MRF89XAM9A-I/RM - Microchip Technology

MRF89XAM9A

Data Sheet

915 MHz Ultra Low-Power Sub-GHz

Transceiver Module

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ISBN: 978-1-61341-343-2

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MRF89XAM9A

Features

• Module designed from the MRF89XA Integrated

Ultra Low-Power, Sub-GHz Transceiver IC.

• Supports MiWi™ Development Environment

Proprietary Wireless Networking Protocols

• 4-Wire Serial Peripheral Interface (SPI) with

Interrupts

• Small Size: 0.7" x 1.1" (17.8 mm x 27.9 mm),

Surface Mountable – Pin compatible with

MRF89XAM8A

• Integrated Crystal, Internal Voltage Regulator,

Matching Circuitry and Printed Circuit Board

(PCB) Antenna

• Easy Integration into Final Product – Minimize

Product Development, Quicker Time to Market

• Compatible with Microchip’s Microcontroller

Families (PIC16, PIC18, PIC24, dsPIC33 and

PIC32)

• Modular Device Approval for United States (FCC),

Canada (IC) and Radio Regulation Certified for

Australia/New Zealand (C-TICK)

Operational

• Operating Voltage: 2.1–3.6V (3.3V typical)

• Temperature Range: -40°C to +85°C Industrial

• Low-Current Consumption:

- Rx mode: 3 mA (typical)

- Tx mode: 25 mA at +10 dBm (typical)

- Sleep: 0.1 µA (typical)

RF/Analog Features

• ISM Band 902–928 MHz Operation

• Modulation: FSK and OOK

• Data Rate:

- FSK: 200 kbps

- OOK: 28 kbps

• Reception sensitivity

- FSK: -105 dBm (typical) at 25 kbps

- OOK: -111 dBm (typical) at 2 kbps

• +10 dBm Typical Output Power with 21 dB Tx

Power Control Range

Media Access Controller (MAC)/

Baseband Features

• Packet handling feature with data whitening and

automatic CRC generation

• Incoming sync word (pattern) recognition

• Built-in bit synchronizer for incoming data, and clock

synchronization and recovery

• 64-byte transmit/receive FIFO with preload in Stand-by

mode

• Supports Manchester encoding/decoding

techniques

Pin diagram

VIN

GND

RESET

CSCON

SDO

SDI

SCK

CSDATA

IRQ1

GND

IRQ0

11 GND

915 MHz Ultra Low-Power Sub-GHz Transceiver Module

MRF89XAM9A

Table of Contents

1.0 Device Overview .......................................................................................................................................................................... 3

2.0 Circuit Description ........................................................................................................................................................................ 9

3.0 Regulatory Approval................................................................................................................................................................... 17

4.0 Electrical Characteristics ............................................................................................................................................................ 21

Appendix A: Revision History............................................................................................................................................................... 27

The Microchip Web Site ....................................................................................................................................................................... 29

Customer Change Notification Service ................................................................................................................................................ 29

Customer Support ................................................................................................................................................................................ 29

Reader Response ................................................................................................................................................................................ 30

Product Identification System............................................................................................................................................................... 31

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Customer Notific at ion Syst em

MRF89XAM9A

1.0 DEVICE OVERVIEW

The MRF89XAM9A is an ultra low-power sub-GHz

surface mount transceiver module with integrated

crystal, internal voltage regulator, matching circuitry

and PCB antenna. The MRF89XAM9A module

operates in the United States/Canada 902–928 MHz

ISM frequency band. The integrated module design

frees the integrator from extensive RF and antenna

design, and regulatory compliance testing, allowing

quicker time to market.

The MRF89XAM9A module is compatible with

Microchip’s MiWi™ Development Environment software

stacks. The software stacks are available as a free

download, including source code, from the Microchip’s

web site http://www.microchip.com/wireless.

The MRF89XAM9A module has received regulatory

approvals for modular devices in the United States

(FCC) and Canada (IC). Modular device approval

removes the need for expensive RF and antenna

design, and allows the user to place the MRF89XAM9A

module inside a finished product and not require

regulatory testing for an intentional radiator (RF

transmitter). To maintain conformance, refer to module

settings in Section 3.1.1, MRF89XAM9A SETTINGS

for the United States and Section 3.2.1, MRF89XAM9A

SETTINGS for Canada.

1.1 Interface description

The simplified block diagram of the MRF89XAM9A

module is shown in Figure 1-1. The module is based on

the Microchip Technology MRF89XA Ultra Low-Power

Sub-GHz Transceiver Integrated Circuit (IC). The

module interfaces to many popular Microchip PIC®

microcontrollers through a 3-wire serial SPI interface,

two chip selects (configuration and data), two interrupts

Interrupt Request 0 (IRQ0) and Interrupt Request 1

(IRQ1), Reset, Power and Ground as shown in

Figure 1-2. Table 1-1 provides the pin descriptions.

Data communication and module configuration are

documented in the “MRF89XA Ultra Low-Power,

Integrated Sub-GHz Transceiver” (DS70622) Data

Sheet. For more information on specific serial interface

protocol and general register definitions, refer to the

“MRF89XA Data Sheet” and see Section 1.3,

Operation for specific register settings unique to the

MRF89XAM9A module operation to maintain

regulatory compliance.

FIGURE 1-1: MRF89XAM9A BLOCK DIAGRAM

MRF89XA

Control

Interface

Power

Management

BasebandRF

MRF89XAM9A Module

SPI Digital I/O

IRQ0

Power

12.8 MHz Crystal

Matching

Circuitry

and

SAW Filter

PCB

Antenna

Loop

Filter

VCO

Tank

IRQ1

CSDATA

CSCON

RESET

MRF89XAM9A

TABLE 1-1: PIN DESCRIPTION

FIGURE 1-2: MICROCONTROLLER TO MRF89XAM9A INTERFACE

Pin Symbol Type Description

1 GND Power Ground

2 RESET DI Reset Pin. For more information, refer to Section 1.3.1, Reset

3CSCON DI Serial Interface Configure Chip Select

4 IRQ0 DO Interrupt Request Output

5 SDI DI Serial Interface Data Input

6 SCK DI Serial Interface Clock

7 SDO DO Serial Interface Data Output

8CSDATA DI Serial Interface Data Chip Select

9 IRQ1 DO Interrupt Request Output

10 Vin Power Power Supply

11 GND Power Ground

12 GND Power Ground

PIC® Microcontroller

I/O

SDO

SDI

SCK

INTx

I/O

MRF89XAM9A

CSCON

CSDATA

SDI

SDO

SCK

IRQ0

IRQ1

RESET

VIN

GND

MRF89XAM9A

1.2 Mounting Details

The MRF89XAM9A is a surface mountable module.

The dimensions of the module are shown in

Figure 1-3. The module PCB is 0.032" thick with

castellated mounting holes on the edge. Figure 1-4 is

the recommended host PCB footprint for the

MRF89XAM9A.

The MRF89XAM9A has an integrated PCB antenna.

For the best performance, follow the mounting details

shown in Figure 1-5. It is recommended that the

module be mounted on the edge of the host PCB and

an area around the antenna, approximately 3.4" (8.6

cm), be kept clear of metal objects for best

performance. A host PCB ground plane around the

MRF89XAM9A acts as a counterpoise to the PCB

antenna. It is recommended to extend the ground plane

at least 0.4" (1 cm) around the module.

FIGURE 1-3: MODULE DETAILS

FIGURE 1-4: RECOMMENDED PCB FOOTPRINT

MRF89XAM9A

FIGURE 1-5: MOUNTING DETAILS

3.4”

0.4”

Edge of PCB

0.470”

Keep area around the antenna,

approximately 3.4” (6.8 cm), be

kept clear of metallic objects for

best performance.

Host PCB top copper ground plane

(antenna counterpoise): Extend the

host PCB top copper ground plane

under and to the left and right side

of the module at least 0.4 inches (1

cm) for best antenna performance.

MRF89XAM9A

1.3 Operation

The MRF89XAM9A module is based on the

Microchip’s MRF89XA Ultra Low-Power, Integrated

ISM Band Sub-GHz Transceiver IC. Data

communication and module configuration are

documented in the “MRF89XA Ultra Low-Power,

Integrated ISM Band Sub-GHz Transceiver Data

Sheet” (DS70622).

This section emphasizes operational settings that are

unique to the MRF89XAM9A module design that must

be followed for proper operation.

1.3.1 RESET

Pin 2 of the module, RESET, allows an external reset of

the MRF89XA IC. RESET is connected to the TEST8

pin of the MRF89XA IC. During normal operations of

the MRF89XAM9A, the RESET pin should be held in a

high impedance state. For more information on

assertion of the RESET pin, refer to “Section 3.1.2

Manual Reset” in the “MRF89XA Data Sheet”

(DS70622).

1.3.2 CRYSTAL FREQUENCY

When calculating frequency deviation, bit rate, receiver

bandwidth, and PLL R, P and S values, use crystal

frequency fxtal = 12.8 MHz.

1.3.3 CLOCK OUTPUT (CLKOUT)

The CLKOUT pin 19 of the MRF89XA IC is not used on

the module. Ensure that the CLKOUT signal is disabled

to minimize current consumption.

1.3.4 FREQUENCY BAND SELECT

The Frequency Band Select (FBS<1:0>) bits in the

GCONREG<4:3> should be set for target channel

range 902–915 MHz FBS<1:0> = '00' or 915–928 MHz

FBS<1:0> = '01'.

1.3.5 VCO TANK TRIM VALUE

The VCO Trim (VCOT<1:0>) bits in the

GCONREG<2:1> should be set for VCOT<1:0> = '01'

for the inductor values of the module.

1.3.6 BIT RATE

The maximum bit rate value will be limited to 28 kbps

for OOK modulation due to the crystal frequency of

12.8 MHz.

MRF89XAM9A

NOTES:

MRF89XAM9A

2.0 CIRCUIT DESCRIPTION

The MRF89XAM9A module interfaces to Microchip’s

PIC16, PIC18, PIC24, dsPIC33 and PIC32

microcontrollers with a minimum of external

components through digital only connections. An

example application schematic is shown in Figure 2-2.

2.1 Module Schematic

The MRF89XAM9A module is based on the

Microchip’s MRF89XA Ultra Low-Power, Integrated

ISM Band Sub-GHz Transceiver IC. The serial I/O

(CSCON, CSDATA, SCK, SDO and SDI), RESET,

IRQ0 and IRQ1 pins are routed out and available on

the module pins as shown in Figure 2-2. Crystal X1 is

a 12.8 MHz crystal with a frequency tolerance of ±10

ppm at 25°C. The RFIO output is matched to the SAW

filter FL1 and further matched to the PCB trace

antenna.

Figure 2-2 illustrates the MRF89XAM9A schematics.

Table 2-1 details the Bill of Materials (BOM).

FIGURE 2-1: MRF89XAM9A APPLICATION SCHEMATIC

Note 1

+C2

1 0

0.1

To Host

Microcontroller

To Host

Microcontroller

MRF89XAM9A-I/RM

+ 3.3V

GND

RESET

CSCON

IRQ0

SDI

SCK

GND

IRQ1

CSDATA

SDO

Note: For battery powered applications, place a 10 μF capacitor in parallel with the 0.1 μF bypass

capacitor to provide a low impedance during startup sequences.

MRF89XAM9A

FIGURE 2-2: MRF89XAM9A SCHEMATIC

Note: Designators not used: C6, L5

MRF89XAM9A

TABLE 2-1: MRF89XAM9A BILL OF MATERIALS

Desi

gnat

or Value Description Manufacturer Part Number

C1 0.047 µF Capacitor, Ceramic, 10V, ±10%, X7R, SMT

0402

Murata GRM155R71A473KA01D

C2 0.22 µF Capacitor, Ceramic, 16V, ±10%, X7R, SMT

0402

Murata GRM155R71C224KA12D

C3 1 µF Capacitor, Ceramic, 6.3V, ±10%, X5R, SMT

0603

Murata GRM188R60J105KA01D

C4 30 pF Capacitor, Ceramic, 50V, ±5%, UHI-Q NP0,

SMT 0402

Johanson Technology 250R07S300JV4T

C5 1.8 pF Capacitor, Ceramic, 50V, ±0.1 pF, UHI-Q

NP0, SMT 0402

Johanson Technology 500R07S1R8BV4

C6 — Designator not used — —

C7 33 pF Capacitor, Ceramic, 50V, ±5%, C0G, SMT

0402

Murata GRM1555C1H330JZ01D

C8 0.1 µF Capacitor, Ceramic, 16V, ±10%, X7R, SMT

0402

Murata GRM155R71C104KA88D

C9 680 pF Capacitor, Ceramic, 50V, ±5%, C0G, SMT

0402

Murata GRM1555C1H681JA01D

C10 0.01 µF Capacitor, Ceramic, 16V, ±10%, X7R, SMT

0402

Murata GRM155R71C103KA01D

C11 1.0 pF Capacitor, Ceramic, 50V, ±0.1 pF, UHI-Q

NP0, SMT 0402

Johanson Technology 500R07S1R0BV4

C12 0.9 pF Capacitor, Ceramic, 50V, ±0.1 pF, UHI-Q

NP0, SMT 0402

Johanson Technology 500R07S0R9BV4

FL1 TA0281A Filter, SAW, 902–928 MHz Tai-saw Technology TA0281A

L1 10 nH Inductor, Ceramic, ±5%, SMT 0402 Johanson Technology L-07C10NJV6T

L2 100 nH Inductor, Ceramic, ±5%, SMT 0402 Johanson Technology L-07CR10JV6T

L3 5.6 nH Inductor, Wirewound, ±5%, SMT 0402 Johanson Technology L-07W5N6JV4T

L4 5.6 nH Inductor, Wirewound, ±5%, SMT 0402 Johanson Technology L-07W5N6JV4T

L5 — Designator not used — —

L6 10 nH Inductor, Ceramic, ±5%, SMT 0402 Johanson Technology L-07C10NJV6T

R1 1ΩResistor, 1%, ±100 ppm/0C, SMT 0402 Vishay/Dale CRCW04021R00FKED

R2 100KΩResistor, 5%, ±100 ppm/0C, SMT 0402 Yageo RC0402JR-07100KL

R3 6.8KΩResistor, 1%, ±100 ppm/0C, SMT 0402 Yageo RC0402FR-076K8L

U1 MRF89XA Transceiver, Ultra Low-Power, Integrated

Sub-GHz

Microchip Technology MRF89XA-I/MQ

X1 12.8 MHz Crystal, ±10 ppm, 15 pF, ESR 100 ohms,

SMT 5 x 3.2mm

Abracon ABM3B-155-12.800MHz-T

MRF89XAM9A

2.2 Printed Circuit Board

The MRF89XAM9A module PCB is constructed with

high temperature FR4 material that is four layers and

0.032 inches thick. The layers are shown in Figure 2-3

through Figure 2-8. The PCB layer stack up is shown in

Figure 2-9

FIGURE 2-3: TOP SILK SCREEN

FIGURE 2-4: TOP COPPER

FIGURE 2-5: LAYER 2 — GROUND

PLANE

FIGURE 2-6: LAYER 3 — POWER

PLANE

MRF89XAM9A

FIGURE 2-7: BOTTOM COPPER FIGURE 2-8: BOTTOM SILK SCREEN

FIGURE 2-9: PCB LAYER STACK UP

Top Copper

Ground Plane

Power Plane

Bottom Copper

1/2 oz. Copper

8 mil FR4

12 mil FR4

8 mil FR4

0.032”

±0.005”

MRF89XAM9A

2.3 PCB Antenna

The PCB antenna is fabricated on the top copper trace.

Figure 2-10 shows the PCB antenna dimensions. The

layers below the antenna have no copper traces. The

ground and power planes under the components serve

as a counterpoise to the PCB antenna. Additional

ground plane on the host PCB will substantially

enhance the performance of the module. For best

performance, place the module on the host PCB by

following the recommendations in Section 1.2,

Mounting Details.

The PCB antenna was designed and simulated using

Ansoft Designer® and HFSS™ 3D full-wave solver

software by ANSYS, Inc. (www.ansoft.com). The goal

of the design was to create a compact, low-cost

antenna with the best radiation pattern. Figure 2-11

shows the PCB antenna simulation drawing and

Figure 2-12 and Figure 2-13 show the simulated 2D

and 3D radiation patterns. As shown by the radiation

patterns, the performance of the antenna is dependant

upon the orientation of the module. Figure 2-14 shows

the impedance simulation and Figure 2-15 shows the

actual impedance measurement. The discrete

matching circuitry matches the impedance of the

antenna with the SAW filter and MRF89XA transceiver

IC.

FIGURE 2-10: PCB ANTENNA

DIMENSIONS

FIGURE 2-11: PCB ANTENNA SIMULATION DRAWING

16.8mm 1.0mm

8.4mm

1.1mm

0.5mm

2.5mm

MRF89XAM9A

FIGURE 2-12: SIMULATED 2D RADIATION PATTERN

FIGURE 2-13: SIMULATED 3D RADIATION PATTERN

MRF89XAM9A

FIGURE 2-14: SIMULATED PCB ANTENNA IMPEDANCE

FIGURE 2-15: MEASURED ANTENNA IMPEDANCE (915 MHZ BAND)

MRF89XAM9A

3.0 REGULATORY APPROVAL

The MRF89XAM9A module has received regulatory

approvals for modular devices in the United States and

Canada. Modular device approval allows the end user

to place the MRF89XAM9A module inside a finished

product and not require regulatory testing for an

intentional radiator (RF transmitter), provided no

changes or modifications are made to the module

circuitry. Changes or modifications could void the

user’s authority to operate the equipment. The end

user must comply with all of the instructions provided

by the Grantee, which indicate installation and/or

operating conditions necessary for compliance.

The integrator is still responsible for testing the end

product for any additional compliance requirements

required with this module installed (digital device

emission, PC peripheral requirements, etc.) in the

specific country that the end device will be marketed.

For more information on regulatory compliance, refer to

the specific country radio regulations in the following

sections.

3.1 United States

The MRF89XAM9A has received Federal

Communications Commission (FCC) CFR47

Telecommunications, Part 15 Subpart C “Intentional

Radiators” 15.247 and 15.249 and modular approval in

accordance with Part 15.212 Modular Transmitter

approval. The MRF89XAM9A module can be

integrated into a finished product without obtaining

subsequent and separate FCC certification.

The MRF89XAM9A module has been labeled with its

own FCC ID number, and if the FCC ID is not visible

when the module is installed inside another device,

then the outside of the finished product into which the

module is installed must also display a label referring

to the enclosed module. This exterior label can use

wording as following:

Requirements for product labeling are given in Part

15.19 Labelling Requirements.

The user’s manual should include the following

statement:

3.1.1 MRF89XAM9A SETTINGS

To meet the FCC requirements, the following settings

must be observed by the integrator:

3.1.1.1 FSK Modulation

The following settings configure the MRF89XAM9A for

wideband digital modulation techniques that conform to

the requirements of Part 15.247. These settings allow

higher radio frequency (RF) output power and greater

link budget:

• Bit Rate Setting: 50 - 200 kbps

- Transmit Power Maximum Setting: 13 dBm

• Bit Rate Setting: 2 - 40 kbps

- Transmit Power Maximum Setting: 7 dBm

• Frequency Deviation Setting: 200 kHz

• Data Whitening: On

• Lower Frequency Setting: 902.800 MHz

• Upper Frequency Setting: 926.500 MHz

Contains Transmitter Module FCC ID:

OA3MRF89XAM9A

-or-

Contains FCC ID: OA3MRF89XAM9A

This device complies with Part 15 of the FCC Rules.

Operation is subject to the following two conditions:

(1) this device may not cause harmful interference,

and (2) this device must accept any interference

received, including interference that may cause

undesired operation.

This equipment has been tested and found to comply

with the limits for a Class B digital device, pursuant to

part 15 of the FCC Rules. These limits are designed to

provide reasonable protection against harmful

interference in a residential installation. This

equipment generates, uses and can radiate radio

frequency energy, and if not installed and used in

accordance with the instructions, may cause harmful

interference to radio communications. However, there

is no guarantee that interference will not occur in a

particular installation. If this equipment does cause

harmful interference to radio or television reception,

which can be determined by turning the equipment

OFF and ON, the user is encouraged to try to correct

the interference by one or more of the following

measures:

• Reorient or relocate the receiving antenna.

• Increase the separation between the equipment

and receiver.

• Connect the equipment into an outlet on a

circuit different from that to which the receiver is

connected.

• Consult the dealer or an experienced radio/TV

technician for help.

MRF89XAM9A

3.1.1.2 OOK Modulation

The following settings configure the MRF89XAM9A for

narrowband operation that conform to the requirements

of the part 15.249. The part 15.249 requires a much

lower power setting than it is allowed in the part 15.247.

These settings are good for applications that require

lower transmit power current consumption and shorter

transmit distances:

• Transmit Power Maximum Setting: 1 dBm

• Bit Rate Maximum Setting: 28 kbps

• Frequency Deviation Setting: 200 kHz

• Lower Frequency Setting: 902.330 MHz

• Upper Frequency Setting: 927.500 MHz

3.1.2 RF EXPOSURE

All transmitters regulated by FCC must comply with RF

exposure requirements. OET Bulletin 65 “Evaluating

Compliance with FCC Guidelines for Human Exposure

to Radio Frequency Electromagnetic Fields” provides

assistance in determining whether proposed or existing

transmitting facilities, operations or devices comply

with limits for human exposure to RF fields adopted by

the Federal Communications Commission (FCC). The

bulletin offers guidelines and suggestions for

evaluating compliance.

If appropriate, compliance with exposure guidelines for

mobile and unlicensed devices can be accomplished

by using warning labels and by providing informations

concerning minimum separation distances from

transmitting structures and proper installation of

antennas.

The following statement must be included as a

CAUTION statement in manuals and OEM products to

alert users of FCC RF Exposure compliance:

If the MRF89XAM9A module is used in a portable

application (antenna is less than 20 cm from persons

during operation), the integrator is responsible for

performing Specific Absorption Rate (SAR) testing in

accordance with FCC rules 2.1091.

3.1.3 HELPFUL WEB SITES

Federal Communications Commission (FCC) http://

www.fcc.gov

To satisfy FCC RF Exposure requirements for mobile

and base station transmission devices, a separation

distance of 20 cm or more should be maintained

between the antenna of this device and persons

during operation. To ensure compliance, operation at

closer than this distance is not recommended.

The antenna(s) used for this transmitter must not be

co-located or operating in conjunction with any other

antenna or transmitter.

MRF89XAM9A

3.2 Canada

The MRF89XAM9A module has been certified for use in

Canada under Industry Canada (IC) Radio Standards

Specification (RSS) RSS-210 and RSS-Gen. Modular

approval permits the installation of a module in a host

device without the need to recertify the device.

Labeling Requirements for the Host Device (from

Section 3.2.1, RSS-Gen, Issue 3, December 2010):

The host device must be labeled to identify the module

within the host device.

The Industry Canada certification label of a module

shall be clearly visible at all times when installed in the

host device, otherwise the host device must be labeled

to display the Industry Canada certification number of

the module, preceded by the words “Contains

transmitter module”, or the word “Contains”, or similar

wording expressing the same meaning, as follows:

User Manual Notice for License-Exempt Radio

Apparatus (from Section 7.1.3 RSS-Gen, Issue 3,

December 2010):

User manuals for license-exempt radio apparatus must

contain the following or equivalent notice in a

conspicuous location in the user manual or

alternatively on the device or both.

3.2.1 MRF89XAM9A SETTINGS

To meet Industry Canada (IC) requirements, the

following settings must be observed by the integrator:

3.2.1.1 FSK Modulation

The following settings configure the MRF89XAM9A for

wideband digital modulation techniques that conform to

the requirements of RSS-210 Issue 8, Annex 8. These

settings allow higher radio frequency (RF) output

power and greater link budget.

• Bit Rate Setting: 50–200 kbps

- Transmit Power Maximum Setting: 13 dBm

• Bit Rate Setting: 2–40 kbps

- Transmit Power Maximum Setting: 7 dBm

• Frequency Deviation Setting: 200 kHz

• Data Whitening: On

• Lower Frequency Setting: 902.800 MHz

• Upper Frequency Setting: 926.500 MHz

3.2.1.2 OOK Modulation

The following settings configure the MRF89XAM9A for

narrowband operation that conform to the requirements

of RSS-Gen Issue 3. RSS-Gen Issue 3 requires a

much lower power setting than is allowed in Part RSS-

210 Issue 8 Annex 8. These settings are good for

applications that require lower transmit power current

consumption and shorter transmit distances.

• Transmit Power Maximum Setting: 1 dBm

• Bit Rate Maximum Setting: 28 kbps

• Frequency Deviation Setting: 200 kHz

• Lower Frequency Setting: 902.330 MHz

• Upper Frequency Setting: 927.500 MHz

3.2.2 HELPFUL WEB SITES

Industry Canada: http://www.ic.gc.ca/

Contains transmitter module IC: 7693A-89XAM9A

This device complies with Industry Canada license-

exempt RSS standard(s). Operation is subject to the

following two conditions: (1) this device may not

cause interference, and (2) this device must accept

any interference, including interference that may

cause undesired operation of the device.

Le présent appareil est conforme aux CNR

d'Industrie Canada applicables aux appareils radio

exempts de licence. L'exploitation est autorisée aux

deux conditions suivantes: (1) l'appareil ne doit pas

produire de brouillage, et (2) l'utilisateur de l'appareil

doit accepter tout brouillage radioélectrique subi,

même si le brouillage est susceptible d'en

compromettre le fonctionnement.

MRF89XAM9A

NOTES:

MRF89XAM9A

4.0 ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings

Ambient temperature under bias.............................................................................................................. -40°C to +85°C

Storage temperature .............................................................................................................................. -55°C to +125°C

Voltage on VIN with respect to VSS ................................................................................................................ -0.3V to 6V

Voltage on any combined digital and analog pin with respect to VSS (except VIN) ...........................-0.3V to (VIN + 0.3V)

Input current into pin (except VIN and VSS)........................................................................................... -25 mA to 25 mA

NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the

device. This is a stress rating only and functional operation of the device at those or any other conditions above

those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for

extended periods may affect device reliability.

MRF89XAM9A

TABLE 4-1: RECOMMENDED OPERATING CONDITIONS

TABLE 4-2: CURRENT CONSUMPTION

TABLE 4-3: DIGITAL I/O PIN INPUT SPECIFICATIONS(1)

Parameter Min Typ Max Unit Condition

Ambient Operating Temperature -40 — +85 °C —

Supply Voltage for RF, Analog and Digital Circuits 2.1 — 3.6 V —

Supply Voltage for Digital I/O 2.1 — 3.6 V —

Input High Voltage (VIH) 0.5 * VIN —VIN + 0.3 V —

Input Low Voltage (VIL) -0.3V — 0.2 * VIN V—

AC Peak Voltage on Open Collector Outputs (IO)(1) VIN – 1.5 — VIN + 1.5 V —

Note 1: At minimum, VIN – 1.5V should not be lower than 1.8V.

Symbol Chip Mode Min Typ Max Unit Condition

IDDSL Sleep — 0.1 2 µA Sleep clock disabled, all blocks

disabled

IDDST Idle — 65 80 µA Oscillator and baseband enabled

IDDFS Frequency Synthesizer — 1.3 1.7 mA Frequency synthesizer running

IDDTX Tx —

—

Output power = +10 dBm

Output power = +1 dBm(1)

IDDRX Rx — 3.0 3.5 mA —

Note 1: Guaranteed by design and characterization.

Symbol Characteristic Min Typ Max Unit Condition

VIL Input Low Voltage — — 0.2 * VIN V—

VIH Input High Voltage 0.8 * VIN ——V —

IIL Input Low Leakage Current(2) -0.5 — 0.5 µA VIL = 0V

IIH Input High Leakage Current -0.5 — 0.5 µA VIH = VIN, VIN = 3.7

VOL Digital Low Output Voltage — — 0.1 * VIN —IOL = 1 mA

VOH Digital Low Output 0.9 * VIN ——V IOH = -1 mA

Note 1: Measurement Conditions: TA = 25°C, VIN = 3.3V, Crystal Frequency = 12.8 MHz, unless otherwise

specified.

2: Negative current is defined as the current sourced by the pin.

MRF89XAM9A

TABLE 4-4: PLL PARAMETERS AC CHARACTERISTICS(1)

Symbol Parameter Min Typ Max Unit Condition

FRO Frequency Ranges 902 — 928 MHz —

BRFSK Bit Rate (FSK) 2 — 200 kbps NRZ

BROOK Bit Rate (OOK) 1.56 — 28 kbps NRZ

FDFSK Frequency Deviation (FSK) 33 — 200 kHz —

FXTAL Crystal Oscillator Frequency — 12.8 — MHz —

FSSTP Frequency Synthesizer Step — 2 — kHz Variable, depending on the

frequency

TSOSC Oscillator Wake-up Time — 1.5 5 ms From Sleep mode(1)

TSFS Frequency Synthesizer Wake-

up Time; at most, 10 kHz

away from the target

— 500 800 µs From Stand-by mode

TSHOP Frequency Synthesizer Hop

Time; at most, 10 kHz away

from the target

— 180 — µs 200 kHz step

— 200 — µs 1 MHz step

— 250 — µs 5 MHz step

— 260 — µs 7 MHz step

— 290 — µs 12 MHz step

— 320 — µs 20 MHz step

— 340 — µs 27 MHz step

Note 1: Guaranteed by design and characterization.

MRF89XAM9A

TABLE 4-5: RECEIVER AC CHARACTERISTICS(1)

Symbol Parameter Min Typ Max Unit Condition

RSF Sensitivity (FSK) — -105 — dBm 915 MHz, BR = 25 kbps,

fdev = 50 kHz, fc = 100 kHz

— -101 — dBm 915 MHz, BR = 66.7 kbps,

fdev = 100 kHz, fc = 200 kHz

RSO Sensitivity (OOK) — -111 — dBm 915 MHz, 2 kbps NRZ

fc – fo = 50 kHz, fo = 50 kHz

— -105 — dBm 915 MHz, 16.7 kbps NRZ

fc – fo = 100 kHz, fo = 100 kHz

CCR Co-Channel Rejection — -12 — dBc Modulation as wanted signal

ACR Adjacent Channel Rejection — 27 — dB Offset = 300 kHz, unwanted tone is

not modulated

— 52 — dB Offset = 600 kHz, unwanted tone is

not modulated

— 57 — dB Offset = 1.2 MHz, unwanted tone is

not modulated

BI Blocking Immunity — -48 — dBm Offset = 1 MHz, unmodulated

— -37 — dBm Offset = 2 MHz, unmodulated, no

SAW

— -33 — dBm Offset = 10 MHz, unmodulated, no

SAW

RXBWF Receiver Bandwidth in FSK

Mode(2) 50 — 250 kHz Single side BW, Polyphase Off

RXBWU Receiver Bandwidth in OOK

Mode(2) 50 — 400 kHz Single side BW, Polyphase On

ITP3 Input Third Order Intercept

Point

— -28 — dBm Interferers at 1 MHz and 1.950 MHz

offset

TSRWF Receiver Wake-up Time — 280 500 µs From FS to Rx ready

TSRWS Receiver Wake-up Time — 600 900 µs From Stand-by to Rx ready

TSRHOP Receiver Hop Time from Rx

Ready to Rx Ready with a

Frequency Hop

— 400 — µs 200 kHz step

— 400 — µs 1 MHz step

— 460 — µs 5 MHz step

— 480 — µs 7 MHz step

— 520 — µs 12 MHz step

— 550 — µs 20 MHz step

— 600 — µs 27 MHz step

RSSIST RSSI Sampling Time — — 1/fdev s From Rx ready

RSSTDR RSSI Dynamic Range — 70 — dB Ranging from sensitivity

Note 1: Guaranteed by design and characterization.

2: This reflects the whole receiver bandwidth, as described by conditions for active and passive filters.

MRF89XAM9A

TABLE 4-6: TR ANSMITTER AC CHAR ACTERISTICS (1)

4.1 Timing Specification and Diagram

TABLE 4-7: SPI TIMING SPECIFICATION(1,2)

Symbol Description Min Typ Max Unit Condition

RFOP RF Output Power, Programmable

with 8 Steps of typ. 3 dB

— +12.5 — dBm Maximum power setting

— -8.5 — dBm Minimum power setting

PN Phase Noise — -112 — dBc/Hz Measured with a 600 kHz

offset at the transmitter output

TXSP Transmitted Spurious — — -47 dBc At any offset between 200 kHz

and 600 kHz, unmodulated

carrier, fdev = 50 kHz

Tx2 Second Harmonic

——-40dBm

No modulation, see Note(2)

Tx3 Third Harmonic

Tx4 Fourth Harmonic

Txn Harmonics above Tx4

FSKDEV FSK Deviation ±33 ±55 ±200 kHz Programmable

TSTWF Transmitter Wake-up Time — 120 500 µs From FS to Tx ready

TSTWS Transmitter Wake-up Time — 600 900 µs From Stand-by to Tx ready

Note 1: Guaranteed by design and characterization.

2: Transmitter in-circuit performance with SAW filter and crystal.

Parameter Min Typ Max Unit Condition

SPI Configure Clock Frequency — — 6 MHz —

SPI Data Clock Frequency — — 1 MHz —

Data Hold and Setup Time 2 — — µs —

SDI Setup Time for SPI Configure 250 — — ns —

SDI Setup Time for SPI Data 312 — — ns —

CSCON Low to SCK Rising Edge;

SCK Falling Edge to CSCON High

500 — — ns —

CSDATA Low to SCK Rising Edge;

SCK Falling Edge to CSDATA High

625 — — ns —

CSCON Rising to Falling Edge 500 — — ns —

CSDATA Rising to Falling Edge 625 — — ns —

Note 1: Typical Values: TA = 25°C, VIN = 3.3V, Crystal Frequency = 12.8 MHz, unless otherwise specified.

2: Negative current is defined as the current sourced by the pin.

MRF89XAM9A

NOTES:

MRF89XAM9A

APPENDIX A: REVISION HISTORY

Revision A (July 2011)

This is the Initial release of the document.

MRF89XAM9A

NOTES:

MRF89XAM9A

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MRF89XAM9A

READER RESPONSE

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DS75017AMRF89XAM9A

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MRF89XAM9A

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, for example, on pricing or delivery, refer to the factory or the listed sales office.

Device MRF89XAM9A-I/RM: Ultra Low-Power, Integrated ISM Band Sub-GHz

Transceiver module

Temperature

Range

I = -40ºC to +85ºC (Industrial)

Example:

a) MRF89XAM9A-I/RM: Industrial temperature

tray.

b) MRF89XAM9AT-I/RM: Industrial temperature

tape and reel,

PART NO

Device

Module

Type

Tape and

Reel

-X

Temperature

Range

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