 
 
SCLS079E − MARCH 1984 − REVISED MARCH 2004
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DWide Operating Voltage Range of 2 V to 6 V
DOutputs Can Drive Up To 10 LSTTL Loads
DLow Power Consumption, 20-µA Max ICC
DTypical tpd = 7 ns
D±4-mA Output Drive at 5 V
DLow Input Current of 1 µA Max
DUnbuffered Outputs
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1A
1Y
2A
2Y
3A
3Y
GND
VCC
6A
6Y
5A
5Y
4A
4Y
SN54HCU04 ...J OR W PACKAGE
SN74HCU04 . . . D, DB, N, NS, OR PW PACKAGE
(TOP VIEW)
3212019
910111213
4
5
6
7
8
18
17
16
15
14
6Y
NC
5A
NC
5Y
2A
NC
2Y
NC
3A
1Y
1A
NC
4Y
4A V
6A
3Y
GND
NC
SN54HCU04 . . . FK PACKAGE
(TOP VIEW)
CC
NC − No internal connection
description/ordering information
The ’HCU04 devices contain six independent inverters. They perform the Boolean function Y = A in positive
logic.
ORDERING INFORMATION
TAPACKAGE†ORDERABLE
PART NUMBER TOP-SIDE
MARKING
PDIP − N Tube of 25 SN74HCU04N SN74HCU04N
Tube of 50 SN74HCU04D
SOIC − D Reel of 2500 SN74HCU04DR HCU04
SOIC − D
Reel of 250 SN74HCU04DT
HCU04
−40°C to 85°CSOP − NS Reel of 2000 SN74HCU04NSR HCU04
−40 C to 85 C
SSOP − DB Reel of 2000 SN74HCU04DBR HU04
Reel of 90 SN74HCU04PW
TSSOP − PW Reel of 2000 SN74HCU04PWR HCU04
TSSOP − PW
Reel of 250 SN74HCU04PWT
HCU04
CDIP − J Tube of 25 SNJ54HCU04J SNJ54HCU04J
−55°C to 125°CCFP − W Tube of 150 SNJ54HCU04W SNJ54HCU04W
−55 C to 125 C
LCCC − FK Tube of 55 SNJ54HCU04FK SNJ54HCU04FK
†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Copyright 2004, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
    !   "#$ %!&
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 
SCLS079E − MARCH 1984 − REVISED MARCH 2004
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
FUNCTION TABLE
(each inverter)
INPUT
AOUTPUT
Y
H L
L H
logic diagram (positive logic)
AY
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC −0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous output current, IO (VO = 0 to VCC) ±25 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous current through VCC or GND ±50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Note 2): D package 86°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DB package 96°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
N package 80°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
NS package 76°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PW package 113°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
SN54HCU04 SN74HCU04
UNIT
MIN NOM MAX MIN NOM MAX
UNIT
VCC Supply voltage 2 5 6 2 5 6 V
VCC = 2 V 1.7 1.7
V
IH
High-level input voltage VCC = 4.5 V 3.6 3.6 V
VIH
High-level input voltage
VCC = 6 V 4.8 4.8
V
VCC = 2 V 0.5 0.5
V
IL
Low-level input voltage VCC = 4.5 V 1.35 1.35 V
VIL
Low-level input voltage
VCC = 6 V 1.8 1.8
V
VIInput voltage 0 VCC 0 VCC V
VOOutput voltage 0 VCC 0 VCC V
TAOperating free-air temperature −55 125 −40 85 °C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
 
 
SCLS079E − MARCH 1984 − REVISED MARCH 2004
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
TA = 25°C SN54HCU04 SN74HCU04
UNIT
PARAMETER
TEST CONDITIONS
V
CC MIN TYP MAX MIN MAX MIN MAX
UNIT
2 V 1.8 1.8 1.8
I
OH
= −20 µA4.5 V 4 4 4
V
OH
V
= V
or GND
IOH = −20 µA
6 V 5.5 5.5 5.5 V
VOH
IOH = −4 mA 4.5 V 3.98 3.7 3.84
V
IOH = −5.2 mA 6 V 5.48 5.2 5.34
2 V 0.2 0.2 0.2
I
OL
= 20 µA4.5 V 0.5 0.5 0.5
V
OL
V
= V
or GND
IOL = 20 µA
6 V 0.5 0.5 0.5 V
VOL
IOL = 4 mA 4.5 V 0.26 0.4 0.33
V
IOL = 5.2 mA 6 V 0.26 0.4 0.33
IIVI = VCC or 0 6 V ±100 ±1000 ±1000 nA
ICC VI = VCC or 0, IO = 0 6 V 2 40 20 µA
Ci2 V to 6 V 3 10 10 10 pF
switching characteristics over recommended operating free-air temperature range, CL = 50 pF
(unless otherwise noted) (see Figure 1)
PARAMETER
FROM
TO
VCC
TA = 25°C SN54HCU04 SN74HCU04
UNIT
PARAMETER
FROM
(INPUT)
TO
(OUTPUT)
V
CC MIN TYP MAX MIN MAX MIN MAX
UNIT
2 V 40 80 120 100
t
pd
A Y 4.5 V 8 16 24 20 ns
tpd
A
Y
6 V 7 14 20 17
ns
2 V 38 75 110 95
t
f
Y4.5 V 8 15 22 19 ns
tf
Y
6 V 6 13 19 16
ns
operating characteristics, TA = 25°C
PARAMETER TEST CONDITIONS TYP UNIT
Cpd Power dissipation capacitance per inverter No load 20 pF
 
 
SCLS079E − MARCH 1984 − REVISED MARCH 2004
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
VOLTAGE WAVEFORM
INPUT RISE AND FALL TIMES
50%50% 10%10% 90% 90% VCC
0 V
trtf
Input
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
50%
50%50% 10%10% 90% 90%
V
CC
VOH
VOL
0 V
tr†tf
Input
In-Phase
Output
50%
tPLH tPHL
50% 50%
10% 10% 90%90% VOH
VOL
tr†
tf
tPHL tPLH
Out-of-Phase
Output
Test
Point
From Output
Under Test
CL = 50 pF
(see Note A)
LOAD CIRCUIT
NOTES: A. CL includes probe and test-fixture capacitance.
B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 6 ns, tf = 6 ns.
C. The outputs are measured one at a time, with one input transition per measurement.
D. t
PLH
and t
PHL
are the same as t
pd
.
†tr is not applicable to ’HCU devices.
Figure 1. Load Circuit and Voltage Waveforms
IMPORTANT NOTICE
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TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products andapplications using TI components. To minimize the risks associated with customer products and applications, customers shouldprovide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, maskwork right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or servicesare used. Information published by TI regarding third-party products or services does not constitute a license from TI to use suchproducts or services or a warranty or endorsement thereof. Use of such information may require a license from a third party underthe patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and isaccompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is anunfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or servicevoids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive businesspractice. TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product wouldreasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreementspecifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramificationsof their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-relatedrequirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding anyapplications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and itsrepresentatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products arespecifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet militaryspecifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade issolely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements inconnection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI productsare designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use anynon-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
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Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2007, Texas Instruments Incorporated
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
86010012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
8601001CA ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
SN54HCU04J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
SN74HCU04D ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCU04DBR ACTIVE SSOP DB 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCU04DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCU04DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCU04DE4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCU04DG4 ACTIVE SOIC D 14 50 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCU04DR ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCU04DRE4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCU04DRG4 ACTIVE SOIC D 14 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCU04DT ACTIVE SOIC D 14 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCU04DTE4 ACTIVE SOIC D 14 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCU04DTG4 ACTIVE SOIC D 14 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCU04N ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74HCU04N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74HCU04NE4 ACTIVE PDIP N 14 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
SN74HCU04NSR ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCU04NSRE4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCU04NSRG4 ACTIVE SO NS 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCU04PW ACTIVE TSSOP PW 14 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCU04PWE4 ACTIVE TSSOP PW 14 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCU04PWG4 ACTIVE TSSOP PW 14 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCU04PWR ACTIVE TSSOP PW 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCU04PWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCU04PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 15-Oct-2009
Addendum-Page 1
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
no Sb/Br)
SN74HCU04PWT ACTIVE TSSOP PW 14 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCU04PWTE4 ACTIVE TSSOP PW 14 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74HCU04PWTG4 ACTIVE TSSOP PW 14 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SNJ54HCU04FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54HCU04J ACTIVE CDIP J 14 1 TBD A42 N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 15-Oct-2009
Addendum-Page 2
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74HCU04DBR SSOP DB 14 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
SN74HCU04DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74HCU04DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74HCU04NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
SN74HCU04PWR TSSOP PW 14 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 19-Mar-2008
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74HCU04DBR SSOP DB 14 2000 346.0 346.0 33.0
SN74HCU04DR SOIC D 14 2500 346.0 346.0 33.0
SN74HCU04DR SOIC D 14 2500 333.2 345.9 28.6
SN74HCU04NSR SO NS 14 2000 346.0 346.0 33.0
SN74HCU04PWR TSSOP PW 14 2000 346.0 346.0 29.0
PACKAGE MATERIALS INFORMATION
www.ti.com 19-Mar-2008
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°–ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,65 M
0,10
0,10
0,25
0,50
0,75
0,15 NOM
Gage Plane
28
9,80
9,60
24
7,90
7,70
2016
6,60
6,40
4040064/F 01/97
0,30
6,60
6,20
80,19
4,30
4,50
7
0,15
14
A
1
1,20 MAX
14
5,10
4,90
8
3,10
2,90
A MAX
A MIN
DIM PINS **
0,05
4,90
5,10
Seating Plane
0°–8°
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
MECHANICAL DATA
MLCC006B – OCTOBER 1996
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER
4040140/D 10/96
28 TERMINAL SHOWN
B
0.358
(9,09)
MAX
(11,63)
0.560
(14,22)
0.560
0.458
0.858
(21,8)
1.063
(27,0)
(14,22)
A
NO. OF
MINMAX
0.358
0.660
0.761
0.458
0.342
(8,69)
MIN
(11,23)
(16,26)
0.640
0.739
0.442
(9,09)
(11,63)
(16,76)
0.962
1.165
(23,83)
0.938
(28,99)
1.141
(24,43)
(29,59)
(19,32)(18,78)
**
20
28
52
44
68
84
0.020 (0,51)
TERMINALS
0.080 (2,03)
0.064 (1,63)
(7,80)
0.307
(10,31)
0.406
(12,58)
0.495
(12,58)
0.495
(21,6)
0.850
(26,6)
1.047
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.035 (0,89)
0.010 (0,25)
12
1314151618 17
11
10
8
9
7
5
432
0.020 (0,51)
0.010 (0,25)
6
12826 27
19
21
B SQ
A SQ 22
23
24
25
20
0.055 (1,40)
0.045 (1,14)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004