PACDN1404C/1408C/1416C ESD Protection Arrays, Chip Scale Package Features Product Description * The PACDN1404C, PACDN1408C and PACDN1416C are transient voltage suppressor arrays that provide a very high level of protection for sensitive electronic components that may be subjected to ESD. * * * 4, 8, or 16 transient voltage suppressors in a single package In-system Electrostatic Discharge (ESD) protection to +25kV contact discharge per IEC 61000-4-2 international standard Compact Chip Scale Package (0.65mm pitch) format saves board space and eases layout in space critical applications compared to discrete solutions and traditional wire bonded packages Lead-free versions available Applications * * * * * * * * ESD protection for sensitive electronic equipment I/O port, keypad and button circuitry protection for portable devices Wireless Handsets Handheld PCs / PDAs MP3 Players Digital Cameras and Camcorders Notebooks Desktop PCs These devices are designed and characterized to safely dissipate ESD strikes at levels well beyond the maximum requirements set forth in the IEC 61000-4-2 international standard (Level 4, +8kV contact discharge). All I/Os are rated at +25kV using the IEC 61000-4-2 contact discharge method. Using the MILSTD-883D (Method 3015) specification for Human Body Model (HBM) ESD, all pins are protected for contact discharges to greater than +30kV. The Chip Scale Package format of these devices enable extremely small footprints that are necessary in portable electronics such as cellular phones, PDAs, internet appliances and PCs. The large solder bumps allow for standard attachment to laminate boards without the use of underfill. The PACDN1404C, PACDN1408C and PACDN1416C are available with optional lead-free finishing. Electrical Schematic B1 B2 B3 B1 B2 B3 B4 B5 D1 D2 D3 D4 D5 A1 A2 A3 A1 A2 A3 A4 A5 C1 C2 C3 C4 C5 B1 B2 B3 B4 B5 A1 A2 A3 A4 A5 PACDN1404C PACDN1408C PACDN1416C (c) 2003 California Micro Devices Corp. All rights reserved. 10/10/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 1 PACDN1404C/1408C/1416C PACKAGE / PINOUT DIAGRAMS TOP VIEW BOTTOM VIEW (Bumps Down View) (Bumps Up View) Orientation Marking (see note 2) 1 A 2 3 D14 B B1 B2 B3 A1 A2 A3 PACDN1404C CSP Package Orientation Marking (see note 2) TOP VIEW BOTTOM VIEW (Bumps Down View) (Bumps Up View) 1 A 2 3 4 5 DN1408 B B1 B2 B3 B4 B5 A1 A2 A3 A4 A5 PACDN1408C CSP Package Orientation Marking (see note 2) 1 TOP VIEW BOTTOM VIEW (Bumps Down View) (Bumps Up View) 2 3 4 5 A B C DN 1416 D D1 D2 D3 D4 D5 C1 C2 C3 C4 C5 B1 B2 B3 B4 B5 A1 A2 A3 A4 A5 PACDN1416C CSP Package Notes: 1) These drawings are not to scale. 2) Lead-free devices are specified by using a "+" character for the top side orientation mark. Ordering Information PART NUMBERING INFORMATION Lead-free Finish2 Standard Finish Bumps Package Ordering Part Number1 Part Marking Ordering Part Number1 Part Marking 6 CSP PACDN1404C D14 PACDN1404CG D14 10 CSP PACDN1408C DN1408 PACDN1408CG DN1408 20 CSP PACDN1416C DN1416 PACDN1416CG DN1416 Note 1: Parts are shipped in Tape & Reel form unless otherwise specified. Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark. (c) 2003 California Micro Devices Corp. All rights reserved. 2 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 10/10/03 PACDN1404C/1408C/1416C Specifications ABSOLUTE MAXIMUM RATINGS PARAMETER Storage Temperature Range RATING UNITS -65 to +150 C STANDARD OPERATING CONDITIONS PARAMETER Operating Temperature Range RATING UNITS -40 to +85 C ELECTRICAL OPERATING CHARACTERISTICS1 SYMBOL PARAMETER CONDITIONS MIN VREV Reverse Standoff Voltage IDIODE=10A 5.5 ILEAK Leakage Current VIN=3.3V DC VSIG Signal Clamp Voltage Positive Clamp Negative Clamp ILOAD = 10mA In-system ESD Withstand Voltage a) Human Body Model, MIL-STD-883, Method 3015 b) Contact Discharge per IEC 61000-4-2 Level 4 Notes 2 & 3 Clamping Voltage during ESD Discharge MIL-STD-883 (Method 3015), 8kV Positive Transients Negative Transients Notes 2 & 3 Channel Capacitance At 2.5V DC, f = 1MHz VESD VCL C 5.6 -1.2 TYP MAX UNITS V 6.8 -0.8 100 nA 8.0 -0.4 V V +30 kV +25 kV +12 -8 39 V V 47 pF Note 1: TA=25C unless otherwise specified. GND in this document refers to the lower supply voltage. Note 2: ESD applied to channel pins with respect to GND, one at a time. All other channels are open. All GND pins tied to ground. Note 3: These parameters are guaranteed by design and characterization. (c) 2003 California Micro Devices Corp. All rights reserved. 10/10/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 3 PACDN1404C/1408C/1416C Application Information Refer to Application Note AP-217, "The Chip Scale Package", for a detailed description of Chip Scale Packages offered by California Micro Devices. PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER VALUE Pad Size on PCB 0.300mm Pad Shape Round Pad Definition Non-Solder Mask defined pads Solder Mask Opening 0.350mm Round Solder Stencil Thickness 0.125 - 0.150mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.360mm Round Solder Flux Ratio 50/50 by volume Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance -- Edge To Corner Ball +50m Solder Ball Side Coplanarity +20m Maximum Dwell Time Above Liquidous 60 seconds Soldering Maximum Temperature 260C Non-Solder Mask Defined Pad 0.300mm DIA. Solder Stencil Opening 0.360mm DIA. Solder Mask Opening 0.350mm DIA. Figure 1. Recommended Non-Solder Mask Defined Pad Illustration Temperature (C) 250 200 150 100 50 0 Figure 2. Eutectic (SnPb) Solder Ball Reflow Profile 1:00.0 2:00.0 3:00.0 Time (minutes) 4:00.0 Figure 3. Lead-free (SnAgCu) Solder Ball Reflow Profile (c) 2003 California Micro Devices Corp. All rights reserved. 4 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 10/10/03 PACDN1404C/1408C/1416C Mechanical Details The PACDN1404C/1408C/1416C devices are packaged in custom Chip Scale Packages (CSP). PACDN1404C 6-bump CSP Mechanical Specifications The PACDN1404C devices are packaged in a 6-bump custom Chip Scale Package (CSP). Dimensions are presented below. Mechanical Package Diagrams PACKAGE DIMENSIONS Package A1 Custom CSP 6 Millimeters Inches 3 Max Nom Max A1 1.109 1.154 1.199 0.0437 0.0454 0.0472 A2 1.759 1.804 1.849 0.0693 0.0710 0.0728 B1 0.645 0.650 0.655 0.0254 0.0256 0.0258 B2 0.645 0.650 0.655 0.0254 0.0256 0.0258 B3 0.645 0.650 0.655 0.0254 0.0256 0.0258 C1 0.202 0.252 0.302 0.0080 0.0099 0.0119 C2 0.202 0.252 0.302 0.0080 0.0099 0.0119 D1 0.600 0.644 0.687 0.0236 0.0253 0.0271 D2 0.356 0.381 0.406 0.0140 0.0150 0.0160 A2 Nom 2 1 A B C2 Min # per tape and reel Min SIDE VIEW C1 B1 B3 B2 Bumps Dim BOTTOM VIEW D1 0.35 DIA. D2 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS DIMENSIONS IN MILLIMETERS Package Dimensions for PACDN1404C 6-bump Chip Scale Package 3500 pieces Controlling dimension: millimeters CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 PACDN1404C 1.804 X 1.154 X 0.644 1.98 X 1.32 X 0.91 TAPE WIDTH W REEL DIA. QTY PER REEL P0 P1 8mm 178mm (7") 3500 4mm 4mm 10 Pitches Cumulative Tolerance On Tape 0.2 mm Po Top Cover Tape Ao W Bo Ko For tape feeder reference only including draft. Concentric around B. Embossment Center Lines of Cavity P1 User Direction of Feed Figure 4. Tape and Reel Mechanical Data (c) 2003 California Micro Devices Corp. All rights reserved. 10/10/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 5 PACDN1404C/1408C/1416C Mechanical Details (cont'd) PACDN1408C 10-bump CSP Mechanical Specifications The PACDN1408C devices are packaged in a 10-bump custom Chip Scale Package (CSP). Dimensions are presented below. Mechanical Package Diagrams PACKAGE DIMENSIONS Package Custom CSP Bumps 10 Millimeters A1 Inches Nom 5 Min Nom Max A1 1.109 1.154 1.199 0.0437 0.0454 0.0472 A2 3.059 3.104 3.149 0.1204 0.1222 0.1240 3 B1 0.645 0.650 0.655 0.0254 0.0256 0.0258 2 B2 0.645 0.650 0.655 0.0254 0.0256 0.0258 1 C1 0.202 0.252 0.302 0.0080 0.0099 0.0119 C2 0.202 0.252 0.302 0.0080 0.0099 0.0119 D1 0.600 0.644 0.687 0.0236 0.0253 0.0271 D2 0.356 0.381 0.406 Max 4 A2 B A B A C2 # per tape and reel Min SIDE VIEW C1 B1 B2 Dim BOTTOM VIEW D1 0.35 DIA. D2 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS DIMENSIONS IN MILLIMETERS 0.0140 0.0150 0.0160 3500 pieces Controlling dimension: millimeters Package Dimensions for PACDN1408C 10-bump Chip Scale Package CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K 0 PACDN1408C 3.104 X 1.154 X 0.644 3.28 X 1.32 X 0.81 Po Top Cover Tape TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 8mm 178mm (7") 3500 4mm 4mm 10 Pitches Cumulative Tolerance On Tape 0.2 mm Ao W Bo Ko For tape feeder reference only including draft. Concentric around B. Embossment P1 Center Lines of Cavity User Direction of Feed Figure 5. Tape and Reel Mechanical Data (c) 2003 California Micro Devices Corp. All rights reserved. 6 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 10/10/03 PACDN1404C/1408C/1416C Mechanical Details (cont'd) PACDN1416C 20-bump CSP Mechanical Specifications The PACDN1416C devices are packaged in a 20-bump custom Chip Scale Package (CSP). Dimensions are presented below. Mechanical Package Diagrams PACKAGE DIMENSIONS Custom CSP Bumps 20 Dim Millimeters A1 Inches 5 Min Nom Max A1 2.409 2.454 2.499 0.0948 0.0966 0.0984 A2 3.059 3.104 3.149 0.1204 0.1222 0.1240 3 B1 0.645 0.650 0.655 0.0254 0.0256 0.0258 2 B2 0.645 0.650 0.655 0.0254 0.0256 0.0258 1 C1 0.202 0.252 0.302 0.0080 0.0099 0.0119 C2 0.202 0.252 0.302 0.0080 0.0099 0.0119 D1 0.600 0.644 0.687 0.0236 0.0253 0.0271 D2 0.356 0.381 0.406 Nom Max 4 A2 D C B A B A C2 # per tape and reel Min SIDE VIEW C1 B1 B2 Package BOTTOM VIEW 0.35 DIA. 63/37 Sn/Pb (Eutectic) or 96.8/2.6/0.6 Sn/Ag/Cu (Lead-free) SOLDER BUMPS 0.0140 0.0150 0.0160 D1 D2 3500 pieces DIMENSIONS IN MILLIMETERS Controlling dimension: millimeters Package Dimensions for PACDN1416C 20-bump Chip Scale Package CSP Tape and Reel Specifications PART NUMBER CHIP SIZE (mm) POCKET SIZE (mm) B0 X A0 X K0 PACDN1416C 3.104 X 2.454 X 0.644 3.28 X 2.64 X 0.86 TAPE WIDTH W REEL DIAMETER QTY PER REEL P0 P1 8mm 178mm (7") 3500 4mm 4mm 10 Pitches Cumulative Tolerance On Tape 0.2 mm Po Top Cover Tape Ao W Bo Ko For tape feeder reference only including draft. Concentric around B. Embossment Center Lines of Cavity P1 User Direction of Feed Figure 6. Tape and Reel Mechanical Data (c) 2003 California Micro Devices Corp. All rights reserved. 10/10/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 Tel: 408.263.3214 Fax: 408.263.7846 www.calmicro.com 7