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22111・14・
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Datasheet
Datasheet
2/30
BD9060HFP-C BD9060F-C
TSZ02201-0T1T0AL00080-1-2
©2013 ROHM Co., Ltd. All rights reserved.
30.Aug.2013 Rev.004
www.rohm.co.jp
TSZ22111・15・001
Block Diagram, Pin Configuration, Pin Description
Pin No. Pin Name Function
1 VIN Power supply input
2 SW Output
3 FB Error Amp output
4 GND Ground
5 INV Output cottage feedback
6 RT Frequency setting resistor connection
7 EN/SYNC Enable/Synchronizing pulse input
FIN - Ground
Pin No. Pin Name Function
1 VIN Power supply input
(N
o
t
e
1)
2 SW Output
3 FB Error Amp output
4 INV Output cottage feedback
5 EN/SYNC Enable/Synchronizing pulse input
6 RT Frequency setting resistor connection
7 GND Ground
8 PVIN Power supply input(Note1)
(Note 1) PVIN and VIN are shorted
(BD9060F-C)
(BD9060HFP-C)
SOP8
(TOP VIEW)
1 2 3 4
8 7 6 5
1 2 3 4 5 6 7
HRP7
(TOP VIEW)
1
VIN
VREG
VREFUVLO
TSD
OSC
6
SYNC
7
SLOPE
UVLO
TSD
PWM
DRV
LOGIC
S
R
UVLO, TSD
OCP, SCP
ERR
5
INV
0.8V
SOFT
START
3
FB SCP
0.6V
SCP
OCP OCP
VINVIN
DRV
2
RT
GND
4
SW
EN/SYNC
VIN VIN
1
VIN
VREG
VREFUVLO
TSD
OSC
6
SYNC
5
SLOPE
UVLO
TSD
PWM
DRV
LOGIC
S
R
UVLO, TSD
OCP, SCP
ERR
4INV
0.8V
SOFT
START
3
FB SCP
0.6V
SCP
OCP OCP
PVINPVIN
DRV
8
2
RT
GND
7
SW
PVIN
EN/SYNC
Datasheet
Datasheet
3/30
BD9060HFP-C BD9060F-C
TSZ02201-0T1T0AL00080-1-2
©2013 ROHM Co., Ltd. All rights reserved.
30.Aug.2013 Rev.004
www.rohm.co.jp
TSZ22111・15・001
Description of Blocks
・ERR(Error Amp)
The Error Amp block is an error amplifier used to input the reference voltage (0.8V (Typ)) and the INV pin voltage. The
output FB pin controls the switching duty and output voltage Vo. These INV and FB pins are externally mounted to
facilitate phase compensation. Inserting a capacitor and resistor between these pins enables adjustment of phase margin.
(Refer to recommended examples on P. 15 to 17)
・SOFT START
The SOFT START block provides a function to prevent the overshoot of the output voltage Vo through gradually increasing
the normal rotation input of the error amplifier when power supply turns ON to gradually increase the switching duty. The
soft start time is set to 2.7ms (Typ).
・SYNC(EN/SYNC)
By making the “EN/SYNC” terminal less than 0.8V, the circuit can be shut down. Furthermore, by applying higher
frequency pulse than the configured oscillation frequency to the “EN/SYNC” pin, external synchronization is possible.
Frequency range of external synchronization is FOSC x 1.05 ≤Fsync≤500kHz and 1.5 times of the set frequency. (Refer to
P. 11 )
・OSC (Oscillator)
This circuit generates the pulse wave to be inputted to the SLOPE, and by connecting a resistor to the “RT”, 50kHz to
500kHz oscillating frequency can be configured. (Refer to P.15 Figure 23)
・SLOPE
This block generates sawtooth waves from the clock generated by the OSC. The generated sawtooth waves are sent to
PWM.
・PWM
The PWM Comparator block is a comparator to make comparison between the FB pin and internal sawtooth wave and
outputs a switching pulse. The switching pulse duty varies with the FB value. (Min Duty width: 250ns)
・TSD (Thermal Shutdown)
In order to prevent thermal destruction/thermal runway of the IC, the TSD block will turn OFF the output when the chip
temperature reaches approximately 150°C or more. When the chip temperature falls to a specified level, the output will be
reset. However, since the TSD is designed to protect the IC, the chip junction temperature should be provided with the
thermal shutdown detection temperature of less than approximately.150°C.
・OCP (Over Current Protection)
While the output POWER P-ch MOS FET is ON, if the voltage between drain and source (on-resistancexload current)
exceeds the reference voltage internally set with the IC, OCP will start up.This OCPis a self-return type. If OCP operates,
the duty will be small, and output voltage will decrease. However, this protection circuit is only effective in preventing
destruction from sudden accident. It does not support for continuous operation of the protection circuit (e.g. if a load, which
significantly exceeds the output current capacitance, is normally connected). Furthermore, since the overcurrent
protection detection value has negative temperature characteristics, consider thermal design.
・SCP (Short Current Protection)
While OCP operates, and if the output voltage falls below 70%, SCP will start up. If SCP operates, the output will be turned
OFF after a period of 1024 pulse. It extends the output OFF time to reduce the average output current. In addition, during
power start-up, this feature is masked until it reaches the set output voltage to prevent wrong trigger of SCP.
・UVLO (Under Voltage Lock-Out)
UVLO is a protection circuit for low voltage malfunction. It preventsmalfunction of the internal circuit at the time of sudden
rise and fall of power supply voltage. It monitors the VIN powersupply voltage and internal regulator voltage. If VIN is less
than 4.3V (Typ), Pch POWER MOS FET output is OFF. This threshold voltage has a hysteresis of 200mV (Typ). If VIN is
more than 4.5V (Typ) , UVLO will be released and the soft start circuit will be restarted.
・DRV (Driver)
This is a driver circuit for driving the gate electrode of the Pch POWER MOS FET output. By switching the driving voltage
when the power supply voltage drop, it reduces the deterioration ofPOWER MOS FET on-resistance. It monitors the VIN
power supply voltage and internal regulator voltage. If VIN is less than 7.5V (Typ), the driving voltage is switched.This
threshold voltage has a hysteresis of 1.5V (Typ).
Datasheet
Datasheet
4/30
BD9060HFP-C BD9060F-C
TSZ02201-0T1T0AL00080-1-2
©2013 ROHM Co., Ltd. All rights reserved.
30.Aug.2013 Rev.004
www.rohm.co.jp
TSZ22111・15・001
Absolute Maximum Ratings(Ta=25°C)
Parameter Symbol Limits Unit
Power Supply Voltage VIN, PVIN 42 V
Output Switch Pin Voltage VSW V
IN V
Output Switch Current ISW 4
(Note 1) A
EN/SYNC Pin Voltage VEN/SYNC V
IN V
RT,FB,INV Pin Voltage VRT,VFB, VINV 7 V
Power Dissipation
HRP7 Pd 5.51
(Note 2) W
SOP8 Pd 0.69(Note 3) W
Storage Temperature Range Tstg -55 to +150 °C
Maximum Junction Temperature Tjmax 150 °C
(Note 1) Pd should not be exceeded.
(Note 2) Reduce by 44mW/°C,when mounted on 2-layerPCB of 70mmx70mmx16mm
(PCB incorporates thermal via. Copper foil area on the reverse side of PCB: 10.5mmx10.5mm
Copper foil area on the reverse side of PCB: 70mmx70mm).
(Note 3) Reduce by 5.52mW/°C,when mounted on 1-layerPCB of 70mm x70mm x1.6mm
Caution: Operating the IC over the absolute maximum ratings may damage the IC. In addition, it is impossible to predict all destructive situations such as
short-circuit modes, open circuit modes, etc. Therefore, it is important to consider circuit protection measures, like adding a fuse, in case the IC is operated in a
special mode exceeding the absolute maximum ratings.
Recommended Operating Conditions
Parameter Symbol Limits Unit
Operating Power Supply Voltage VIN, PVIN 5 to 35 V
Operating Temperature Range Topr -40 to +125 °C
Output Switch Current ISW to 2 A
Output Voltage (min pulse width) PWMIN 250 ns
Oscillating Frequency fosc 50 to 500 kHz
Oscillating Frequency Set Resistance RT 27 to 360 kΩ
External Sync Frequency fSYNC F
OSC x 1.05 ≤Fsync≤FOSC x 1.5 (Note 1) kHz
(Note 1) It should be configured at less than 500kHz.
Datasheet
Datasheet
5/30
BD9060HFP-C BD9060F-C
TSZ02201-0T1T0AL00080-1-2
©2013 ROHM Co., Ltd. All rights reserved.
30.Aug.2013 Rev.004
www.rohm.co.jp
TSZ22111・15・001
Electrical Characteristics(Unless otherwise specified, Ta=- 40°C to +125°C, VIN=13.2V,VEN/SYNC =5V)
Parameter Symbol
Guaranteed Limit Unit Conditions
Min Typ Max
Standby Circuit Current ISTB － 0 5 µA
VEN/SYNC=0V,
Ta=-40°Cto +105°C
Circuit Current ICC － 3.7 8.0 mA
IOUT=0A, RT=51kΩ,
VINV=0.7V
SW Block
POWER MOS FET ON
Resistance RON － 0.3 0.6 Ω
Operating Output Switch
Current Of Overcurrent
Protection (Note 1)
ILIMIT 2.5 4 － A
Output Leak Current IOLEAK － 0 5 µA
VIN=35V, VEN/SYNC =0V,
Ta=-40°C to +105°C
Error Amp Block
Reference Voltage 1 VREF1 0.784 0.800 0.816 V VFB= VINV
Reference Voltage 2 VREF2 0.780 0.800 0.820 V VFB= VINV, VIN =5V to 35V
Reference Voltage Input
Regulation ΔVREF － 0.5 － %
VIN =5V to 35V
Input Bias Current IB -1 － － µA
VINV =0.6V
Maximum FB Voltage VFBH 2.0 2.5 － V
VINV =0V
Minimum FB Voltage VFBL － 0.51 0.80 V
VINV =2V
FB Sink Current IFBSINK -2.45 -1.23 -0.45 mA VFB=1V, VINV=1V
FB Source Current IFBSOURCE 1.0 6.3 15.0 mA
VFB=1V, VINV=0.6V
Soft Start Time (Note 1) TSS 1.7 2.7 5.0 ms
Oscillator Block
Oscillating Frequency fosc 285 300 315 kHz
RT=51kΩ
Frequency Input Regulation Δfosc － 0.5 － %
VIN =5V to 35V
Enable/Sync Input Block
Output ON Voltage VENON 2.6 － － V
VEN/SYNC Sweep Up
Output OFF Voltage VENOFF － － 0.8 V
VEN/SYNC Sweep Down
Sink Current IEN/SYNC － 19 60 µA
(Note 1)This item is not 100% production tested.
(Caution) EN / SYNC and RT are shorted at VIN and EN / SYNC short-circuited, IC is destroyed in VIN ≥ 7V,
Datasheet
Datasheet
6/30
BD9060HFP-C BD9060F-C
TSZ02201-0T1T0AL00080-1-2
©2013 ROHM Co., Ltd. All rights reserved.
30.Aug.2013 Rev.004
www.rohm.co.jp
TSZ22111・15・001
Typical Performance Curves
Figure 1. Reference Voltage vs Temperature Figure 2. Oscillating Frequency vs Temperature
(RT=330kΩ)
Figure 3.Oscillating Frequency vs Temperature
(RT=160kΩ)
Figure 4.Oscillating Frequency vs Temperature
(RT=51kΩ)
0.784
0.788
0.792
0.796
0.800
0.804
0.808
0.812
0.816
-50-25 0 255075100125150
Reference Voltage:VREF [V]
Ambient Temperature: Ta [ °C]
95
96
97
98
99
100
101
102
103
104
105
-50-250 255075100125150
Oscillating Frequency: FOSC [kHz]
Ambient Temperature: Ta [°C]
RT = 160 kΩ
47.5
48.0
48.5
49.0
49.5
50.0
50.5
51.0
51.5
52.0
52.5
-50-25 0 255075100125150
Oscillating Frequency: F
OSC
[kHz]
Ambient Temperature:Ta [°C]
RT = 330 kΩ
285
288
291
294
297
300
303
306
309
312
315
-50-25 0 255075100125150
Oscillating Frequency: F
OSC
[kHz]
Ambient Temperature: Ta [°C]
RT = 51 kΩ
Datasheet
Datasheet
7/30
BD9060HFP-C BD9060F-C
TSZ02201-0T1T0AL00080-1-2
©2013 ROHM Co., Ltd. All rights reserved.
30.Aug.2013 Rev.004
www.rohm.co.jp
TSZ22111・15・001
Figure 5.Oscillating Frequency vs Temperature
(RT=30kΩ)
Figure 6.Standby Circuit Current vs Input Voltage
Figure 7. Circuit Current vs Input Voltage
Figure 8.EN/SYNC Input Current vs Input Voltage
475
480
485
490
495
500
505
510
515
520
525
-50-25 0 255075100125150
Oscillating Frequency: F
OSC
[kHz]
Ambient Temperature: Ta [°C]
RT = 30 kΩ
0
1
2
3
4
5
0 5 10 15 20 25 30 35 40
Stand- by Current: ISTB [µA]
Input Voltage: VIN [V]
Ta=125°C
Ta=105°C
Ta=25°C, -40°C
0
1
2
3
4
5
6
7
8
0 5 10 15 20 25 30 35 40
Circuit Current: I
CC
[mA]
Input Voltage: V
IN
[V]
From Top:Ta=125°C
Ta=25°C
Ta=-40°C
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0 5 10 15 20 25 30 35 40
EN/SYNCInputCurrent:I
EN
[mA]
Input Voltage: V
EN
/ SYNC [V]
Inflection Point
From Top:VEN=6.2V(Ta=125°C)
V
EN=6.5V(Ta=25°C)
V
EN=6.7V(Ta=-40°C)
Datasheet
Datasheet
8/30
BD9060HFP-C BD9060F-C
TSZ02201-0T1T0AL00080-1-2
©2013 ROHM Co., Ltd. All rights reserved.
30.Aug.2013 Rev.004
www.rohm.co.jp
TSZ22111・15・001
Figure 12.Conversion Efficiency vs Output Current
(f=100kHz)
Figure 9. ON Resistance vs Output Current
(VIN=5V)
Figure 10. ON Resistance vs Output Current
(VIN =13.2V)
Figure 11. ON Resistance vs Output Current
(VIN =35V)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0.00.51.01.52.0
FETOnResistance:R
ON
[Ω]
OutputCurrent:l
O
[A]
From Top: Ta=125°C
Ta=25°C
Ta=-40°C
VIN = 13.2 V
VIN = 5 V
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0.0 0.5 1.0 1.5 2.0
FET On Resistance: RON [Ω]
Output Current: lO[A]
From Top: Ta=125°C
Ta=25°C
Ta=-40°C
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0.0 0.5 1.0 1.5 2.0
FET On Resistance: R
ON
[Ω]
Output Current: l
O
[A]
From Top: Ta=125°C
Ta=25°C
Ta=-40°C
VIN =35 V
0
10
20
30
40
50
60
70
80
90
100
0.00.51.01.52.0
Conversion Efficiency[％]
Output Current:lo[A]
From Top: 5.0V output
3.3V output
VIN =13.2V
f=100kHz
Ta=25 °C
*It measured BD9060HFP.
Datasheet
Datasheet
9/30
BD9060HFP-C BD9060F-C
TSZ02201-0T1T0AL00080-1-2
©2013 ROHM Co., Ltd. All rights reserved.
30.Aug.2013 Rev.004
www.rohm.co.jp
TSZ22111・15・001
Figure 13.Conversion Efficiency vs Output Current
(f=300kHz)
Figure 14.Conversion Efficiency vs Output Current
(f=500kHz)
0
10
20
30
40
50
60
70
80
90
100
0.0 0.5 1.0 1.5 2.0
Conversion Efficiency[％]
Output Current:lo[A]
From Top: 5.0V output
3.3V output
VIN =13.2V
f=500kHz
Ta=25 °C
*It measured BD9060HFP.
Figure 15.Overcurrent Protected Operation Current
0
2
4
6
8
10
012345
Output Current: lO [A]
Output Voltage: V
O [V]
From Left:Ta=125°C
Ta=25°C
Ta=-40°C
VIN = 13.2 V
f = 300 kHz
VO = 5 V
0
10
20
30
40
50
60
70
80
90
100
0.00.51.01.52.0
Conversion Efficiency[％]
Output Current:lo [A]
From Top: 5.0V output
3.3V output
VIN =13.2V
f=300kHz
Ta=25 °C
*It measured BD9060HFP.
Datasheet
Datasheet
10/30
BD9060HFP-C BD9060F-C
TSZ02201-0T1T0AL00080-1-2
©2013 ROHM Co., Ltd. All rights reserved.
30.Aug.2013 Rev.004
www.rohm.co.jp
TSZ22111・15・001
Timing Chart
・Basic Operation
・Over Current Protection Operation
VIN=13.2V
f=300kHz
VO=5V
Figure 17.Timing Chart (Over Current Protection Operation)
VIN
FB
SW
VEN / SYNC
Internal SLOPE
Figure 16. Timing Chart (Basic Operation)
SW
IL
VO
INV
FB
Internal
Soft Start
Normal pulse repetition at
the following
Auto reset
(Soft Start Operation)
tOFF = 1024 / fosc [s]
ex）fosc = 300 kHz、tOFF = 3.41 ms
tOFF, tSS Terminal
tSS = 2.7 [ms] (Typ)
tOFF tSS
Datasheet
Datasheet
11/30
BD9060HFP-C BD9060F-C
TSZ02201-0T1T0AL00080-1-2
©2013 ROHM Co., Ltd. All rights reserved.
30.Aug.2013 Rev.004
www.rohm.co.jp
TSZ22111・15・001
External Synchronizing Function
In order to activate the external synchronizing function, connect the frequency-setting resistor to the RT pin and then input a
synchronizing signal to the EN/SYNC pin. As the synchronizing signal, input a pulse wave higher than a frequency
determined with the setting resistor(RT).However, the external sync frequency should be configured between 1.05 to 1.5
times the set frequency.
(Frequency determined with RT x 1.05 ≤ External sync frequency ≤ Frequency determined with RT x 1.5)
(ex.) When the configured frequency is 300kHz, the external sync frequency should be between 315kHz to 450kHz.
Furthermore, the pulse wave’s LOW voltage should be under 0.8V and the HIGH voltage over 2.6V,(when the HIGH voltage
is over 6V the EN/SYNC input current increases [Refer to p.7 Fig.8])the through rate of stand-up(and stand-down)under
20V/µs. The duty of External sync pulse should be configured between 20% to 80%.
Figure 18.External Sync Sample Circuit
(VO=5V,IO=1A,f=300kHz,EN/SYNC=450kHz)
Cbulk CIN
RT
51 kΩ
R3
10kΩ
R2
8.2 kΩ
R1
43kΩ
R4
0kΩ
CO
22µF
D1
VIN
EN/SYNC
VO
IL
VIN/PVIN
RT
EN/SYNC
SW
INV
FB
BD9060HFP-C
BD9060F-C C2
1000pF
CO
22µF
VEN/SNC = 0V to 5 V
f = 450 kHZ
SR = 20 V / µs
Duty = 50 %
C1
4700pF
C3
100pF
GND
Datasheet
Datasheet
12/30
BD9060HFP-C BD9060F-C
TSZ02201-0T1T0AL00080-1-2
©2013 ROHM Co., Ltd. All rights reserved.
30.Aug.2013 Rev.004
www.rohm.co.jp
TSZ22111・15・001
Selection of Components Externally Connected
Necessary parametersare as followsin designingthe power supply.
Parameter Symbol SpecificationCase
Input Voltage VIN 8V to 33V
Output Voltage VO 5V
Output Ripple Voltage ΔVPP 20mVp-p
Input Range IO Min 0.5A / Typ1.0A / Max 1.5A
Switching Frequency fSW 300kHz
Operating Temperature Range Topr -40°Cto+125°C
1. Setofoutputinductor L constant
In DC/DC converter, to supply electric current continuously to the load, the LC filter is necessary for the smoothness of the
output voltage.ΔIL that flows to the inductor becomes small when a big inductor of the inductance value is selected, and
the voltage of the output ripple becomes small. It is a trade-off against the responsiveness, the size and the cost of the
inductor.
The inductance value of the inductor is shown in the next expression.
∆ ・・・(a)
(VIN(MAX):Maximum input voltage,ΔIL:Inductor ripple current)
ΔIL is set to make SW the continuous control action (IL keeps continuously flowing) usually.The condition of thecontinuous
operation is shown in the next expression.
＞
・・・(b)
(IO :Load current)
Fi
g
ure 19.A
pp
lication Sam
p
le Circuit
Figure 20. Continuous Action
Figure 21. Discontinuous Action
Cbulk CIN R4
VIN
EN/SYNC
VO
IL
VIN/PVIN
RT
EN/SYNC
SW
INV
FB
BD9060HFP-C
BD9060F-C C2
R1
R2
CoD1
C1R3
C3
RT
GND
SW
V
t
I
t
Io
ΔIL
SW
V
t
I
t
Io
Datasheet
Datasheet
13/30
BD9060HFP-C BD9060F-C
TSZ02201-0T1T0AL00080-1-2
©2013 ROHM Co., Ltd. All rights reserved.
30.Aug.2013 Rev.004
www.rohm.co.jp
TSZ22111・15・001
IO
Figure 22.OvercurrentDetection
ILIMIT
IO
The smaller the ΔIL, the Inductor core loss(iron loss) and loss due to ESR of the output capacitor, ΔVPP will be reduced.
ΔVPPis shown in the next expression.
∆ ∆
∆
・・・(c)
(ESR: Equivalent series resistance of output capacitor, CO: Output condenser capacity)
ΔIL is set to approximately 10% to 40% of IO. Generally, even if ΔIL is somewhat large, ΔVPP of the target is satisfied
because the ceramic capacitor has super-low ESR. In that case, it is also possible to use it by the discontinuous action.
The inductance value of the inductor can be set small as an advantage.
It contributes to the miniaturization of the set because of the large rated current, small inductor is possible if the inductance
value is small.The disadvantagesare the increase in core losses in the inductor, the decrease in maximum output current,
and the deterioration of theresponse. When other capacitors (electrolytic capacitor, tantalum capacitor, and
electroconductive polymer etc) are used for output capacitor CO,check theESRfromthe manufacturer's data sheetand
determine the ΔIL to fitwithin the acceptable range of ΔVPP.Especially inthe case ofelectrolytic capacitor, because the
capacity decrease at the low temperature is remarkable, ΔVPPincreases. When using capacitor at the low temperature, it is
necessary to note this.The maximum output electric current is limited to the overcurrent protection working current as
shown in the next expression.
∆
・・・(d)
Where: IO(MAX) is Maximum output current, ILIMIT(min):Minimum operating output switch current of overcurrent protection2.5A
The shield type (closed magnetic circuit type) is the recommended type of inductor. There is no problem in the open
magnetic circuit type if the application is low cost and does not consider noise.In that case, there is magnetic field radiation
between the parts.There should be enough space between the parts.
For ferrite core inductor type, in particular, please note the magnetic saturation.It is necessary not to saturate the core in
allcases.Care must be taken giventhe provisions of thecurrent rating because it differs according to each manufacturer.
Pleaseconfirm the rated current at the maximum ambient temperature of the application to the manufacturer.
2. SetofoutputCapacitor CO constant
The output capacitor is selected on the basis of ESR that is required from the expression (c).ΔVPP can be reduced by
using a capacitor with a small ESR.The ceramic capacitor is the best selection that meets this requirement.The ceramic
capacitor contributes to the miniaturization of the set because it has small ESR.Please confirm frequency characteristic of
ESR from the datasheet of the manufacturer, and select the one that ESR in the switching frequency used is low.It is
necessary to note the ceramic capacitor because the DC biasing characteristic is remarkable. For the voltage rating of the
ceramic capacitor, twice or more of the maximum output voltage is usually required.By selecting those high voltage rating,
it is possible to reduce the influence of DC bias characteristics.Moreover, in order to maintain good temperature
characteristics, the one with the characteristic of X7R and X5R or more is recommended.Because the voltage rating of a
mass ceramic capacitor is low, the selection becomes difficult in the application with high output voltage. In that case,
please select electrolytic capacitor. Please select the one with voltage rating of 1.2 times or more of the output voltage
when you use electrolytic capacitor.Electrolytic capacitors are high blocking voltage, a large capacity, and the little DC
biasing characteristic, and are generally cheap.Because main failure mode is OPEN, it is effective to use electrolytic
capacitor selection in the application when reliability is demandedsuch as in-vehicle. There are disadvantages as, ESR is
relatively large, and decrease of capacity at low temperatures.It is necessary to note this so that the low temperature, and
in particular, ΔVPP may increase.Moreover, the feature of this capacitor is to define the lifetime because there is possible
dry up. A very excellent characteristic of the tantalum capacitor and the electro-conductive polymer is the thermal
characteristic unlike the electrolytic capacitor.The design is facilitated because there is little DC biasing characteristic like
the electrolytic capacitor.Typically, for voltage rating, a tantalum capacitor is selected twice the output voltage, and for
conductive polymer is selected 1.5 times more than the output voltage.The disadvantage of the tantalum capacitor is that
the failure mode is SHORT, and the breakdown voltage is low.It is not generally selected in the application that reliability
such as in-vehicle is demanded.The disadvantage of the electroconductive polymer is that the failure mode is
SHORT(SHORT happens by accident chiefly, though it is OPEN),the breakdown voltage is low , and generally
expensive.Although in most cases ignored, these capacitors are rated in ripple current. The RMS values of the ripple
electric current obtained in the next expression must not exceed the ratings ripple electric current.
t
Datasheet
Datasheet
14/30
BD9060HFP-C BD9060F-C
TSZ02201-0T1T0AL00080-1-2
©2013 ROHM Co., Ltd. All rights reserved.
30.Aug.2013 Rev.004
www.rohm.co.jp
TSZ22111・15・001
∆
√ ・・・(e)
Where:ICO(RMS) is RMS value of the ripple electric current
In addition,with respect toCO, choose capacitance value lessthan the valueobtainedby the following equation.
.
・・・(f)
Where: ILIMIT(MIN) is OCP operation output switch current(Min) 2.5A,1.7ms: Soft Start Time(Min)
There is a possibility that boot failure happens when the limits from the above-mentioned are exceeded.Especiallyif
thecapacitance valueis extremely large, you may activate over-current protectionby theinrush currentat startup, and
theoutputdoes not start. Please confirm this well on the actual circuit.The capacitance value is an important parameter that
decides the LC resonant frequency. For stable transient response, the loop is dependent on the CO.Please select after
confirming the setting of the phase compensation circuit.
3. Setting constant of capacitor CIN / Cbulk input
The input capacitor is usually required for two types of decoupling: capacitorsCIN and bulk capacitorsCbulk.Ceramic
capacitor 1µF to 10µF is necessary for the decoupling capacitor.Ceramic capacitor is effective by being placed as close as
possible to the VIN pin.Voltage rating is recommended to more than 1.2 times the maximum input voltage, or twice the
normal input voltage.About the bulk capacitor, the decrease in the line voltage is prevented, and the role of the backup
power supply to keep the input potential constant is realized.The low ESR electrolytic capacitor with large capacity is
suitable for the bulk capacitor.It is necessary to select the best capacitance value as per set application.When impedance
on the input side is high because wiring from the power supply to VIN is long, etc., then high capacitance is needed.In
actual use conditions,it is necessary to verify that there is no problem when IC operation turns off the output due to the
decrease of VIN at transient response.In that case, please be careful not to exceed the rated ripple current of the capacitor.
The RMS value of the input ripple electric current is obtained in the next expression.
・・・(g)
where: ICIN(RMS) is RMS value of the input ripple electric current
In addition, in automotive and other applications requiring reliability, it is recommended that capacitors are connected in
parallel to accommodate a multiple of electrolytic capacitors minimal dry up chances.We will recommend making it to two
series + two parallel structures to decrease the risk of the ceramic capacitor by short destruction.The line has been
improved to the summary respectively by 1pack in each capacitor manufacturer and confirms two series and two parallel
structures to each manufacturer.
4. Setting output voltage
Output voltage is governed by the following equation.
0.8
・・・(h)
Please set return resistance R2 below 30kΩto reduce the error margin by the bias current.In addition, since power
efficiency is reduced with a small R1 + R2, please set the current flowing through the feedback resistor to be small enough
than the output current IO.
5. Selectionof the schottky barrier diode
The schottky barrier diode that has small forward voltage and short reverse recovery time is used for Di.An important
parameter for selecting it is an average rectified current and a direct current inverse-direction voltage.Average rectified
current IF(AVG) is obtained in the next expression.
・・・(i)
where: IF(AVG) isAverage rectified current
Datasheet
Datasheet
15/30
BD9060HFP-C BD9060F-C
TSZ02201-0T1T0AL00080-1-2
©2013 ROHM Co., Ltd. All rights reserved.
30.Aug.2013 Rev.004
www.rohm.co.jp
TSZ22111・15・001
The absolute maximum rating of the schottky barrier diode rectified current average is more than 1.2 times IF(AVG) and the
absolute maximum rating of the DC reverse voltage is greater than or equal to 1.2 times the maximum input voltage. The
loss of Di is obtained in the next expression.
・・・(j)
Where: VF is Forward voltage in Io(MAX) condition
Selecting a diode that has small forward voltage, and has short reverse recovery time is highly effective.Please select the
0.6V Max for the forward voltage. Please note that there is possibility of the internal element destruction when a diode with
larger VF than this is used.Because the reverse recovery time of the schottky barrier diode is so shortthat it is possible to
disregard, the switching loss can be disregarded. When it is necessary that the diode endures in the state of the output
short-circuit, power dissipation ratings and the heat radiation ability are needed in addition. The rated current is required
about 1.5 times the overcurrent detection value.The loss when the output is short-circuited is obtained in the next
expression.
・・・(k)
Where: ILIMIT(MAX) isOCP operation output switch current(MAX) 6A
6. Setting the oscillating frequency
An internal oscillating frequency can be set by the resistance connected with RT.
The range that can be set is 50kHz to 500kHz, and the relation between resistance and the oscillation frequency is decided as shown
in the figure below.When setting beyond this range, there is a possibility of non-oscillation and IC operation cannot be guaranteed.
7. Setting the phase compensation circuit
A high response performance is achieved by setting 0dB crossing frequency fc of the total gain (frequency at the gain 0dB)
high.However, you need to be aware of the relationship to be a trade-off between stability.Moreover, DC/DC converter
application is sampled by switching frequency, and should suppress the gain in switching frequency.It is necessary to set
0dB crossing frequency to 1/10 or less of the switching frequency.In summary,target these characteristics with the
application as follows.
・When thegain is 1(0dB), phase lagis less than or equal to135 ˚(More than45 ˚phase margin).
・0dB crossing frequency is 1/10 times or less of the switching frequency.To improve the responsiveness, higher frequency of
switching frequency is needed.
We recommend the Bode diagram to be made by using the transfer function of the control loop to obtain frequency
characteristic of target for the phase compensation circuit.Make sure the frequency characteristics of the total gain by
totaling the transfer function of the following three.
RT[kΩ] fosc[kHz] RT[kΩ] fosc[kHz]
27 537 100 160
30 489 110 146
33 449 120 134
36 415 130 124
39 386 150 108
43 353 160 102
47 324 180 91
51 300 200 82
56 275 220 75
62 250 240 69
68 229 270 61
75 209 300 55
82 192 330 50
91 174 360 46
Figure 23.Oscillating Frequency vs RT
Graph'svalue is Typical and You need to consider
thevariationof±5% respectively.
50
100
150
200
250
300
350
400
450
500
0 50 100 150 200 250 300
Oscillating Frequency:fOSC[kHz]
Oscillating Frequency Setting Resistance:RT[kΩ]
Datasheet
Datasheet
16/30
BD9060HFP-C BD9060F-C
TSZ02201-0T1T0AL00080-1-2
©2013 ROHM Co., Ltd. All rights reserved.
30.Aug.2013 Rev.004
www.rohm.co.jp
TSZ22111・15・001
・・・(l)
・・・(m)
∆ ・・・(n)
Where: GLCis Transfer functionof theLCresonance
GFB is Transfer functionof thephase compensation
GPWM is Transfer functionof thePWM, ΔVRAMP：0.7V
Because BD9060HFP-C/BD9060F-C is a voltage mode control, two poles and two zeroes of the phase interpolator
circuitshown in the figure below can be added.Necessary frequencies of poles and zeroes are obtained in the following.
・・・(o)
・・・(p)
・・・(q)
・・・(r)
・・・(s)
・・・(t)
Where: DCR isDCresistanceof the inductor
RO isLoad resistance
Frequency response is optimized by placing the appropriate frequency of these poles and zeros.The standard is as
follows.
Figure 24. Phase Compensation Circuit
VO
D1
SW
DCR L ESR
Co
R4
C2
R1
R2
INV
FB
C3
C1 R3
VREF
Datasheet
Datasheet
17/30
BD9060HFP-C BD9060F-C
TSZ02201-0T1T0AL00080-1-2
©2013 ROHM Co., Ltd. All rights reserved.
30.Aug.2013 Rev.004
www.rohm.co.jp
TSZ22111・15・001
0.2
・・・(u)
0.5
2 ・・・(v)
0.5 ・・・(w)
・・・(x)
The phase delays (-180°) by the LC resonance can be canceled by setting the phase amends as mentioned above.fp2is
not necessary if fESR is higher than the SW frequency (The ceramic capacitor that has low ESR is used for the output
capacitor).In addition, if Q(quality factor)of the LC filter is high,the gain may peak out, and phase margin can not be
secured sufficiently.When Q is high, fz1 and fz2 are brought close to fLC as much as possible. Q is obtained in the next
expression.
・・・(y)
・・・(z)
The setting method by above-mentioned conditional expression is suitable as the starting point of the phase
amends.Please confirm that you meet the frequency characteristics to create a Bode plot.Actually, the frequency
characteristic changes are greatly affected by the type and the condition (temperature, etc.) of parts that are used, and the
wire routing and layout for the PCB.For instance, the LC resonance point moves because of the capacity decrease at low
temperature and an increase of ESR when electrolytic capacitor is used for the output capacitor that there is even
possibility of oscillation.To C1, C2 and C3 for phase compensation capacitor,use of CH products or temperature
compensation type C0G, etc. with an excellent thermal characteristic are recommended.
Please confirm stability and responsiveness in actual equipment.
To check on the actual frequency characteristics, use a FRA or a gain-phase analyzer.Moreover, the method of observing
the degree of change by the loading response can be done, when these measuring instruments do not exist.The response
is low when the output is made to change under no load to maximum load, and there is a lot of variation quantities.It can
be said that the phase margin degree is low when there is a lot of ringing frequencies after it changes, usually two times or
more of ringing as standard. However, a quantitative phase margin degree cannot be confirmed.
0
Load
t
Adequate phase margin.
Figure 25. Load Response
Maxi
mum
Output volta
g
e
Inadequate
phase margin
Datasheet
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22111・15・
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22111・15・
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0AL00080-1
.2013 Rev.0
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BD9060HFP-C BD9060F-C
TSZ02201-0T1T0AL00080-1-2
©2013 ROHM Co., Ltd. All rights reserved.
30.Aug.2013 Rev.004
www.rohm.co.jp
TSZ22111・15・001
Input Filter
The input filter circuit for EMC measures is depicted in Figure 28.
The π type filters are the third LC filters. When the decoupling capacitor for high frequency is insufficient, it uses π type
filters.
Because a large attenuation characteristic is obtained, an excellent characteristic can be obtained as an EMI filter.
TVS(TransientVoltageSuppressors) is used for the first protection of the in-vehicle power supply line.Because it is necessary
to endure high energy that dumps the load, a general zener diode is insufficient. The following are recommended. To protect
it when the power supply such as BATTERY is accidentally connected in reverse, reverse polarity protection diode is
needed.
Recommended Parts Manufacturer List
Show the parts manufacturer for the recommended reference.
No Part name (series) Manufacturer
L CLF series TDK
XAL series Coilcraft
C CJ series NICHICON
CZ series NICHICON
TVS SM8 series VISHAY
D S3A thru S3M series VISHAY
Device Type Manufacturer URL
C Electrolytic capacitors NICHICON www.nichicon.com
C Ceramic capacitors MURATA
www.murata.com
L Coils TDK
www.global.tdk.com
L Coils Coilcraft
www.coilcraft.com
L Coils Sumida
www.sumida.com
D Diodes VISHAY www.vishay.com
D Diodes/Resistors ROHM www.rohm.com
Figure 28. Frequency Characte
r
istics
BD9060HFP-C
BD9060F-C
L
CC
π-type filter
TVS
D
Reverse Polarity
Protection Diode
C
C
C
C
C
C
C
C
Datasheet
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BD9060HFP-C BD9060F-C
TSZ02201-0T1T0AL00080-1-2
©2013 ROHM Co., Ltd. All rights reserved.
30.Aug.2013 Rev.004
www.rohm.co.jp
TSZ22111・15・001
◎VIN
◎VO
◎
R1
R4
C2
R2
CIN
D1
L1
C1
C3
R3
Co
RT
GND
Cbulk
Directions For Pattern Layout of PCB
1. Arrange the wirings shown by wide lines as short as possible in a broad pattern.
2. Locate the input ceramic capacitor CIN as close to the VIN-GND pin as possible.
3. Locate the RT as close to the GND pin as possible.
4. Locate the R1 and R2 as close to the INV pin as possible, and provide the shortest wiring from the R1 and R2 to the INV
pin.
5. Locate the R1 and R2 as far away from the L1 as possible.
6. Separate Power GND (schottky diode, I/O capacitor`s GND) and Signal GND (RT,GND), so that SW noise doesnot have
an effect on SIGNAL GND at all.
7. Design the POWER wire line as wide and short as possible.
Figure 29. Filter Circuit Diagram
(BD9060HFP-C)
Figure 31. BD9060HFP-C Reference Layout Pattern
*
Please make GND to cover the wide area with no parts.
*Gray areas mean GND in the above Layout Pattern.
L1
Co C2R4
R3
C3
R1 R2
RT
C28
CIN
D1
C1
Figure 30. Application Circuit
(BD9060F-C)
BD9060HFP
GND
R2
Power
GND
C1
R3
Signal GND
VIN
SW
FB
GND
INV
RT
EN/SYNC
D1
Cbulk CIN
Co L
D
A
D
R1 R4
C2
C3
RT
L1
BD9060F
R2
Power
GND
C1
R3
Signal GND
VIN
SW
FB
INV
RT
EN/SYNC
D1
Cbulk CIN
Co L
D
A
D
R1 R4
C2
C3
RT
GND
PVIN
L1
Figure 32. BD9060F-C Reference Layout Pattern
Cbulk
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BD9060HFP-C BD9060F-C
TSZ02201-0T1T0AL00080-1-2
©2013 ROHM Co., Ltd. All rights reserved.
30.Aug.2013 Rev.004
www.rohm.co.jp
TSZ22111・15・001
Power Dissipation
For thermal design, be sure to operate the IC within the following conditions.
(Since the temperatures described hereunder are all guaranteed temperature, take margin into account.)
1.The ambient temperature Ta is to be 125°C or less.
2.The chip junction temperature Tj is to be 150°C or less.
The chip junction temperature Tj can be considered in the following two patterns: °C
1. To obtain Tj from the IC surface
temperatureTc in actual use
＜Reference value＞ θjc : HRP7 7°C/W
θjc : SOP8 32.5°C/W
2. To obtain Tj from the ambient temperature Ta
＜Reference value＞ θja : HRP7 125.0°C/W Single piece of IC
54.3°C/W 2-layer PCB (Copper foil area on the front side of PCB : 15mm×15mm)
22.7°C/W 2-layer PCB (Copper foil area on the front side of PCB : 70mm×70mm)
17.1°C/W 4-layer PCB (Copper foil area on the front side of PCB : 70mm×70mm)
PCB Size: 70mm×70mm×1.6mm (PCB incorporates thermal via)
Copper foil area on the front side of PCB: 10.5mm×10.5mm
θja : SOP8 222.2°C/W Single piece of IC
181.3°C/W 1-layer PCB(Copper foil area on the front side of PCB : 70mm×70mm)
The heat loss W of the IC can be obtained by the formula shown below:
W
Where:
RONis the ON resistance of IC (refer to page.8)
Io isthe Load current
VOisthe Output Voltage
VINistheinput Voltage
ICCisthe Circuit current(refer to page.5)
Tr isthe Switching rise/fall time (approximately 15n/35ns)
fis the Oscillating Frequency
①
②21
21
Figure 33. SW waveform
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BD9060HFP-C BD9060F-C
TSZ02201-0T1T0AL00080-1-2
©2013 ROHM Co., Ltd. All rights reserved.
30.Aug.2013 Rev.004
www.rohm.co.jp
TSZ22111・15・001
I/O Equivalent Circuit
Figure 34. I/O Equivalent Circuit
INV
VIN
1kΩ
Internal Regulator
RT
VIN
167kΩ
Internal Regulator
EN / SYNC
SW
RT
FB
INV
SW
VIN
VIN (BD9060HFP-C)
Internal Regulator
222kΩ
VIN
EN/SYNC
145kΩ
221kΩ
60ｋΩ
Datasheet
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BD9060HFP-C BD9060F-C
TSZ02201-0T1T0AL00080-1-2
©2013 ROHM Co., Ltd. All rights reserved.
30.Aug.2013 Rev.004
www.rohm.co.jp
TSZ22111・15・001
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity
whenconnecting the power supply, such as mounting an external diode between the power supply and the IC’s
powersupply terminals.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance ground and supply lines. Separate the ground and
supplylines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from
affectingthe analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect
oftemperature and aging on the capacitance value when using electrolytic capacitors.
3. Ground Voltage
The voltage of the ground pin must be the lowest voltage of all pins of the IC at all operating conditions. Ensure that
nopins are at a voltage below the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current GND traces, the two ground traces should be routed separately
butconnected to a single ground at the reference point of the application board to avoid fluctuations in the
small-signalground caused by large currents. Also ensure that the GND traces of external components do not cause
variations onthe GND voltage. The power supply and ground lines must be as short and thick as possible to reduce
line impedance.
5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result
indeterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is
whenthe IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum
rating,increase the board size and copper area to prevent exceeding the Pd rating.
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately
obtained.The electrical characteristics are guaranteed under the conditions of each parameter.
7. Rush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrushcurrent may flow
instantaneously due to the internal powering sequence and delays, especially if the IChas more than one power
supply. Therefore, give special consideration to power coupling capacitance,power wiring, width of GND wiring, and
routing of connections.
8. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin
maysubject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power
supplyshould always be turned off completely before connecting or removing it from the test setup during the
inspectionprocess. To prevent damage from static discharge, ground the IC during assembly and use similar
precautions duringtransport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground. Inter-pin shorts could be due to
many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder
bridgedeposited in between pins during assembly to name a few.
11. Unused Input Terminals
Input terminals of an IC are often connected to the gate of a CMOS transistor. The gate has extremely high
impedanceand extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it.
The smallcharge acquired in this way is enough to produce a significant effect on the conduction through the
transistor andcause unexpected operation of IC. So unless otherwise specified, input terminals not being used should
be connectedto the power supply or ground line.
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TSZ02201-0T1T0AL00080-1-2
©2013 ROHM Co., Ltd. All rights reserved.
30.Aug.2013 Rev.004
www.rohm.co.jp
TSZ22111・15・001
12. Regarding the Input Pin of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep
themisolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating
aparasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in
mutualinterference among circuits, operational faults, or physical damage. Therefore, conditions that cause these
diodes tooperate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate)
should beavoided.
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance
withtemperature and the decrease in nominal capacitance due to DC bias and others.
14. Area of Safe Operation (ASO)
Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe
Operation (ASO).
15. Thermal Shutdown Circuit(TSD)
This IC incorporates and integrated thermal shutdown circuit to prevent heat damage to the IC. Normal
operationshould be within the power dissipation rating, if however the rating is exceeded for a continued period, the
junctiontemperature (Tj) will rise and the TSD circuit will be activated and turn all output pins OFF. After the Tj falls
below theTSD threshold the circuits are automatically restored to normal operation.Note that the TSD circuit operates
in a situation that exceeds the absolute maximum ratings and therefore, under nocircumstances, should the TSD
circuit be used in a set design or for any purpose other than protecting the IC fromheat damage.
16. Over Current Protection Circuit (OCP)
This IC incorporates an integrated overcurrent protection circuit that is activated when the load is shorted.
Thisprotection circuit is effective in preventing damage due to sudden and unexpected incidents. However, the IC
shouldnot be used in applications characterized by continuous operation or transitioning of the protection circuit.
Datasheet
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BD9060HFP-C BD9060F-C
TSZ02201-0T1T0AL00080-1-2
©2013 ROHM Co., Ltd. All rights reserved.
30.Aug.2013 Rev.004
www.rohm.co.jp
TSZ22111・15・001
Ordering Information
B D 9 0 6 0 H F P - C T R
Rohm Model Name
Package Type
HFP : HRP7
F : SOP8
Product Grade
Automotive
Tape and Reel Information
TR: Reel type embossed taping (HRP7)
E2: Reel type embossed taping (SOP8)
Marking Diagram
HRP7(TOP VIEW)
BD9060HFP
Part Number Marking
LOT Number
1PIN MARK
SOP8(TOP VIEW)
D9060
Part Number Marking
LOT Number
1PIN MARK
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BD9060HFP-C BD9060F-C
TSZ02201-0T1T0AL00080-1-2
©2013 ROHM Co., Ltd. All rights reserved.
30.Aug.2013 Rev.004
www.rohm.co.jp
TSZ22111・15・001
Thermal reduction characteristics
HRP7 SOP8
①: Single piece of IC
②: Mounted on a Rohm standard board
Board size : 70mm×70mm×1.6mm
②2.3 W
①1.0 W
③5.5W
④7.3W
0
1
2
3
4
5
6
7
8
9
10
0 255075100125150
Power Dissipation: Pd[W]
Ambient Temperature: Ta[°C]
②0.69W
①0.56 W
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0 255075100125150
Power Dissipation: Pd[W]
Ambient Temperature: Ta[°C]
Figure 34. Figure 38. Thermal reduction characteristics
①: Single piece of IC
Board size: 70mm×70mm×1.6mm
(with thermal via on the board)
Copper area:10.5mm×10.5mm
②: 2-layer PCB
(Copper foil area on the reverse side of PCB:
15mm×15mm)
③: 2-layer PCB
(Copper foil area on the reverse side of PCB:
70mm×70mm)
④: 4-layer PCB
(Copper foil area on the reverse side of PCB:
70mm×70mm)
Datasheet
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9060HF
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22111・15・
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BD9060HFP-C BD9060F-C
TSZ02201-0T1T0AL00080-1-2
©2013 ROHM Co., Ltd. All rights reserved.
30.Aug.2013 Rev.004
www.rohm.co.jp
TSZ22111・15・001
Package Name SOP8
∗
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
2500pcs
E2
()
Direction of feed
Reel 1pin
Figure 35. Thermal
reduction characteristics
Datasheet
Datasheet
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BD9060HFP-C BD9060F-C
TSZ02201-0T1T0AL00080-1-2
©2013 ROHM Co., Ltd. All rights reserved.
30.Aug.2013 Rev.004
www.rohm.co.jp
TSZ22111・15・001
Revision History
Date Revision Changes
2013.08.30 004
New Release
Notice-PAA-E Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅣ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
