© 2003 California Micro Devices Corp. All rights reserved.
10/10/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 ▲Fax: 408.263.7846 ▲www.calmicro.com 1
PACDN1404C/1408C/1416C
ESD Protection Arrays, Chip Scale Package
Features
• 4, 8, or 16 transient voltage suppressors in a single
package
• In-system Electrostatic Discharge (ESD) protection
to +25kV contact discharge per IEC 61000-4-2
international standard
• Compact Chip Scale Package (0.65mm pitch) for-
mat saves board space and eases layout in space
critical applications compared to discrete solutions
and traditional wire bonded packages
• Lead-free versions available
Applications
• ESD protection for sensitive electronic equipment
• I/O port, keypad and button circuitry protection for
portable devices
• Wireless Handsets
• Handheld PCs / PDAs
• MP3 Players
• Digital Cameras and Camcorders
• Notebooks
• Desktop PCs
Product Description
The PACDN1404C, PACDN1408C and PACDN1416C
are transient voltage suppressor arrays that provide a
very high level of protection for sensitive electronic
components that may be subjected to ESD.
These devices are designed and characterized to
safely dissipate ESD strikes at levels well beyond the
maximum requirements set forth in the IEC 61000-4-2
international standard (Level 4, +8kV contact dis-
charge). All I/Os are rated at +25kV using the IEC
61000-4-2 contact discharge method. Using the MIL-
STD-883D (Method 3015) specification for Human
Body Model (HBM) ESD, all pins are protected for con-
tact discharges to greater than +30kV.
The Chip Scale Package format of these devices
enable extremely small footprints that are necessary in
portable electronics such as cellular phones, PDAs,
internet appliances and PCs. The large solder bumps
allow for standard attachment to laminate boards with-
out the use of underfill. The PACDN1404C,
PACDN1408C and PACDN1416C are available with
optional lead-free finishing.
Electrical Schematic
PACDN1404C PACDN1408C
PACDN1416C
A1 A2 A3
B1 B2 B3
C2 C3 C4
D2 D3 D4
C5
D5
C1
D1
A2 A3 A4
B2 B3 B4
A5
B5
A1
B1
A2 A3 A4
B2 B3 B4
A5
B5
A1
B1
© 2003 California Micro Devices Corp. All rights reserved.
2430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 ▲Fax: 408.263.7846 ▲www.calmicro.com 10/10/03
PACDN1404C/1408C/1416C
Ordering Information
Note 1: Parts are shipped in Tape & Reel form unless otherwise specified.
Note 2: Lead-free devices are specified by using a "+" character for the top side orientation mark.
C3
D3
C2C1
D2D1
C5
D5
C4
D4
A3
B3
A2A1
B2B1
A5
B5
A4
B4
DN
1416
32541
B
A
D
C
Orientation
Marking
(see note 2)
A3
B3
A2A1
B2B1
A5
B5
A4
B4
DN1408
32541
B
A
Orientation
Marking
(see note 2)
A3
B3
A2A1
B2B1
D14
321
B
A
Orientation
Marking
(see note 2)
PACDN1404C
CSP Package
PACKAGE / PINOUT DIAGRAMS
Notes:
BOTTOM VIEW
(Bumps Up View)
TOP VIEW
(Bumps Down View)
PACDN1408C
CSP Package
BOTTOM VIEW
(Bumps Up View)
TOP VIEW
(Bumps Down View)
CSP Package
PACDN1416C
BOTTOM VIEW
(Bumps Up View)
TOP VIEW
(Bumps Down View)
1) These drawings are not to scale.
2) Lead-free devices are specified by using a "+" character for the top side orientation mark.
PART NUMBERING INFORMATION
Bumps Package
Standard Finish Lead-free Finish2
Ordering Part
Number1Part Marking
Ordering Part
Number1Part Marking
6 CSP PACDN1404C D14 PACDN1404CG D14
10 CSP PACDN1408C DN1408 PACDN1408CG DN1408
20 CSP PACDN1416C DN1416 PACDN1416CG DN1416
© 2003 California Micro Devices Corp. All rights reserved.
10/10/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 ▲Fax: 408.263.7846 ▲www.calmicro.com 3
PACDN1404C/1408C/1416C
Specifications
Note 1: TA=25°C unless otherwise specified. GND in this document refers to the lower supply voltage.
Note 2: ESD applied to channel pins with respect to GND, one at a time. All other channels are open. All GND pins tied to ground.
Note 3: These parameters are guaranteed by design and characterization.
ABSOLUTE MAXIMUM RATINGS
PARAMETER RATING UNITS
Storage Temperature Range -65 to +150 °C
STANDARD OPERATING CONDITIONS
PARAMETER RATING UNITS
Operating Temperature Range -40 to +85 °C
ELECTRICAL OPERATING CHARACTERISTICS1
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS
VREV Reverse Standoff Voltage IDIODE=10µA5.5 V
ILEAK Leakage Current VIN=3.3V DC 100 nA
VSIG Signal Clamp Voltage
Positive Clamp
Negative Clamp
ILOAD = 10mA
5.6
-1.2
6.8
-0.8
8.0
-0.4
V
V
VESD In-system ESD Withstand Voltage
a) Human Body Model, MIL-STD-883,
Method 3015
b) Contact Discharge per IEC 61000-4-2
Level 4
Notes 2 & 3
+30
+25
kV
kV
VCL Clamping Voltage during ESD Discharge
MIL-STD-883 (Method 3015), 8kV
Positive Transients
Negative Transients
Notes 2 & 3
+12
-8
V
V
C Channel Capacitance At 2.5V DC,
f
= 1MHz 39 47 pF
© 2003 California Micro Devices Corp. All rights reserved.
4430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 ▲Fax: 408.263.7846 ▲www.calmicro.com 10/10/03
PACDN1404C/1408C/1416C
Application Information
Refer to Application Note AP-217, "The Chip Scale
Package", for a detailed description of Chip Scale
Packages offered by California Micro Devices.
Figure 1. Recommended Non-Solder Mask Defined Pad Illustration
Figure 2. Eutectic (SnPb) Solder
Ball Reflow Profile
Figure 3. Lead-free (SnAgCu) Solder
Ball Reflow Profile
PRINTED CIRCUIT BOARD RECOMMENDATIONS
PARAMETER VALUE
Pad Size on PCB 0.300mm
Pad Shape Round
Pad Definition Non-Solder Mask defined pads
Solder Mask Opening 0.350mm Round
Solder Stencil Thickness 0.125 - 0.150mm
Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.360mm Round
Solder Flux Ratio 50/50 by volume
Solder Paste Type No Clean
Pad Protective Finish OSP (Entek Cu Plus 106A)
Tolerance — Edge To Corner Ball +50µm
Solder Ball Side Coplanarity +20µm
Maximum Dwell Time Above Liquidous 60 seconds
Soldering Maximum Temperature 260°C
Solder Mask Opening
0.350mm DIA.
Non-Solder Mask Defined Pad
0.300mm DIA.
Solder Stencil Opening
0.360mm DIA.
200
250
150
100
50
0 1:00.0 2:00.0 3:00.0 4:00.0
Time (minutes)
Temperature (°C)
© 2003 California Micro Devices Corp. All rights reserved.
10/10/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 ▲Fax: 408.263.7846 ▲www.calmicro.com 5
PACDN1404C/1408C/1416C
Mechanical Details
The PACDN1404C/1408C/1416C devices are pack-
aged in custom Chip Scale Packages (CSP).
PACDN1404C 6-bump CSP Mechanical Specifications
The PACDN1404C devices are packaged in a 6-bump
custom Chip Scale Package (CSP). Dimensions are
presented below.
Package Dimensions for
PACDN1404C 6-bump Chip Scale Package
CSP Tape and Reel Specifications
Figure 4. Tape and Reel Mechanical Data
PACKAGE DIMENSIONS
Package Custom CSP
Bumps 6
Dim Millimeters Inches
Min Nom Max Min Nom Max
A1 1.109 1.154 1.199 0.0437 0.0454 0.0472
A2 1.759 1.804 1.849 0.0693 0.0710 0.0728
B1 0.645 0.650 0.655 0.0254 0.0256 0.0258
B2 0.645 0.650 0.655 0.0254 0.0256 0.0258
B3 0.645 0.650 0.655 0.0254 0.0256 0.0258
C1 0.202 0.252 0.302 0.0080 0.0099 0.0119
C2 0.202 0.252 0.302 0.0080 0.0099 0.0119
D1 0.600 0.644 0.687 0.0236 0.0253 0.0271
D2 0.356 0.381 0.406 0.0140 0.0150 0.0160
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
Mechanical Package Diagrams
1
2
3
B
C1
B1
A1
B2
C2
DIMENSIONS IN MILLIMETERS
D1
D2
A2
BOTTOM VIEW
SIDE
VIEW
A
B3
0.35 DIA.
63/37 Sn/Pb (Eutectic) or
SOLDER BUMPS
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
PART NUMBER CHIP SIZE (mm)
POCKET SIZE (mm)
B0 X A0 X K0
TAPE WIDTH
W
REEL
DIA.
QTY
PER
REEL P0P1
PACDN1404C 1.804 X 1.154 X 0.644 1.98 X 1.32 X 0.91 8mm 178mm (7") 3500 4mm 4mm
Top
For tape feeder reference
Cover
Tape
P
1
only including draft.
Concentric around B.
K
o
Embossment
User Direction of Feed
±
0.2 mm
P
o
Center Lines
of Cavity
W
10 Pitches Cumulative
Tolerance On Tape
A
o
B
o
© 2003 California Micro Devices Corp. All rights reserved.
6430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 ▲Fax: 408.263.7846 ▲www.calmicro.com 10/10/03
PACDN1404C/1408C/1416C
Mechanical Details (cont’d)
PACDN1408C 10-bump CSP Mechanical Specifications
The PACDN1408C devices are packaged in a 10-bump
custom Chip Scale Package (CSP). Dimensions are
presented below.
Package Dimensions for
PACDN1408C 10-bump Chip Scale Package
CSP Tape and Reel Specifications
Figure 5. Tape and Reel Mechanical Data
PACKAGE DIMENSIONS
Package Custom CSP
Bumps 10
Dim Millimeters Inches
Min Nom Max Min Nom Max
A1 1.109 1.154 1.199 0.0437 0.0454 0.0472
A2 3.059 3.104 3.149 0.1204 0.1222 0.1240
B1 0.645 0.650 0.655 0.0254 0.0256 0.0258
B2 0.645 0.650 0.655 0.0254 0.0256 0.0258
C1 0.202 0.252 0.302 0.0080 0.0099 0.0119
C2 0.202 0.252 0.302 0.0080 0.0099 0.0119
D1 0.600 0.644 0.687 0.0236 0.0253 0.0271
D2 0.356 0.381 0.406 0.0140 0.0150 0.0160
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
Mechanical Package Diagrams
4
5
B
C1
B1
A1
B2 C2
D1
D2
A2
BOTTOM VIEW
SIDE
VIEW
A
1
2
3
DIMENSIONS IN MILLIMETERS
AB
0.35 DIA.
63/37 Sn/Pb (Eutectic) or
SOLDER BUMPS
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
PART NUMBER CHIP SIZE (mm)
POCKET SIZE (mm)
B0 X A0 X K0
TAPE WIDTH
W
REEL
DIAMETER
QTY
PER
REEL P0P1
PACDN1408C 3.104 X 1.154 X 0.644 3.28 X 1.32 X 0.81 8mm 178mm (7") 3500 4mm 4mm
Top
For tape feeder reference
Cover
Tape
P
1
only including draft.
Concentric around B.
K
o
Embossment
User Direction of Feed
±
0.2 mm
P
o
Center Lines
of Cavity
W
10 Pitches Cumulative
Tolerance On Tape
A
o
B
o
© 2003 California Micro Devices Corp. All rights reserved.
10/10/03 430 N. McCarthy Blvd., Milpitas, CA 95035-5112 ▲Tel: 408.263.3214 ▲Fax: 408.263.7846 ▲www.calmicro.com 7
PACDN1404C/1408C/1416C
Mechanical Details (cont’d)
PACDN1416C 20-bump CSP Mechanical Specifications
The PACDN1416C devices are packaged in a 20-bump
custom Chip Scale Package (CSP). Dimensions are
presented below.
Package Dimensions for
PACDN1416C 20-bump Chip Scale Package
CSP Tape and Reel Specifications
Figure 6. Tape and Reel Mechanical Data
PACKAGE DIMENSIONS
Package Custom CSP
Bumps 20
Dim Millimeters Inches
Min Nom Max Min Nom Max
A1 2.409 2.454 2.499 0.0948 0.0966 0.0984
A2 3.059 3.104 3.149 0.1204 0.1222 0.1240
B1 0.645 0.650 0.655 0.0254 0.0256 0.0258
B2 0.645 0.650 0.655 0.0254 0.0256 0.0258
C1 0.202 0.252 0.302 0.0080 0.0099 0.0119
C2 0.202 0.252 0.302 0.0080 0.0099 0.0119
D1 0.600 0.644 0.687 0.0236 0.0253 0.0271
D2 0.356 0.381 0.406 0.0140 0.0150 0.0160
# per tape and
reel
3500 pieces
Controlling dimension: millimeters
Mechanical Package Diagrams
4
5
B
C1
B1
A1
B2 C2
D1
D2
A2
BOTTOM VIEW
SIDE
VIEW
A
1
2
3
DIMENSIONS IN MILLIMETERS
ABCD
0.35 DIA.
63/37 Sn/Pb (Eutectic) or
SOLDER BUMPS
96.8/2.6/0.6 Sn/Ag/Cu (Lead-free)
PART NUMBER CHIP SIZE (mm)
POCKET SIZE (mm)
B0 X A0 X K0
TAPE WIDTH
W
REEL
DIAMETER
QTY
PER
REEL P0P1
PACDN1416C 3.104 X 2.454 X 0.644 3.28 X 2.64 X 0.86 8mm 178mm (7") 3500 4mm 4mm
Top
For tape feeder reference
Cover
Tape
P
1
only including draft.
Concentric around B.
K
o
Embossment
User Direction of Feed
±
0.2 mm
P
o
Center Lines
of Cavity
W
10 Pitches Cumulative
Tolerance On Tape
A
o
B
o
