SPECIFICATIONS Burn-in & test socket BI TS Series Clamshell, BG A/ LGA Type 1.27 mm [.05"] Pitch Mechanical Durability: 10'000 cycles min. Actuation force: 1.5kgf max. DUT Heat Dissipation: 150W max. under 6 CFM. 41x41 Grid Size Max. Compressed Contact Design Electrical Current Rating: 1Amp/pin min. Dielectric Withstanding Voltage: 650V A.C for 60 sec. Insulation Resistance: 1000M min. Contact Resistance: 300m max. Hast: Pass 130 at 85% RH, 168 hours duration THB: Pass 85 at 85% RH, 1000 hours duration Bake : Pass 150 for 168 hours Physical Cover & Base: Thermoplastic, UL 94V-0 Contact: Copper alloy Contact Plating: See "ORDERING INFORMATION" Operating Temperature: 150 max. DRAWING ORDERING I NF OR MATI ON PRODUCT NO.: 2 Q * * * * 3 * - 2 0 * 0 - 1 0 F Pin Counts 1681=1681 Pos. 1368=1368 Pos LF Code F=LF Tail Plating Pick-up Design 3=Au Contact Plating 0=None 3=30" Gold Plating 7=15" Gold Plating Package 1=Soft Tray Chip/Burn-in Board 2=BGA/LGA Chip Spec. 0=None Pitch Design Type 0=1.27 mm 1=Type #1 2=Type #2 All specification & dimensions are subject to change, please call your nearest Foxconn sales representative for update information.