Applications
Applied to a high speed signal interface, the 42510ESDA protects:
• Digital video equipment
• Mobile phone
• GPS Antenna
• Bluetooth communication equipment antenna circuit
• IEEE-1394
• DVI
• HDMI
Part Numbering System: 4 2510 ESDA- TR1
• Four channel SIN 1 chip
• 2.5x1.0mm footprint size
• ESDA ESD Suppressor
• Tape and reel packaging code
Packaging
• Supplied in tape and reel packaging, 5000 parts per seven inch
(178mm) reel per EIA Standard 481-1
Ordering Information
Four-Channel ESD Suppressor
PolySurg™ 42510ESDA-TR1
0810 BU-SB10816 Page 1 of 2 Data Sheet 4378
Description
The Cooper Bussmann®PolySurg™ 42510ESDA four-channel array ESD
suppressor protects sensitive electronic circuits from the threat of
electrostatic discharge (ESD) without distorting data signals. This protection is
a result of its ultra-low capacitance (0.1pF typical) that is well suited for HDMI
ESD protection applications.
Features
• Halogen free, lead free and RoHS compliant for global applications
• Ultra-low capacitance (0.1pF typical) ideally suited for protecting high
speed data applications
• Provides ESD protection with fast response time (<1ns) allowing
equipment to pass the IEC 61000-4-2 Level 4 test
• Four (4) channel array
• Zero signal distortion
• Low leakage current (<0.01µA typical)
Pb
HALOGEN
HF
FREE
* Note, Capacitance measured with 1Vrms
Surface Mount Device
Electrical Specifications
Characteristic Value/Range
Rated Voltage (max) 12V
Leakage Current (max @ 12Vdc) 0.01μA
Trigger Voltage (Vt) 300V Typical
Clamping Voltage (Vc) 30V Typical
Capacitance (Cp) @1MHz* 0.1pF Typical
Response Time <1ns
ESD Voltage Capability, IEC 61000-4-2 8kV
Contact Discharge Mode
ESD Voltage Capability, IEC 61000-4-2 15kV
Air Discharge Mode
ESD Withstand Pulses 100 Times Minimal
Catalog Number Description
42510ESDA-TR1 5000 suppressors in paper tape on a 7 inch
(178mm) reel
Environmental Specifications
Characteristic Value
Load Humidity +85°C/90%RH with rated voltage for 1000 hrs
Thermal Shock -40°C to +85°C, 30 minute cycle, 5 cycles
Moisture Resistance Test J-STD-020 Standard: Level 2
(1 year floor life under 30°C/65%RH conditions
Operating Temperature Range -40°C to +85°C (-40°F to 185°F)
Storage Temperature Range -55°C to +125°C (-67°F to +257°F)
L
W
E
T
B
C
D
© 2010 Cooper Bussmann
www.cooperbussmann.com
0810 BU-SB10816 Page 2 of 2 Data Sheet 4378
The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This bulletin is
intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann reserves the right, without notice, to change
design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to change or update, without notice, any technical information con-
tained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications.
Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life sup-
port systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result
in significant injury to the user.
Soldering Recommendations
• Compatible with lead and lead-free solder reflow processes
• Hand soldering - soldering tip should not directly touch part -
280°C max for 3 sec. max
• Peak reflow temperatures and durations:
- IR Reflow = 260°C max for 20 sec. max
- Wave Solder = 260°C max for 10 sec. max
Recommended IR Reflow Profile
Tape and Reel Packaging Specifications - mm
Dimensions - mm
Recommended Pad Layout - mm
GPP
1XX
1YY
1Z
0.2 0.5 1 0.2 0.3 0.6 1.4 1.4
Note: Print solder 0.01~0.015mm thick.
BC D E L T W
0.2 0.3 0.2 0.5 2.5 0.5 1.0
±0.1 ±0.05 ±0.05 ±0.05 ±0.1 ±0.1 ±0.1
7RS7DSH
)
/
:
(
'
$
&
%
Unit: mm
AB C D E F LW
8.00 3.50 1.75 2.00 4.00 1.50 2.90 1.40
±0.30 ±0.05 ±0.10 ±0.05 ±0.10 ±0.10 ±0.20 ±0.20
Design Considerations
• Follow the soldering recommendations to avoid deforming product
• Do not use high temperature, high humidity or corrosive atmospheres
(sulfide and chloride gas) that could damage the solderability
• Moisture Sensitivity Level (MSL) according to J-STD-020 standard:
Level 2 (Floor Life 1 year under <30°C/65%RH conditions)
• Solderability requirement according to IPC/JEDEC J-STD-002C,
Test D, Test B1
• Use Sn/Ag/Cu (96.5/3.0/0.5) or equivalent solder and activated flux #5
or equivalent.
Circuit Schematic
HDMI Application
