Data eet Datasheet In nput Volta age 5..0V to o 35V V Output S Switch Curre C nt 2A A 1ch Step p-Dow wn DC C/DC Conv verte er BD9060HF B P-C BD9 9060F-C Key y Specificatio ons Input Vo oltage Range: 5V to 35 5V Output Voltage V Rangee: 0.8V to VIN NV Output Switch S Currentt: 2 A (Ma ax) Selectab ble Oscillating Frequency: 50kHz to 500kH Hz Oscillating Frequencyy Accuracy: 5 5% 0kHz to 500kH Hz) (f=200 R MOS FET O On Resistance:: 0.6(Ma ax) POWER Reference Voltage Acccuracy: 2% (Tyyp) Standby y Circuit Curreent: 0 A (Tyyp) Operatin ng Temperaturre Range: -40C to +125C AEC-Q100 Qualified Ge eneral Descrription The BD906 60HFP-C BD D9060F-C arre high-accu uracy frequency-flexible step-down switching regulators with built-in POW WER MOS FET F which ca an withstand high pressure. The operattional frequency is frreely configurable wide e with externa al resistance. It features a w input voltag ge range (5V to 35V) and a high freque ency accuracy of 5% (f=200kH Hz to 500kHz)). Furthermore e, an nchronization input pin ena ables synchron nous external syn operation w with external clock. The output capa acitor correspondss to the ceram mic capacitor. Fe eatures Minimal external com mponents P-ch PO OWER MOS FET F included in i the package e Low dro opout:100% ON O duty cycle Externa al synchroniza ation enabled Soft sta art function: so oft start time fix xed to 2.7ms ((Typ) Built-in overcurrent protection circu uit Built-in thermal shutd down protectio on circuit Pac ckage W(Typ) x D(Typ) D x H(Ma ax) HRP7 2 9.395mm x 110.540mm x 2.005mm SOP8 5.00mm x 6.220mm x 1.71m mm Ap pplications Battery-pow wered in-vehiclle unit (Cluster, Car multime edia, etc.), communication such h as ETC, all fields f of indusstrial equipment, Flat TV, Printe er, DVD, AV, OA O Typical Applic cation Circuit P Product structure eSilicon mono olithic integrated d circuit ww ww.rohm.co.jp 013 ROHM Co., Ltd. All rights reserved. r (c)20 TSZ Z22111140 001 Thiis product has no n designed protection against radioactive rays s 1/30 TSZ002201-0T1T0AL00080-1-2 30.Aug.2013 Rev.00 04 BD9060HFP-C Datasheet BD9060F-C Block Diagram, Pin Configuration, Pin Description (BD9060HFP-C) VIN 1 7 EN/SYNC VREG UVLO UVLO VREF TSD TSD SYNC OSC VIN INV 5 VIN S ERR DRV LOGIC SLOPE 0.8V DRV 2 SW R PWM VIN VIN UVLO, TSD OCP, SCP SOFT START OCP FB 3 OCP SCP SCP 4 GND 0.6V 6 RT HRP7 (TOP VIEW) Pin No. 1 2 3 4 5 6 7 FIN Pin Name VIN SW FB GND INV RT EN/SYNC - Function Power supply input Output Error Amp output Ground Output cottage feedback Frequency setting resistor connection Enable/Synchronizing pulse input Ground 1 2 3 4 5 6 7 (BD9060F-C) VIN 1 5 EN/SYNC VREG UVLO UVLO VREF TSD TSD 8 PVIN SYNC OSC INV 4 S ERR DRV LOGIC SLOPE 0.8V DRV 2 SW R PWM PVIN PVIN UVLO, TSD OCP, SCP SOFT START OCP FB 3 SCP OCP SCP 7 GND 0.6V 6 SOP8 (TOP VIEW) 8 7 6 5 1 2 3 4 www.rohm.co.jp (c)2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 RT Pin No. 1 2 3 4 5 6 7 8 Pin Name VIN SW FB INV EN/SYNC RT GND PVIN Function Power supply input(Note1) Output Error Amp output Output cottage feedback Enable/Synchronizing pulse input Frequency setting resistor connection Ground Power supply input(Note1) (Note 1) PVIN and VIN are shorted 2/30 TSZ02201-0T1T0AL00080-1-2 30.Aug.2013 Rev.004 BD9060HFP-C Datasheet BD9060F-C Description of Blocks ERR(Error Amp) The Error Amp block is an error amplifier used to input the reference voltage (0.8V (Typ)) and the INV pin voltage. The output FB pin controls the switching duty and output voltage Vo. These INV and FB pins are externally mounted to facilitate phase compensation. Inserting a capacitor and resistor between these pins enables adjustment of phase margin. (Refer to recommended examples on P. 15 to 17) SOFT START The SOFT START block provides a function to prevent the overshoot of the output voltage Vo through gradually increasing the normal rotation input of the error amplifier when power supply turns ON to gradually increase the switching duty. The soft start time is set to 2.7ms (Typ). SYNC(EN/SYNC) By making the "EN/SYNC" terminal less than 0.8V, the circuit can be shut down. Furthermore, by applying higher frequency pulse than the configured oscillation frequency to the "EN/SYNC" pin, external synchronization is possible. Frequency range of external synchronization is FOSC x 1.05 Fsync500kHz and 1.5 times of the set frequency. (Refer to P.11) OSC (Oscillator) This circuit generates the pulse wave to be inputted to the SLOPE, and by connecting a resistor to the "RT", 50kHz to 500kHz oscillating frequency can be configured. (Refer to P.15 Figure 23) SLOPE This block generates sawtooth waves from the clock generated by the OSC. The generated sawtooth waves are sent to PWM. PWM The PWM Comparator block is a comparator to make comparison between the FB pin and internal sawtooth wave and outputs a switching pulse. The switching pulse duty varies with the FB value. (Min Duty width: 250ns) TSD (Thermal Shutdown) In order to prevent thermal destruction/thermal runway of the IC, the TSD block will turn OFF the output when the chip temperature reaches approximately 150C or more. When the chip temperature falls to a specified level, the output will be reset. However, since the TSD is designed to protect the IC, the chip junction temperature should be provided with the thermal shutdown detection temperature of less than approximately.150C. OCP (Over Current Protection) While the output POWER P-ch MOS FET is ON, if the voltage between drain and source (on-resistancexload current) exceeds the reference voltage internally set with the IC, OCP will start up.This OCPis a self-return type. If OCP operates, the duty will be small, and output voltage will decrease. However, this protection circuit is only effective in preventing destruction from sudden accident. It does not support for continuous operation of the protection circuit (e.g. if a load, which significantly exceeds the output current capacitance, is normally connected). Furthermore, since the overcurrent protection detection value has negative temperature characteristics, consider thermal design. SCP (Short Current Protection) While OCP operates, and if the output voltage falls below 70%, SCP will start up. If SCP operates, the output will be turned OFF after a period of 1024 pulse. It extends the output OFF time to reduce the average output current. In addition, during power start-up, this feature is masked until it reaches the set output voltage to prevent wrong trigger of SCP. UVLO (Under Voltage Lock-Out) UVLO is a protection circuit for low voltage malfunction. It preventsmalfunction of the internal circuit at the time of sudden rise and fall of power supply voltage. It monitors the VIN powersupply voltage and internal regulator voltage. If VIN is less than 4.3V (Typ), Pch POWER MOS FET output is OFF. This threshold voltage has a hysteresis of 200mV (Typ). If VIN is more than 4.5V (Typ) , UVLO will be released and the soft start circuit will be restarted. DRV (Driver) This is a driver circuit for driving the gate electrode of the Pch POWER MOS FET output. By switching the driving voltage when the power supply voltage drop, it reduces the deterioration ofPOWER MOS FET on-resistance. It monitors the VIN power supply voltage and internal regulator voltage. If VIN is less than 7.5V (Typ), the driving voltage is switched.This threshold voltage has a hysteresis of 1.5V (Typ). www.rohm.co.jp (c)2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 3/30 TSZ02201-0T1T0AL00080-1-2 30.Aug.2013 Rev.004 BD9060HFP-C Datasheet BD9060F-C Absolute Maximum Ratings(Ta=25C) Parameter Symbol Limits Unit VIN, PVIN 42 V Output Switch Pin Voltage VSW VIN V Output Switch Current ISW 4 (Note 1) A EN/SYNC Pin Voltage VEN/SYNC VIN V RT,FB,INV Pin Voltage VRT,VFB, VINV 7 V HRP7 Pd 5.51 (Note 2) W SOP8 Pd 0.69(Note 3) W Tstg -55 to +150 C Tjmax 150 C Power Supply Voltage Power Dissipation Storage Temperature Range Maximum Junction Temperature (Note 1) Pd should not be exceeded. (Note 2) Reduce by 44mW/C,when mounted on 2-layerPCB of 70mmx70mmx16mm (PCB incorporates thermal via. Copper foil area on the reverse side of PCB: 10.5mmx10.5mm Copper foil area on the reverse side of PCB: 70mmx70mm). (Note 3) Reduce by 5.52mW/C,when mounted on 1-layerPCB of 70mm x70mm x1.6mm Caution: Operating the IC over the absolute maximum ratings may damage the IC. In addition, it is impossible to predict all destructive situations such as short-circuit modes, open circuit modes, etc. Therefore, it is important to consider circuit protection measures, like adding a fuse, in case the IC is operated in a special mode exceeding the absolute maximum ratings. Recommended Operating Conditions Parameter Symbol Limits Unit VIN, PVIN 5 to 35 V Operating Temperature Range Topr -40 to +125 C Output Switch Current ISW to 2 A PWMIN 250 ns Oscillating Frequency fosc 50 to 500 kHz Oscillating Frequency Set Resistance RT 27 to 360 k fSYNC FOSC x 1.05 FsyncFOSC x 1.5 (Note 1) kHz Operating Power Supply Voltage Output Voltage (min pulse width) External Sync Frequency (Note 1) It should be configured at less than 500kHz. www.rohm.co.jp (c)2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 4/30 TSZ02201-0T1T0AL00080-1-2 30.Aug.2013 Rev.004 BD9060HFP-C Datasheet BD9060F-C Electrical Characteristics(Unless otherwise specified, Ta=- 40C to +125C, VIN=13.2V,VEN/SYNC =5V) Parameter Symbol Standby Circuit Current ISTB Circuit Current ICC Guaranteed Limit Min Typ Max 0 5 Unit A Conditions VEN/SYNC=0V, Ta=-40Cto +105C 3.7 8.0 mA IOUT=0A, RT=51k, VINV=0.7V SW Block POWER MOS FET ON Resistance RON 0.3 0.6 Operating Output Switch Current Of Overcurrent Protection (Note 1) ILIMIT 2.5 4 A Output Leak Current IOLEAK 0 5 A VIN=35V, VEN/SYNC =0V, Ta=-40C to +105C Error Amp Block Reference Voltage 1 VREF1 0.784 0.800 0.816 V VFB= VINV Reference Voltage 2 VREF2 0.780 0.800 0.820 V VFB= VINV, VIN =5V to 35V Reference Voltage Input Regulation VREF 0.5 % VIN =5V to 35V IB -1 A VINV =0.6V Maximum FB Voltage VFBH 2.0 2.5 V VINV =0V Minimum FB Voltage VFBL 0.51 0.80 V VINV =2V IFBSINK -2.45 -1.23 -0.45 mA VFB=1V, VINV=1V IFBSOURCE 1.0 6.3 15.0 mA VFB=1V, VINV=0.6V TSS 1.7 2.7 5.0 ms fosc 285 300 315 kHz fosc 0.5 % VIN =5V to 35V Output ON Voltage VENON 2.6 V VEN/SYNC Sweep Up Output OFF Voltage VENOFF 0.8 V VEN/SYNC Sweep Down Sink Current IEN/SYNC 19 60 A Input Bias Current FB Sink Current FB Source Current Soft Start Time (Note 1) Oscillator Block Oscillating Frequency Frequency Input Regulation RT=51k Enable/Sync Input Block (Note 1)This item is not 100% production tested. EN / SYNC and RT are shorted at VIN and EN / SYNC short-circuited, IC is destroyed in VIN 7V, (Caution) www.rohm.co.jp (c)2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 5/30 TSZ02201-0T1T0AL00080-1-2 30.Aug.2013 Rev.004 BD9060HFP-C Datasheet BD9060F-C Typical Performance Curves 0.816 52.5 52.0 Oscillating Frequency: FOSC [kHz] Reference Voltage:VREF [V] 0.812 0.808 0.804 0.800 0.796 0.792 51.5 51.0 RT = 330 k 50.5 50.0 49.5 49.0 48.5 48.0 0.788 47.5 0.784 -50 -50 -25 0 25 50 75 -25 100 125 150 0 25 50 75 100 125 150 Ambient Temperature:Ta [C] Ambient Temperature: Ta [ C] Figure 2. Oscillating Frequency vs Temperature (RT=330k) 105 315 104 312 103 102 Oscillating Frequency: FOSC [kHz] Oscillating Frequency: FOSC [kHz] Figure 1. Reference Voltage vs Temperature RT = 160 k 101 100 99 98 97 96 309 306 303 RT = 51 k 300 297 294 291 288 95 -50 -25 0 25 50 75 100 125 150 285 -50 Ambient Temperature: Ta [C] -25 0 25 50 75 100 125 150 Ambient Temperature: Ta [C] Figure 3.Oscillating Frequency vs Temperature (RT=160k) www.rohm.co.jp (c)2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 Figure 4.Oscillating Frequency vs Temperature (RT=51k) 6/30 TSZ02201-0T1T0AL00080-1-2 30.Aug.2013 Rev.004 BD9060HFP-C Datasheet BD9060F-C 5 525 Oscillating Frequency: FOSC [kHz] 520 510 505 500 RT = 30 k 495 4 Stand- by Current: ISTB [A] 515 490 Ta=125C Ta=105C 3 2 Ta=25C, -40C 485 1 480 475 0 -50 -25 0 25 50 75 100 125 150 0 5 10 15 20 25 30 35 40 Input Voltage: VIN [V] Ambient Temperature: Ta [C] Figure 5.Oscillating Frequency vs Temperature (RT=30k) Figure 6.Standby Circuit Current vs Input Voltage 1.6 8 7 1.4 6 Inflection Point From Top:VEN=6.2V(Ta=125C) VEN=6.5V(Ta=25C) VEN=6.7V(Ta=-40C) EN / SYNC Input Current: IEN [mA] Circuit Current: ICC [mA] From Top:Ta=125C Ta=25C Ta=-40C 1.2 1.0 5 0.8 4 0.6 3 0.4 2 0.2 1 0.0 0 0 5 10 15 20 25 30 35 0 40 10 15 20 25 30 35 40 Input Voltage: VEN / SYNC [V] Input Voltage: VIN [V] Figure 8.EN/SYNC Input Current vs Input Voltage Figure 7. Circuit Current vs Input Voltage www.rohm.co.jp (c)2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 5 7/30 TSZ02201-0T1T0AL00080-1-2 30.Aug.2013 Rev.004 Datasheet BD9060F-C 1.6 1.6 1.4 1.4 FET On Resistance: RON [] FET On Resistance: RON [] BD9060HFP-C From Top: Ta=125C Ta=25C Ta=-40C 1.2 1.0 0.8 0.6 From Top: Ta=125C Ta=25C Ta=-40C 1.2 1.0 0.8 0.6 0.4 0.4 0.2 VIN = 5 V 0.2 0.0 0.0 0.0 0.0 0.5 1.0 1.5 2.0 1.6 100 1.4 90 From Top: Ta=125C Ta=25C Ta=-40C 0.8 0.6 0.4 0.2 60 50 From Top: 5.0V output 3.3V output 40 30 VIN =13.2V f=100kHz Ta=25C 10 VIN =35 V 0.0 *It measured BD9060HFP. 0 1.0 1.5 2.0 0.0 0.5 1.0 1.5 2.0 Output Current:lo[A] Output Current: lO [A] Figure 11. ON Resistance vs Output Current (VIN =35V) www.rohm.co.jp (c)2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 2.0 70 20 0.5 VIN = 13.2 V 80 1.0 0.0 1.5 Figure 10. ON Resistance vs Output Current (VIN =13.2V) Conversion Efficiency[] FET On Resistance: RON [] 1.0 Output Current: lO [A] Output Current: lO [A] Figure 9. ON Resistance vs Output Current (VIN=5V) 1.2 0.5 Figure 12.Conversion Efficiency vs Output Current (f=100kHz) 8/30 TSZ02201-0T1T0AL00080-1-2 30.Aug.2013 Rev.004 BD9060HFP-C Datasheet BD9060F-C 100 100 90 80 Conversion Efficiency[] Conversion Efficiency[] 90 70 60 From Top: 5.0V output 3.3V output 50 40 30 VIN =13.2V f=300kHz Ta=25C 20 10 80 70 60 From Top: 5.0V output 3.3V output 50 40 30 VIN =13.2V f=500kHz Ta=25C 20 10 *It measured BD9060HFP. *It measured BD9060HFP. 0 0 0.0 0.5 1.0 1.5 0.0 2.0 0.5 1.0 1.5 2.0 Output Current:lo[A] Output Current:lo [A] Figure 13.Conversion Efficiency vs Output Current (f=300kHz) Figure 14.Conversion Efficiency vs Output Current (f=500kHz) 10 Output Voltage: VO [V] 8 From Left:Ta=125C Ta=25C Ta=-40C 6 4 2 VIN = 13.2 V f = 300 kHz VO = 5 V 0 0 1 2 3 4 Output Current: l O [A] 5 Figure 15.Overcurrent Protected Operation Current www.rohm.co.jp (c)2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 9/30 TSZ02201-0T1T0AL00080-1-2 30.Aug.2013 Rev.004 BD9060HFP-C Datasheet BD9060F-C Timing Chart Basic Operation VIN Internal SLOPE FB SW VEN / SYNC VIN=13.2V f=300kHz VO=5V Figure 16. Timing Chart (Basic Operation) Over Current Protection Operation Normal pulse repetition at SW the following IL VO INV FB Internal Soft Start tOFF tOFF, tSS Terminal tOFF = 1024 / fosc [s] exfosc = 300 kHztOFF = 3.41 ms tSS = 2.7 [ms] (Typ) tSS Auto reset (Soft Start Operation) Figure 17.Timing Chart (Over Current Protection Operation) www.rohm.co.jp (c)2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 10/30 TSZ02201-0T1T0AL00080-1-2 30.Aug.2013 Rev.004 BD9060HFP-C Datasheet BD9060F-C External Synchronizing Function In order to activate the external synchronizing function, connect the frequency-setting resistor to the RT pin and then input a synchronizing signal to the EN/SYNC pin. As the synchronizing signal, input a pulse wave higher than a frequency determined with the setting resistor(RT).However, the external sync frequency should be configured between 1.05 to 1.5 times the set frequency. (Frequency determined with RT x 1.05 External sync frequency Frequency determined with RT x 1.5) (ex.) When the configured frequency is 300kHz, the external sync frequency should be between 315kHz to 450kHz. Furthermore, the pulse wave's LOW voltage should be under 0.8V and the HIGH voltage over 2.6V,(when the HIGH voltage is over 6V the EN/SYNC input current increases [Refer to p.7 Fig.8])the through rate of stand-up(and stand-down)under 20V/s. The duty of External sync pulse should be configured between 20% to 80%. IL VIN Cbulk VIN/PVIN CIN D1 BD9060HFP-C BD9060F-C RT VO SW CO 22F CO 22F R3 C1 10k 4700pF EN/SYNC VEN/SNC = 0V to 5 V f = 450 kHZ SR = 20 V / s Duty = 50 % R1 43k C2 1000pF INV RT 51 k EN/SYNC R4 0k R2 8.2 k FB GND C3 100pF Figure 18.External Sync Sample Circuit (VO=5V,IO=1A,f=300kHz,EN/SYNC=450kHz) www.rohm.co.jp (c)2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 11/30 TSZ02201-0T1T0AL00080-1-2 30.Aug.2013 Rev.004 BD9060HFP-C Datasheet BD9060F-C Selection of Components Externally Connected Necessary parametersare as followsin designingthe power supply. Parameter Symbol Input Voltage VIN Output Voltage VO Output Ripple Voltage VPP Input Range IO Switching Frequency fSW Operating Temperature Range Topr SpecificationCase 8V to 33V 5V 20mVp-p Min 0.5A / Typ1.0A / Max 1.5A 300kHz -40Cto+125C IL VIN VIN/PVIN CIN Cbulk VO SW D1 BD9060HFP-C BD9060F-C RT Co R4 R1 C2 INV RT R3 EN/SYNC R2 C1 FB EN/SYNC GND C3 Figure 19.Application Sample Circuit 1. Setofoutputinductor L constant In DC/DC converter, to supply electric current continuously to the load, the LC filter is necessary for the smoothness of the output voltage.IL that flows to the inductor becomes small when a big inductor of the inductance value is selected, and the voltage of the output ripple becomes small. It is a trade-off against the responsiveness, the size and the cost of the inductor. The inductance value of the inductor is shown in the next expression. (a) (VIN(MAX):Maximum input voltage,IL:Inductor ripple current) IL is set to make SW the continuous control action (IL keeps continuously flowing) usually.The condition of thecontinuous operation is shown in the next expression. (b) (IO :Load current) V V SW SW t t I I Io IL Io t Figure 20. Continuous Action www.rohm.co.jp (c)2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 t Figure 21. Discontinuous Action 12/30 TSZ02201-0T1T0AL00080-1-2 30.Aug.2013 Rev.004 BD9060HFP-C Datasheet BD9060F-C The smaller the IL, the Inductor core loss(iron loss) and loss due to ESR of the output capacitor, VPP will be reduced. VPPis shown in the next expression. (c) (ESR: Equivalent series resistance of output capacitor, CO: Output condenser capacity) IL is set to approximately 10% to 40% of IO. Generally, even if IL is somewhat large, VPP of the target is satisfied because the ceramic capacitor has super-low ESR. In that case, it is also possible to use it by the discontinuous action. The inductance value of the inductor can be set small as an advantage. It contributes to the miniaturization of the set because of the large rated current, small inductor is possible if the inductance value is small.The disadvantagesare the increase in core losses in the inductor, the decrease in maximum output current, and the deterioration of theresponse. When other capacitors (electrolytic capacitor, tantalum capacitor, and electroconductive polymer etc) are used for output capacitor CO,check theESRfromthe manufacturer's data sheetand determine the IL to fitwithin the acceptable range of VPP.Especially inthe case ofelectrolytic capacitor, because the capacity decrease at the low temperature is remarkable, VPPincreases. When using capacitor at the low temperature, it is necessary to note this.The maximum output electric current is limited to the overcurrent protection working current as shown in the next expression. (d) Where: IO(MAX) is Maximum output current, ILIMIT(min):Minimum operating output switch current of overcurrent protection2.5A IO ILIMIT IO t Figure 22.OvercurrentDetection The shield type (closed magnetic circuit type) is the recommended type of inductor. There is no problem in the open magnetic circuit type if the application is low cost and does not consider noise.In that case, there is magnetic field radiation between the parts.There should be enough space between the parts. For ferrite core inductor type, in particular, please note the magnetic saturation.It is necessary not to saturate the core in allcases.Care must be taken giventhe provisions of thecurrent rating because it differs according to each manufacturer. Pleaseconfirm the rated current at the maximum ambient temperature of the application to the manufacturer. 2. SetofoutputCapacitor CO constant The output capacitor is selected on the basis of ESR that is required from the expression (c).VPP can be reduced by using a capacitor with a small ESR.The ceramic capacitor is the best selection that meets this requirement.The ceramic capacitor contributes to the miniaturization of the set because it has small ESR.Please confirm frequency characteristic of ESR from the datasheet of the manufacturer, and select the one that ESR in the switching frequency used is low.It is necessary to note the ceramic capacitor because the DC biasing characteristic is remarkable. For the voltage rating of the ceramic capacitor, twice or more of the maximum output voltage is usually required.By selecting those high voltage rating, it is possible to reduce the influence of DC bias characteristics.Moreover, in order to maintain good temperature characteristics, the one with the characteristic of X7R and X5R or more is recommended.Because the voltage rating of a mass ceramic capacitor is low, the selection becomes difficult in the application with high output voltage. In that case, please select electrolytic capacitor. Please select the one with voltage rating of 1.2 times or more of the output voltage when you use electrolytic capacitor.Electrolytic capacitors are high blocking voltage, a large capacity, and the little DC biasing characteristic, and are generally cheap.Because main failure mode is OPEN, it is effective to use electrolytic capacitor selection in the application when reliability is demandedsuch as in-vehicle. There are disadvantages as, ESR is relatively large, and decrease of capacity at low temperatures.It is necessary to note this so that the low temperature, and in particular, VPP may increase.Moreover, the feature of this capacitor is to define the lifetime because there is possible dry up. A very excellent characteristic of the tantalum capacitor and the electro-conductive polymer is the thermal characteristic unlike the electrolytic capacitor.The design is facilitated because there is little DC biasing characteristic like the electrolytic capacitor.Typically, for voltage rating, a tantalum capacitor is selected twice the output voltage, and for conductive polymer is selected 1.5 times more than the output voltage.The disadvantage of the tantalum capacitor is that the failure mode is SHORT, and the breakdown voltage is low.It is not generally selected in the application that reliability such as in-vehicle is demanded.The disadvantage of the electroconductive polymer is that the failure mode is SHORT(SHORT happens by accident chiefly, though it is OPEN),the breakdown voltage is low , and generally expensive.Although in most cases ignored, these capacitors are rated in ripple current. The RMS values of the ripple electric current obtained in the next expression must not exceed the ratings ripple electric current. www.rohm.co.jp (c)2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 13/30 TSZ02201-0T1T0AL00080-1-2 30.Aug.2013 Rev.004 BD9060HFP-C Datasheet BD9060F-C (e) Where:ICO(RMS) is RMS value of the ripple electric current In addition,with respect toCO, choose capacitance value lessthan the valueobtainedby the following equation. . (f) Where: ILIMIT(MIN) is OCP operation output switch current(Min) 2.5A,1.7ms: Soft Start Time(Min) There is a possibility that boot failure happens when the limits from the above-mentioned are exceeded.Especiallyif thecapacitance valueis extremely large, you may activate over-current protectionby theinrush currentat startup, and theoutputdoes not start. Please confirm this well on the actual circuit.The capacitance value is an important parameter that decides the LC resonant frequency. For stable transient response, the loop is dependent on the CO.Please select after confirming the setting of the phase compensation circuit. 3. Setting constant of capacitor CIN / Cbulk input The input capacitor is usually required for two types of decoupling: capacitorsCIN and bulk capacitorsCbulk.Ceramic capacitor 1F to 10F is necessary for the decoupling capacitor.Ceramic capacitor is effective by being placed as close as possible to the VIN pin.Voltage rating is recommended to more than 1.2 times the maximum input voltage, or twice the normal input voltage.About the bulk capacitor, the decrease in the line voltage is prevented, and the role of the backup power supply to keep the input potential constant is realized.The low ESR electrolytic capacitor with large capacity is suitable for the bulk capacitor.It is necessary to select the best capacitance value as per set application.When impedance on the input side is high because wiring from the power supply to VIN is long, etc., then high capacitance is needed.In actual use conditions,it is necessary to verify that there is no problem when IC operation turns off the output due to the decrease of VIN at transient response.In that case, please be careful not to exceed the rated ripple current of the capacitor. The RMS value of the input ripple electric current is obtained in the next expression. (g) where: ICIN(RMS) is RMS value of the input ripple electric current In addition, in automotive and other applications requiring reliability, it is recommended that capacitors are connected in parallel to accommodate a multiple of electrolytic capacitors minimal dry up chances.We will recommend making it to two series + two parallel structures to decrease the risk of the ceramic capacitor by short destruction.The line has been improved to the summary respectively by 1pack in each capacitor manufacturer and confirms two series and two parallel structures to each manufacturer. 4. Setting output voltage Output voltage is governed by the following equation. 0.8 (h) Please set return resistance R2 below 30kto reduce the error margin by the bias current.In addition, since power efficiency is reduced with a small R1 + R2, please set the current flowing through the feedback resistor to be small enough than the output current IO. 5. Selectionof the schottky barrier diode The schottky barrier diode that has small forward voltage and short reverse recovery time is used for Di.An important parameter for selecting it is an average rectified current and a direct current inverse-direction voltage.Average rectified current IF(AVG) is obtained in the next expression. (i) where: IF(AVG) isAverage rectified current www.rohm.co.jp (c)2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 14/30 TSZ02201-0T1T0AL00080-1-2 30.Aug.2013 Rev.004 BD9060HFP-C Datasheet BD9060F-C The absolute maximum rating of the schottky barrier diode rectified current average is more than 1.2 times IF(AVG) and the absolute maximum rating of the DC reverse voltage is greater than or equal to 1.2 times the maximum input voltage. The loss of Di is obtained in the next expression. (j) Where: VF is Forward voltage in Io(MAX) condition Selecting a diode that has small forward voltage, and has short reverse recovery time is highly effective.Please select the 0.6V Max for the forward voltage. Please note that there is possibility of the internal element destruction when a diode with larger VF than this is used.Because the reverse recovery time of the schottky barrier diode is so shortthat it is possible to disregard, the switching loss can be disregarded. When it is necessary that the diode endures in the state of the output short-circuit, power dissipation ratings and the heat radiation ability are needed in addition. The rated current is required about 1.5 times the overcurrent detection value.The loss when the output is short-circuited is obtained in the next expression. (k) Where: ILIMIT(MAX) isOCP operation output switch current(MAX) 6A 6. Setting the oscillating frequency An internal oscillating frequency can be set by the resistance connected with RT. The range that can be set is 50kHz to 500kHz, and the relation between resistance and the oscillation frequency is decided as shown in the figure below.When setting beyond this range, there is a possibility of non-oscillation and IC operation cannot be guaranteed. Oscillating Frequency:fOSC[kHz] 500 RT[k] 27 30 33 36 39 43 47 51 56 62 68 75 82 91 450 400 350 300 250 200 150 100 50 0 50 100 150 200 250 300 Oscillating Frequency Setting Resistance:RT[k] Figure 23.Oscillating Frequency vs RT 7. fosc[kHz] 537 489 449 415 386 353 324 300 275 250 229 209 192 174 RT[k] 100 110 120 130 150 160 180 200 220 240 270 300 330 360 fosc[kHz] 160 146 134 124 108 102 91 82 75 69 61 55 50 46 Graph'svalue is Typical and You need to consider thevariationof5% respectively. Setting the phase compensation circuit A high response performance is achieved by setting 0dB crossing frequency fc of the total gain (frequency at the gain 0dB) high.However, you need to be aware of the relationship to be a trade-off between stability.Moreover, DC/DC converter application is sampled by switching frequency, and should suppress the gain in switching frequency.It is necessary to set 0dB crossing frequency to 1/10 or less of the switching frequency.In summary,target these characteristics with the application as follows. When thegain is 1(0dB), phase lagis less than or equal to135 (More than45 phase margin). 0dB crossing frequency is 1/10 times or less of the switching frequency.To improve the responsiveness, higher frequency of switching frequency is needed. We recommend the Bode diagram to be made by using the transfer function of the control loop to obtain frequency characteristic of target for the phase compensation circuit.Make sure the frequency characteristics of the total gain by totaling the transfer function of the following three. www.rohm.co.jp (c)2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 15/30 TSZ02201-0T1T0AL00080-1-2 30.Aug.2013 Rev.004 BD9060HFP-C Datasheet BD9060F-C (l) (m) (n) Where: GLCis Transfer functionof theLCresonance GFB is Transfer functionof thephase compensation GPWM is Transfer functionof thePWM, VRAMP0.7V Because BD9060HFP-C/BD9060F-C is a voltage mode control, two poles and two zeroes of the phase interpolator circuitshown in the figure below can be added.Necessary frequencies of poles and zeroes are obtained in the following. VO SW DCR L ESR R4 Co C2 D1 C3 C1 R1 R3 FB INV R2 VREF Figure 24. Phase Compensation Circuit (o) (p) (q) (r) (s) (t) Where: DCR isDCresistanceof the inductor RO isLoad resistance Frequency response is optimized by placing the appropriate frequency of these poles and zeros.The standard is as follows. www.rohm.co.jp (c)2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 16/30 TSZ02201-0T1T0AL00080-1-2 30.Aug.2013 Rev.004 BD9060HFP-C Datasheet BD9060F-C 0.2 (u) 0.5 2 (v) 0.5 (w) (x) The phase delays (-180) by the LC resonance can be canceled by setting the phase amends as mentioned above.fp2is not necessary if fESR is higher than the SW frequency (The ceramic capacitor that has low ESR is used for the output capacitor).In addition, if Q(quality factor)of the LC filter is high,the gain may peak out, and phase margin can not be secured sufficiently.When Q is high, fz1 and fz2 are brought close to fLC as much as possible. Q is obtained in the next expression. (y) (z) The setting method by above-mentioned conditional expression is suitable as the starting point of the phase amends.Please confirm that you meet the frequency characteristics to create a Bode plot.Actually, the frequency characteristic changes are greatly affected by the type and the condition (temperature, etc.) of parts that are used, and the wire routing and layout for the PCB.For instance, the LC resonance point moves because of the capacity decrease at low temperature and an increase of ESR when electrolytic capacitor is used for the output capacitor that there is even possibility of oscillation.To C1, C2 and C3 for phase compensation capacitor,use of CH products or temperature compensation type C0G, etc. with an excellent thermal characteristic are recommended. Please confirm stability and responsiveness in actual equipment. To check on the actual frequency characteristics, use a FRA or a gain-phase analyzer.Moreover, the method of observing the degree of change by the loading response can be done, when these measuring instruments do not exist.The response is low when the output is made to change under no load to maximum load, and there is a lot of variation quantities.It can be said that the phase margin degree is low when there is a lot of ringing frequencies after it changes, usually two times or more of ringing as standard. However, a quantitative phase margin degree cannot be confirmed. Maxi mum Load Output voltage Adequate phase margin. Inadequate phase margin 0 t Figure 25. Load Response www.rohm.co.jp (c)2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 17/30 TSZ02201-0T1T0AL00080-1-2 30.Aug.2013 Rev.004 BD D9060HFP P-C Datashe Datasheet eet BD90 060F-C Ap pplication Ex xamples Parameter Input Voltage e Output Volta age Output Ripplle Voltage Output Curre ent Switching Frrequency Operating Te emperature Syymbol VIN VO VPP IO fSW Sp pecificationcasse 8V to 28V 5V 20mVp-p Min 0.5A A / Typ 1.0A / M Max 1.5A 300kHz -4 40Cto+125C C T Topr IL VIN VIN/PV VIN Cbulk VO SW CIN D1 Co Co R4 BD D9060HFP-C RT R1 C2 INV RT R3 EN/SYNC R2 C1 FB EN/SY YNC GND C3 Figure 26. A Application Ex xamples 1 No Package e Pa arameters Part name(series) Type Manufacturer R1 R2 1005 43k,, 1%, 1/16W MCR01 series s Chip resistorss RO OHM 1005 8.2k, 1%, 1/16W MCR01 series s Chip resistorss RO OHM R3 1005 10k,, 1%, 1/16W MCR01 series s Chip resistorss RO OHM R4 1005 0k, 1%, 1/16W MCR01 series s Chip resistorss RO OHM RT 1005 51k,, 1%, 1/16W MCR01 series s Chip resistorss RO OHM C1 1005 4700pF,R,50V GCM se eries Ce eramic capacito tors MUR RATA C2 1005 1000 0pF,CH,50V GCM se eries Ce eramic capacito tors MUR RATA C3 1005 100p pF,CH,50V GCM se eries Ce eramic capacito tors MUR RATA CIN 3216 2.2F,X7R.50V GCM se eries Ce eramic capacito tors MUR RATA CO 3216 22F F,X7R,16V GCM se eries Ce eramic capacito tors MUR RATA Cbulk 220 0Fx2,35V CZ series Elec ctrolytic capaccitors NICH HICON L 10x10x3.8(m mm3) 33H CLF10040 series Coil TD DK D CPD Averag ge I = 6A Max RB095B B-40 Schottky S Diodees RO OHM Tektronix M MSO5204 100 NF FRA5087 Te ektronix MSO5204 90 EFFICIENCY[%] 80 VO50mV/div @ AC 70 60 50 40 VO 10mV//div @ AC 30 Io 400mA/div @ DC C 20 1.66s/div 10 0 0.0 0.5 1.0 1.5 2 2.0 200s/div VIN=13.2 2V Io=1.0A VIN=13.2V = Io=1 1.5A VIN=13.2V Io Step1.0A to 1.5A A OUT PUT CURRENT:Io[A] Converssion Efficiencyy ww ww.rohm.co.jp (c)20 013 ROHM Co., Ltd. All rights reserved. r TSZ Z22111150 001 Outpu ut Ripple Volta age Freq quency Chara acteristics 18/30 Load Change C TSZ002201-0T1T0AL00080-1-2 30.Aug.2013 Rev.00 04 BD D9060HFP P-C Datashe Datasheet eet BD90 060F-C Parameter Input Voltage e Output Volta age Output Ripplle Voltage Output Curre ent Switching Frrequency Operating Te emperature Syymbol VIN VO VPP IO fSW Sp pecificationcasse 5 V to 16V 3.3V 20mVp-p Min 0.1A A / Typ 0.4A / M Max 0.8A 300kHz -40Cto+85C C T Topr IL VIN VIN/PV VIN VO SW CIN Cbulk D1 Co R4 B BD9060F-C R1 C2 RT INV RT R3 EN/SYNC R2 C1 FB EN/SY YNC GND C3 Figure 27. A Application Ex xamples 2 No Package e Pa arameters Part name(series) Type Manufacturer R1 1005 47k,, 1%, 1/16W MCR01 series s Chip resistorss RO OHM R2 1005 15k,, 1%, 1/16W MCR01 series s Chip resistorss RO OHM R3 1005 8.2k, 1%, 1/16W MCR01 series s Chip resistorss RO OHM R4 1005 0k, 1%, 1/16W MCR01 series s Chip resistorss RO OHM RT 1005 51k,, 1%, 1/16W MCR01 series s Chip resistorss RO OHM C1 1005 4700 0pF, R, 50V GCM se eries Ce eramic capacito tors MUR RATA C2 1005 820p pF, CH, 50V GCM se eries Ce eramic capacito tors MUR RATA C3 1005 100p pF, CH, 50V GCM se eries Ce eramic capacito tors MUR RATA CIN 3216 2.2F F, X7R, 50V GCM se eries Ce eramic capacito tors MUR RATA CO 3216 22F F, X7R, 16V GCM se eries Ce eramic capacito tors MUR RATA 220F, 50V CD series Elec ctrolytic capaccitors NICH HICON Cbulk L 10x10x3.8(m mm3) 33H CLF6045 series s Coil TD DK D PMDS Averag ge I = 2A Max RB060L L-40 Schottky S Diodees RO OHM 100 Tektronix TD DS5034B NF FRA5087 Tektronix TDS5034B 90 VO50mV/div @ AC EFFICIENCY[%] 80 Phase 70 60 Ga ain 50 40 VO10mV/d div @ AC 30 Io 200mA/div @ DC C 20 2 s/div 10 0 0.0 0.2 0.4 0.6 0.8 OUT PUT CURRENT:Io[A] 1.0 200s/div VIN=13.2 2V Io=0.4A Converssion Efficiency ww ww.rohm.co.jp (c)20 013 ROHM Co., Ltd. All rights reserved. r TSZ Z22111150 001 Outp put Ripple Volttage VIN=13.2V = Io=0 0.8A V VIN=13.2V Io Step 0.4A to 0.8A Freq quency Characteristics 19/30 Load Change C TSZ002201-0T1T0AL00080-1-2 30.Aug.2013 Rev.00 04 BD9060HFP-C Datasheet BD9060F-C Input Filter Reverse Polarity Protection Diode D C C L C C C TVS C C C C C BD9060HFP-C BD9060F-C -type filter Figure 28. Frequency Characteristics The input filter circuit for EMC measures is depicted in Figure 28. The type filters are the third LC filters. When the decoupling capacitor for high frequency is insufficient, it uses type filters. Because a large attenuation characteristic is obtained, an excellent characteristic can be obtained as an EMI filter. TVS(TransientVoltageSuppressors) is used for the first protection of the in-vehicle power supply line.Because it is necessary to endure high energy that dumps the load, a general zener diode is insufficient. The following are recommended. To protect it when the power supply such as BATTERY is accidentally connected in reverse, reverse polarity protection diode is needed. No Part name (series) Manufacturer L CLF series TDK XAL series Coilcraft CJ series NICHICON CZ series NICHICON TVS SM8 series VISHAY D S3A thru S3M series VISHAY C Recommended Parts Manufacturer List Show the parts manufacturer for the recommended reference. Device Type Manufacturer C Electrolytic capacitors NICHICON www.nichicon.com C Ceramic capacitors MURATA www.murata.com L Coils TDK L Coils Coilcraft www.coilcraft.com L Coils Sumida www.sumida.com D Diodes VISHAY www.vishay.com D Diodes/Resistors ROHM www.rohm.com www.rohm.co.jp (c)2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 20/30 URL www.global.tdk.com TSZ02201-0T1T0AL00080-1-2 30.Aug.2013 Rev.004 BD9060HFP-C Datasheet BD9060F-C Signal GND Directions For Pattern Layout of PCB RT EN/SYNC RT INV FB VIN SW BD9060F EN/SYNC RT INV GND FB SW VIN BD9060HFP GND PVIN GND RT R3 R3 C3 C1 Cbulk CIN Signal GND L1 D1 L D A D Co Power GND R1 Cbulk CIN R4 5. 6. 7. L1 D1 Co C2 Power GND R2 Figure 29. Filter Circuit Diagram (BD9060HFP-C) 1. 2. 3. 4. C3 C1 L D A D R1 R4 C2 R2 Figure 30. Application Circuit (BD9060F-C) Arrange the wirings shown by wide lines as short as possible in a broad pattern. Locate the input ceramic capacitor CIN as close to the VIN-GND pin as possible. Locate the RT as close to the GND pin as possible. Locate the R1 and R2 as close to the INV pin as possible, and provide the shortest wiring from the R1 and R2 to the INV pin. Locate the R1 and R2 as far away from the L1 as possible. Separate Power GND (schottky diode, I/O capacitors GND) and Signal GND (RT,GND), so that SW noise doesnot have an effect on SIGNAL GND at all. Design the POWER wire line as wide and short as possible. D1 R3 RT D1 R2 Co R4 C2 R1 C1 C1 R3 L1 C3 C3 L1 CIN RT GND Cbulk C CIN bulk C28 VIN Co R4 C2 R1 VO Figure 31. BD9060HFP-C Reference Layout Pattern R2 Figure 32. BD9060F-C Reference Layout Pattern * Please make GND to cover the wide area with no parts. Gray areas mean GND in the above Layout Pattern. * www.rohm.co.jp (c)2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 21/30 TSZ02201-0T1T0AL00080-1-2 30.Aug.2013 Rev.004 BD9060HFP-C Datasheet BD9060F-C Power Dissipation For thermal design, be sure to operate the IC within the following conditions. (Since the temperatures described hereunder are all guaranteed temperature, take margin into account.) 1.The ambient temperature Ta is to be 125C or less. 2.The chip junction temperature Tj is to be 150C or less. The chip junction temperature Tj can be considered in the following two patterns: C 1. To obtain Tj from the IC surface temperatureTc in actual use Reference value 2. jc : HRP7 jc : SOP8 7C/W 32.5C/W To obtain Tj from the ambient temperature Ta Reference value Single piece of IC ja : HRP7 125.0C/W 54.3C/W 2-layer PCB (Copper foil area on the front side of PCB : 15mmx15mm) 22.7C/W 2-layer PCB (Copper foil area on the front side of PCB : 70mmx70mm) 17.1C/W 4-layer PCB (Copper foil area on the front side of PCB : 70mmx70mm) PCB Size: 70mmx70mmx1.6mm (PCB incorporates thermal via) Copper foil area on the front side of PCB: 10.5mmx10.5mm ja : SOP8 222.2C/W Single piece of IC 181.3C/W 1-layer PCB(Copper foil area on the front side of PCB : 70mmx70mm) The heat loss W of the IC can be obtained by the formula shown below: W Where: RONis the ON resistance of IC (refer to page.8) Io isthe Load current VOisthe Output Voltage VINistheinput Voltage ICCisthe Circuit current(refer to page.5) Tr isthe Switching rise/fall time (approximately 15n/35ns) fis the Oscillating Frequency 2 1 2 1 Figure 33. SW waveform www.rohm.co.jp (c)2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 22/30 TSZ02201-0T1T0AL00080-1-2 30.Aug.2013 Rev.004 BD9060HFP-C Datasheet BD9060F-C I/O Equivalent Circuit SW FB VIN VIN (BD9060HFP-C) SW INV RT Internal Regulator Internal Regulator VIN VIN RT INV 167k 1k EN / SYNC Internal Regulator VIN 60 EN/SYNC 222k 221k 145k Figure 34. I/O Equivalent Circuit www.rohm.co.jp (c)2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 23/30 TSZ02201-0T1T0AL00080-1-2 30.Aug.2013 Rev.004 BD9060HFP-C Datasheet BD9060F-C Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity whenconnecting the power supply, such as mounting an external diode between the power supply and the IC's powersupply terminals. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance ground and supply lines. Separate the ground and supplylines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affectingthe analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect oftemperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that nopins are at a voltage below the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current GND traces, the two ground traces should be routed separately butconnected to a single ground at the reference point of the application board to avoid fluctuations in the small-signalground caused by large currents. Also ensure that the GND traces of external components do not cause variations onthe GND voltage. The power supply and ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result indeterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is whenthe IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating,increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.The electrical characteristics are guaranteed under the conditions of each parameter. 7. Rush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrushcurrent may flow instantaneously due to the internal powering sequence and delays, especially if the IChas more than one power supply. Therefore, give special consideration to power coupling capacitance,power wiring, width of GND wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin maysubject the IC to stress. Always discharge capacitors completely after each process or step. The IC's power supplyshould always be turned off completely before connecting or removing it from the test setup during the inspectionprocess. To prevent damage from static discharge, ground the IC during assembly and use similar precautions duringtransport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridgedeposited in between pins during assembly to name a few. 11. Unused Input Terminals Input terminals of an IC are often connected to the gate of a CMOS transistor. The gate has extremely high impedanceand extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The smallcharge acquired in this way is enough to produce a significant effect on the conduction through the transistor andcause unexpected operation of IC. So unless otherwise specified, input terminals not being used should be connectedto the power supply or ground line. www.rohm.co.jp (c)2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 24/30 TSZ02201-0T1T0AL00080-1-2 30.Aug.2013 Rev.004 BD9060HFP-C Datasheet BD9060F-C 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep themisolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating aparasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutualinterference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes tooperate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should beavoided. 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance withtemperature and the decrease in nominal capacitance due to DC bias and others. 14. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe Operation (ASO). 15. Thermal Shutdown Circuit(TSD) This IC incorporates and integrated thermal shutdown circuit to prevent heat damage to the IC. Normal operationshould be within the power dissipation rating, if however the rating is exceeded for a continued period, the junctiontemperature (Tj) will rise and the TSD circuit will be activated and turn all output pins OFF. After the Tj falls below theTSD threshold the circuits are automatically restored to normal operation.Note that the TSD circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under nocircumstances, should the TSD circuit be used in a set design or for any purpose other than protecting the IC fromheat damage. 16. Over Current Protection Circuit (OCP) This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted. Thisprotection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC shouldnot be used in applications characterized by continuous operation or transitioning of the protection circuit. www.rohm.co.jp (c)2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 25/30 TSZ02201-0T1T0AL00080-1-2 30.Aug.2013 Rev.004 BD9060HFP-C Datasheet BD9060F-C Ordering Information B D 9 0 6 Rohm Model Name 0 H F P Package Type HFP : HRP7 F : SOP8 - C T Product Grade Automotive R Tape and Reel Information TR: Reel type embossed taping (HRP7) E2: Reel type embossed taping (SOP8) Marking Diagram HRP7(TOP VIEW) Part Number Marking BD9060HFP LOT Number 1PIN MARK SOP8(TOP VIEW) Part Number Marking D 9 0 6 0 LOT Number 1PIN MARK www.rohm.co.jp (c)2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 26/30 TSZ02201-0T1T0AL00080-1-2 30.Aug.2013 Rev.004 BD9060HFP-C Datasheet BD9060F-C Thermal reduction characteristics HRP7 SOP8 10 0.8 9 8 7.3W Power Dissipation: Pd[W] Power Dissipation: Pd[W] 0.69W 0.7 7 5.5W 6 5 4 3 2.3 W 2 1.0 W 0.6 0.5 0.56 W 0.4 0.3 0.2 0.1 1 0.0 0 0 25 50 75 100 125 0 150 25 50 75 100 125 150 Ambient Temperature: Ta[C] Ambient Temperature: Ta[C] : Single piece of IC Board size: 70mmx70mmx1.6mm (with thermal via on the board) Copper area:10.5mmx10.5mm : 2-layer PCB (Copper foil area on the reverse side of PCB: 15mmx15mm) : 2-layer PCB (Copper foil area on the reverse side of PCB: 70mmx70mm) : 4-layer PCB (Copper foil area on the reverse side of PCB: 70mmx70mm) : Single piece of IC : Mounted on a Rohm standard board Board size : 70mmx70mmx1.6mm Figure 34. Figure 38. Thermal reduction characteristics www.rohm.co.jp (c)2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 27/30 TSZ02201-0T1T0AL00080-1-2 30.Aug.2013 Rev.004 BD D9060HFP P-C Datashe Datasheet eet BD90 060F-C Ph hysical Dime ension, Tape e and Reel Information Package P Na ame ww ww.rohm.co.jp (c)20 013 ROHM Co., Ltd. All rights reserved. r TSZ Z22111150 001 HR RP7 28/30 TSZ002201-0T1T0AL00080-1-2 30.Aug.2013 Rev.00 04 BD9060HFP-C Datasheet BD9060F-C Package Name SOP8 Figure 35. Thermal reduction characteristics <Tape and Reel information> Tape Embossed carrier tape Quantity 2500pcs Direction of feed E2 The direction is the 1pin of product is at the upper left when you hold ( reel on the left hand and you pull out the tape on the right hand Direction of feed 1pin Reel www.rohm.co.jp (c)2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 ) Order quantity needs to be multiple of the minimum quantity. 29/30 TSZ02201-0T1T0AL00080-1-2 30.Aug.2013 Rev.004 BD9060HFP-C Datasheet BD9060F-C Revision History Date Revision 2013.08.30 004 Changes New Release www.rohm.co.jp (c)2013 ROHM Co., Ltd. All rights reserved. TSZ2211115001 30/30 TSZ02201-0T1T0AL00080-1-2 30.Aug.2013 Rev.004 Notice Precaution on using ROHM Products 1. (Note 1) If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment , aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ("Specific Applications"), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM's Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASS CLASSb CLASS CLASS CLASS CLASS 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM's Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PAA-E (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM's internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PAA-E (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM's Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM's Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an "as is" basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice - WE (c) 2015 ROHM Co., Ltd. All rights reserved. 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