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SIGNATURE SERIES
Comparators
LM393xxx LM2903xx LM339xx LM2901xx
General Description
LM393xxx, LM2903xx, LM339xx, and LM2901xx
monolithic ICs integrate two or four independent
comparator circuits on a single chip and feature high
gain, low power consumption, and an operating
voltage range from 2V to 36V (single power supply).
Features
Operable with a Single Power Supply
Wide Operating Supply Voltage Range
Input / Output Ground Sense
Low Supply Current
Open Collector
Wide Temperature Range
Application
Consumer Electronics
Current Sense Application
Battery Monitor
Multivibrator
Pin Configuration
SO Package8: LM393DT
(SOP-J8) LM393WDT
LM2903DT
TSSOP8: LM393PT
(TSSOP-B8) LM393WPT
LM2903PT
Mini SO8: LM393ST
(TSSOP-B8J)
Pin Description
LM393xxx/LM2903xx
Key Specifications
Operating Supply Voltage:
Single Supply +2V to +36V
Dual Supply ±1V to ±18V
Supply Current:
LM393xxx/LM2903xx 0.4mA (Typ)
LM339xx/LM2901xx 1.1mA (Typ)
Input Bias Current: 25nA (Typ)
Input Offset Current: 5nA (Typ)
Temperature Range:
LM393xx/LM339xxx -40°C to + 85°C
LM2903xx/LM2901xx -40°C to +125°C
Packages W(Typ) x D(Typ) x H(Max)
SO Package8 4.90mm x 6.0mm x 1.55mm
TSSOP8 3.00mm x 6.4mm x 1.10mm
Mini SO8 3.00mm x 4.9mm x 0.95mm
SO Package14 8.65mm x 6.0mm x 1.55mm
TSSOP14 5.00mm x 6.4mm x 1.10mm
Pin No. Pin Name Function
1 OUTPUT 1 CH1 Output
2 INVERTING INPUT 1 CH1 Inverting Input
3 NON-INVERTING INPUT 1 CH1 Non-inverting Input
4 Vcc- Negative power supply
5 NON-INVERTING INPUT 2 CH2 Non-inverting Input
6 INVERTING INPUT 2 CH2 Inverting Input
7 OUTPUT 2 CH2 Output
8 Vcc+ Positive power supply
NON-INVERTING
INPUT 1
OUTPUT 2
Vcc+
OUTPUT 1
INVERTING
INPUT 1
Vcc-
INVERTING
INPUT 2
NON-INVERTING
INPUT 2
+
CH2
-
+
CH1
-+
1
2
3
4
8
7
6
5
○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays.
Datashee
t
Datasheet
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LM393xxx LM2903xx LM339xx LM2901xx
Pin Configuration
SO Package14: LM339DT
(SOP-J14) LM2901DT
TSSOP14: LM339PT
(TSSOP-B14J) LM2901PT
Pin Description
LM339xx/LM2901xx
Pin No. Pin Name Function
1 OUTPUT 2 CH2 Output
2 OUTPUT 1 CH1 Output
3 Vcc+ Positive power supply
4 INVERTING INPUT 1 CH1 Inverting Input
5 NON-INVERTING INPUT 1 CH1 Non-inverting Input
6 INVERTING INPUT 2 CH2 Inverting Input
7 NON-INVERTING INPUT 2 CH2 Non-inverting Input
8 INVERTING INPUT 3 CH3 Inverting Input
9 NON-INVERTING INPUT 3 CH3 Non-inverting Input
10 INVERTING INPUT 4 CH4 Inverting Input
11 NON-INVERTING INPUT 4 CH4 Non-inverting Input
12 Vcc- Negative power supply
13 OUTPUT 4 CH4 Output
14 OUTPUT 3 CH3 Output
NON-INVERTING
INPUT 3
-
1
2
3
4
5
6
7
14
13
12
11
10
9
8
OUTPUT 2
OUTPUT 1
Vcc+
INVERTING
INPUT 1
NON-INVERTING
INPUT 1
INVERTING
INPUT 2
NON-INVERTING
INPUT 2
OUTPUT 3
OUTPUT 4
Vcc-
NON-INVERTING
INPUT 4
INVERTING
INPUT 4
INVERTING
INPUT 3
+
+
--+
-+
CH1
CH2
CH4
CH3
Datasheet
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LM393xxx LM2903xx LM339xx LM2901xx
Circuit Diagram
Absolute Maximum Ratings (TA=25°C)
Parameter Symbol Ratings Unit
LM393xxx LM339xx LM2903xx LM2901xx
Supply Voltage Vcc+-Vcc－ +36 V
Power Dissipation PD
SO Package8 0.67(Note 1,6) - 0.67(Note 1,6) -
W
TSSOP8 0.62(Note 2,6) - 0.62(Note 2,6) -
Mini SO8 0.58(Note 3,6) - - -
SO Package14 - 1.02(Note 4,6) - 1.02(Note 4,6)
TSSOP14 - 0.84(Note 5,6) - 0.84(Note 5,6)
Differential Input Voltage(Note 7) V
ID +36 V
Input Common-mode Voltage Range VICM (Vcc--0.3) to (Vcc-+36) V
Input Current(Note 8) I
I -10 mA
Operating Supply Voltage Vopr +2.0 to +36.0
(±1.0 to ±18.0) V
Operating Temperature Range Topr -40 to +85 -40 to +125 °C
Storage Temperature Range Tstg -55 to +150 °C
Maximum Junction Temperature Tjmax +150 °C
Note: Absolute maximum rating item indicates the condition which must not be exceeded. Application of voltage in excess of absolute maximum rating
or use out of absolute maximum rated temperature environment may cause deterioration of characteristics.
(Note 1) To use at temperature above TA=25°C reduce 5.4mW.
(Note 2) To use at temperature above TA=25°C reduce 5.0mW.
(Note 3) To use at temperature above TA=25°C reduce 4.7mW.
(Note 4) To use at temperature above TA=25°C reduce 8.2mW.
(Note 5) To use at temperature above TA=25°C reduce 6.8mW.
(Note 6) Mounted on a FR4 glass epoxy PCB 70mm×70mm×1.6mm(Copper foil area less than 3%).
(Note 7) The voltage difference between inverting input and non-inverting input is the differential input voltage.
The input terminal voltage is set to more than Vcc-.
(Note 8) An excessive input current will flow when input voltages of less than Vcc--0.6V are applied.
The input current can be set to less than the rated current by adding a limiting resistor.
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is
operated over the absolute maximum ratings.
Figure 1. Circuit Diagram (each channel)
NON-INVERTING
INPUT
INVERTING
INPUT
Vcc+
OUTPUT
Vcc-
Datasheet
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LM393xxx LM2903xx LM339xx LM2901xx
Electric Characteristics
○LM393xxx(Unless otherwise specified Vcc+=+5V, Vcc-=0V, TA=25°C)
Parameter Symbol
Temperature
Range
Limit Unit Conditions
Min Typ Max
Input Offset Voltage (Note 9,10) V
IO 25°C - 1 7
mV Vcc+=5V to 30V, VO=1.4V
VICM=0 to 1.5V
Full range - - 9
Input Offset Current (Note 9,10) I
IO 25°C - 5 50
nA VO=1.4V
Full range - - 150
Input Bias Current (Note 9,10) I
IB 25°C - 25 250
nA VO=1.4V
Full range - - 400
Large Signal Voltage Gain AV 25°C 25 200 - V/mV
Vcc+=15V
VO=1.4V to 11.4V, RL=15kΩ
Supply Current (Note 10)
(All Comparators) ICC 25°C - 0.4 1
mA Vcc+=5V, No Load
Full range - 1 2.5 Vcc+=30V, No Load
Input Common-mode
Voltage Range (Note 10) VICM 25°C 0 - Vcc+-1.5 V -
Full range 0 - Vcc+-2.0
Output Saturation Voltage (Note 10)
(Low Level Output Voltage) VOL 25°C - 250 400 mV VID=-1V, ISINK=4mA
Full range - - 700
Output Leakage Current (Note 10)
(High Level Output Current) ILEAK 25°C - 0.1 - nA
Vcc+=30V, VID=1V
VO=30V
Full range - - 1 μA
Output Sink Current (Note 10,11) I
SINK Full range 6 16 - mA VID=-1V, VO=1.5V
Small Signal Response Time
tRE 25°C - 1.3 - μs
RL=5.1kΩ, VRL=5V
VIN=100mVp-p,
Overdrive=5mV
Large Signal Response Time tREL 25°C - 300 - ns
RL=5.1kΩ, VRL=5V
VIN=TTL input, VREF=1.4V
(Note 9) Absolute value
(Note 10) Full range: TA=-40°C to +85°C
(Note 11) Consider the power dissipation of the IC under high temperature environment when selecting the output current value.
There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC.
Datasheet
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LM393xxx LM2903xx LM339xx LM2901xx
Electric Characteristics - continued
○LM339xx(Unless otherwise specified Vcc+=+5V, Vcc-=0V, TA=25°C)
Parameter Symbol
Temperature
Range
Limit Unit Conditions
Min Typ Max
Input Offset Voltage (Note 12,13) V
IO
25°C - 1 7
mV Vcc+=5V to 30V, VO=1.4V
VICM=0 to 1.5V
Full range - - 9
Input Offset Current (Note 12,13) I
IO
25°C - 5 50
nA VO=1.4V
Full range - - 150
Input Bias Current (Note 12,13) I
IB
25°C - 25 250
nA VO=1.4V
Full range - - 400
Large Signal Voltage Gain AV 25°C 25 200 - V/mV
Vcc+=15V
VO=1.4V to 11.4V, RL=15kΩ
Supply Current (Note 13)
(All Comparators) ICC
25°C - 1.1 2
mA Vcc+=5V, No Load
Full range - 1.3 2.5 Vcc+=30V, No Load
Input Common-mode
Voltage Range (Note 13) VICM
25°C 0 - Vcc+-1.5 V -
Full range 0 - Vcc+-2.0
Output Saturation Voltage (Note 13)
(Low Level Output Voltage) VOL
25°C - 250 400 mV VID=-1V, ISINK=4mA
Full range - - 700
Output Leakage Current (Note 13)
(High Level Output Current) ILEAK
25°C - 0.1 - nA
Vcc+=30V, VID=1V
VO=30V
Full range - - 1 μA
Output Sink Current (Note 13,14) I
SINK Full range 6 16 - mA VID=-1V, VO=1.5V
Small Signal Response Time
tRE 25°C - 1.3 - μs
RL=5.1kΩ, VRL=5V
VIN=100mVp-p,
Overdrive=5mV
Large Signal Response Time tREL 25°C - 300 - ns
RL=5.1kΩ, VRL=5V
VIN=TTL input, VREF=1.4V
(Note 12) Absolute value
(Note 13) Full range: TA=-40°C to +85°C
(Note 14) Consider the power dissipation of the IC under high temperature environment when selecting the output current value.
There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC.
Datasheet
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LM393xxx LM2903xx LM339xx LM2901xx
Electric Characteristics - continued
○LM2903xx(Unless otherwise specified Vcc+=+5V, Vcc-=0V, TA=25°C)
Parameter Symbol
Temperature
Range
Limit Unit Conditions
Min Typ Max
Input Offset Voltage (Note 15,16) V
IO
25°C - 2 7
mV Vcc+=5V to 30V, VO=1.4V
VICM=0 to 1.5V
Full range - - 15
Input Offset Current (Note 15,16) I
IO
25°C - 5 50
nA VO=1.4V
Full range - - 150
Input Bias Current (Note 15,16) I
IB
25°C - 25 250
nA VO=1.4V
Full range - - 400
Large Signal Voltage Gain AV 25°C 25 200 - V/mV
Vcc+=15V
VO=1.4V to 11.4V, RL=15kΩ
Supply Current (Note 16)
(All Comparators) ICC
25°C - 0.4 1
mA Vcc+=5V, No Load
Full range - 1 2.5 Vcc+=30V, No Load
Input Common-mode
Voltage Range (Note 16) VICM
25°C 0 - Vcc+-1.5 V -
Full range 0 - Vcc+-2.0
Output Saturation Voltage (Note 16)
(Low Level Output Voltage) VOL
25°C - 250 400
mV VID=-1V, ISINK=4mA
Full range - - 700
Output Leakage Current (Note 16)
(High Level Output Current) ILEAK
25°C - 0.1 - nA
Vcc+=30V, VID=1V
VO=30V
Full range - - 1 μA
Output Sink Current (Note 16,17) I
SINK Full range 6 16 - mA VID=-1V, VO=1.5V
Small Signal Response Time
tRE 25°C - 1.3 - μs
RL=5.1kΩ, VRL=5V
VIN=100mVp-p,
Overdrive=5mV
Large Signal Response Time tREL 25°C - - 1.0 μs
RL=5.1kΩ, VRL=5V
VIN=TTL input, VREF=1.4V
VO at 95%
(Note 15) Absolute value
(Note 16) Full range: TA=-40°C to +125°C
(Note 17) Consider the power dissipation of the IC under high temperature environment when selecting the output current value.
There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC.
Datasheet
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LM393xxx LM2903xx LM339xx LM2901xx
Electric Characteristics - continued
○LM2901xx(Unless otherwise specified Vcc+=+5V, Vcc-=0V, TA=25°C)
Parameter Symbol
Temperature
Range
Limit Unit Conditions
Min Typ Max
Input Offset Voltage (Note 15,16) V
IO
25°C - 1 7
mV Vcc+=5V to 30V, VO=1.4V
VICM=0 to 1.5V
Full range - - 15
Input Offset Current (Note 15,16) I
IO
25°C - 5 50
nA VO=1.4V
Full range - - 150
Input Bias Current (Note 15,16) I
IB
25°C - 25 250
nA VO=1.4V
Full range - - 400
Large Signal Voltage Gain AV 25°C 25 200 - V/mV
Vcc+=15V
VO=1.4V to 11.4V, RL=15kΩ
Supply Current (Note 16)
(All Comparators) ICC
25°C - 1.1 2
mA Vcc+=5V, No Load
Full range - 1.3 2.5 Vcc+=30V, No Load
Input Common-mode
Voltage Range (Note 16) VICM
25°C 0 - Vcc+-1.5 V -
Full range 0 - Vcc+-2.0
Output Saturation Voltage (Note 16)
(Low Level Output Voltage) VOL
25°C - 250 400 mV VID=-1V, ISINK=4mA
Full range - - 700
Output Leakage Current (Note 16)
(High Level Output Current) ILEAK
25°C - 0.1 - nA
Vcc+=30V, VID=1V
VO=30V
Full range - - 1 μA
Output Sink Current (Note 16,17) I
SINK Full range 6 16 - mA VID=-1V, VO=1.5V
Small Signal Response Time
tRE 25°C - 1.3 - μs
RL=5.1kΩ, VRL=5V
VIN=100mVp-p,
Overdrive=5mV
Large Signal Response Time tREL 25°C - - 1.0 μs
RL=5.1kΩ, VRL=5V
VIN=TTL input, VREF=1.4V
VO at 95%
(Note 18) Absolute value
(Note 19) Full range: TA=-40°C to +125°C
(Note 20) Consider the power dissipation of the IC under high temperature environment when selecting the output current value.
There may be a case where the output current value is reduced due to the rise in IC temperature caused by the heat generated inside the IC.
Datasheet
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LM393xxx LM2903xx LM339xx LM2901xx
Description of Electrical Characteristics
Described below are descriptions of the relevant electrical terms used in this datasheet. Items and symbols used are also
shown. Note that item name and symbol and their meaning may differ from those on another manufacturer’s document or
general document.
1. Absolute maximum ratings
Absolute maximum rating items indicate the condition which must not be exceeded. Application of voltage in excess of absolute
maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics.
(1) Supply Voltage (Vcc+/ Vcc-)
Indicates the maximum voltage that can be applied between the positive power supply pin and negative power
supply pin without deterioration or destruction of characteristics of internal circuit.
(2) Differential Input Voltage (VID)
Indicates the maximum voltage that can be applied between non-inverting and inverting pins without damaging the
IC.
(3) Input Common-mode Voltage Range (VICM)
Indicates the maximum voltage that can be applied to the non-inverting and inverting pins without deterioration or
destruction of electrical characteristics. Input common-mode voltage range of the maximum ratings does not assure
normal operation of IC. For normal operation, use the IC within the input common-mode voltage range characteristics.
(4) Operating and storage temperature ranges (Topr, Tstg)
The operating temperature range indicates the temperature range within which the IC can operate. The higher the
ambient temperature, the lower the power consumption of the IC. The storage temperature range denotes the range
of temperatures the IC can be stored under without causing excessive deterioration of the electrical characteristics.
(5) Power dissipation (PD)
Indicates the power that can be consumed by the IC when mounted on a specific board at ambient temperature 25°C(normal
temperature). As for package product, PD is determined by the temperature that can be permitted by the IC in the
package (maximum junction temperature) and the thermal resistance of the package.
2. Electrical characteristics
(1) Input Offset Voltage (VIO)
Indicates the voltage difference between non-inverting pin and inverting pins. It can be translated into the input
voltage difference required for setting the output voltage at 0 V.
(2) Input Offset Current (IIO)
Indicates the difference of input bias current between the non-inverting and inverting pins.
(3) Input Bias Current (IB)
Indicates the current that flows into or out of the input pin. It is defined by the average of input bias currents at the
non-inverting and inverting pins.
(4) Large Signal Voltage Gain (AV)
Indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting pin and
inverting pin. It is normally the amplifying rate (gain) with reference to DC voltage.
AV = (Output Voltage) / (Differential Input Voltage)
(5) Supply Current (ICC)
Indicates the current that flows within the IC under specified no-load conditions.
(6) Input Common-mode Voltage Range (VICM)
Indicates the input voltage range where IC normally operates.
(7) Output Saturation Voltage, Low Level Output Voltage (VOL)
Signifies the voltage range that can be output under specific output conditions.
(8) Output Leakage Current, High Level Output Current (ILEAK)
Indicates the current that flows into the IC under specific input and output conditions.
(9) Output Sink Current (ISINK)
Denotes the maximum current that can be output from the IC under specific output conditions.
(10) Response Time (tRE)
Response time indicates the delay time between the input and output signal which is determined by the time
difference from the fifty percent of input signal swing to the fifty percent of output signal swing.
Datasheet
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LM393xxx LM2903xx LM339xx LM2901xx
Typical Performance Curves
○LM393xxx/LM2903xx
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
LM393：-40°C to ＋85°C LM2903：-40°C to ＋125°C
Figure 3. Supply Current vs Supply Voltage
Figure 4. Supply Current vs Ambient Temperature
Figure 2. Power Dissipation vs Ambient Temperature
(Derating Curve)
Figure 5. Output Saturation Voltage vs Supply Voltage
(ISINK=4mA)
0.0
0.2
0.4
0.6
0.8
1.0
0 255075100125150
Ambient Temperature [°C]
Power Dissipation [W]
LM393PT
LM393WPT
LM2903PT
LM2903DT
LM393DT
LM393WDT
LM393ST
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
0 10203040
Supply Voltage [V]
Supply Current [mA]
25°C
125°C
-40°C
85°C
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
-50 -25 0 25 50 75 100 125 150
Ambient Temperature [°C]
Supply Current [mA]
2V
5V
36V
0
50
100
150
200
0 10203040
Supply Voltage [V]
Output Saturation Voltage [mV]
-40°C
25°C
125°C
85°C
85
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LM393xxx LM2903xx LM339xx LM2901xx
Typical Performance Curves - continued
○LM393xxx/LM2903xx
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
LM393：-40°C to ＋85°C LM2903：-40°C to ＋125°C
Figure 9. Input Offset Voltage vs Supply Voltage
Figure 6. Output Saturation Voltage vs
Ambient Temperature ( ISINK=4mA)
Figure 7. Output Saturation Voltage vs
Output Sink Current (Vcc+=5V)
Figure 8. Output Sink Current vs
Ambient Temperature (VO=1.5V)
0
50
100
150
200
-50 -25 0 25 50 75 100 125 150
Ambient Temperature [°C]
Output Saturation Voltage [mV]
36V
5V
2V
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
0 2 4 6 8 101214161820
Output Sink Current [mA]
Output Saturation Voltage [V]
-40°C
25°C
125°C
85°C
0
10
20
30
40
-50 -25 0 25 50 75 100 125 150
Ambient Temperature [°C]
Output Sink Current [mA]
36V
5V
2V
-8
-6
-4
-2
0
2
4
6
8
010203040
Supply Voltage [V]
Input Offset Voltage [mV]
-40°C
25°C 125°C
85°C
Datasheet
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LM393xxx LM2903xx LM339xx LM2901xx
Typical Performance Curves - continued
○LM393xxx/LM2903xx
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
LM393：-40°C to ＋85°C LM2903：-40°C to ＋125°C
85°C
Figure 10. Input Offset Voltage vs
Ambient Temperature
Figure 11. Input Bias Current vs Supply Voltage
Figure 12. Input Bias Current vs
Ambient Temperature
Figure 13. Input Offset Current vs Supply Voltage
-8
-6
-4
-2
0
2
4
6
8
-50 -25 0 25 50 75 100 125 150
Ambient Temperature [°C]
Input Offset Voltage [mV]
2V
5V 36V
0
20
40
60
80
100
120
140
160
0 5 10 15 20 25 30 35
Supply Voltage [V]
Input Bias Current [nA]
-40°C
25°C
125°C
0
20
40
60
80
100
120
140
160
-50 -25 0 25 50 75 100 125 150
Ambient Temperature [°C]
Input Bias Current [nA]
2V
5V
36V
-50
-40
-30
-20
-10
0
10
20
30
40
50
0 10203040
Supply Voltage [V]
Input Offset Current [nA]
125°C
25°C -40°C
85°C
Datasheet
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LM393xxx LM2903xx LM339xx LM2901xx
Typical Performance Curves - continued
○LM393xxx/LM2903xx
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
LM393：-40°C to ＋85°C LM2903：-40°C to ＋125°C
Figure 15. Large Signal Voltage Gain vs
Supply Voltage
Figure 14. Input Offset Current vs
Ambient Temperature
Figure 17.Common-mode Rejection Ratio vs
Supply Voltage
Figure 16. Large Signal Voltage Gain vs
Ambient Temperature
-50
-40
-30
-20
-10
0
10
20
30
40
50
-50 -25 0 25 50 75 100 125 150
Ambient Temperature [°C]
Input Offset Current [nA]
2V
5V 36V
40
60
80
100
120
140
160
010203040
Supply Voltage [V]
Common-mode Rejection Ratio [dB]
-40°C 25°C
125°C
85°C
60
70
80
90
100
110
120
130
140
0 10203040
Supply Voltage [V]
Large Signal Voltage Gain [dB]
25°C
125°C
-40°C
85°C
60
70
80
90
100
110
120
130
140
-50 -25 0 25 50 75 100 125 150
Ambient Temperature [°C]
Large Signal Voltage Gain [dB]
15V 5V
36V
2V
Datasheet
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© 2015 ROHM Co., Ltd. All rights reserved. 13/34 6.July.2015 Rev.001
TSZ22111･15･001
LM393xxx LM2903xx LM339xx LM2901xx
Typical Performance Curves - continued
○LM393xxx/LM2903xx
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
LM393：-40°C to ＋85°C LM2903：-40°C to ＋125°C
60
80
100
120
140
160
180
200
-50 -25 0 25 50 75 100 125 150
Ambient Temperature [°C]
Power Supply Rejection Ratio [dB]
Figure 18. Common-mode Rejection Ratio vs
Ambient Temperature
Figure 20.Power Supply Rejection Ratio vs
AmbientTemperature
Figure 19.Input Offset Voltage vs Input Voltage
(Vcc+=5V)
Figure 21. Response Time (Low to High) vs
Overdrive Voltage (Vcc+=5V, VRL=5V, RL=5.1kΩ)
0
25
50
75
100
125
150
-50 -25 0 25 50 75 100 125 150
Ambient Temperature [°C]
Common-mode Rejection Ratio [dB]
2V
5V
36V
-6
-4
-2
0
2
4
6
-1012345
Input Voltage [V]
Input Offset Voltage [mV]
-40°C
25°C
125°C
85°C
0
1
2
3
4
5
-100 -80 -60 -40 -20 0
Overdrive Voltage [mV]
Response Time (Low to High) [μs]
125°C 25°C -40°C
85°C
Datasheet
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© 2015 ROHM Co., Ltd. All rights reserved. 14/34 6.July.2015 Rev.001
TSZ22111･15･001
LM393xxx LM2903xx LM339xx LM2901xx
Typical Performance Curves - continued
○LM393xxx/LM2903xx
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
LM393：-40°C to ＋85°C LM2903：-40°C to ＋125°C
Figure 22. Response Time (Low to High) vs
Ambient Temperature (Vcc+=5V, VRL=5V, RL=5.1kΩ)
Figure 24. Response Time (High to Low) vs
Ambient Temperature (Vcc+=5V, VRL=5V, RL=5.1kΩ)
Figure 23. Response Time (High to Low) vs
Overdrive Voltage (Vcc+=5V, VRL=5V, RL=5.1kΩ)
0
1
2
3
4
5
0 20406080100
Overdrive Voltage [mV]
Response Time (High to Low) [μs]
125°C
25°C
-40°C
85°C
0
1
2
3
4
5
-50 -25 0 25 50 75 100 125 150
Ambient Temperature [°C]
Response Time (Low to High) [μs]
5mV overdrive
20mV overdrive
100mV overdrive
0
1
2
3
4
5
-50 -25 0 25 50 75 100 125 150
Ambient Temperature [°C]
Response Time (High to Low) [μs]
5mV overdrive
20mV overdrive
100mV overdrive
Datasheet
www.rohm.com TSZ02201-0RFR0G200530-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 15/34 6.July.2015 Rev.001
TSZ22111･15･001
LM393xxx LM2903xx LM339xx LM2901xx
Typical Performance Curves - continued
○LM339xx/LM2901xx
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
LM339：-40°C to ＋85°C LM2901：-40°C to ＋125°C
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0 25 50 75 100 125 150
Ambient Temperature [°C]
Power Dissipation [W]
Figure 26.Supply Current vs Supply Voltage
Figure 27.Supply Current vs Ambient Temperature
Figure 25. Power Dissipation vs Ambient Temperature
(Derating Curve)
Figure 28. Output Saturation Voltage vs
Supply Voltage (ISINK=4mA)
85
LM339DT
LM339PT
LM2901DT
LM2901PT
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
0 10203040
Supply Voltage [V]
Supply Current [mA]
-40°C
25°C
125°C
85°C
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
-50 -25 0 25 50 75 100 125 150
Ambient Temperature [°C]
Supply Current [mA]
2V
5V
36V
0
50
100
150
200
0 10203040
Supply Voltage [V]
Output Saturation Voltage [mV]
-40°C
25°C
125°C
85°C
Datasheet
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© 2015 ROHM Co., Ltd. All rights reserved. 16/34 6.July.2015 Rev.001
TSZ22111･15･001
LM393xxx LM2903xx LM339xx LM2901xx
Typical Performance Curves - continued
○LM339xx/LM2901xx
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
LM339：-40°C to ＋85°C LM2901：-40°C to ＋125°C
Figure 32. Input Offset Voltage vs Supply Voltage
Figure 29. Output Saturation Voltage vs
Ambient Temperature ( ISINK=4mA)
Figure 30. Output Saturation Voltage vs
Output Sink Current (Vcc+=5V)
Figure 31. Output Sink Current vs
Ambient Temperature (VO=1.5V)
0
50
100
150
200
-50 -25 0 25 50 75 100 125 150
Ambient Temperature [°C]
Output Saturation Voltage [mV]
36V
5V
2V
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
0 2 4 6 8 101214161820
Output Sink Current [mA]
Output Saturation Voltage [V]
-40°C
25°C
125°C
85°C
0
10
20
30
40
-50 -25 0 25 50 75 100 125 150
Ambient Temperature [°C]
Output Sink Current [mA]
36V
5V
2V
-8
-6
-4
-2
0
2
4
6
8
0 10203040
Supply Voltage [V]
Input Offset Voltage [mV]
-40°C
25°C 125°C
85°C
Datasheet
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© 2015 ROHM Co., Ltd. All rights reserved. 17/34 6.July.2015 Rev.001
TSZ22111･15･001
LM393xxx LM2903xx LM339xx LM2901xx
Typical Performance Curves - continued
○LM339xx/LM2901xx
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
LM339：-40°C to ＋85°C LM2901：-40°C to ＋125°C
0
20
40
60
80
100
120
140
160
-50 -25 0 25 50 75 100 125 150
Ambient Temperature [°C]
Input Bias Current [nA]
5V
2V
5V
36V
Figure 33. Input Offset Voltage vs
Ambient Temperature
Figure 34. Input Bias Current vs Supply Voltage
Figure 35. Input Bias Current vs
Ambient Temperature
Figure 36. Input Offset Current vs Supply Voltage
-8
-6
-4
-2
0
2
4
6
8
-50 -25 0 25 50 75 100 125 150
Ambient Temperature [°C]
Input Offset Voltage [mV]
2V
36V
0
20
40
60
80
100
120
140
160
0 10203040
Supply Voltage [V]
Input Bias Current [nA]
-40°C
25°C
125°C
85°C
-50
-40
-30
-20
-10
0
10
20
30
40
50
0 10203040
Supply Voltage [V]
Input Offset Current [nA]
125°C
25°C
-40°C
85°C
Datasheet
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© 2015 ROHM Co., Ltd. All rights reserved. 18/34 6.July.2015 Rev.001
TSZ22111･15･001
LM393xxx LM2903xx LM339xx LM2901xx
Typical Performance Curves - continued
○LM339xx/LM2901xx
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
LM339：-40°C to ＋85°C LM2901：-40°C to ＋125°C
Figure 38. Large Signal Voltage Gain vs
Supply Voltage
Figure 37. Input Offset Current vs
Ambient Temperature
Figure 40. Common-mode Rejection Ratio vs
Supply Voltage
Figure 39. Large Signal Voltage Gain vs
Ambient Temperature
-50
-40
-30
-20
-10
0
10
20
30
40
50
-50 -25 0 25 50 75 100 125 150
Ambient Temperature [°C]
Input Offset Current [nA]
2V
5V 36V
40
60
80
100
120
140
160
010203040
Supply Voltage [V]
Common-mode Rejection Ratio [dB]
-40°C 25°C
125°C
85°C
60
70
80
90
100
110
120
130
140
0 10203040
Supply Voltage [V]
Large Signal Voltage Gain [dB]
25°C
125°C
-40°C
85°C
60
70
80
90
100
110
120
130
140
-50 -25 0 25 50 75 100 125 150
Ambient Temperature [°C]
Large Signal Voltage Gain [dB]
15V 5V
36V
2V
Datasheet
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© 2015 ROHM Co., Ltd. All rights reserved. 19/34 6.July.2015 Rev.001
TSZ22111･15･001
LM393xxx LM2903xx LM339xx LM2901xx
Typical Performance Curves - continued
○LM339xx/LM2901xx
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
LM339：-40°C to ＋85°C LM2901：-40°C to ＋125°C
60
80
100
120
140
160
180
200
-50 -25 0 25 50 75 100 125 150
Ambient Temperature [°C]
Power Supply Rejection Ratio [dB]
Figure 41. Common-mode Rejection Ratio vs
Ambient Temperature
Figure 43. Power Supply Rejection Ratio vs
Ambient Temperature
Figure 42. Input Offset Voltage vs Input Voltage
(Vcc+=5V)
Figure 44. Response Time (Low to High) vs
Overdrive Voltage (Vcc+=5V, VRL=5V, RL=5.1kΩ)
0
25
50
75
100
125
150
-50 -25 0 25 50 75 100 125 150
Ambient Temperature [°C]
Common-mode Rejection Ratio [dB]
2V
5V
36V
-6
-4
-2
0
2
4
6
-1012345
Input Voltage [V]
Input Offset Voltage [mV]
-40°C
25°C
125°C
85°C
0
1
2
3
4
5
-100 -80 -60 -40 -20 0
Overdrive Voltage [mV]
Response Time (Low to High) [μs]
125°C 25°C -40°C
85°C
Datasheet
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© 2015 ROHM Co., Ltd. All rights reserved. 20/34 6.July.2015 Rev.001
TSZ22111･15･001
LM393xxx LM2903xx LM339xx LM2901xx
Typical Performance Curves - continued
○LM339xx/LM2901xx
(*)The above characteristics are measurements of typical sample, they are not guaranteed.
LM339：-40°C to ＋85°C LM2901：-40°C to ＋125°C
Figure 45. Response Time (Low to High) vs
Ambient Temperature
(Vcc+=5V, VRL=5V, RL=5.1kΩ)
Figure 47. Response Time (High to Low) vs
Ambient Temperature (Vcc+=5V, VRL=5V, RL=5.1kΩ)
Figure 46. Response Time (High to Low) vs
Overdrive Voltage (Vcc+=5V, VRL=5V, RL=5.1kΩ)
0
1
2
3
4
5
-50 -25 0 25 50 75 100 125 150
Ambient Temperature [°C]
Response Time (High to Low) [μs]
5mV overdrive
20mV overdrive
100mV overdrive
0
1
2
3
4
5
-50 -25 0 25 50 75 100 125 150
Ambient Temperature [°C]
Response Time (Low to High) [μs]
5mV overdrive
20mV overdrive
100mV overdrive
0
1
2
3
4
5
0 20406080100
Overdrive Voltage [mV]
Response Time (High to Low) [μs]
125°C
25°C
-40°C
85°C
Datasheet
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© 2015 ROHM Co., Ltd. All rights reserved. 21/34 6.July.2015 Rev.001
TSZ22111･15･001
LM393xxx LM2903xx LM339xx LM2901xx
Application Information
Measurement Circuit 1 NULL Method Measurement Condition
Vcc+,Vcc-,EK,VICM unit：V
Parameter VF SW1 SW2 SW3 Vcc+Vcc-EK V
ICM Calculation
Input Offset Voltage VF1 ON ON ON 5 to 30 0 -1.4 0 1
Input Offset Current VF2 OFF OFF ON 5 0 -1.4 0 2
Input Bias Current VF3 OFF ON ON 5 0 -1.4 0 3
VF4 ON OFF 5 0 -1.4 0
Large Signal Voltage Gain VF5 ON ON ON 15 0 -1.4 0 4
VF6 15 0 -11.4 0
-Calculation-
1. Input Offset Voltage (VIO)
2. Input Offset Current (IIO)
3. Input Bias Current (IB)
4. Large Signal Voltage Gain (AV)
VIO
|VF1|
=1+RF/RS
[V]
A
V
|VF5-VF6|
=10 × (1+RF/RS)[dB]
20Log
=
IB
|VF4-VF3|
2 × RI ×(1+RF/RS)[A]
IIO
|VF2-VF1|
RI ×(1+RF/RS)[A]
=
Vcc+
RF=50kΩ
RI=10kΩ
RS=50Ω
RL
SW2
500kΩ
500kΩ0.1µF
EK15V
DUT
Vcc-
50kΩ
VICM
SW1
RI=10kΩ
VO
VF
RS=50Ω 1000pF
0.1µF
-15V
NULL
SW3
VRL
Figure 48. Measurement Circuit 1 (each Comparator)
Datasheet
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LM393xxx LM2903xx LM339xx LM2901xx
Application Information - continued
Measurement Circuit 2: Switch Condition
SW No. SW1 SW2 SW3 SW4 SW5 SW6 SW7
Supply Current - ON OFF ON OFF OFF OFF OFF
Output Sink Current VO=1.5V ON OFF ON OFF ON ON OFF
Output Saturation Voltage ISINK=4mA ON OFF ON OFF OFF OFF ON
Output Leakage Current VO=36V ON OFF ON OFF OFF OFF ON
Response Time RL=5.1kΩ ON ON OFF ON OFF ON OFF
VRL=5V
Figure 49. Measurement Circuit 2 (each Comparator)
Figure 50. Response Time
Vcc+/2
Overdrive Voltage
VREF=1.4V
Input Voltage
Lt
RE ( ow to High)
0V
Vcc+
VREF=1.4V
Input Voltage
Input wave
Overdrive Voltage
Input wave
tRE (High to Low)
0V
Vcc+
Vcc+/2
1.5V
∆ov=5mV
1.405V
1.3V
tt
t
Output VoltageOutput Voltage
∆ov=5mV
SW2
SW1 －
＋
SW4 SW5
A
VIN+
Vcc+
Vcc-
SW3
SW7
A
V
VO
RL
SW6
VIN- VRL
Datasheet
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TSZ22111･15･001
LM393xxx LM2903xx LM339xx LM2901xx
Example of Circuit
○Reference voltage is VIN-
When the input voltage is bigger than reference voltage,
output voltage is high. When the input voltage is smaller than
reference voltage, output voltage is low.
○Reference voltage is VIN+
When the input voltage is smaller than reference voltage,
output voltage is high. When the input voltage is bigger than
reference voltage, output voltage is low.
+
-
Reference
voltage VREF
IN
Vcc+
Vcc-
VRL
RL
OUT
+
-
VREF
Vcc-
Vcc+ VRL
RL
Reference
voltage
IN
t
VREF
OUT
t
High
Low
t
VREF
Low
High
t
IN
OUT
IN
OUT
Datasheet
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TSZ22111･15･001
LM393xxx LM2903xx LM339xx LM2901xx
Power Dissipation
Power dissipation (total loss) indicates the power that the IC can consume at TA=25°C (normal temperature). As the IC
consumes power, it heats up, causing its temperature to be higher than the ambient temperature. The allowable
temperature that the IC can accept is limited. This depends on the circuit configuration, manufacturing process, and
consumable power.
Power dissipation is determined by the allowable temperature within the IC (maximum junction temperature) and the
thermal resistance of the package used (heat dissipation capability). Maximum junction temperature is typically equal to the
maximum storage temperature. The heat generated through the consumption of power by the IC radiates from the mold
resin or lead frame of the package. Thermal resistance, represented by the symbol θJA°C/W, indicates this heat dissipation
capability. Similarly, the temperature of an IC inside its package can be estimated by thermal resistance.
Figure 51(a) shows the model of the thermal resistance of a package. The equation below shows how to compute for the
Thermal resistance (θJA), given the ambient temperature (TA), maximum junction temperature (TJmax), and power dissipation
(PD).
θJA = (TJmax－TA) / PD °C/W
The Derating curve in Figure 51(b) indicates the power that the IC can consume with reference to ambient temperature.
Power consumption of the IC begins to attenuate at certain temperatures. This gradient is determined by Thermal
resistance (θJA), which depends on the chip size, power consumption, package, ambient temperature, package condition,
wind velocity, etc. This may also vary even when the same package is used. Thermal reduction curve indicates a reference
value measured at a specified condition. Figure 51(c) and (d) shows an example of the derating curve for LM393xxx,
LM2903xx, LM339xx, and LM2901xx.
(Note 21) (Note 22) (Note 23) (Note 24) (Note 25) Unit
5.4 5.0 4.7 8.2 6.8 mW/°C
When using the unit above TA=25°C, subtract the value above per Celsius degree.
Power dissipation is the value when FR4 glass epoxy board 70mm ×70mm ×1.6mm (cooper foil area below 3%) is mounted.
0.0
0.2
0.4
0.6
0.8
1.0
1.2
0 25 50 75 100 125 150
Ambient Temperature [°C]
Power Dissipation [°C]
0.0
0.2
0.4
0.6
0.8
1.0
0 25 50 75 100 125 150
Ambient Temperature [°C]
Power Dissipation [°C]
Figure 51. Thermal Resistance and Derating Curve
(c) LM393xxx/LM2903xx
θJA=(TJmax-TA)/ PD °C/W
A
mbient temperature T
A
[ °C ]
Chip surface temperature TJ [ °C ]
(a) Thermal Resistance (b) Derating Curve
Ambient temperature T
A
[ °C ]
Power dissipation of LSI [W]
PDmax
θJA2 < θJA1
05075 100 125 150
25
P1
P2
θJA2
θJA1
TJmax
Power dissipation of IC
(d) LM339xx/LM2901xx
85
LM393PT(Note 22)
LM393WPT(Note 22)
LM2903PT(Note 22)
LM2903DT
(N
o
t
e
21)
LM393DT(Note 21)
LM393WDT(Note 21)
LM393ST(Note 23)
85
LM339DT(Note 24)
LM339PT(Note 25)
LM2901DT
(N
o
t
e
2
4
)
LM2901PT(Note 25)
Datasheet
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© 2015 ROHM Co., Ltd. All rights reserved. 25/34 6.July.2015 Rev.001
TSZ22111･15･001
LM393xxx LM2903xx LM339xx LM2901xx
Operational Notes
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply
pins.
2. Pow er Supply Lines
Design the PCB layout pattern to provide low impedance ground and supply lines. Separate the ground and supply
lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting
the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of
temperature and aging on the capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The power supply and ground lines must be as short and thick as possible to reduce line
impedance.
5. Thermal Consideration
Should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in
deterioration of the properties of the chip. The absolute maximum rating of the PD stated in this specification is when
the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating,
increase the board size and copper area to prevent exceeding the PD rating.
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply.
Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing
of connections.
8. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
9. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject
the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should
always be turned off completely before connecting or removing it from the test setup during the inspection process. To
prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and
storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
Datasheet
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LM393xxx LM2903xx LM339xx LM2901xx
Operational Notes – continued
11. Regarding Input Pins of the IC
This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them
isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a
parasitic diode or transistor. For example (refer to figure below):
When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode.
When GND > Pin B, the P-N junction operates as a parasitic transistor.
Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual
interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to
operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be
avoided.
NN
P+PNN
P+
P Substrate
Parasitic
Element
GND
NP+
NN
P+
NP
P Substrate
GND GND
Parasitic
Element
Pin A
Pin A
Pin B Pin B
BC
E
Parasitic
Element
GND
Parasitic element
or Transistor
Parasitic
Element
CB
E
Transistor (NPN)Resistor
Figure 52. Example of Monolithic IC Structure
12. Unused Circuits
When there are unused circuits it is recommended that they be connected as in Figure 53, setting the non-inverting
input pin to a potential within the in-phase input voltage range (VICM).
Figure 53. Disable Circuit Example
13. Input Voltage
Applying Vcc- + 36V to the input pin is possible without causing deterioration of the electrical characteristics or
destruction, regardless of the supply voltage. However, this does not ensure normal circuit operation. Please note that
the circuit operates normally only when the input voltage is within the common-mode input voltage range of the electric
characteristics.
14. Power Supply (single/dual)
The comparator operates when the specified voltage supplied is between Vcc+ and Vcc-. Therefore, the single supply
comparator can be used as a dual supply comparator as well.
15. Terminal short-circuits
When the output and Vcc+ pins are shorted, excessive output current may flow, resulting in undue heat generation and,
subsequently, destruction.
16. IC Handling
Applying mechanical stress to the IC by deflecting or bending the board may cause fluctuations in the electrical
characteristics due to piezo resistance effects.
Please keep
this
p
otential in VICM +
-
Vcc+
Vcc-
OPEN
V
ICM
Datasheet
www.rohm.com TSZ02201-0RFR0G200530-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 27/34 6.July.2015 Rev.001
TSZ22111･15･001
LM393xxx LM2903xx LM339xx LM2901xx
Physical Dimension, Tape and Reel information
Package Name SO Package8 (SOP-J8)
∗
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
2500pcs
E2
()
Direction of feed
Reel 1pin
Datasheet
www.rohm.com TSZ02201-0RFR0G200530-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 28/34 6.July.2015 Rev.001
TSZ22111･15･001
LM393xxx LM2903xx LM339xx LM2901xx
Physical Dimension, Tape and Reel Information – continued
Package Name TSSOP8 (TSSOP-B8)
Direction of feed
Reel ∗
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
3000pcs
E2
()
1pin
Datasheet
www.rohm.com TSZ02201-0RFR0G200530-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 29/34 6.July.2015 Rev.001
TSZ22111･15･001
LM393xxx LM2903xx LM339xx LM2901xx
Physical Dimension, Tape and Reel Information – continued
Package Name Mini SO8 (TSSOP-B8J)
Direction of feed
Reel
∗
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
2500pcs
E2
()
1pin
Datasheet
www.rohm.com TSZ02201-0RFR0G200530-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 30/34 6.July.2015 Rev.001
TSZ22111･15･001
LM393xxx LM2903xx LM339xx LM2901xx
Physical Dimension, Tape and Reel Information – continued
Package Name SO Package14 (SOP-J14)
∗
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
2500pcs
E2
()
Direction of feed
Reel 1pin
Datasheet
www.rohm.com TSZ02201-0RFR0G200530-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 31/34 6.July.2015 Rev.001
TSZ22111･15･001
LM393xxx LM2903xx LM339xx LM2901xx
Physical Dimension, Tape and Reel Information – continued
Package Name TSSOP14 (TSSOP-B14J)
∗
Order quantity needs to be multiple of the minimum quantity.
<Tape and Reel information>
Embossed carrier tapeTape
Quantity
Direction
of feed
The direction is the 1pin of product is at the upper left when you hold
reel on the left hand and you pull out the tape on the right hand
2500pcs
E2
()
Direction of feed
Reel 1pin
Datasheet
www.rohm.com TSZ02201-0RFR0G200530-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 32/34 6.July.2015 Rev.001
TSZ22111･15･001
LM393xxx LM2903xx LM339xx LM2901xx
Ordering Information
L M x x x x x x T
Part Number
LM393DT
LM393WDT
LM393PT
LM393WPT
LM393ST
LM339DT
LM339PT
LM2903DT
LM2903PT
LM2901DT
LM2901PT
ESD Tolerance
applicable
W : 2kV
None : Normal
Package type
D : S.O package
P : SSOP
S : Mini SO
Packaging and forming sp ecificatio n
T: Embossed tape and reel
Line-up
Topr Channels ESD Package Orderable
Part Number
-40°C to +85°C
2
Normal
SO Package8 Reel of 2500 LM393DT
TSSOP8 Reel of 2500 LM393PT
Mini SO8 Reel of 2500 LM393ST
2kV SO Package8 Reel of 2500 LM393WDT
TSSOP8 Reel of 2500 LM393WPT
4 Normal
SO Package14 Reel of 2500 LM339DT
TSSOP14 Reel of 2500 LM339PT
-40°C to +125°C
2
Normal
SO Package8 Reel of 2500 LM2903DT
TSSOP8 Reel of 2500 LM2903PT
4 SO Package14 Reel of 2500 LM2901DT
TSSOP14 Reel of 2500 LM2901PT
Datasheet
www.rohm.com TSZ02201-0RFR0G200530-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 33/34 6.July.2015 Rev.001
TSZ22111･15･001
LM393xxx LM2903xx LM339xx LM2901xx
Marking Diagram
Product Name Package Type Marking
LM393
DT SO Package8 (SOP-J8)
393
PT TSSOP8 (TSSPO-B8)
ST Mini SO8 (TSSOP-B8J)
WDT SO Package8 (SOP-J8)
WPT TSSOP8 (TSSPO-B8)
LM339 DT SO Package14 (SOP-J14) 339
PT TSSOP14 (TSSOP-B14J)
LM2903 DT SO Package8 (SOP-J8) 2903
PT TSSOP8 (TSSPO-B8)
LM2901 DT SO Package14 (SOP-J14) 2901
PT TSSOP14 (TSSOP-B14J)
SOP-J8(TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
TSSOP-B8J(TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
TSSOP-B8(TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
SOP-J14(TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
TSSOP-B14J (TOP VIEW)
Part Number Marking
LOT Numbe
r
1PIN MARK
TSSOP-B8(TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
Datasheet
www.rohm.com TSZ02201-0RFR0G200530-1-2
© 2015 ROHM Co., Ltd. All rights reserved. 34/34 6.July.2015 Rev.001
TSZ22111･15･001
LM393xxx LM2903xx LM339xx LM2901xx
Land Pattern Data All dimensions in mm
PKG Land pitch
e
Land space
MIE
Land length
≥ℓ 2
Land width
b2
SO Package8 (SOP-J8)
SO Package14 (SOP-J14) 1.27 3.90 1.35 0.76
TSSOP8 (TSSPO-B8)
TSSOP14 (TSSOP-B14J) 0.65 4.60 1.20 0.35
Mini SO8 (TSSOP-B8J) 0.65 3.20 1.15 0.35
Revision History
Date Revision Changes
6.July.2015 001 New Release
SOP-J8, TSSOP-B8, TSSOP-B8J,
SOP-J14, TSSOP-B14J
MIE
ℓ2
b2 e
Datasheet
Datasheet
Notice-PGA-E Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for applicatio n in ordinar y elec tronic eq uipm ents (such as AV equipment ,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred b y you or third parties arisin g from the use of an y ROHM’s Prod ucts for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN USA EU CHINA
CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ
CLASSⅣ CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe d esign against the physical injur y, damage to any property, which
a failure or malfunction of our Products may cause. T he following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliabili ty, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlig ht or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing comp onents, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flu x (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radi ation-proof design.
5. Please verify and confirm ch aracteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Po wer Dissipation (P d) dependi ng on Ambient temp erature (T a). When used i n sealed area, confirm the actual
ambient temperature.
8. Confirm that operation temperature is within the specifi ed range described in the product specification.
9. ROHM shall n ot be in any way responsible or liable for failure induce d under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a hig hly active hal ogenous (chlor i ne, bromine, etc.) flu x is used, the residue of flux may negativel y affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM represe ntative in advance.
For details, please refer to ROHM Mounting specification
Datasheet
Datasheet
Notice-PGA-E Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise you r own indepen dent verificatio n and judgmen t in the use of such information
contained in this document. ROHM shall not be in any way responsib le or liable for an y damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please t ake special care under dry condit ion (e.g. Grounding of human body / equipment / sol der iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportati on
1. Product performance and soldered connections may deteri orate if the Products are store d in the places where:
[a] the Products are exposed to sea winds or corrosive gases, includ ing Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage c ondition, solderabilit y of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommen de d storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive s t ress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier ba g. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
QR code printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products pl ease dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoi ng information or data will not infringe any int ellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained i n this document. Provide d, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including b ut not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccuracy or errors of or
concerning such information.
