© Semiconductor Components Industries, LLC, 2005
July, 2005 − Rev. 2 1Publication Order Number:
MBR120VLSFT1/D
MBR120VLSFT1
Surface Mount
Schottky Power Rectifier
Plastic SOD−123 Package
This device uses the Schottky Barrier principle with a large area
metal−to−silicon power diode. Ideally suited for low voltage, high
frequency rectification or as free wheeling and polarity protection
diodes in surface mount applications where compact size and weight
are critical to the system. This package also provides an easy to work
with alternative to leadless 34 package style. Because of its small size,
it is ideal for use in portable and battery powered products such as
cellular and cordless phones, chargers, notebook computers, printers,
PDAs and PCMCIA cards. Typical applications are AC−DC and
DC−DC converters, reverse battery protection, and “Oring” of
multiple supply voltages and any other application where performance
and size are critical.
Features
Guardring for Stress Protection
Optimized for Very Low Forward Voltage
125°C Operating Junction Temperature
Epoxy Meets UL 94 V−0 @ 0.125 in
Package Designed for Optimal Automated Board Assembly
ESD Ratings: Machine Model, C;
Human Body Model, 3B
Pb−Free Packages are Available
Mechanical Characteristics
Reel Options: MBR120VLSFT1 = 3,000 per 7 reel/8 mm tape
MBR120VLSFT3 = 10,000 per 13 reel/8 mm tape
Device Marking: L2V
Polarity Designator: Cathode Band
Weight: 11.7 mg (approximately)
Case: Epoxy, Molded
Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
Device Meets MSL 1 Requirements
SOD−123FL
CASE 498
PLASTIC
SCHOTTKY BARRIER
RECTIFIER
1.0 AMPERES
20 VOLTS
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L2V = Specific Device Code
M = Date Code
G= Pb−Free Package
(Note: Microdot may be in either location)
L2VMG
G
Device Package Shipping
ORDERING INFORMATION
MBR120VLS FT1 SOD−123FL 3000/Tape & Reel
MBR120VLS FT3 SOD−123FL 10000/Tape & Ree
l
MBR120VLSFT1G SOD−123FL
(Pb−Free) 3000/Tape & Reel
MBR120VLSFT3G SOD−123FL
(Pb−Free) 10000/Tape & Ree
l
For information on tape and reel specifications,
including part orientation and tape sizes, please
refer t o our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
MARKING DIAGRAM
MBR120VLSFT1
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MAXIMUM RATINGS
Rating Symbol Value Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
20 V
Average Rectified Forward Current
(Rated V R) TL = 119°CIF(AV) 1.0 A
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions, Halfwave, Single Phase, 60 Hz) IFSM 45 A
Storage Temperature Range Tstg −65 to +125 °C
Operating Junction Temperature TJ−65 to +125 °C
Voltage Rate of Change (Rated VR) dv/dt 1000 V/ms
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
THERMAL CHARACTERISTICS
Characteristic Symbol Value Unit
Thermal Resistance − Junction−to−Lead (Note 1)
Thermal Resistance − Junction−to−Lead (Note 2)
Thermal Resistance − Junction−to−Ambient (Note 1)
Thermal Resistance − Junction−to−Ambient (Note 2)
Rtjl
Rtjl
Rtja
Rtja
26
21
325
82
°C/W
1. Mounted with minimum recommended pad size, PC Board FR4.
2. Mounted with 1 in. copper pad (Cu area 700 mm2).
ELECTRICAL CHARACTERISTICS
Characteristic Symbol TJ = 255C TJ = 855C Unit
Maximum Instantaneous Forward Voltage (Note 3)
(IF = 0.1 A)
(IF = 0.5 A)
(IF = 1.0 A)
VF0.275
0.315
0.340
0.205
0.270
0.300
V
Maximum Instantaneous Reverse Current (Note 3)
(Rated DC Voltage) IR0.60 15 mA
3. Pulse Test: Pulse Width = 300 ms, Duty Cycle 2%.
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IF, INSTANTANEOUS FORWARD CURRENT (AMPS)
I
F
, INSTANTANEOUS FORWARD CURRENT (AMPS)
Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage
0
VF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)
10
1
VF, MAXIMUM INSTANTANEOUS FORWARD VOLTAGE
(VOLTS)
0.1 0.30.1 0.2 0.6
TJ = 85°C
TJ = 125°C
TJ = −55°C
TJ = 25°C
0.1
10
1
0.1 0.40.2 0.3 0.
5
TJ = 85°C
TJ = 125°C
TJ = 25°C
0.50.4
IR, MAXIMUM REVERSE CURRENT (AMPS)
I
R
, REVERSE CURRENT (AMPS)
Figure 3. Typical Reverse Current Figure 4. Maximum Reverse Current
200
VR, REVERSE VOLTAGE (VOLTS)
100E−3
10E−3
1E−3
100E−6
10E−6
VR, REVERSE VOLTAGE (VOLTS)
51015 2
0
0
100E−6
10E−6 51015
TJ = 125°C
TJ = 85°C
TJ = 25°C
100E−3
10E−3
1E−3
TJ = 125°C
TJ = 85°C
TJ = 25°C
SQUARE
WAVE
dc
IO, AVERAGE FORWARD CURRENT (AMPS)
Figure 5. Current Derating
TL, LEAD TEMPERATURE (°C)
4525
1.8
1.2
1.0
0.6
0.2
085 105
0.8
65 125
0.4
PFO, AVERAGE POWER DISSIPATION (WATTS)
Figure 6. Forward Power Dissipation
IO, AVERAGE FORWARD CURRENT (AMPS)
0.20
0.5
0.3
0.1
01.00.4 0.8 1.2 1.6
0.4
0.6 1.4
0.2
1.4
1.6
Ipk/Io = 20
Ipk/Io = 10
Ipk/Io = 5
Ipk/Io = p
SQUARE
WAVE
dc freq = 20 kHz
Ipk/Io = p
Ipk/Io = 5
Ipk/Io = 10
Ipk/Io = 20
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4
C, CAPACITANCE (pF)
120
VR, REVERSE VOLTAGE (VOLTS)
500
100
048
TJ = 25°C
2016
Figure 7. Capacitance
TJ, DERATED OPERATING
TEMPERATURE (°C)
120
VR, DC REVERSE VOLTAGE (VOLTS)
125
100
65 6.02.0 4.0 8.0 10 2014 16 18
Figure 8. Typical Operating Temperature
Derating*
* Reverse power dissipation and the possibility of thermal runaway must be considered when operating this device under any re-
verse voltage conditions. Calculations of TJ therefore must include forward and reverse power effects. The allowable operating
TJ may be calculated from the equation: TJ = TJmax − r(t)(Pf + Pr) where
r(t) = thermal impedance under given conditions,
Pf = forward power dissipation, and
Pr = reverse power dissipation
This graph displays the derated allowable TJ due to reverse bias under DC conditions only and is calculated as TJ = TJmax − r(t)Pr,
where r(t) = Rthja. For other power applications further calculations must be performed.
70
75
80
85
90
95
105
110
115
120
RqJA = 25.6°C/W
400°C/W
324.9°C/W
235°C/W
130°C/W
1026 1814
200
300
400
r(t), TRANSIENT THERMAL RESISTANCE
Figure 9. Thermal Response
100
0
0.10.00001
t1, TIME (sec)
1000
1
0.0001 0.001 0.01 1 10 1000.000001
0.1
10
100
P(pk)
t1
t2
DUTY CYCLE, D = t1/t2
qJA = 321.8 °C/W
Test Type > Min Pad < Die Size 38x38 @ 75% mils
D = 0.5
SINGLE PULSE
0.2
0.1
0.05
0.01
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5
PACKAGE DIMENSIONS
SOD−123LF
CASE 498−01
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M,
1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH.
4. DIMENSIONS D AND J ARE TO BE MEASURED ON FLAT
SECTION OF THE LEAD: BETWEEN 0.10 AND 0.25 MM
FROM THE LEAD TIP.
D
E
b
A
A1
L
c
POLARITY INDICATOR
OPTIONAL AS NEEDED
HE
DIM
AMIN NOM MAX MIN
MILLIMETERS
0.90 0.95 1.00 0.035
INCHES
A1 0.00 0.05 0.10 0.000
b0.70 0.90 1.10 0.028
c0.10 0.15 0.20 0.004
D1.50 1.65 1.80 0.059
E2.50 2.70 2.90 0.098
L0.55 0.75 0.95 0.022
0.037 0.039
0.002 0.004
0.035 0.043
0.006 0.008
0.065 0.071
0.106 0.114
0.030 0.037
NOM MAX
3.40 3.60 3.80 0.134 0.142 0.150
HE
0°8°0°8°
q
q
q
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
mm
inches
0.91
0.036
1.22
0.048
2.36
0.093
4.19
0.165
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
MBR120VLSFT1
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6
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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MBR120VLSFT1/D
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