MMBTA63-7-F - DIODES INC

MMBTA63 / MMBTA64

Document number: DS30055 Rev. 9 - 2

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MMBTA63 / MMBTA64

PNP SMALL SIGNAL TRANSISTOR IN SOT23

Features

 Epitaxial Planar Die Construction

 Ideal for Low Power Amplification and Switching

 High Current Gain

 Complementary NPN Type: MMBTA13 /MMBTA14

 Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)

 Halogen and Antimony Free. “Green” Device (Note 3)

 Qualified to AEC-Q101 Standards for High Reliability

Mechanical Data

 Case: SOT23

 Case Material: Molded Plastic, “Green” Molding Compound;

UL Flammability Classification Rating 94V-0

 Moisture Sensitivity: Level 1 per J-STD-020

 Terminals: Finish-Matte Tin Plated Leads.

Solderable per MIL-STD-202, Method 208

 Weight: 0.008 grams (Approximate)

Ordering Information (Note 4)

Part Number

Compliance

Marking

Reel Size (inches)

Tape Width (mm)

Quantity Per Reel

MMBTA63-7-F

AEC-Q101

K3E

3,000

MMBTA64-7-F

AEC-Q101

K3E

3,000

Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant.

2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and

Lead-free.

3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and

<1000ppm antimony compounds.

4. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes-packaging/.

Marking Information

Date Code Key

Year

2018

2019

2020

2021

2022

2023

2024

2025

2026

2027

2028

2029

Code

Month

Jan

Feb

Mar

Apr

May

Jun

Jul

Aug

Sep

Oct

Nov

Dec

Code

Top View

Device Symbol

Symbolhematic

SOT23

Top View

Pin-Out

Symbolhematic

K3E = Product Type Marking Code

YM = Date Code Marking

Y = Year (ex: F = 2018)

M = Month (ex: 9 = September)

SOT23

K3E

MMBTA63 / MMBTA64

Document number: DS30055 Rev. 9 - 2

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November 2018

MMBTA63 / MMBTA64

Absolute Maximum Ratings (@TA = +25°C, unless otherwise specified.)

Characteristic

Symbol

Value

Unit

Collector-Base Voltage

VCBO

-30

Collector-Emitter Voltage

VCEO

-30

Emitter-Base Voltage

VEBO

-10

Collector Current - Continuous

-500

Thermal Characteristics (@TA = +25°C, unless otherwise specified.)

Characteristic

Symbol

Value

Unit

Power Dissipation

(Note 5)

300

Thermal Resistance, Junction to Ambient

(Note 5)

RθJA

417

°C/W

Operating and Storage Temperature Range

TJ,TSTG

-55 to +150

°C

ESD Ratings (Note 6)

Characteristic

Symbol

Value

Unit

JEDEC Class

Electrostatic Discharge - Human Body Model

ESD HBM

4,000

Electrostatic Discharge - Machine Model

ESD MM

400

Notes: 5. For a device mounted on minimum recommended pad layout 1oz copper that is on a single-sided FR-4 PCB; device is measured under still air

conditions whilst operating in a steady-state.

6. Refer to JEDEC specification JESD22-A114 and JESD22-A115.

100

25 50 75 100 125 150 175 200

P , POWER DISSIPATION (mW)

T , AMBIENT TEMPERATURE (

癈

)

Fig. 1, Max Power Dissipation vs. Ambient Temperature

150

200

250

300

350

400

100

25 50 75 100 125 150 175 200

P , POWER DISSIPATION (mW)

T , AMBIENT TEMPERATURE (

癈

)

Fig. 1, Max Power Dissipation vs. Ambient Temperature

150

200

250

300

350

400

(°C)

MMBTA63 / MMBTA64

Document number: DS30055 Rev. 9 - 2

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November 2018

MMBTA63 / MMBTA64

Electrical Characteristics (@TA = +25°C, unless otherwise specified.)

Note: 7. Measured under pulsed conditions. Pulse width ≤ 300µs. Duty cycle ≤ 2%.

Characteristic

Symbol

Min

Max

Unit

Test Condition

OFF CHARACTERISTICS (Note 7)

Collector-Emitter Breakdown Voltage

BVCEO

-30



IC = -100A, VBE = 0V

Collector Cut-Off Current

ICBO



-100

VCB = -30V, IE = 0

Emitter Cut-Off Current

IEBO



-100

VEB = -10V, IC = 0

ON CHARACTERISTICS (Note 7)

DC Current Gain MMBTA63

MMBTA64

MMBTA63

MMBTA64

hFE

5,000

10,000

20,000



IC = -10mA, VCE = -5.0V

IC = -100mA, VCE = -5.0V

Collector-Emitter Saturation Voltage

VCE(SAT)



-1.5

IC = -100mA, IB = -100A

Base-Emitter Saturation Voltage

VBE(SAT)



-2.0

IC = -100mA, VCE = -5.0V

SMALL SIGNAL CHARACTERISTICS

Current Gain-Bandwidth Product

125



MHz

VCE = -5.0V, IC = -10mA,

f = 100MHz

MMBTA63 / MMBTA64

Document number: DS30055 Rev. 9 - 2

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November 2018

MMBTA63 / MMBTA64

Typical Electrical Characteristics (@TA = +25°C, unless otherwise specified.)

0.40

0.45

0.50

0.55

0.60

0.65

0.70

0.75

0.80

0.85

0.90

0.95

1.00

1.05

1.10

1.15

1.20

110 100 1,000

V , COLLECTOR TO EMITTER

SATURATION VOLTAGE (V)

CE(SAT)

I , COLLECTOR CURRENT (mA)

Fig. 2, Collector Emitter Saturation Voltage vs. Collector Current

100

1,000

10,000,000

10,000

100,000

1,000,000

110 1,000100

h , DC CURRENT GAIN

I , COLLECTOR CURRENT (mA)

Fig. 3, DC Current Gain vs. Collector Current

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.1

1.2

1.3

1.4

1.5

1.6

0.1 110 100

V , BASE EMITTER VOLTAGE (V)

BE(ON)

I , COLLECTOR CURRENT (mA)

Fig. 4, Base Emitter Voltage vs. Collector Current

1,000

100

110 100

f , GAIN BANDWIDTH PRODUCT (MHz)

I , COLLECTOR CURRENT (mA)

Fig. 5, Gain Bandwidth Product vs. Collector Current

MMBTA63 / MMBTA64

Document number: DS30055 Rev. 9 - 2

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MMBTA63 / MMBTA64

Package Outline Dimensions

Please see http://www.diodes.com/package-outlines.html for the latest version.

SOT23

Dim

Min

Max

Typ

0.37

0.51

0.40

1.20

1.40

1.30

2.30

2.50

2.40

0.89

1.03

0.915

0.45

0.60

0.535

1.78

2.05

1.83

2.80

3.00

2.90

0.013

0.10

0.05

0.890

1.00

0.975

0.903

1.10

1.025

0.45

0.61

0.55

0.25

0.55

0.40

0.085

0.150

0.110

0°

8°

All Dimensions in mm

Suggested Pad Layout

Please see http://www.diodes.com/package-outlines.html for the latest version.

SOT23

Dimensions

Value (in mm)

2.0

0.8

1.35

0.9

2.9

K1 K

GAUGE PLANE

0.25

All 7°

Y1 C

MMBTA63 / MMBTA64

Document number: DS30055 Rev. 9 - 2

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MMBTA63 / MMBTA64

IMPORTANT NOTICE

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,

INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE

(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).

Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes

without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the

application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or

trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume

all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated

website, harmless against all damages.

Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.

Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and

hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or

indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.

Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings

noted herein may also be covered by one or more United States, international or foreign trademarks.

This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the

final and determinative format released by Diodes Incorporated.

LIFE SUPPORT

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express

written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:

A. Life support devices or systems are devices or systems which:

1. are intended to implant into the body, or

2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the

labeling can be reasonably expected to result in significant injury to the user.

B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the

failure of the life support device or to affect its safety or effectiveness.

Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and

acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any

use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related

information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its

representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.