INTEGRATED CIRCUITS DIVISION
www.ixysic.com
DS-LAA108-R04 1
LAA108
Dual Single-Pole, Normally Open
OptoMOS® Relay
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Pb
Part # Description
LAA108 8-Pin DIP (50/Tube)
LAA108S 8-Pin Surface Mount (50/Tube)
LAA108STR 8-Pin Surface Mount (1,000/Reel)
LAA108P 8-Pin Flat Pack (50/Tube)
LAA108PTR 8-Pin Flat Pack (1,000/Reel)
Parameter Ratings Units
Blocking Voltage 100 VP
Load Current 300 mArms / mADC
On-Resistance (max) 8
Applications
Features
Description
Approvals
Ordering Information
Pin Configuration
Switching Characteristics of
Normally Open (Form A) Devices
Form-A
I
F
I
LOAD
10%
90%
t
on
t
off
• 3750Vrms Input/Output Isolation
• Low Drive Power Requirements
(TTL/CMOS Compatible)
• High Reliability
• Arc-Free With No Snubbing Circuits
• FCC Compatible
• VDE Compatible
• No EMI/RFI Generation
• Small 8-Pin Package
• Machine Insertable, Wave Solderable
• Surface Mount Tape & Reel Versions Available
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment-Patient/Equipment Isolation
• Security
• Aerospace
• Industrial Controls
IXYS Integrated Circuits Division's LAA108 is
a 100V, 300mA, 8 dual single-pole, normally
open (1-Form-A) Solid State Relay that has two
independently controlled, optically coupled outputs.
The output MOSFET switches and photovoltaic die
employ optically coupled MOSFET technology to
provide 3750 Vrms of input-to-output isolation.
The relay outputs, that use patented OptoMOS
architecture, are controlled by a highly efficient
GaAlAS infrared LED.
This dual single-pole OptoMOS relay provides a more
compact design solution than two discrete
single-pole relays in a variety of applications, saving
board space by incorporating both switches in a single
8-Pin package.
• UL Certified Component: File E76270
• CSA Certified Component: Certificate 1175739
• EN/IEC 60950-1 Certified Component:
TUV Certificate B 10 05 49410 006
1
2
3
4
8
7
6
5
+ Control - Switch #1
– Control - Switch #1
+ Control - Switch #2
– Control - Switch #2
Load - Switch #1
Load - Switch #1
Load - Switch #2
Load - Switch #2
INTEGRATED CIRCUITS DIVISION
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2R04
LAA108
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Parameter Conditions Symbol Min Typ Max Units
Output Characteristics
Load Current
Continuous 1-I
L- - 300 mArms / mADC
Peak t =10ms ILPK - - ±400 mAP
On-Resistance 2IL=300mA RON - 4.5 8
Off-State Leakage Current VL=100VPILEAK --1 A
Switching Speeds
Turn-On IF=5mA, VL=10V ton - 0.43 3 ms
Turn-Off toff - 0.17 3
Output Capacitance VL=50V, f=1MHz COUT - 110 - pF
Input Characteristics
Input Control Current to Activate 3IL=300mA IF- 0.5 2 mA
Input Control Current to Deactivate - - 0.2 0.3 - mA
Input Voltage Drop IF=5mA VF0.9 1.2 1.4 V
Reverse Input Current VR=5V IR--10 A
Common Characteristics
Input to Output Capacitance - CI/O -3- pF
1 If both poles operate simultaneously, the load current must be derated so as not to exceed the package total power dissipation value.
2 Measurement taken within one (1) second of on-time.
3 For applications requiring high-temperature operation (T>60ºC), a LED drive currrent of 4mA is recommended.
Parameter Ratings Units
Blocking Voltage 100 VP
Reverse Input Voltage 5 V
Input Control Current 50 mA
Peak (10ms) 1 A
Input Power Dissipation 1150 mW
Total Power Dissipation 2800 mW
Isolation Voltage, Input to Output 3750 Vrms
Operational Temperature -40 to +85 °C
Storage Temperature -40 to +125 °C
1 Derate linearly 1.33 mW / °C
2 Derate linearly 6.67 mW / °C
Absolute Maximum Ratings @ 25°C
Electrical Characteristics @ 25ºC (Unless Otherwise Noted)
INTEGRATED CIRCUITS DIVISION
LAA108
www.ixysic.com 3
R04
PERFORMANCE DATA@ 25ºC (Unless Otherwise Noted)*
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
LED Forward Voltage (V)
1.26 1.27 1.28 1.29 1.30 1.31
Device Count (N)
0
5
10
15
20
25
30
LED Forward Voltage Distribution
(IF=5mA)
Turn-On Time (ms)
0.135 0.150 0.165 0.180 0.195 0.210 0.225
Device Count (N)
0
5
10
15
20
Turn-On Time Distribution
(IF=5mA, IL=200mA)
Turn-Off Time (ms)
0.34 0.38 0.42 0.46 0.50 0.54 0.58
Device Count (N)
0
5
10
15
20
25
Turn-Off Time Distribution
(IF=5mA, IL=200mA)
0.40 0.45 0.50 0.55 0.60 0.65 0.70
Device Count (N)
0
5
10
15
20
LED Current to Operate Distribution
(IL=100mA)
LED Current to Operate (mA) On-Resistance (:)
4.46 4.48 4.50 4.52 4.54 4.56 4.58
Device Count (N)
0
5
10
15
20
On-Resistance Distribution
(IF=2mA, IL=200mA)
Blocking Voltage (VP)
139 140 141 142 143 144
Device Count (N)
0
5
10
15
20
25
Blocking Voltage Distribution
-40 -20 0 20 40 60 80 100
1.0
1.1
1.2
1.3
1.4
1.5
1.6
Temperature (ºC)
LED Forward Voltage (V)
LED Forward Voltage vs. Temperature
IF=20mA
IF=50mA
IF=5mA
IF=10mA
IF=2mA
LED Forward Current (mA)
0 1020304050
Turn-On Time (ms)
0
0.1
0.2
0.3
0.4
0.5
Turn-On Time vs. LED Forward Current
(IL=80mA)
LED Forward Current (mA)
0 1020304050
Turn-Off Time (ms)
0.425
0.430
0.435
0.440
0.445
0.450
Turn-Off Time vs. LED Forward Current
(IL=80mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Current (mA)
0.45
0.50
0.55
0.60
0.65
0.70
0.75
0.80
LED Current to Operate
vs. Temperature
(IL=100mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Turn-On Time (ms)
0.14
0.16
0.18
0.20
0.22
0.24
0.26
Turn-On Time vs. Temperature
(IF=5mA, IL=80mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Turn-Off Time (ms)
0.25
0.30
0.35
0.40
0.45
0.50
0.55
0.60
0.65
Turn-Off Time vs. Temperature
(IF=5mA, IL=80mA)
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
4R04
LAA108
PERFORMANCE DATA@ 25ºC (Unless Otherwise Noted)*
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifi cations, please
contact our application department.
Temperature (ºC)
-40 -20 0 20 40 60 80 100
On-Resistance (:)
4.0
4.5
5.0
5.5
6.0
6.5
On-Resistance vs. Temperature
(IF=2mA, IL=200mA)
Load Voltage (V)
-0.3 -0.2 -0.1 0.0 0.1 0.2 0.3
Load Current (mA)
-0.6
-0.4
-0.2
0.0
0.2
0.4
0.6
Typical Load Current vs. Load Voltage
(IF=2mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Load Current (mA)
100
150
200
250
300
350
400
450
500
Maximum Load Current
vs. Temperature
(IF=5mA)
Single Pole Operating
Total Current - Both Poles Operating *
* Neither pole to exceed
single pole limits
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Blocking Voltage (VP)
134
136
138
140
142
144
146
148
150
Blocking Voltage vs. Temperature
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Leakage (nA)
0
5
10
15
20
25
Leakage Current vs. Temperature
Measured Across Pins 5 & 6, 7 & 8
(VL=100V)
Time
10Ps 100Ps 1ms 10ms 100ms 1s 10s 100s
Load Curent (A)
Energy Rating Curve
(Single Pole, IF=5mA)
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0.2
INTEGRATED CIRCUITS DIVISION
LAA108
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R04
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Rating
LAA108 / LAA108S / LAA108P MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device Maximum Temperature x Time
LAA108 / LAA108S 250ºC for 30 seconds
LAA108P 260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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INTEGRATED CIRCUITS DIVISION
www.ixysic.com
6R04
LAA108
MECHANICAL DIMENSIONS
LAA108
LAA108S
LAA108P
Dimensions
mm
(inches)
PCB Hole Pattern
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
9.144 ± 0.508
(0.360 ± 0.020)
0.457 ± 0.076
(0.018 ± 0.003)
9.652 ± 0.381
(0.380 ± 0.015)
7.239 TYP.
(0.285)
7.620 ± 0.254
(0.300 ± 0.010)
4.064 TYP
(0.160)
0.813 ± 0.102
(0.032 ± 0.004)
8-0.800 DIA.
(8-0.031 DIA.) 2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
Pin 1
0.254 ± 0.0127
(0.010 ± 0.0005)
Dimensions
mm
(inches)
PCB Land Pattern
9.398 ± 0.127
(0.370 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
0 MIN / 0.102 MAX
(0 MIN / 0.004 MAX)
2.286 MAX.
(0.090 MAX.)
0.203 ± 0.013
(0.008 ± 0.0005)
0.635 ± 0.127
(0.025 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
0.457 ± 0.076
(0.018 ± 0.003)
2.159 ± 0.025
(0.085 ± 0.001)
2.54
(0.10)
8.70
(0.3425)
1.55
(0.0610)
0.65
(0.0255)
0.864 ± 0.120
(0.034 ± 0.004)
Pin 1
Dimensions
mm
(inches)
PCB Land Pattern
2.540 ± 0.127
(0.100 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
6.350 ± 0.127
(0.250 ± 0.005)
9.525 ± 0.254
(0.375 ± 0.010)
0.457 ± 0.076
(0.018 ± 0.003)
0.813 ± 0.102
(0.032 ± 0.004)
4.445 ± 0.127
(0.175 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
0.635 ± 0.127
(0.025 ± 0.005)
0.254 ± 0.0127
(0.010 ± 0.0005)
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
0.65
(0.0255)
3.302 ± 0.051
(0.130 ± 0.002)
Pin 1
INTEGRATED CIRCUITS DIVISION
For additional information please visit our website at: www.ixysic.com
7
LAA108
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-LAA108-R04
©Copyright 2012, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/19/2012
MECHANICAL DIMENSIONS
LAA108STR Tape & Reel
LAA108PTR Tape & Reel
Dimensions
mm
(inches)
User Direction of Feed
NOTES:
1. Dimensions carry tolerances of EIA Standard 481-2
2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
K1
=4.20
(0.165)
0
K =4.90
(0.193)
P=12.00
(0.472)
W=16.00
(0.63)
Bo=10.30
(0.406)
Ao=10.30
(0.406)
Dimensions
mm
(inches)
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
User Direction of Feed
P = 12.00
(0.472)
W = 16.00
(0.63)
Bo = 10.30
(0.406)
Ao = 10.30
(0.406)
K1 = 2.00
(0.079)
K0 = 2.70
(0.106)
7.50
(0.295)
2.00
(0.079)
4.00
(0.157)
