2005-2013 Microchip Technology Inc. DS20001941L-page 1
24AA1025/24LC1025/24FC1025
Device Selection Table:
Features:
• Low-Power CMOS Technology:
- Read current 450 A, maximum
- Standby current 5 A, maximum
• 2-Wire Serial Interface, I2C™ Compatible
• Cascadable up to Four Devices
• Schmitt Trigger Inputs for Noise Suppression
• Output Slope Control to Eliminate Ground Bounce
• 100 kHz and 400 kHz Clock Compatibility
• 1 MHz Clock for FC Versions
• Page Write Time 3 ms, typical
• Self-Timed Erase/Write Cycle
• 128-Byte Page Write Buffer
• Hardware Write-Protect
• ESD Protection >4000V
• More than 1 Million Erase/Write Cycles
• Data Retention >200 Years
• Factory Programming Available
• Packages include 8-lead PDIP, SOIJ and SOIC
• Pb-Free and RoHS Compliant
• Temperature Ranges:
- Industrial (I): -40C to +85C
- Automotive (E): -40C to +125C
Description:
The Microchip Technology Inc. 24AA1025/24LC1025/
24FC1025 (24XX1025*) is a 128K x 8 (1024K bit)
Serial Electrically Erasable PROM, capable of
operation across a broad voltage range (1.7V to 5.5V).
It has been developed for advanced, low-power
applications such as personal communications or data
acquisition. This device has both byte write and page
write capability of up to 128 bytes of data.
This device is capable of both random and sequential
reads. Reads may be sequential within address
boundaries 0000h to FFFFh and 10000h to 1FFFFh.
Functional address lines allow up to four devices on the
same data bus. This allows for up to 4 Mbits total
system EEPROM memory. This device is available in
the standard 8-pin PDIP, SOIC and SOIJ packages.
Package Type
Block Diagram
*24XX1025 is used in this document as a generic part number
for the 24AA1025/24LC1025/24FC1025 devices.
Part
Number
VCC
Range
Max. Clock
Frequency
Temp.
Ranges
24AA1025 1.7-5.5V 400 kHz†I
24LC1025 2.5-5.5V 400 kHz* I, E
24FC1025 1.8-5.5V 1 MHz‡I
†100 kHz for VCC < 2.5V
*100 kHz for VCC < 4.5V, E-temp
‡400 kHz for VCC < 2.5V
A0
A1
A2*
VSS
VCC
WP
SCL
SDA
1
2
3
4
8
7
6
5
PDIP
SOIJ/SOIC
A0
A1
A2*
VSS
1
2
3
4
8
7
6
5
VCC
WP
SCL
SDA
*A2 must be tied to VCC.
HV Generator
EEPROM
Array
Page Latches
YDEC
XDEC
Sense AMP
R/W Control
Memory
Control
Logic
I/O
Control
Logic
I/O
A0 A1
SDA
SCL
V
CC
V
SS
WP
1024K I2C™ Serial EEPROM
24AA1025/24LC1025/24FC1025
DS20001941L-page 2 2005-2013 Microchip Technology Inc.
1.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings(†)
VCC.............................................................................................................................................................................6.5V
All inputs and outputs w.r.t. VSS .......................................................................................................... -0.6V to VCC+1.0V
Storage temperature ...............................................................................................................................-65°C to +150°C
Ambient temperature with power applied................................................................................................-40°C to +125°C
ESD protection on all pins 4kV
TABLE 1-1: DC CHARACTERISTICS
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
DC CHARACTERISTICS Industrial (I): VCC = +1.7V to 5.5V TA = -40°C to +85°C
Automotive (E): VCC = +2.5V to 5.5V TA = -40°C to +125°C
Param.
No. Sym. Characteristic Min. Max. Units Conditions
— A1, A2, SCL, SDA and
WP pins:
———
D1 VIH High-level input voltage 0.7 VCC —V
D2 VIL Low-level input voltage — 0.3 VCC
0.2 VCC
V
V
VCC 2.5V
VCC < 2.5V
D3 VHYS Hysteresis of Schmitt
Trigger inputs
(SDA, SCL pins)
0.05 VCC —VVCC 2.5V (Note)
D4 VOL Low-level output voltage — 0.40 V IOL = 3.0 mA @ VCC = 4.5V
IOL = 2.1 mA @ VCC = 2.5V
D5 ILI Input leakage current — ±1 AVIN = VSS or VCC
VIN = VSS or VCC
D6 ILO Output leakage current — ±1 AVOUT = VSS or VCC
D7 CIN,
COUT
Pin capacitance
(all inputs/outputs)
—10pFVCC = 5.0V (Note)
T
A = 25°C, FCLK = 1 MHz
D8 ICC Read Operating current — 450 AVCC = 5.5V, SCL = 400 kHz
ICC Write — 5 mA VCC = 5.5V
D9 ICCS Standby current — 5
A SCL, SDA, VCC = 5.5V
A1, A2, WP = VSS
Note: This parameter is periodically sampled and not 100% tested.
2005-2013 Microchip Technology Inc. DS20001941L-page 3
24AA1025/24LC1025/24FC1025
TABLE 1-2: AC CHARACTERISTICS
AC CHARACTERISTICS Industrial (I): VCC = +1.7V to 5.5V TA = -40°C to +85°C
Automotive (E): Vcc = +2.5V to 5.5V T
A = -40°C to +125°C
Param.
No. Sym. Characteristic Min. Max. Units Conditions
1F
CLK Clock frequency —
—
—
—
—
100
100
400
400
1000
kHz 1.7V VCC 2.5V
2.5V VCC 4.5V, E-temp
2.5V VCC 5.5V
1.8V VCC 2.5V (24FC1025 only)
2.5V VCC 5.5V (24FC1025 only)
2T
HIGH Clock high time 4000
4000
600
600
500
—
—
—
—
—
ns 1.7V VCC 2.5V
2.5V VCC 4.5V, E-temp
2.5V VCC 5.5V
1.8V VCC 2.5V (24FC1025 only)
2.5V VCC 5.5V (24FC1025 only)
3T
LOW Clock low time 4700
4700
1300
1300
500
—
—
—
—
—
ns 1.7V VCC 2.5V
2.5V VCC 4.5V, E-temp
2.5V VCC 5.5V
1.8V VCC 2.5V (24FC1025 only)
2.5V VCC 5.5V (24FC1025 only)
4T
RSDA and SCL rise time
(Note 1)
—
—
—
—
—
1000
1000
300
300
300
ns 1.7V VCC 2.5V
2.5V VCC 4.5V, E-temp
2.5V VCC 5.5V
1.8V VCC 2.5V (24FC1025 only)
2.5V VCC 5.5V (24FC1025 only)
5T
FSDA and SCL fall time
(Note 1)
—
—
300
100
ns All except 24FC1025
1.8V VCC 5.5V (24FC1025 only)
6T
HD:STA Start condition hold time 4000
4000
600
600
250
—
—
—
—
—
ns 1.7V VCC 2.5V
2.5V VCC 4.5V, E-temp
2.5V VCC 5.5V
1.8V VCC 2.5V (24FC1025 only)
2.5V VCC 5.5V (24FC1025 only)
7T
SU:STA Start condition setup time 4700
4700
600
600
250
—
—
—
—
—
ns 1.7V VCC 2.5V
2.5V VCC 4.5V, E-temp
2.5V VCC 5.5V
1.8V VCC 2.5V (24FC1025 only)
2.5V VCC 5.5V (24FC1025 only)
8T
HD:DAT Data input hold time 0 — ns (Note 2)
9T
SU:DAT Data input setup time 250
250
100
100
100
—
—
—
—
—
ns 1.7V VCC 2.5V
2.5V VCC 4.5V, E-temp
2.5V VCC 5.5V
1.8V VCC 2.5V (24FC1025 only)
2.5V VCC 5.5V (24FC1025 only)
10 TSU:STO Stop condition setup time 4000
4000
600
600
250
—
—
—
—
—
ns 1.7V VCC 2.5V
2.5V VCC 4.5V, E-temp
2.5V VCC 5.5V
1.8V VCC 2.5V (24FC1025 only)
2.5V VCC 5.5V (24FC1025 only)
Note 1: Not 100% tested. CB = total capacitance of one bus line in pF.
2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region (minimum
300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.
3: The combined TSP and VHYS specifications are due to new Schmitt Trigger inputs which provide improved noise spike
suppression. This eliminates the need for a TI specification for standard operation.
4: This parameter is not tested but established by characterization. For endurance estimates in a specific application,
please consult the Total Endurance™ Model which can be obtained from Microchip’s web site at www.microchip.com.
24AA1025/24LC1025/24FC1025
DS20001941L-page 4 2005-2013 Microchip Technology Inc.
FIGURE 1-1: BUS TIMING DATA
11 TSU:WP WP setup time 4000
4000
600
600
600
—
—
—
—
—
ns 1.7V VCC 2.5V
2.5V VCC 4.5V, E-temp
2.5V VCC 5.5V
1.8V VCC 2.5V (24FC1025 only)
2.5V VCC 5.5V (24FC1025 only)
12 THD:WP WP hold time 4700
4700
1300
1300
1300
—
—
—
—
—
ns 1.7V VCC 2.5V
2.5V VCC 4.5V, E-temp
2.5V VCC 5.5V
1.8V VCC 2.5V (24FC1025 only)
2.5V VCC 5.5V (24FC1025 only)
13 TAA Output valid from clock
(Note 2)
—
—
—
—
—
3500
3500
900
900
400
ns 1.7V VCC 2.5V
2.5V VCC 4.5V, E-temp
2.5V VCC 5.5V
1.8V VCC 2.5V (24FC1025 only)
2.5V VCC 5.5V (24FC1025 only)
14 TBUF Bus free time: Time the bus
must be free before a new
transmission can start
4700
4700
1300
1300
500
—
—
—
—
—
ns 1.7V VCC 2.5V
2.5V VCC 4.5V, E-temp
2.5V VCC 5.5V
1.8V VCC 2.5V (24FC1025 only)
2.5V VCC 5.5V (24FC1025 only)
15 TSP Input filter spike suppression
(SDA and SCL pins)
— 50 ns All except 24FC1025 (Note 1 and Note 3)
16 TWC Write cycle time (byte or page) — 5 ms —
17 Endurance 1,000,000 — cycles Page mode, 25°C, VCC = 5.5V (Note 4)
AC CHARACTERISTICS (Continued) Industrial (I): VCC = +1.7V to 5.5V TA = -40°C to +85°C
Automotive (E): Vcc = +2.5V to 5.5V T
A = -40°C to +125°C
Param.
No. Sym. Characteristic Min. Max. Units Conditions
Note 1: Not 100% tested. CB = total capacitance of one bus line in pF.
2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region (minimum
300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.
3: The combined TSP and VHYS specifications are due to new Schmitt Trigger inputs which provide improved noise spike
suppression. This eliminates the need for a TI specification for standard operation.
4: This parameter is not tested but established by characterization. For endurance estimates in a specific application,
please consult the Total Endurance™ Model which can be obtained from Microchip’s web site at www.microchip.com.
(unprotected)
(protected)
SCL
SDA
IN
SDA
OUT
WP
5
7
6
15
3
2
89
13
D3 4
10
11 12
14
2005-2013 Microchip Technology Inc. DS20001941L-page 5
24AA1025/24LC1025/24FC1025
2.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Tab le 2 -1 .
TABLE 2-1: PIN FUNCTION TABLE
2.1 A0, A1 Chip Address Inputs
The A0 and A1 inputs are used by the 24XX1025 for
multiple device operations. The levels on these inputs
are compared with the corresponding bits in the slave
address. The chip is selected if the comparison is true.
Up to four devices may be connected to the same bus
by using different Chip Select bit combinations. In most
applications, the chip address inputs A0 and A1 are
hard-wired to logic ‘0’ or logic ‘1’. For applications in
which these pins are controlled by a microcontroller or
other programmable device, the chip address pins
must be driven to logic ‘0’ or logic ‘1’ before normal
device operation can proceed.
2.2 A2 Chip Address Input
The A2 input is non-configurable Chip Select. This pin
must be tied to VCC in order for this device to operate.
If left floating or tied to VSS, device operation will be
undefined.
2.3 Serial Data (SDA)
This is a bidirectional pin used to transfer addresses
and data into and data out of the device. It is an open-
drain terminal, therefore, the SDA bus requires a pull-
up resistor to VCC (typical 10 k for 100kHz, 2kfor
400 kHz and 1 MHz).
For normal data transfer SDA is allowed to change only
during SCL low. Changes during SCL high are
reserved for indicating the Start and Stop conditions.
2.4 Serial Clock (SCL)
This input is used to synchronize the data transfer from
and to the device.
2.5 Write-Protect (WP)
This pin must be connected to either VSS or VCC. If tied
to VSS, write operations are enabled. If tied to VCC,
write operations are inhibited, but read operations are
not affected.
Name PDIP SOIJ SOIC Function
A0 1 1 1 User Configurable Chip Select
A1 2 2 2 User Configurable Chip Select
A2 3 3 3 Non-Configurable Chip Select.
This pin must be hard-wired to logical 1 state (VCC). Operation will
be undefined with this pin left floating or held to logical 0 (VSS).
VSS 4 4 4 Ground
SDA 5 5 5 Serial Data
SCL 6 6 6 Serial Clock
WP 7 7 7 Write-Protect Input
VCC 8 8 8 +1.7 to 5.5V (24AA1025)
+2.5 to 5.5V (24LC1025)
+1.8 to 5.5V (24FC1025)
24AA1025/24LC1025/24FC1025
DS20001941L-page 6 2005-2013 Microchip Technology Inc.
3.0 FUNCTIONAL DESCRIPTION
The 24XX1025 supports a bidirectional 2-wire bus and
data transmission protocol. A device that sends data
onto the bus is defined as a transmitter and a device
receiving data as a receiver. The bus must be
controlled by a master device which generates the
Serial Clock (SCL), controls the bus access, and
generates the Start and Stop conditions while the
24XX1025 works as a slave. Both master and slave
can operate as a transmitter or receiver, but the master
device determines which mode is activated.
2005-2013 Microchip Technology Inc. DS20001941L-page 7
24AA1025/24LC1025/24FC1025
4.0 BUS CHARACTERISTICS
The following bus protocol has been defined:
• Data transfer may be initiated only when the bus
is not busy.
• During data transfer, the data line must remain
stable whenever the clock line is high. Changes in
the data line while the clock line is high will be
interpreted as a Start or Stop condition.
Accordingly, the following bus conditions have been
defined (Figure 4-1).
4.1 Bus Not Busy (A)
Both data and clock lines remain high.
4.2 Start Data Transfer (B)
A high-to-low transition of the SDA line while the clock
(SCL) is high determines a Start condition. All
commands must be preceded by a Start condition.
4.3 Stop Data Transfer (C)
A low-to-high transition of the SDA line while the clock
(SCL) is high determines a Stop condition. All
operations must end with a Stop condition.
4.4 Data Valid (D)
The state of the data line represents valid data when,
after a Start condition, the data line is stable for the
duration of the high period of the clock signal.
The data on the line must be changed during the low
period of the clock signal. There is one bit of data per
clock pulse.
Each data transfer is initiated with a Start condition and
terminated with a Stop condition. The number of the
data bytes transferred between the Start and Stop
conditions is determined by the master device.
4.5 Acknowledge
Each receiving device, when addressed, is obliged to
generate an Acknowledge signal after the reception of
each byte. The master device must generate an extra
clock pulse which is associated with this Acknowledge
bit.
A device that acknowledges must pull-down the SDA
line during the Acknowledge clock pulse in such a way
that the SDA line is stable low during the high period of
the acknowledge related clock pulse. Of course, setup
and hold times must be taken into account. During
reads, a master must signal an end of data to the slave
by NOT generating an Acknowledge bit on the last byte
that has been clocked out of the slave. In this case, the
slave (24XX1025) will leave the data line high to enable
the master to generate the Stop condition.
FIGURE 4-1: DATA TRANSFER SEQUENCE ON THE SERIAL BUS
FIGURE 4-2: ACKNOWLEDGE TIMING
Note: The 24XX1025 does not generate any
Acknowledge bits if an internal program-
ming cycle is in progress, however, the
control byte that is being polled must
match the control byte used to initiate the
write cycle.
Address or
Acknowledge
Vali d
Data
Allowed
To Change
Stop
Condition
Start
Condition
SCL
SDA
(A) (B) (D) (D) (C) (A)
SCL 987654321123
The transmitter must release the SDA line at this
point allowing the receiver to pull the SDA line low
to acknowledge the previous eight bits of data.
The receiver must release the SDA line at this
point so the transmitter can continue sending
data.
Data from transmitter Data from transmitter
SDA
Acknowledge
Bit
24AA1025/24LC1025/24FC1025
DS20001941L-page 8 2005-2013 Microchip Technology Inc.
5.0 DEVICE ADDRESSING
A control byte is the first byte received following the
Start condition from the master device (Figure 5-1).
The control byte consists of a 4-bit control code; for the
24XX1025, this is set as ‘1010’ binary for read and
write operations. The next bit of the control byte is the
block select bit (B0). This bit acts as the A16 address
bit for accessing the entire array. The next two bits of
the control byte are the Chip Select bits (A1, A0). The
Chip Select bits allow the use of up to four 24XX1025
devices on the same bus and are used to select which
device is accessed. The Chip Select bits in the control
byte must correspond to the logic levels on the
corresponding A1 and A0 pins for the device to
respond. These bits are in effect the two Most
Significant bits (MSb) of the word address.
The last bit of the control byte defines the operation to
be performed. When set to a one, a read operation is
selected, and when set to a zero, a write operation is
selected. The next two bytes received define the
address of the first data byte (Figure 5-2). The upper
address bits are transferred first, followed by the Least
Significant bits (LSb).
Following the Start condition, the 24XX1025 monitors
the SDA bus checking the device type identifier being
transmitted. Upon receiving a ‘1010’ code and
appropriate device select bits, the slave device outputs
an Acknowledge signal on the SDA line. Depending on
the state of the R/W bit, the 24XX1025 will select a read
or write operation.
This device has an internal addressing boundary
limitation that is divided into two segments of 512K bits.
Block select bit ‘B0’ to control access to each segment.
FIGURE 5-1: CONTROL BYTE
FORMAT
5.1 Contiguous Addressing Across
Multiple Devices
The Chip Select bits A1 and A0 can be used to expand
the contiguous address space for up to 4 Mbit by add-
ing up to four 24XX1025’s on the same bus. In this
case, software can use A0 of the control byte as
address bit A17 and A1 as address bit A18. It is not
possible to sequentially read across device boundar-
ies.
Each device has internal addressing boundary
limitations. This divides each part into two segments of
512K bits. The block select bit ‘B0’ controls access to
each “half”.
Sequential read operations are limited to 512K blocks.
To read through four devices on the same bus, eight
random Read commands must be given.
FIGURE 5-2: ADDRESS SEQUENCE BIT ASSIGNMENTS
1010B0 A1 A0SACKR/W
Control Code
Chip
Bits
Slave Address
Acknowledge Bit
Start Bit
Read/Write Bit
Select
Block
Select
Bits
1 010B
0A
1A
0R/W A
11 A
10 A
9A
7A
0
A
8••••••
A
12
Control Byte Address High Byte Address Low Byte
Control
Code
Chip
Select
Bits X = “don’t care” bit
A
13
A
14
Block
Select
Bit
A
15
2005-2013 Microchip Technology Inc. DS20001941L-page 9
24AA1025/24LC1025/24FC1025
6.0 WRITE OPERATIONS
6.1 Byte Write
Following the Start condition from the master, the
control code (four bits), the block select (one bit), the
Chip Select (two bits), and the R/W bit (which is a logic
low) are clocked onto the bus by the master transmitter.
This indicates to the addressed slave receiver that the
address high byte will follow after it has generated an
Acknowledge bit during the ninth clock cycle.
Therefore, the next byte transmitted by the master is
the high-order byte of the word address and will be
written into the Address Pointer of the 24XX1025. The
next byte is the Least Significant Address Byte. After
receiving another Acknowledge signal from the
24XX1025, the master device will transmit the data
word to be written into the addressed memory location.
The 24XX1025 acknowledges again and the master
generates a Stop condition. This initiates the internal
write cycle and during this time, the 24XX1025 will not
generate Acknowledge signals as long as the control
byte being polled matches the control byte that was
used to initiate the write (Figure 6-1). If an attempt is
made to write to the array with the WP pin held high, the
device will acknowledge the command, but no write
cycle will occur, no data will be written and the device
will immediately accept a new command. After a byte
Write command, the internal address counter will point
to the address location following the one that was just
written.
6.2 Page Write
The write control byte, word address and the first data
byte are transmitted to the 24XX1025 in the same way
as in a byte write. But instead of generating a Stop
condition, the master transmits up to 127 additional
bytes, which are temporarily stored in the on-chip page
buffer and will be written into memory after the master
has transmitted a Stop condition. After receipt of each
word, the seven lower Address Pointer bits are
internally incremented by one. If the master should
transmit more than 128 bytes prior to generating the
Stop condition, the address counter will roll over and
the previously received data will be overwritten. As with
the byte write operation, once the Stop condition is
received, an internal write cycle will begin (Figure 6-2).
If an attempt is made to write to the array with the WP
pin held high, the device will acknowledge the
command, but no write cycle will occur, no data will be
written and the device will immediately accept a new
command.
6.3 Write Protection
The WP pin allows the user to write-protect the entire
array (00000-1FFFF) when the pin is tied to VCC. If tied
to VSS the write protection is disabled. The WP pin is
sampled at the Stop bit for every Write command
(Figure 1-1). Toggling the WP pin after the Stop bit will
have no effect on the execution of the write cycle.
Note: When doing a write of less than 128 bytes
the data in the rest of the page is
refreshed along with the data bytes being
written. This will force the entire page to
endure a write cycle, for this reason
endurance is specified per page.
Note: Page write operations are limited to writ-
ing bytes within a single physical page,
regardless of the number of bytes actually
being written. Physical page boundaries
start at addresses that are integer
multiples of the page buffer size (or ‘page
size’) and end at addresses that are
integer multiples of [page size – 1]. If a
Page Write command attempts to write
across a physical page boundary, the
result is that the data wraps around to the
beginning of the current page (overwriting
data previously stored there), instead of
being written to the next page as might be
expected. It is therefore necessary for the
application software to prevent page write
operations that would attempt to cross a
page boundary.
24AA1025/24LC1025/24FC1025
DS20001941L-page 10 2005-2013 Microchip Technology Inc.
FIGURE 6-1: BYTE WRITE
FIGURE 6-2: PAGE WRITE
BUS ACTIVITY
MASTER
SDA LINE
BUS ACTIVITY
S
T
A
R
T
Control
Byte
Address
High Byte
Address
Low Byte Data
S
T
O
P
A
C
K
A
C
K
A
C
K
A
C
K
X = “don’t care” bit
S1010 0
B
0A
1A
0P
BUS ACTIVITY
MASTER
SDA LINE
BUS ACTIVITY
S
T
A
R
T
Control
Byte
Address
High Byte
Address
Low Byte Data Byte 0
S
T
O
P
A
C
K
A
C
K
A
C
K
A
C
K
Data Byte 127
A
C
K
X = “don’t care” bit
S1010 0
B
0A
1A
0P
2005-2013 Microchip Technology Inc. DS20001941L-page 11
24AA1025/24LC1025/24FC1025
7.0 ACKNOWLEDGE POLLING
Since the device will not acknowledge during a write
cycle, this can be used to determine when the cycle is
complete. (This feature can be used to maximize bus
throughput.) Once the Stop condition for a Write
command has been issued from the master, the device
initiates the internally timed write cycle. ACK polling
can be initiated immediately. This involves the master
sending a Start condition, followed by the control byte
for a Write command (R/W = 0). If the device is still
busy with the write cycle, then no ACK will be returned.
If no ACK is returned, then the Start bit and control byte
must be resent. If the cycle is complete, then the device
will return the ACK and the master can then proceed
with the next Read or Write command. See Figure 7-1
for flow diagram.
FIGURE 7-1: ACKNOWLEDGE
POLLING FLOW
Note: Care must be taken when polling the
24XX1025. The control byte that was
used to initiate the write needs to match
the control byte used for polling.
Send
Write Command
Send Stop
Condition to
Initiate Write Cycle
Send Start
Send Control Byte
with R/W = 0
Did Device
Acknowledge
(ACK = 0)?
Next
Operation
No
Yes
24AA1025/24LC1025/24FC1025
DS20001941L-page 12 2005-2013 Microchip Technology Inc.
8.0 READ OPERATION
Read operations are initiated in the same way as write
operations with the exception that the R/W bit of the
control byte is set to one. There are three basic types
of read operations: current address read, random read
and sequential read.
8.1 Current Address Read
The 24XX1025 contains an address counter that
maintains the address of the last word accessed,
internally incremented by one. Therefore, if the
previous read access was to address n (n is any legal
address), the next current address read operation
would access data from address n + 1.
Upon receipt of the control byte with R/W bit set to one,
the 24XX1025 issues an acknowledge and transmits
the 8-bit data word. The master will not acknowledge
the transfer, but does generate a Stop condition and the
24XX1025 discontinues transmission (Figure 8-1).
FIGURE 8-1: CURRENT ADDRESS
READ
8.2 Random Read
Random read operations allow the master to access
any memory location in a random manner. To perform
this type of read operation, first the word address must
be set. This is done by sending the word address to the
24XX1025 as part of a write operation (R/W bit set to
0). After the word address is sent, the master
generates a Start condition following the acknowledge.
This terminates the write operation, but not before the
internal Address Pointer is set. Then, the master issues
the control byte again, but with the R/W bit set to a one.
The 24XX1025 will then issue an acknowledge and
transmit the 8-bit data word. The master will not
acknowledge the transfer, but does generate a Stop
condition which causes the 24XX1025 to discontinue
transmission (Figure 8-2). After a random Read
command, the internal address counter will point to the
address location following the one that was just read.
8.3 Sequential Read
Sequential reads are initiated in the same way as a
random read except that after the 24XX1025 transmits
the first data byte, the master issues an acknowledge
as opposed to the Stop condition used in a random
read. This acknowledge directs the 24XX1025 to
transmit the next sequentially addressed 8-bit word
(Figure 8-3). Following the final byte transmitted to the
master, the master will NOT generate an acknowledge,
but will generate a Stop condition. To provide
sequential reads, the 24XX1025 contains an internal
Address Pointer which is incremented by one at the
completion of each operation. This Address Pointer
allows half the memory contents to be serially read
during one operation. Sequential read address
boundaries are 00000h to 0FFFFh and 10000h to
1FFFFh. The internal Address Pointer will
automatically roll over from address 0FFFFh to
address 00000h if the master acknowledges the byte
received from the array address, 0FFFFh. The internal
address counter will automatically roll over from
address 1FFFFh to address 10000h if the master
acknowledges the byte received from the array
address, 1FFFFh.
BUS ACTIVITY
MASTER
SDA LINE
BUS ACTIVITY
PS
S
T
O
P
Control
Byte
S
T
A
R
T
Data
A
C
K
N
O
A
C
K
1100
BAA1
Byte
010
2005-2013 Microchip Technology Inc. DS20001941L-page 13
24AA1025/24LC1025/24FC1025
FIGURE 8-2: RANDOM READ
FIGURE 8-3: SEQUENTIAL READ
BUS ACTIVITY
MASTER
SDA LINE
BUS ACTIVITY
A
C
K
N
O
A
C
K
A
C
K
A
C
K
A
C
K
S
T
O
P
S
T
A
R
T
Control
Byte
Address
High Byte
Address
Low Byte
Control
Byte
Data
Byte
S
T
A
R
T
S1010BAA0
010 S1010BAA
1
010 P
BUS ACTIVITY
MASTER
SDA LINE
BUS ACTIVITY
Control
Byte Data n Data n + 1 Data n + 2 Data n + X
N
O
A
C
K
A
C
K
A
C
K
A
C
K
A
C
K
S
T
O
P
P
24AA1025/24LC1025/24FC1025
DS20001941L-page 14 2005-2013 Microchip Technology Inc.
9.0 PACKAGING INFORMATION
9.1 Package Marking Information
XXXXXXXX
TXXXXNNN
YYWW
8-Lead PDIP (300 mil) Example:
*Standard marking consists of Microchip part number, year code, week code, traceability code (facility
code, mask rev#, and assembly code). For marking beyond this, certain price adders apply. Please
check with your Microchip Sales Office.
24LC1025
I/P 13F
0928
8-Lead SOIJ (5.28 mm) Example
:
XXXXXXXX
YYWWNNN
TXXXXXXX
24LC1025
0928 13F
I/SM
Legend: XX...X Part number or part number code
T Temperature (I, E)
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code (2 characters for small packages)
Pb-free JEDEC designator for Matte Tin (Sn)
Note: For very small packages with no room for the Pb-free JEDEC designator
, the marking will only appear on the outer carton or reel label.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
3
e
3
e
8-Lead SOIC (3.90 mm) Example
:
XXXXXXXT
NNN
XXXXYYWW
24L1025I
0928
SN
3
e
13F
2005-2013 Microchip Technology Inc. DS20001941L-page 15
24AA1025/24LC1025/24FC1025
N
E1
NOTE 1
D
123
A
A1
A2
L
b1
b
e
E
eB
c
24AA1025/24LC1025/24FC1025
DS20001941L-page 16 2005-2013 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2005-2013 Microchip Technology Inc. DS20001941L-page 17
24AA1025/24LC1025/24FC1025
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
24AA1025/24LC1025/24FC1025
DS20001941L-page 18 2005-2013 Microchip Technology Inc.
! ""#$%& !'
2005-2013 Microchip Technology Inc. DS20001941L-page 19
24AA1025/24LC1025/24FC1025
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
24AA1025/24LC1025/24FC1025
DS20001941L-page 20 2005-2013 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2005-2013 Microchip Technology Inc. DS20001941L-page 21
24AA1025/24LC1025/24FC1025
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
24AA1025/24LC1025/24FC1025
DS20001941L-page 22 2005-2013 Microchip Technology Inc.
APPENDIX A: REVISION HISTORY
Revision A (02/2005)
Original release.
Revision B (09/2005)
Section 1.0 Electrical Characteristics: revised Ambient
Temperature; Revised Table 1-1; Revised Section 2.1
and Section 2.5.
Revision C (04/2006)
Revised Features, Maximum Read Current and Table
1-1, D9; Revised Table 2-1, VCC; Revised Section 6.3.
Revision D (01/2007)
Revised Device Selection Table; Features Section;
Changed 1.8V to 1.7V; Revised Tables 1-1, 1-2, 2-1;
Revised Product ID System; Replaced Package
Drawings.
Revision E (03/2007)
Replaced Package Drawings (Rev. AM).
Revision F (10/2008)
Corrections on the Device Selection Table; Corrections
on the Description; Corrections on the AC Characteris-
tics table; Corrections on the Pin Function Table;
Corrections on the Product ID System; Updated
Package Drawings.
Revision G (01/2010)
Added 8-Lead SOIC Package.
Revision H (01/2011)
Revised PDIP Package Type Diagram; Revised
Section 1.0 Electrical Characteristics; Revised SOIC
Package Marking Information (3.90mm).
Revision J (07/2011)
Revised Table 1-2: AC Characteristics.
Revision K (04/2012)
Revised document title (removed CMOS); Revised
Section 5.1.
Revision L (08/2013)
Features Section: Revised ESD Protection to 4000V.
2005-2013 Microchip Technology Inc. DS20001941L-page 23
24AA1025/24LC1025/24FC1025
THE MICROCHIP WEB SITE
Microchip provides online support via our WWW site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following informa-
tion:
•Product Support – Data sheets and errata, appli-
cation notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
•General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
•Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of Micro-
chip sales offices, distributors and factory repre-
sentatives
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a spec-
ified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com. Under “Support”, click on “Cus-
tomer Change Notification” and follow the registration
instructions.
CUSTOMER SUPPORT
Users of Microchip products can receive assistance
through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support
Customers should contact their distributor, representa-
tive or Field Application Engineer (FAE) for support.
Local sales offices are also available to help custom-
ers. A listing of sales offices and locations is included in
the back of this document.
Technical support is available through the web site
at: http://microchip.com/support
24AA1025/24LC1025/24FC1025
DS20001941L-page 24 2005-2013 Microchip Technology Inc.
NOTES:
2005-2013 Microchip Technology Inc. DS20001941L-page 25
24AA1025/24LC1025/24FC1025
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO. X/XX
PackageTemperature
Range
Device
Device: 24AA1025 = 1024K Bit 1.7V I2C CMOS Serial EEPROM
24AA1025T = 1024K Bit 1.7V I2C CMOS Serial EEPROM
(Tape and Reel)
24LC1025 = 1024K Bit 2.5V I2C CMOS Serial EEPROM
24LC1025T = 1024K Bit 2.5V I2C CMOS Serial EEPROM
(Tape and Reel)
24FC1025 = 1024K Bit 1.8V I2C CMOS Serial EEPROM
24FC1025T = 1024K Bit 1.8V I2C CMOS Serial EEPROM
(Tape and Reel)
Temperature
Range:
I = -40°C to +85°C
E = -40°C to +125°C
Package: P = Plastic DIP (300 mil Body), 8-lead
SM = Plastic SOIJ (5.28 mm Body), 8-lead
SN = Plastic SOIC (3.90 mm Body), 8-lead
Examples:
a) 24AA1025T-I/SM: Tape and Reel, Industrial
Temperature, SOIJ package.
b) 24LC1025-I/P: Industrial Temperature,
PDIP package.
c) 24LC1025-E/SM: Extended Temperature,
SOIJ package.
d) 24LC1025T-I/SM: Tape and Reel, Industrial
Temperature, SOIJ package.
e) 24FC1025-I/SN: Tape and Reel, Industrial
Temperature, SOIC package.
24AA1025/24LC1025/24FC1025
DS20001941L-page 26 2005-2013 Microchip Technology Inc.
NOTES:
2005-2013 Microchip Technology Inc. DS20001941L-page 27
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2005-2013, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620773758
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT S
YSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
DS20001941L-page 28 2005-2013 Microchip Technology Inc.
AMERICAS
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11/29/12
