NO CLEAN CORED SOLDER WIRE FLUX FLUX PROPERTIES
TEST RESULT
Acid value 215-230mg KOH/g
Halide content Zero
Copper mirror Pass
Chromate paper Pass
Corrosion J-STD-004 Pass
Test IPC-SF-818 Pass (10 days)
BS 5625 Pass
DTD 599A Pass
DIN 8516 Pass
JIS-Z-3197 Pass
Properties of Multicore X39 solid flux for cored solder
wires:
No clean
Low residue
Eliminates cost of cleaning
Halide free
Non-corrosive formulation
Negligible residues
Fast Soldering on copper and brass
PRODUCT RANGE
Multicore X39 cored wires are manufactured as standard
with a nominal flux content of 1%. SPECIAL PROPERTIES
The uncleaned residues PASS SIR testing to the Bellcore
TR-NWT-000078 issue 3 (December 1991) and IPC Class
1,2 and 3 protocols. They also pass the electromigration
test specified by Bellcore TR-NWT-000078.
Multicore X39 cored wires are available in a variety of
alloys conforming to J-STD-006 and EN 29453 or alloys
conforming to similar national or international standards.
For details refer to document “Properties of Alloys used in
Cored Solder Wires ”. A wide range of wire diameters is
available.
BELLCORE TR-NWT-000078 ISSUE 3
SIR TEST RESULTS ON UNCLEANED COMBS
Test conditions 35°C, 85% RH
Test time, h 24 96
Surface insulation
resistance, ohms 3.17 x 1011 3.52 x 1011
Passmark, ohms - 1011
TECHNICAL SPECIFICATION
A full description of test methods and detailed test results
are available on request.
Alloys: The alloys used for Multicore flux cored solder
wires conform to the purity requirements of the common
national and international standards. A wide range of wire
diameters is available manufactured to close dimensional
tolerances. For details refer to document “Properties of
Alloys used in Cored Solder Wires ”.
IPC-SF-818
SIR TEST RESULTS ON UNCLEANED COMBS
Test conditions 85°C, 85% RH
Test time, h 0 24 96 168
Surface insulation
resistance, ohms 1.63 x 1012
1.68 x 109 3.37 x 109 3.43 x 109
Passmark, ohms - 108 108 108
Flux: Multicore X39 solid flux is based on modified rosins
and halide free carboxylic acid activators. In use it has a
mild rosin smell and leaves a small quantity of clear
residue. It may be classified as RO L0 according to J-STD-
004 (January 1995), LR3CN according to IPC-SF-818 or
DIN F-SW32 according to DIN 8511. It meets the
requirements of Bellcore TR-NWT-000078 issue 3
(December 1991).
BELLCORE TR-NWT-000078 ISSUE 3
ELECTROMIGRATION TEST RESULTS ON UNCLEANED COMBS
Test conditions 85°C, 85% RH
Test time, h 96 500
Bias, V (DC) No bias 10
Surface insulation
resistance, ohms 1.16 x 109 5.43 x 109
Unfluxed control, ohms 5.09 x 109 8.91 x 109
Technical Data Shee
t
MulticoreCored Solder Wire Flux
X
39
A
pril 2004
NOT FOR PRODUCT SPECIFICATIONS
THE TECHNICAL INFORMATION CONTAINED HEREIN ARE INTENDED AS REFERENCE ONLY:
PLEASE CONTACT HENKEL TECHNOLOGIES FOR ASSISTANCE AND RECOMMENDATIONS
ON SPECIFICATIONS FOR THIS
HENKEL LOCTITE ADHESIVES LTD. , KELSEY HOUSE, WOODLANE END. HEMEL
HEMPSTEAD HERTFORDSHIRE HP2 4RQ UK TEL +44 1442 233 233 FAX +44 1442 269 554
RECOMMENDED OPERATING CONDITIONS
Soldering iron: Good results should be obtained using a range
of tip temperatures. However, the optimum tip temperature and
heat capacity required for a hand soldering process is a function
of both soldering iron design and the nature of the task and care
should be exercised to avoid unnecessarily high tip temperatures
for excessive times. A high tip temperature will increase any
tendency to flux spitting and it may produce some residue
darkening.
The soldering iron tip should be properly tinned and this may be
achieved using Multicore cored wire. Severely contaminated
soldering iron tips should first be cleaned and pre-tinned using
Multicore Tip Tinner/Cleaner TTC1, then wiped on a clean, damp
sponge before re-tinning with Multicore cored wire.
Soldering process: Multicore cored wires contain a careful
balance of resins and activators to provide clear residues,
maximum activity and high residue reliability, without cleaning in
most situations. To achieve the best results from Multicore solder
wires, recommended working practices for hand soldering should
be observed as follows:
Apply the soldering iron tip to the work surface, ensuring that
it simultaneously contacts the base material and the
component termination to heat both surfaces adequately.
This process should only take a fraction of a second.
Apply Multicore flux cored solder wire to a part of the joint
surface away from the soldering iron and allow to flow
sufficiently to form a sound joint fillet – this should be
virtually instantaneous. Do not apply excessive solder or
heat to the joint as this may result in dull, gritty fillets and
excessive or darkened flux residues.
Remove solder wire from the work piece and then remove
the iron tip.
The total process will be very rapid, depending upon thermal
mass, tip temperature and configuration and the solderability of
the surfaces to be joined.
Multicore flux cored solder wires provide fast soldering on copper
and brass surfaces as well as solder coated materials. The good
thermal stability of Multicore fluxes means they are also well
suited to soldering applications requiring high melting temperature
alloys.
Cleaning: Multicore X39 flux cored wires have been formulated
to leave minimal quantities of flux residue and to resist spitting
and fuming.
Cleaning will not be required in most situations but if necessary
this is best achieved using Multicore MCF800 Cleaner (see
separate technical data sheet). Other proprietary solvent or semi-
aqueous processes may be suitable. Saponification may be
viable but customers must ensure that the desired level of
cleanliness can be achieved by their chosen system
HEALTH AND SAFETY
WARNING: The following information is for guidance only and
users must refer to the Material Safety Data Sheets relevant to
specific Multicore X39 products before use.
Health Hazards and Precautions: Inhalation of the flux fumes given
off during soldering should be avoided. The fumes are irritating to the
throat and respiratory system. Prolonged or repeated exposure to
rosin or modified rosin based flux fumes may lead to the development
of respiratory sensitisation and occupational asthma.
Multicore solder wires must always be used with suitable fume
extraction equipment to remove fumes from the breathing zone of
operators and the general work environment.
Solder alloys containing lead give off negligible fume at normal
soldering temperatures up to 500°C.
Normal handling of lead alloy wires will not cause lead to be
absorbed through the skin. The most likely route of entry is
through ingestion but this will not be significant if a good standard
of personal hygiene is maintained. Eating, drinking and smoking
should not be permitted in the working area. Hands should be
washed with soap and warm water after handling solder wire.
Waste disposal: Wherever possible, waste solder wire should
be recycled for recovery of metal. Otherwise it should be
disposed of according to local or national regulations.
Note
The data contained herein are furnished for information only and
are believed to be reliable. We cannot assume responsibility for
the results obtained by others over whose methods we have no
control. It is the user's responsibility to determine suitability for
the user's purpose of any production methods mentioned herein
and to adopt such precautions as may be advisable for the
protection of property and of persons against any hazards that
may be involved in the handling and use thereof. In light of the
foregoing, Henkel Corporation specifically disclaims all
warranties expressed or implied, including warranties of
merchantability or fitness for a particular purpose, arising
from sale or use of Henkel Corporation’s products. Henkel
Corporation specifically disclaims any liability for
consequential or incidental damages of any kind, including
lost profits. The discussion herein of various processes or
compositions is not to be interpreted as representation that they
are free from domination of patents owned by others or as a
license under any Henkel Corporation patents that may cover
such processes or compositions. We recommend that each
prospective user test his proposed application before repetitive
use, using this data as a guide. This product may be covered by
one or more United States or foreign patents or patent
applications.
NOT FOR PRODUCT SPECIFICATIONS
THE TECHNICAL INFORMATION CONTAINED HEREIN ARE INTENDED AS REFERENCE ONLY:
PLEASE CONTACT HENKEL TECHNOLOGIES FOR ASSISTANCE AND RECOMMENDATIONS
ON SPECIFICATIONS FOR THIS
HENKEL LOCTITE ADHESIVES LTD. , KELSEY HOUSE, WOODLANE END. HEMEL
HEMPSTEAD, HERTFORDSHIRE HP2 4RQ, UK, TEL. +44 1442 233 233, FAX +44 1442 269 554
A
ll trademarks, except where noted, are the property of Henkel Corp. U.S.A