Sample & Buy Product Folder Support & Community Tools & Software Technical Documents SN74LVTH16373-EP SCBS778B - NOVEMBER 2003 - REVISED JUNE 2016 SN74LVTH16373-EP 3.3-V ABT 16-Bit Transparent D-Type Latch With Tri-State Outputs 1 Features 2 Applications * * * * 1 * * * * * * * * * * * * * * Controlled Baseline - One Assembly/Test Site, One Fabrication Site Enhanced Diminishing Manufacturing Sources (DMS) Support Enhanced Product-Change Notification Qualification Pedigree (1) Member of the Texas Instruments WidebusTM Family State-of-the-Art Advanced BiCMOS Technology (ABT) Design for 3.3-V Operation and Low StaticPower Dissipation Supports Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC) Supports Unregulated Battery Operation Down to 2.7 V Typical VOLP (Output Ground Bounce) < 0.8 V at VCC = 3.3 V, TA = 25C Ioff and Power-Up Tri-State Support Hot Insertion Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors Distributed VCC and GND Pins Minimize HighSpeed Switching Noise Flow-Through Architecture Optimizes PCB Layout Latch-Up Performance Exceeds 500 mA Per JESD 17 ESD Protection Exceeds JESD 22 - 4000-V Human Body Model (A114-A) - 200-V Machine Model (A115-A) Data Buffer Bus Driver Display Driver 3 Description The SN74LVTH16373 is a 16-bit transparent D-type latch with tri-state outputs designed for low-voltage (3.3 V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment. This device is particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers. This device can be used as two 8-bit latches or one 16-bit latch. When the latchenable (LE) input is high, the Q outputs follow the data (D) inputs. When LE is taken low, the Q outputs are latched at the levels set up at the D inputs. Device Information(2) PART NUMBER PACKAGE SN74LVTH16373-EP BODY SIZE (NOM) TSSOP (48) 12.50 mm x 6.10 mm SSOP (48) 15.88 mm x 7.49 mm BGA MICROSTAR JUNIOR (56) 4.50 mm x 7.00 mm (1) Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits. (2) For all available packages, see the orderable addendum at the end of the data sheet. SN74LVTH16373-EP Single Channel Block Diagram 1OE 1LE 1 48 C1 1D1 47 2 1Q1 1D To Seven Other Channels 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. SN74LVTH16373-EP SCBS778B - NOVEMBER 2003 - REVISED JUNE 2016 www.ti.com Table of Contents 1 2 3 4 5 6 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 6.1 6.2 6.3 6.4 6.5 6.6 6.7 6.8 6.9 6.10 7 8 1 1 1 2 3 4 Absolute Maximum Ratings ...................................... 4 ESD Ratings.............................................................. 4 Recommended Operating Conditions....................... 5 Thermal Information .................................................. 5 Electrical Characteristics........................................... 6 Timing Requirements (I Version) .............................. 7 Switching Characteristics (I Version) ........................ 7 Timing Requirements (M Version) ............................ 8 Switching Characteristics (M Version) ...................... 8 Typical Characteristics .......................................... 10 Parameter Measurement Information ................ 11 Detailed Description ............................................ 12 8.1 8.2 8.3 8.4 9 Overview ................................................................. Functional Block Diagram ....................................... Feature Description................................................. Device Functional Modes........................................ 12 12 12 12 Application and Implementation ........................ 13 9.1 Application Information............................................ 13 9.2 Typical Application .................................................. 13 10 Power Supply Recommendations ..................... 15 11 Layout................................................................... 15 11.1 Layout Guidelines ................................................. 15 11.2 Layout Example .................................................... 15 12 Device and Documentation Support ................. 16 12.1 12.2 12.3 12.4 12.5 Receiving Notification of Documentation Updates Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 16 16 16 16 16 13 Mechanical, Packaging, and Orderable Information ........................................................... 16 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision A (March 2004) to Revision B Page * Added Pin Functions table, ESD Ratings table, Thermal Information table, Typical Characteristics section, Detailed Description section, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section ...... 1 * Corrected table notes for Absolute Maximum Ratings table .................................................................................................. 4 * Added new device temperature range to Recommended Operating Conditions table .......................................................... 5 * Added new device specifications in Timing Requirements (M Version) and Switching Characteristics (M Version) tables.. 8 * Added Figure 1 to Specifications section ............................................................................................................................... 9 2 Submit Documentation Feedback Copyright (c) 2003-2016, Texas Instruments Incorporated Product Folder Links: SN74LVTH16373-EP SN74LVTH16373-EP www.ti.com SCBS778B - NOVEMBER 2003 - REVISED JUNE 2016 5 Pin Configuration and Functions DGG or DL Package 48-Pin TSSOP or SSOP Top View 1OE 1Q1 1Q2 GND 1Q3 1Q4 VCC 1Q5 1Q6 GND 1Q7 1Q8 2Q1 2Q2 GND 2Q3 2Q4 VCC 2Q5 2Q6 GND 2Q7 2Q8 2OE 1 48 2 47 3 46 4 45 5 44 6 43 7 42 8 41 9 40 10 39 11 38 12 37 13 36 14 35 15 34 16 33 17 32 18 31 19 30 20 29 21 28 22 27 23 26 24 25 GQL Package 56-Pin BGA MICROSTAR JUNIOR Top View 1 1LE 1D1 1D2 GND 1D3 1D4 VCC 1D5 1D6 GND 1D7 1D8 2D1 2D2 GND 2D3 2D4 VCC 2D5 2D6 GND 2D7 2D8 2LE 2 3 4 5 6 A B C D E F G H J K Table 1. Pin Assignments (1) 1 2 3 4 5 6 A 1OE NC NC NC NC 1LE B 1Q2 1Q1 GND GND 1D1 1D2 C 1Q4 1Q3 VCC VCC 1D3 1D4 D 1Q6 1Q5 GND GND 1D5 1D6 E 1Q8 1Q7 1D7 1D8 F 2Q1 2Q2 2D2 2D1 G 2Q3 2Q4 GND GND 2D4 2D3 H 2Q5 2Q6 VCC VCC 2D6 2D5 J 2Q7 2Q8 GND GND 2D8 2D7 K 2OE NC NC NC NC 2LE (1) NC - No internal connection. Copyright (c) 2003-2016, Texas Instruments Incorporated Product Folder Links: SN74LVTH16373-EP Submit Documentation Feedback 3 SN74LVTH16373-EP SCBS778B - NOVEMBER 2003 - REVISED JUNE 2016 www.ti.com Pin Functions PIN NAME 1Dn (1) I/O NO. DESCRIPTION 37, 38, 49, 41, 43, 44, 46, 47 I Data input pins 48 I Latch enable pin to control 1Qn output states 1LE 1OE 1 I Active low enable pin for 1Qn pins 1Qn (1) 2, 3, 5, 6, 8, 9, 11, 12 O Output pins 2Dn (1) 26, 27, 29, 30, 32, 33, 35, 36 I Data input pins 25 I Latch enable pin to control 2Qn output states 2LE 2Qn (1) 13, 14, 16, 17, 19, 20, 22, 23 O Output pins 2OE 24 I Active low enable pin for 2Qn pins GND 4, 10, 15, 21, 28, 34, 39, 45 -- VCC 7, 18, 31, 42 I (1) Ground Power supply input for internal circuits "n" denotes numbering (1 to 8) for data input and output pins. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VCC Supply voltage -0.5 4.6 V VI Input voltage (2) -0.5 7 V VO Voltage applied to any output in the high-impedance or power-off state (2) -0.5 7 V -0.5 (2) VO Voltage applied to any output in the high state VCC + 0.5 V V IO Current into any output in the low state 128 mA IO Current into any output in the high state (3) 64 mA IIK Input clamp current (VI < 0) -50 IOK Output clamp current (VO < 0) -50 Tstg Storage temperature -65 (1) (2) (3) mA mA 150 C Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. This current flows only when the output is in the high state and VO > VCC. 6.2 ESD Ratings V(ESD) Electrostatic discharge VALUE UNIT Human body model (HBM), per A114-A 4000 V Charged device model (CDM), per JEDEC specification JESD22-C101 (1) 3000 V 200 V Machine model (MM), per A115-A (1) 4 JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Submit Documentation Feedback Copyright (c) 2003-2016, Texas Instruments Incorporated Product Folder Links: SN74LVTH16373-EP SN74LVTH16373-EP www.ti.com SCBS778B - NOVEMBER 2003 - REVISED JUNE 2016 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) (1) MIN MAX 2.7 3.6 UNIT VCC Supply voltage VIH High-level input voltage VIL Low-level input voltage 0.8 V VI Input voltage 5.5 V IOH High-level output current -32 mA IOL Low-level output current 64 mA t/v Input transition rise or fall rate, outputs enabled 10 ns/V t/VCC Power-up ramp rate TA (1) V 2 V 200 Operating ambient temperature s/V I version -40 85 C M version -55 125 C All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, SCBA004. 6.4 Thermal Information SN74LVTH16373-EP THERMAL METRIC (1) (2) DGG (TSSOP) DL (SSOP) GQL (BGA MICROSTAR JUNIOR) 48 PINS 48 PINS 56 PINS UNIT RJA Junction-to-ambient thermal resistance 68.9 60.3 62.5 C/W RJC(top) Junction-to-case (top) thermal resistance 14.6 31 24.7 C/W RJB Junction-to-board thermal resistance 35.8 32.1 28.9 C/W JT Junction-to-top characterization parameter 2.4 9.3 0.9 C/W JB Junction-to-board characterization parameter 35.5 31.8 28 C/W (1) (2) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. The package thermal impedance is calculated in accordance with JESD 51-7. Copyright (c) 2003-2016, Texas Instruments Incorporated Product Folder Links: SN74LVTH16373-EP Submit Documentation Feedback 5 SN74LVTH16373-EP SCBS778B - NOVEMBER 2003 - REVISED JUNE 2016 www.ti.com 6.5 Electrical Characteristics over operating free-air temperature range (unless otherwise noted); all typical values are at VCC = 3.3 V, TA = 25C PARAMETER VIK VOH TEST CONDITIONS VCC = 2.7 V, II = -18 mA VCC = 2.7 V to 3.6 V, IOH = -100 A VCC = 2.7 V, IOH = -8 mA VCC = 3 V, IOH = -32 mA VCC = 2.7 V VOL VCC = 3 V, VCC = 0 or 3.6 V, Control inputs VCC = 3.6 V, II Data inputs Ioff Data inputs TYP VCC = 3.6 V -1.2 V V V 2 V IOL = 100 A 0.2 V IOL = 24 mA 0.5 V IOL = 16 mA 0.4 V IOL = 32 mA 0.5 V IOL = 64 mA 0.55 V VI = 5.5 V 10 A VI = VCC or GND 1 A 1 A -5 A 100 A VI or VO = 0 to 4.5 V VI = 0.8 V 75 VI = 2 V VCC = 3.6 V (1), VI = 0 to 3.6 V IOZH VCC = 3.6 V, VO = 3 V IOZL VCC = 3.6 V, VO = 0.5 V IOZPU IOZPD A -75 A 650 A 5 A -5 A VCC = 0 to 1.5 V, VO = 0.5 to 3 V, OE = don't care 100 A VCC = 1.5 V to 0, VO = 0.5 to 3 V, OE = don't care 100 A 0.19 mA Outputs high VCC = 3.6 V, IO = 0, VI = VCC or GND ICC UNIT 2.4 VI = 0 VCC = 3 V MAX VCC - 0.2 VI = VCC VCC = 0, II(hold) MIN Outputs low Outputs disabled 5 mA 0.19 mA 0.2 mA ICC (2) VCC = 3 to 3.6 V, One input at VCC - 0.6 V, Other inputs at VCC or GND Ci VI = 3 V or 0 3 pF Co VO = 3 V or 0 9 pF (1) (2) 6 This is the bus-hold maximum dynamic current. It is the minimum overdrive current required to switch the input from one state to another. This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND. Submit Documentation Feedback Copyright (c) 2003-2016, Texas Instruments Incorporated Product Folder Links: SN74LVTH16373-EP SN74LVTH16373-EP www.ti.com SCBS778B - NOVEMBER 2003 - REVISED JUNE 2016 6.6 Timing Requirements (I Version) over recommended operating conditions (unless otherwise noted); TA = -40C to 85C MIN tw Pulse duration, LE high tsu Setup time, data before LE th Hold time, data after LE MAX UNIT VCC = 3.3 V 0.3 V 3 ns VCC = 2.7 V 3 ns VCC = 3.3 V 0.3 V 1 ns 0.6 ns 1 ns 1.1 ns VCC = 2.7 V VCC = 3.3 V 0.3 V VCC = 2.7 V 6.7 Switching Characteristics (I Version) over recommended operating conditions (unless otherwise noted); TA = -40C to 85C; all typical values are at VCC = 3.3 V, TA = 25C PARAMETER tPLH tPHL FROM (INPUT) TO (OUTPUT) D Q D LE Q tPHL LE Q tPZH tPZL tPHZ tPLZ OE OE OE OE VCC = 3.3 V 0.3 V MIN TYP MAX 1.5 2.7 3.8 ns 4.2 ns VCC = 2.7 V VCC = 3.3 V 0.3 V Q tPLH TEST CONDITIONS 1.5 2.5 3.6 ns 4 ns 2.1 3 4.3 ns 4.8 ns 4 ns 4 ns 4.3 ns 5.1 ns 4.3 ns 4.7 ns 5 ns 5.4 ns 4.7 ns 4.8 ns VCC = 2.7 V VCC = 3.3 V 0.3 V VCC = 2.7 V VCC = 3.3 V 0.3 V 2.1 2.9 VCC = 2.7 V VCC = 3.3 V 0.3 V Q 1.5 2.8 1.5 2.8 VCC = 2.7 V VCC = 3.3 V 0.3 V Q VCC = 2.7 V VCC = 3.3 V 0.3 V Q 2.4 3.5 2 3.2 VCC = 2.7 V VCC = 3.3 V 0.3 V Q VCC = 2.7 V tsk(o) VCC = 3.3 V 0.3 V Copyright (c) 2003-2016, Texas Instruments Incorporated Product Folder Links: SN74LVTH16373-EP UNIT 0.5 ns Submit Documentation Feedback 7 SN74LVTH16373-EP SCBS778B - NOVEMBER 2003 - REVISED JUNE 2016 www.ti.com 6.8 Timing Requirements (M Version) over recommended operating conditions (unless otherwise noted); TA = -55C to 125C MIN tw Pulse duration, LE high tsu Setup time, data before LE th Hold time, data after LE MAX UNIT VCC = 3.3 V 0.3 V 3 ns VCC = 2.7 V 3 ns 1.6 ns 1 ns VCC = 3.3 V 0.3 V 1.4 ns VCC = 2.7 V 1.5 ns VCC = 3.3 V 0.3 V VCC = 2.7 V 6.9 Switching Characteristics (M Version) over recommended operating conditions (unless otherwise noted); TA = -55C to 125C; all typical values are at VCC = 3.3 V, TA = 25C PARAMETER tPLH tPHL FROM (INPUT) TO (OUTPUT) D Q D Q tPLH LE Q tPHL LE Q tPZH tPZL tPHZ tPLZ OE OE OE OE tsk(o) 8 Q Q Q Q TEST CONDITIONS VCC = 3.3 V 0.3 V TYP 1.5 2.7 VCC = 2.7 V VCC = 3.3 V 0.3 V 1.5 2.5 2.1 3 VCC = 2.7 V VCC = 3.3 V 0.3 V VCC = 2.7 V VCC = 3.3 V 0.3 V 2.1 2.9 VCC = 2.7 V VCC = 3.3 V 0.3 V 1.5 2.8 1.5 2.8 VCC = 2.7 V VCC = 3.3 V 0.3 V VCC = 2.7 V VCC = 3.3 V 0.3 V 1.8 3.5 2 3.2 VCC = 2.7 V VCC = 3.3 V 0.3 V VCC = 2.7 V VCC = 3.3 V 0.3 V Submit Documentation Feedback MIN 0.5 MAX UNIT 5 ns 5.5 ns 4.8 ns 5.3 ns 5.4 ns 5.9 ns 4.9 ns 4.9 ns 7 ns 7.9 ns 6.2 ns 7.2 ns 7.2 ns 7.9 ns 5.2 ns 5.4 ns ns Copyright (c) 2003-2016, Texas Instruments Incorporated Product Folder Links: SN74LVTH16373-EP SN74LVTH16373-EP www.ti.com SCBS778B - NOVEMBER 2003 - REVISED JUNE 2016 1M Electromigration Failure Mode Estimated Life (hours) 100k 10k 1k 100 80 90 100 110 120 Continuous Junction Temperature, TJ (qC) 130 140 150 D004 (1) See data sheet for absolute maximum and minimum recommended operating conditions. (2) Silicon operating life design goal is 10 years at 105C junction temperature (does not include package interconnect life). (3) Enhanced plastic product disclaimer applies. Figure 1. Derating Chart for SN74LVTH16373-EP Copyright (c) 2003-2016, Texas Instruments Incorporated Product Folder Links: SN74LVTH16373-EP Submit Documentation Feedback 9 SN74LVTH16373-EP SCBS778B - NOVEMBER 2003 - REVISED JUNE 2016 www.ti.com 6.10 Typical Characteristics 4 0.45 3.5 0.4 3 0.35 0.3 VOL (V) VOH (V) 2.5 2 1.5 0.25 VOL, VCC = 2.7 V @ 100 PA VOL, VCC = 2.7 V @ 24 mA VOL, VCC = 3 V @ 16 mA VOL, VCC = 3 V @ 32 mA VOL, VCC = 3 V @ 64 mA 0.2 0.15 1 VOH, VCC = 3.6 V @ -100 PA VOH, VCC = 2.7 V @ -100 PA VOH, VCC = 2.7 V @ -8 mA VOH, VCC = 3 V @ -32 mA 0.5 0.1 0.05 0 0 -55 -40 -20 0 25 40 80 Junction Temperature (C) 100 125 -55 -40 D001 Figure 2. VOH vs Temperature 10 Submit Documentation Feedback -20 0 25 40 80 Junction Temperature (C) 100 125 D002 Figure 3. VOL vs Temperature Copyright (c) 2003-2016, Texas Instruments Incorporated Product Folder Links: SN74LVTH16373-EP SN74LVTH16373-EP www.ti.com SCBS778B - NOVEMBER 2003 - REVISED JUNE 2016 7 Parameter Measurement Information 6V 500 From Output Under Test S1 GND CL = 50 pF (see Note A) TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open 6V GND Open 500 2.7 V 1.5 V Timing Input LOAD CIRCUIT 0V tw tsu 2.7 V Input 1.5 V 1.5 V th 2.7 V 1.5 V Data Input 1.5 V 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES 2.7 V 1.5 V Input 1.5 V 0V tPLH tPHL VOH 1.5 V Output 1.5 V VOL tPHL 1.5 V VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS 1.5 V 1.5 V 0V tPLZ tPZL 3V 1.5 V VOL + 0.3 V VOL tPHZ tPZH VOH Output Output Waveform 1 S1 at 6 V (see Note B) tPLH 1.5 V 2.7 V Output Control Output Waveform 2 S1 at GND (see Note B) 1.5 V VOH - 0.3 V VOH 0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 , tr 2.5 ns, tf 2.5 ns. D. The outputs are measured one at a time, with one transition per measurement. Figure 4. Load Circuit and Voltage Waveforms Copyright (c) 2003-2016, Texas Instruments Incorporated Product Folder Links: SN74LVTH16373-EP Submit Documentation Feedback 11 SN74LVTH16373-EP SCBS778B - NOVEMBER 2003 - REVISED JUNE 2016 www.ti.com 8 Detailed Description 8.1 Overview The SN74LVTH16373 is a 16-bit transparent D-type latch with tri-state outputs designed for low-voltage (3.3-V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment. This device is particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers. This device can be used as two 8-bit latches or one 16-bit latch. When the latchenable (LE) input is high, the Q outputs follow the data (D) inputs. When LE is taken low, the Q outputs are latched at the levels set up at the D inputs. A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high impedance state and the increased drive provide the capability to drive bus lines without interface or pullup components. OE does not affect internal operations of the latch. Old data can be retained or new data can be entered while the outputs are in the high-impedance state. 8.2 Functional Block Diagram 1OE 1LE 1 48 47 25 2LE C1 1D1 24 2OE C1 2 1Q1 1D 36 2D1 13 1D 2Q1 To Seven Other Channels To Seven Other Channels Figure 5. Logic Diagram (Positive Logic) Figure 6. Logic Diagram (Positive Logic) 8.3 Feature Description The SN74LVTH16373 included active bus-hold circuitry that holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended. Additionally, it features power up three state that will keep the outputs in high-impedance state during power up or power down when VCC is between 0 and 1.5 V. This prevents driver conflict during power up. To ensure the high-impedance state above 1.5 V, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. This device is fully specified for hot-insertion applications using Ioff and power-up tri-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. Table 2. Function Table (Each 8-Bit Section) INPUTS OE LE D OUTPUT Q L H H H L H L L L L X Q0 H X X Z 8.4 Device Functional Modes Device functions as tristatable 8 or 16-bit latch per function table defined in Table 2. 12 Submit Documentation Feedback Copyright (c) 2003-2016, Texas Instruments Incorporated Product Folder Links: SN74LVTH16373-EP SN74LVTH16373-EP www.ti.com SCBS778B - NOVEMBER 2003 - REVISED JUNE 2016 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI's customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 9.1 Application Information The specially designed 3-V LVTH family uses the 0.8- BiCMOS process technology for bus-interface functions. Like its 5-V ABT counterpart, LVHT provides up to 64 mA of drive, low propagation delays. The bus-hold feature eliminates requirements for external pullup resistors and I/Os that can handle up to 7 V, which allows them to act as 5-V/3-V translators. 9.2 Typical Application 3.3 V or 5 V 3.3 V 3.3 V or 5 V VCC . . . uC or System Logic 3.3-V CMOS or TTL 1OE 1LE 1D1 1D8 . . . 2OE 2LE 2D1 2D8 1Q1 . . . uC, System Logic, or LEDs 3.3-V CMOS or TTL 1Q8 2Q1 . . . 2Q8 GND Figure 7. Application Diagram 9.2.1 Design Requirements The SN54LVTH16373 utilizes BiCMOS technology with high-drive currents. Care must be taken to avoid bus contention that can disrupt system functionality and/or cause violation of absolute maximum ratings. 9.2.2 Detailed Design Procedure * * Recommended input conditions - Rise time and fall time specifications. See t/V in Recommended Operating Conditions. - Specified high and low levels. See VIH and VIL in Recommended Operating Conditions. - Inputs are overvoltage tolerant, which allows them to go as high as 5.5 V independent of VCC. Recommend output conditions - Avoid buss contention. - Do not exceed IOH and IOL current limits in Recommended Operating Conditions. - Outputs that are being driven high may not be pulled above VCC by more they 0.5 V. Copyright (c) 2003-2016, Texas Instruments Incorporated Product Folder Links: SN74LVTH16373-EP Submit Documentation Feedback 13 SN74LVTH16373-EP SCBS778B - NOVEMBER 2003 - REVISED JUNE 2016 www.ti.com Typical Application (continued) 9.2.3 Application Curves 3.5 3 ICC (mA) 2.5 2 ICC @ Outputs High ICC @ Outputs Low ICC @ Outputs Disabled 1.5 1 0.5 0 -55 -40 -20 0 25 40 80 Junction Temperature (C) 100 125 D003 Figure 8. ICC vs Temperature 14 Submit Documentation Feedback Copyright (c) 2003-2016, Texas Instruments Incorporated Product Folder Links: SN74LVTH16373-EP SN74LVTH16373-EP www.ti.com SCBS778B - NOVEMBER 2003 - REVISED JUNE 2016 10 Power Supply Recommendations The power supply can be any voltage between the MIN and MAX supply voltage rating located in the Recommended Operating Conditions table. Each VCC pin should have a good bypass capacitor to prevent power disturbance. For devices with a single supply, 0.1 F is recommended. If there are multiple VCC pins, 0.01 F or 0.022 F is recommended for each power pin. It is acceptable to parallel multiple bypass caps to reject different frequencies of noise. A 0.1 F and 1 F are commonly used in parallel. The bypass capacitor should be installed as close to the power pin as possible for best results. 11 Layout 11.1 Layout Guidelines When using multiple bit logic devices, inputs should not float. In many cases, functions or parts of functions of digital logic devices are unused. Some examples are when only two inputs of a triple-input AND gate are used, or when only 3 of the 4-buffer gates are used. Such input pins should not be left unconnected because the undefined voltages at the outside connections result in undefined operational states. Specified in Figure 9 are rules that must be observed under all circumstances. All unused inputs of digital logic devices must be connected to a high or low bias to prevent them from floating. The logic level that should be applied to any particular unused input depends on the function of the device. Generally they will be tied to GND or VCC, whichever makes more sense or is more convenient. It is acceptable to float outputs unless the part is a transceiver. If the transceiver has an output enable pin, it will disable the outputs section of the part when asserted. This will not disable the input section of the I/Os so they also cannot float when disabled. 11.2 Layout Example Vcc Input Unused Input Output Unused Input Output Input Figure 9. Layout Diagram Copyright (c) 2003-2016, Texas Instruments Incorporated Product Folder Links: SN74LVTH16373-EP Submit Documentation Feedback 15 SN74LVTH16373-EP SCBS778B - NOVEMBER 2003 - REVISED JUNE 2016 www.ti.com 12 Device and Documentation Support 12.1 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 12.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2ETM Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 12.3 Trademarks Widebus, E2E are trademarks of Texas Instruments. All other trademarks are the property of their respective owners. 12.4 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 12.5 Glossary SLYZ022 -- TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 16 Submit Documentation Feedback Copyright (c) 2003-2016, Texas Instruments Incorporated Product Folder Links: SN74LVTH16373-EP PACKAGE OPTION ADDENDUM www.ti.com 5-Oct-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) CLVTH16373IDGGREP ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 LH16373EP CLVTH16373IDLREP ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 LH16373EP CLVTH16373MGQLREP ACTIVE BGA MICROSTAR JUNIOR GQL 56 2000 TBD SNPB Level-1-235C-UNLIM -55 to 125 H16373MEP V62/04712-01XE ACTIVE TSSOP DGG 48 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 LH16373EP V62/04712-01YE ACTIVE SSOP DL 48 1000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 LH16373EP V62/04712-02ZA ACTIVE BGA MICROSTAR JUNIOR GQL 56 2000 TBD SNPB Level-1-235C-UNLIM -55 to 125 H16373MEP (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 5-Oct-2016 (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN74LVTH16373-EP : * Catalog: SN74LVTH16373 * Military: SN54LVTH16373 NOTE: Qualified Version Definitions: * Catalog - TI's standard catalog product * Military - QML certified for Military and Defense Applications Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2017 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing CLVTH16373IDGGREP TSSOP CLVTH16373IDLREP SSOP CLVTH16373MGQLREP BGA MI CROSTA R JUNI OR SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DGG 48 2000 330.0 24.4 8.6 13.0 1.8 12.0 24.0 Q1 DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1 GQL 56 2000 330.0 16.4 4.8 7.3 1.5 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 11-Mar-2017 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CLVTH16373IDGGREP TSSOP DGG 48 2000 367.0 367.0 45.0 CLVTH16373IDLREP SSOP DL 48 1000 367.0 367.0 55.0 GQL 56 2000 336.6 336.6 28.6 CLVTH16373MGQLREP BGA MICROSTAR JUNIOR Pack Materials-Page 2 MECHANICAL DATA MTSS003D - JANUARY 1995 - REVISED JANUARY 1998 DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE 48 PINS SHOWN 0,27 0,17 0,50 48 0,08 M 25 6,20 6,00 8,30 7,90 0,15 NOM Gage Plane 1 0,25 24 0- 8 A 0,75 0,50 Seating Plane 0,15 0,05 1,20 MAX PINS ** 0,10 48 56 64 A MAX 12,60 14,10 17,10 A MIN 12,40 13,90 16,90 DIM 4040078 / F 12/97 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold protrusion not to exceed 0,15. Falls within JEDEC MO-153 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 PACKAGE OUTLINE GQL0056A JRBGA - 1 mm max height SCALE 2.100 PLASTIC BALL GRID ARRAY 4.6 4.4 B A BALL A1 CORNER 7.1 6.9 1 MAX C SEATING PLANE 0.35 TYP 0.15 BALL TYP 0.1 C 3.25 TYP (0.625) TYP SYMM K (0.575) TYP J H G 5.85 TYP SYMM F E D C 56X NOTE 3 B A 0.65 TYP BALL A1 CORNER 1 2 3 4 5 0.45 0.35 0.15 0.08 C B A C 6 0.65 TYP 4219710/A 03/2017 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. No metal in this area, indicates orientation. 4. This package is tin-lead (SnPb). www.ti.com EXAMPLE BOARD LAYOUT GQL0056A JRBGA - 1 mm max height PLASTIC BALL GRID ARRAY (0.65) TYP 56X ( 0.33) 2 1 3 4 5 6 A (0.65) TYP B C D E SYMM F G H J K SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:15X SOLDER MASK OPENING 0.05 MAX METAL UNDER SOLDER MASK 0.05 MIN EXPOSED METAL ( 0.33) METAL ( 0.33) SOLDER MASK OPENING EXPOSED METAL SOLDER MASK DEFINED NON-SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DETAILS NOT TO SCALE 4219710/A 03/2017 NOTES: (continued) 5. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. For information, see Texas Instruments literature number SPRAA99 (www.ti.com/lit/spraa99). www.ti.com EXAMPLE STENCIL DESIGN GQL0056A JRBGA - 1 mm max height PLASTIC BALL GRID ARRAY 56X ( 0.33) (0.65) TYP 1 2 3 4 5 6 A (0.65) TYP B C D E SYMM F G H J K SYMM SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:15X 4219710/A 03/2017 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. TI's published terms of sale for semiconductor products (http://www.ti.com/sc/docs/stdterms.htm) apply to the sale of packaged integrated circuit products that TI has qualified and released to market. Additional terms may apply to the use or sale of other types of TI products and services. Reproduction of significant portions of TI information in TI data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such reproduced documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyers and others who are developing systems that incorporate TI products (collectively, "Designers") understand and agree that Designers remain responsible for using their independent analysis, evaluation and judgment in designing their applications and that Designers have full and exclusive responsibility to assure the safety of Designers' applications and compliance of their applications (and of all TI products used in or for Designers' applications) with all applicable regulations, laws and other applicable requirements. Designer represents that, with respect to their applications, Designer has all the necessary expertise to create and implement safeguards that (1) anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and take appropriate actions. Designer agrees that prior to using or distributing any applications that include TI products, Designer will thoroughly test such applications and the functionality of such TI products as used in such applications. TI's provision of technical, application or other design advice, quality characterization, reliability data or other services or information, including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, "TI Resources") are intended to assist designers who are developing applications that incorporate TI products; by downloading, accessing or using TI Resources in any way, Designer (individually or, if Designer is acting on behalf of a company, Designer's company) agrees to use any particular TI Resource solely for this purpose and subject to the terms of this Notice. TI's provision of TI Resources does not expand or otherwise alter TI's applicable published warranties or warranty disclaimers for TI products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections, enhancements, improvements and other changes to its TI Resources. TI has not conducted any testing other than that specifically described in the published documentation for a particular TI Resource. Designer is authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. TI RESOURCES ARE PROVIDED "AS IS" AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM, INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949 and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements. Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use. Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S. TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product). Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications and that proper product selection is at Designers' own risk. Designers are solely responsible for compliance with all legal and regulatory requirements in connection with such selection. Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer's noncompliance with the terms and provisions of this Notice. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2017, Texas Instruments Incorporated Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Texas Instruments: CLVTH16373IDGGREP CLVTH16373IDLREP V62/04712-01XE V62/04712-01YE CLVTH16373MGQLREP