CL21C470JB61PNC - Samsung [Electro-Mechanics]

 Supplier : Samsung electro-mechanics  Samsung P/N : CL21C470JB61PNC

 Product : Multi-layer Ceramic Capacitor  Description : CAP, 47㎊, 50V, ±5%, C0G, 0805

 AEC-Q 200 Specified

CL 21 C 470 J B 6 1 P N C

① ② ③ ④ ⑤ ⑥ ⑦ ⑧⑨⑩⑪

①Series Samsung Multi-layer Ceramic Capacitor

②Size 0805 (inch code) L: 2.0 ± 0.1 mm W: ± 0.1 mm

③Dielectric C0G ⑧Inner electrode Ni

④Capacitance 47 ㎊Termination Cu

⑤Capacitance ±5 % Plating Sn 100% (Pb Free)

tolerance ⑨Product Automotive

⑥Rated Voltage 50 V ⑩Grade code Standard

⑦Thickness 0.6 ± 0.1 mm ⑪Packaging Cardboard Type, 7" reel

B. Reliablility Test and Judgement condition

High Temperature Unpowered, 1000hrs@T=150℃

Exposure Capacitance Change : Measurement at 24±2hrs after test conclusion

within ±2.5% or ±0.25㎊ whichever is larger

Q : 1000 min

IR : More than 10,000㏁ or 500㏁×㎌

Whichever is Smaller

Temperature Cycling 1000Cycles

Capacitance Change : Measurement at 24±2hrs after test conclusion

within ±2.5% or ±0.25㎊ whichever is larger 1 cycle condition :

Q : 1000 min -55+0/-3℃(15±3min) -> Room Temp(1min.)

IR : More than 10,000㏁ or 500㏁×㎌ -> 125+3/-0℃(15±3min) -> Room Temp(1min.)

Whichever is Smaller

Destructive Physical No Defects or abnormalities Per EIA 469

Analysis

Moisture Resistance 10Cycles, t=24hrs/cycle

Capacitance Change : Heat (25~65℃) and humidity (80~98%), Unpowered

within ±2.5% or ±0.25㎊ whichever is larger measurement at 24±2hrs after test conclusion

Q : 350 min

IR : More than 10,000㏁ or 500㏁×㎌

Whichever is Smaller

Humidity Bias 1000hrs 85℃/85%RH, Rated Voltate and 1.3~1.5V,

Capacitance Change : Add 100kohm resistor

within ±2.5% or ±0.25㎊ whichever is larger Measurement at 24±2hrs after test conclusion

Q : 200 min The charge/discharge current is less than 50mA.

IR : More than 500㏁ or 25㏁×㎌

Whichever is Smaller

High Temperature 1000hrs @ TA=125℃, 200% Rated Voltage,

Operating Life Capacitance Change : Measurement at 24±2hrs after test conclusion

within ±3.0% or ±0.3㎊ whichever is larger The charge/discharge current is less than 50mA.

Q : 350 min

IR : More than 10,000㏁ or 500㏁×㎌

Whichever is Smaller

1.25

Specification of Automotive MLCC

A. Samsung Part Number

Appearance : No abnormal exterior appearance

Performance Test condition

Appearance : No abnormal exterior appearance

External Visual No abnormal exterior appearance Microscope (´10)

Physical Dimensions Within the specified dimensions Using The calipers

Mechanical Shock Three shocks in each direction should be applied along

Capacitance Change : 3 mutually perpendicular axes of the test specimen (18 shocks)

within ±2.5% or ±0.25㎊ whichever is larger

Q, IR : initial spec.

Vibration 5g's for 20min., 12cycles each of 3 orientations,

Capacitance Change : Use 8"×5" PCB 0.031" Thick 7 secure points on one long side

within ±2.5% or ±0.25㎊ whichever is larger and 2 secure points at corners of opposite sides. Parts mounted

Q, IR : initial spec. within 2" from any secure point. Test from 10~2000㎐.

Resistance to Solder pot : 260±5℃, 10±1sec.

Solder Heat Capacitance Change :

within ±2.5% or ±0.25㎊ whichever is larger

Q, IR : initial spec.

Thermal Shock -55℃/+125℃.

Capacitance Change : Note: Number of cycles required-300,

within ±2.5% or ±0.25㎊ whichever is larger Maximum transfer time-20 sec, Dwell time-15min. Air-Air

Q, IR : initial spec.

ESD AEC-Q200-002

Capacitance Change :

within ±2.5% or ±0.25㎊ whichever is larger

Q, IR : initial spec.

Solderability 95% of the terminations is to be soldered a) Preheat at 155℃ for 4 hours, Immerse in solder for 5s at 245±5℃

evenly and continuously b) Steam aging for 8 hours, Immerse in solder for 5s at 245±5℃

c) Steam aging for 8 hours, Immerse in solder for 120s at 260±5℃

solder : a solution ethanol and rosin

Electrical Capacitance : Within specified tolerance The Capacitance /Q should be measured at 25℃,

Characterization Q : 1000 max. 1㎒±10%, 0.5~5Vrms

IR(25℃) : More than 100,000㏁ or 1,000㏁×㎌I.R. should be measured with a DC voltage not exceeding

IR(125℃) : More than10,000㏁ or 100㏁×㎌Rated Voltage @25℃, @125℃ for 60~120 sec.

Whichever is Smaller Dielectric Strength : 250% of the rated voltage for 1~5 seconds

Dielectric Strength

Board Flex Bending to the limit (3㎜) for 5 seconds

Capacitance Change :

within ±5.0% or ±0.5㎊ whichever is larger

Terminal 18N, for 60±1 sec.

Strength(SMD) Capacitance Change :

within ±2.5% or ±0.25㎊ whichever is larger

Beam Load Destruction value should not be exceed Beam speed

Chip Length < 2.5㎜0.5±0.05㎜/sec

a) Chip Thickness > 0.5㎜ : 20N

b) Chip Thickness ≤ 0.5㎜ : 8N

Temperature C0G

Characterisitcs (From -55℃ to 125℃, Capacitance change shoud be within ±30PPM/℃)

C. Recommended Soldering method :

Reflow ( Reflow Peak Temperature : 260+0/-5℃, 10sec. Max )

Meet IPC/JEDEC J-STD-020 D Standard

* For the more detail Specification, Please refer to the Samsung MLCC catalogue.

Peakvalue

Appearance : No abnormal exterior appearance

0.5ms Half sine 4.7m/sec.

Appearance : No abnormal exterior appearance

Duration Wave

Appearance : No abnormal exterior appearance

1,500G

Test condition

Velocity

Performance