220)
ISSUE D
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MURF1660CT/D
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