1
Precision Edge®
SY58027U
Micrel, Inc.
M9999-082707
hbwhelp@micrel.com or (408) 955-1690
DESCRIPTION
Two independent differential 2:1 multiplexers
Guaranteed AC performance over temperature and
voltage:
DC-to >10.7Gbps data rate throughput
< 290ps IN-to-Out tpd
< 80ps tr/t
f
Unique, patent-pending input isolation design
minimizes crosstalk
Ultra-low jitter design:
<1psRMS random jitter
<10psPP deterministic jitter
<10psPP total jitter (clock)
<0.7psRMS crosstalk-induced jitter
Unique, patent-pending 50ý input termination and
VT pin accepts DC-coupled and AC-coupled inputs
(CML, LVDS, PECL)
400mV LVPECL output swing
Power supply 2.5V ±5% or 3.3V ±10%
–40°C to +85°C temperature range
Available in 32-pin (5mm
5mm) MLF® package
FEATURES
ULTRA PRECISION DUAL 2:1
400mV LVPECL MUX WITH
INTERNAL TERMINATION
Precision Edge®
SY58027U
APPLICATIONS
Data communication systems
All SONET OC3-OC768 applications
All Fibre Channel applications
All GigE applications
Rev.: D Amendment: /0
Issue Date: August 2007
The SY58027U features two ultra-fast, low jitter 2:1
differential muxes with a guaranteed maximum data
throughput of 10.7Gbps.
The SY58027U differential inputs include a unique
internal termination design that allows access to the
termination network through a VT pin. The device easily
interfaces to different logic standards, both AC- and DC-
coupled, without external resistor-bias and termination
networks. The result is a clean, stub-free, low jitter interface
solution. The differential 400mV LVPECL outputs have
extremely fast rise/fall times guaranteed to be less than
80ps.
The SY58027U operates from a 2.5V or 3.3V supply and
is guaranteed over the full industrial temperature range
(–40°C to +85°C). The SY58027U is part of Micrel’s Precision
Edge® product family.
All support documentation can be found on Micrel’s web
site at www.micrel.com.
FUNCTIONAL BLOCK DIAGRAM
Precision Edge®
QA
/QA
INA0
/INA0
VTA0
50
50
INA1
VREF-ACA0
/INA1
VTA1
50
50
VREF-ACA1
0
1
MUX A
S
ELA
(
TTL/CMOS)
S
Q
B
/Q
B
INB0
/INB0
VTB0
50
50
INB1
VREF-ACB0
/INB1
VTB1
50
50
VREF-ACB1
0
1
MUX B
SELB
(TTL/CMOS)
S
AnyGate and Precision Edge are registered trademarks of Micrel, Inc.
MicroLeadFrame and MLF are registered trademarks of Amkor Technology, Inc.
2
Precision Edge®
SY58027U
Micrel, Inc.
M9999-082707
hbwhelp@micrel.com or (408) 955-1690
PACKAGE/ORDERING INFORMATION
Pin Number Pin Name Pin Function
25, 28, INA0, /INA0, Differential Inputs: These input pairs are the differential signal inputs to the device. Inputs
29, 32, INA1, /INA1, accept AC- or DC-coupled differential signals as small as 100mV. Each pin of a pair internally
1, 4, INB0, /INB0, terminates to a VT pin through 50ý. Note that these inputs will default to an indeterminate
5, 8 INB1, /INB1 state if left open. Unused differential input pairs can be terminated by connecting one input
to VCC and the complementary input to GND through a 1ký resistor. The VT pin is to be
left open in this configuration. Please refer to the “Input Interface Applications” section for
more details.
26, 30, 2, 6 VTA0 , VTA1, Input Termination Center-Tap: Each side of the differential input pair, terminates to a VT
VTB0, VTB1 pin. Each VT pin provides a center-tap to a termination network for maximum interface
flexibility. See “Input Interface Applications” section for more details.
18, 15 SELA, SELB Bank A, Bank B Input Channel Select (TTL/CMOS): These TTL/CMOS-compatible inputs
select the inputs to the multiplexers. These inputs are internally connected to a 25ký
pull-up resistor and will default to a logic HIGH state if left open. Input switching threshold
is VCC/2.
27, 31, 3, 7 VREF-ACA0, Reference Output Voltage: These outputs bias to VCC –1.2V. Conn e ct t o VT pin when
VREF-ACA1, AC-coupling the data inputs. Bypass with 0.01µF low ESR capacitor to VCC. Maximum
VREF-ACB0, current source or sink is 0.5mA. See “Input Interface Applications” section.
VREF-ACB1
10, 13, 16, VCC Positive Power Supply: Bypass with 0.1µF ™ℑ0.01µF low ESR capacitors.
17, 20, 23
22, 21, QA, /QA, Differential 100k LVPECL Outputs: MUX A and MUX B selected LVPECL outputs.
12, 11 QB, /QB See “Output Interface Applications” section for termination. Refer to the “Truth Table” for
logic operation.
9, 24 GND, Ground: Ground pins and exposed pad must be connected to the same ground plane.
Exposed pad
14, 19 NC Not connected.
PIN DESCRIPTION
24
23
22
21
20
19
18
17
GND
VCC
QA
/QA
VCC
NC
SEL
A
VCC
INB0
VTB0
VREF-ACB0
/INB0
INB1
VTB1
VREF-ACB1
/INB1
1
2
3
4
5
6
7
8910111213141516
32 31 30 29 28 27 26 25
/INA0
INA1
VTA1
VREF-ACA1
INA1
VREF-ACA0
VTA0
INA0
VCC
QB
/QB
VCC
GND
NC
SELB
VCC
32-Pin MLF® (MLF-32)
Ordering Information(1)
Package Operating Package Lead
Part Number Type Range Marking Finish
SY58027UMI MLF-32 Industrial SY58027U Sn-Pb
SY58027UMITR(2) MLF-32 Industrial SY58027U Sn-Pb
SY58027UMG(3) MLF-32 Industrial SY58027U with Pb-Free
Pb-Free bar-line indicator NiPdAu
SY58027UMGTR(2, 3) MLF-32 Industrial SY58027U with Pb-Free
Pb-Free bar-line indicator NiPdAu
Notes:
1. Contact factory for die availability. Dice are guaranteed at TA = 25°C, DC electricals only.
2. Tape and Reel.
3. Pb-Free package recommended for new designs.
3
Precision Edge®
SY58027U
Micrel, Inc.
M9999-082707
hbwhelp@micrel.com or (408) 955-1690
Absolute Maximum Ratings(1)
Power Supply Voltage (VCC ) ...................... –0.5V to +4.0V
Input Voltage (VIN) .......................................... –0.5V to VCC
LVPECL Output Current (IOUT)
Continuous..............................................................50mA
Surge ....................................................................100mA
Termination Current(3)
Source or sink current on VT......................................±100mA
Input Current
Source or sink current on IN, /IN ..........................±50mA
Current (VREF-AC)
Source or sink current on VREF-AC(3) ...................±1.5mA
Lead Temperature (soldering, 20 sec.) ..................... 260°C
Storage Temperature Range (TS ) ...........–65°C to +150°C
Operating Ratings(2)
Power Supply Voltage (VCC) ...............+2.375V to +2.625V
.............................................................+3.0V to +3.6V
Ambient Temperature Range (TA)..............–40°C to +85°C
Package Thermal Resistance
MLF® (θJA)
Still-Air............................................................. 35°C/W
500lpfm ........................................................... 28°C/W
MLF® (ψJB)(4)
Junction-to-board ............................................ 20°C/W
Symbol Parameter Condition Min Typ Max Units
VCC Power Supply VCC = 2.5V 2.375 2.5 2.625 V
VCC = 3.3V 3.0 3.3 3.6 V
ICC Power Supply Current No load, max. VCC. 100 140 mA
RDIFF_IN Differential Input Resistance 80 100 120 ý
(IN-to-/IN)
RIN Input Resistance
(IN-to-VT, /IN-to-VT) 40506
VIH Input High Voltage (IN, /IN) Note 6 VCC–1.6 VCC V
VIL Input Low Voltage (IN, /IN) 0 VIH –0.1 V
VIN Input Voltage Swing (IN, /IN) See Figure 1a. 0.1 1.7 V
VDIFF_IN Differential Input Voltage Swing See Figure 1b. 0.2 V
|IN – /IN|
VT IN In to VT (IN, /IN) 1.28 V
VREF-AC Output Reference Voltage VCC–1.3 VCC–1.2 VCC–1.1 V
Notes:
1. Permanent device damage may occur if ratings in the “Absolute Maximum Ratings” section are exceeded. This is a stress rating only and functional
operation is not implied for conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings
conditions for extended periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Due to the limited drive capability, use for input of the same package only.
4. Junction-to-board resistance assumes exposed pad is soldered (or equivalent) to the device’s most negative potential (GND) on the PCB. ΨJB uses 4-
layer θJA in still air unless otherwise stated.
5. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established .
6. VIH (min) not lower than 1.2V.
DC ELECTRICAL CHARACTERISTICS(5)
TA= –40°C to +85°C; Unless otherwise stated.
4
Precision Edge®
SY58027U
Micrel, Inc.
M9999-082707
hbwhelp@micrel.com or (408) 955-1690
VCC = 2.5V ±5% or 3.3V ±10%; TA = –40°C to +85°C; RL = 50ý to VCC–2V, unless otherwise stated.
Symbol Parameter Condition Min Typ Max Units
VOH Output HIGH Voltage VCC–1.145 VCC–0.895 V
Q, /Q
VOL Output LOW Voltage VCC–1.545 VCC–1.295 V
Q, /Q
VOUT Output Voltage Swing See Figure 1a. 150 40 0 mV
Q, /Q
VDIFF-OUT Differential Output Voltage Swing See Figure 1b. 300 800 mV
|Q-/Q|
LVPECL OUTPUTS DC ELECTRICAL CHARACTERISTICS(6)
VCC = 2.5V ±5% or 3.3V ±10%; TA= –40°C to 85°C unless otherwise stated.
Symbol Parameter Condition Min Typ Max Units
VIH Input HIGH Voltage 2.0 V
VIL Input LOW Voltage 0.8 V
IIH Input HIGH Current –175 75 µA
IIL Input LOW Current VIL = 0V –300 µA
LVTTL/CMOS DC ELECTRICAL CHARACTERISTICS(6)
Note:
6. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.
5
Precision Edge®
SY58027U
Micrel, Inc.
M9999-082707
hbwhelp@micrel.com or (408) 955-1690
TRUTH TABLES
INA0 /INA0 INA1 /INA1 SELA QA /QA
01XX001
10XX010
XX01101
XX10110
INB0 /INB0 INB1 /INB1 SELB QB /QB
01XX001
10XX010
XX01101
XX10110
AC ELECTRICAL CHARACTERISTICS(7)
VCC = 2.5V ±5% or 3.3V ±10%; TA= –40°C to +85°C; RL = 50ý to VCC–2V, unless otherwise stated.
Symbol Parameter Condition Min Typ Max Units
fMAX Maximum Operating Frequency NRZ Data 10.7 Gbps
VOUT ž 200mV Clock 7 GHz
tpd Propagation Delay IN-to-Q VIN ž 300mV 140 215 290 ps
SEL-to-Q 100 220 400 ps
tSKEW Input-to-Input Skew (Within-bank) Note 8 615ps
Bank-to-Bank Skew Note 9 820ps
Part-to-Part Skew Note 10 100 ps
tJITTER Data Random Jitter (RJ) Note 11 1ps
RMS
Deterministic Jitter (DJ) Note 12 10 psPP
Clock Cycle-to-Cycle Jitter (RJ) Note 13 1ps
RMS
Total Jitter (TJ) Note 14 10 psPP
Crosstalk-Induced Jitter
Channel-to-Channel Note 15, Within-bank. 0.7 psRMS
tr, tfOutput Rise/Fall Time 20% to 80% At full swing. 20 55 80 ps
Notes:
7. High-speed AC parameters are guaranteed by design and characterization. VIN swing ž 100mV unless otherwise noted.
8. Input-to-input skew is the difference in time between two inputs to the output within a bank.
9. Bank-to-bank skew is the difference in time from input to the output between bank.
10. Part-to-part skew is defined for two parts with identical power supply voltages at the same temperature and with no skew of the edges at the
respective inputs.
11. Random jitter is measured with a K28.7 comma detect character pattern, measured at 5Gbps and 2.5Gbps/3.2Gbps.
12. Deterministic jitter is measured at 2.5Gbps/3.2Gbps, with both K28.5 and 223–1 PRBS pattern.
13. Cycle-to-cycle jitter definition: the variation of periods between adjacent cycles, Tn–Tn–1 where T is the time between rising edges of the output
signal.
14. Total jitter definition: with an ideal clock input of frequency - fMAX, no more than one output edge in 10 12 output edges will deviate by more than the
specified peak-to-peak jitter value.
15. Crosstalk is measured at the output while applying two similar frequencies that are asynchronous with respect to each other at the inputs.
6
Precision Edge®
SY58027U
Micrel, Inc.
M9999-082707
hbwhelp@micrel.com or (408) 955-1690
SINGLE-ENDED AND DIFFERENTIAL SWINGS
V
IN
,
V
OUT
400mV (Typ
.)
Figure 1a. Single-Ended Voltage Swing
V
DIFF_IN
,
V
DIFF_OUT
800mV (Typ
.)
Figure 1b. Differential Voltage Swing
INA0, INA1
/
INA0, /INA1
QA
/QA
tpd
INB0, INB1
/
INB0, /INB1
QB
/QB
tpd
SELA
SELA-to-QA
QA
/QA
tpd
SELB
SELB-to-QB
QB
/QB
tpd
tp
d
tp
d
TIMING DIAGRAM
7
Precision Edge®
SY58027U
Micrel, Inc.
M9999-082707
hbwhelp@micrel.com or (408) 955-1690
TYPICAL OPERATING CHARACTERISTICS
200MHz Output
TIME (600ps/div.)
Output Swing
(100mV/div.)
TA = 25°C
VCC = 3.3V
2GHz Output
TIME (70ps/div.)
Output Swing
(100mV/div.)
TA = 25°C
VCC = 3.3V
/Q
Q
2.5Gbps Output
TIME (100ps/div.)
Output Swing
(100mV/div.)
TA = 25°C
VCC = 3.3V
3.2Gbps Output
TIME (100ps/div.)
Output Swing
(100mV/div.)
TA = 25°C
VCC = 3.3V
150
160
170
180
190
200
210
220
230
-50 -25 0 25 50 75 100
PROPAGATION DELAY (ps)
TEMPERATURE (°C)
Propagation Delay
vs. Temperature
PECL (800mV)
CML (200mV)
LVDS (400mV)
HSTL (1000mV)
0
50
100
150
200
250
300
350
400
450
500
0
2000
4000
6000
8000
10000
12000
OUTPUT SWING (mV)
FREQUENCY (MHz)
Frequency
vs. Output Swing
VCC = 3.3V, TA = 25°C, RL = 50ý to VCC – 2V, DC coupled, unless otherwise stated.
5Gbps Output
TIME (50ps/div.)
Output Swing
(100mV/div.)
/Q
Q
T
A
= 25°C
V
CC
= 3.3V
8
Precision Edge®
SY58027U
Micrel, Inc.
M9999-082707
hbwhelp@micrel.com or (408) 955-1690
INPUT AND OUTPUT STAGE INTERNAL TERMINATION
50
50
V
CC
GND
/
IN
V
T
IN
Figure 2a. Simplified Differential Input Stage
V
CC
Q
/Q
Figure 2b. Simplified LVPECL Output Stage
INPUT INTERFACE APPLICATIONS
LVPECL
IN
/IN
SY58027
U
V
CC
R
p
R
p
For V
CC
=3.3V, R
p
= 100Ω.
For V
CC
=2.5V, R
p
= 50.
G
ND
GND
V
T
0.01µF
V
CC
V
REF-AC
Figure 3b. AC-Coupled
PECL Interface
LVDS IN
/IN
NC
SY58027
U
V
CC
V
T
NC
G
ND
V
REF-AC
Figure 3c. LVDS
Interface
CML IN
/IN
VREF-AC
NC
SY58027
U
VCC
VT
NC
G
ND
Option: May connect VT to VCC.
Figure 3d. DC-Coupled
CML Interface
CML IN
/IN
VREF-AC
VT
0.01µF
SY58027
U
VCC
VCC
G
ND
Figure 3e. AC-Coupled
CML Interface
LVPECL
IN
/IN
VT
SY58027U
VCC
0.01µF
RpNC
For VCC = 3.3V, Rp = 50Ω.
For VCC = 2.5V, Rp = 19Ω.
G
ND
VREF-AC
GND
VCC
Figure 3a. DC-Coupled
PECL Interface
9
Precision Edge®
SY58027U
Micrel, Inc.
M9999-082707
hbwhelp@micrel.com or (408) 955-1690
RELATED MICREL PRODUCTS AND SUPPORT DOCUMENTATION
OUTPUT INTERFACE APPLICATIONS
R2
82
R2
82
ZO = 50
ZO = 50
+3.3V +3.3V
R1
130R1
130
+3.3V
Figure 4a. Parallel Thevenin-Equivalent
Termination
Z
O
= 50
Z
O
= 50
5050
50
+3.3V +3.3V
C (Optiona
l)
0.01µF
V
CC
Figure 4b. Parallel Termination
(3-Resistor)
+3.3V
R2
82
+3.3V
R1
130
Terminate unused outpu
t
to VCC –2V to balance
the differential output pa
ir.
Figure 4c. Terminating Unused Output
Part Number Function Data Sheet Link
SY58016L 3.3V 10Gbps Differential CML Line Driver/Receiver http://www.micrel.com/product-info/products/sy58016l.shtml
with Internal Termination
SY58017U 10.7Gbps Differential CML 2:1 MUX with http://www.micrel.com/product-info/products/sy58017u.shtml
Internal Termination
SY58018U 5Gbps LVPECL 2:1 MUX with Internal Termination http://www.micrel.com/product-info/products/sy58018u.shtml
SY58019U 10.7Gbps 400mV LVPECL 2:1 MUX with http://www.micrel.com/product-info/products/sy58019u.shtml
Internal Termination
SY58025U 10.7Gbps Dual 2:1 CML MUX with http://www.micrel.com/product-info/products/sy58025u.shtml
Internal Termination
SY58026U 5Gbps Dual 2:1 LVPECL MUX with Internal http://www.micrel.com/product-info/products/sy58026u.shtml
Termination
SY58051U 10.7Gbps AnyGate® with Internal Input and Output http://www.micrel.com/product-info/products/sy58051u.shtml
Termination
SY58052U 10Gbps Clock/Data Retimer with 50ý Input Termination http://www.micrel.com/product-info/products/sy58052u.shtml
MLF™ Application Note www.amkor.com/products/notes_papers/MLF_AppNote_0902.pdf
HBW Solutions New Products and Applications www.micrel.com/product-info/products/solutions.shtml
10
Precision Edge®
SY58027U
Micrel, Inc.
M9999-082707
hbwhelp@micrel.com or (408) 955-1690
32-PIN MicroLeadFrame® (MLF-32)
MICREL, INC. 2180 FORTUNE DRIVE SAN JOSE, CA 95131 USA
TEL + 1 (408) 944-0800 FAX + 1 (408) 474-1000 WEB http://www.micrel.com
The information furnished by Micrel in this data sheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use.
Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can
reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into
the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser’s
use or sale of Micrel Products for use in life support appliances, devices or systems is at Purchaser’s own risk and Purchaser agrees to fully indemnify
Micrel for any damages resulting from such use or sale.
© 2005 Micrel, Incorporated.
Package Notes:
1. Package meets Level 2 Moisture Sensitivity Classification.
2. All parts are dry-packaged before shipment.
3. Exposed pads must be soldered to a ground for proper thermal management.
Package
EP- Exposed Pa
d
Die
CompSide Island
Heat Dissipation
Heavy Copper Plane
Heavy Copper Plane
V
EE
V
EE
Heat Dissipation
PCB Thermal Consideration for 32-Pin MLF® Package
(Always solder, or equivalent, the exposed pad to the PCB)