1. Product profile
1.1 General description
General-purpose Zener diode in a SOD323F (SC-90) very small and flat lead
Surface-Mounted Device (SMD) plastic package.
1.2 Features
nNon-repetitive peak reverse power dissipation: ≤60 W
nSmall plastic package suitable for surface-mounted design
1.3 Applications
nGeneral regulation functions
nOvervoltage protection for ElectroLuminescent (EL) driver circuits
nAEC-Q101 qualified
1.4 Quick reference data
[1] tp= 100 µs; square wave; Tj=25°C prior to surge
2. Pinning information
[1] The marking bar indicates the cathode.
BZX100A
Single Zener diode
Rev. 01 — 30 May 2007 Product data sheet
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
VZworking voltage IZ= 1 mA 95 - 105 V
IZSM non-repetitive peak reverse
current [1] - - 0.5 A
Table 2. Pinning
Pin Description Simplified outline Symbol
1 cathode [1]
2 anode 21
006aaa152
2
1
BZX100A_1 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 01 — 30 May 2007 2 of 10
NXP Semiconductors BZX100A
Single Zener diode
3. Ordering information
4. Marking
5. Limiting values
[1] tp= 100 µs; square wave; Tj=25°C prior to surge
[2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[4] Device mounted on a ceramic PCB, Al2O3, standard footprint.
Table 3. Ordering information
Type number Package
Name Description Version
BZX100A SC-90 plastic surface-mounted package; 2 leads SOD323F
Table 4. Marking codes
Type number Marking code
BZX100A AS
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
IFforward current - 0.2 A
IZSM non-repetitive peak reverse
current [1] - 0.5 A
PZSM non-repetitive peak reverse
power dissipation [1] -60W
Ptot total power dissipation Tamb ≤25 °C[2] - 310 mW
[3] - 550 mW
[4] -1 W
Tjjunction temperature - 150 °C
Tamb ambient temperature −65 +150 °C
Tstg storage temperature −65 +150 °C
BZX100A_1 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 01 — 30 May 2007 3 of 10
NXP Semiconductors BZX100A
Single Zener diode
6. Thermal characteristics
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[3] Device mounted on a ceramic PCB, Al2O3, standard footprint.
[4] Soldering point of cathode tab.
(1) Ceramic PCB, Al2O3, standard footprint
(2) FR4 PCB, mounting pad for cathode 1 cm2
(3) FR4 PCB, standard footprint
Fig 1. Power derating curves
Tamb (°C)
−75 17512525 75−25
006aab047
0.4
0.8
1.2
Ptot
(W)
0
(1)
(2)
(3)
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
Rth(j-a) thermal resistance from
junction to ambient in free air [1] - - 400 K/W
[2] - - 230 K/W
[3] - - 125 K/W
Rth(j-sp) thermal resistance from
junction to solder point [4] --55K/W
BZX100A_1 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 01 — 30 May 2007 4 of 10
NXP Semiconductors BZX100A
Single Zener diode
7. Characteristics
[1] Pulse test: tp≤300 µs; δ≤0.02.
Table 7. Characteristics
T
j
=25
°
C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
VFforward voltage [1]
IF= 10 mA - - 0.9 V
IF= 100 mA - - 1.1 V
VZworking voltage IZ= 1 mA 95 - 105 V
rdif differential resistance IZ= 1 mA - - 700 Ω
IRreverse current VR= 76 V - - 0.2 µA
SZtemperature coefficient IZ= 1 mA - 138 - mV/K
Cddiode capacitance f = 1 MHz;
VR=0V --70pF
Tj=25°C (prior to surge) Tj=25°C
Fig 2. Non-repetitive peak reverse power dissipation
as a function of pulse duration; maximum
values
Fig 3. Forward current as a function of forward
voltage; typical values
tp (s)
10−510−2
10−3
10−4
006aab048
102
10
103
PZSM
(W)
1
VF (V)
0.6 1.00.90.7 0.8
006aab049
100
200
300
IF
(mA)
0
BZX100A_1 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 01 — 30 May 2007 5 of 10
NXP Semiconductors BZX100A
Single Zener diode
8. Application information
High-voltage Zener diodes can be used as overvoltage protection diodes for Integrated
Circuits (IC) due to their ability to cut off the applied voltage at a well-defined value. One
important application is the protection of EL driver circuits where a driver IC is connected
to an EL foil. Since both the foil as well as the IC are sensitive against voltage overstress,
it is necessary to install an additional protection device in the circuit. Commonly, a
peak-to-peak voltage of 220 V should not be exceeded, such that two 100 V diodes in
back-to-back configuration are used.
Tj=25°C to 150 °CT
j=25°C
Fig 4. Temperature coefficient as a function of
working current; typical values Fig 5. Working current as a function of working
voltage; typical values
IZ (mA)
054231
006aab050
120
130
110
140
150
SZ
(mV/K)
100
006aab051
10−6
10−8
10−7
10−4
10−5
10−3
IZ
(A)
10−9
VZ (V)
80 12011090 100
Fig 6. Application diagram
006aab052
DRIVER IC
1
CHF
2
CLF
CHF
BZX100A
L
BZX100A
CLF
Renable 3
E
ENABLE
VBAT
4
n.c.
5
GND
EL LAMP
V+
10
L+
9
VO
8
L−
7
n.c.
6
BZX100A_1 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 01 — 30 May 2007 6 of 10
NXP Semiconductors BZX100A
Single Zener diode
9. Test information
9.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 (Stress qualification for discrete semiconductors) and is suitable for
use in automotive critical applications.
10. Package outline
11. Packing information
[1] For further information and the availability of packing methods, see Section 15.
Fig 7. Package outline SOD323F (SC-90)
04-09-13Dimensions in mm
0.80
0.65
0.25
0.10
0.5
0.3
2.7
2.3 1.8
1.6
0.40
0.25
1.35
1.15
1
2
Table 8. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number Package Description Packing quantity
3000 10000
BZX100A SOD323F 4 mm pitch, 8 mm tape and reel -115 -135
BZX100A_1 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 01 — 30 May 2007 7 of 10
NXP Semiconductors BZX100A
Single Zener diode
12. Soldering
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 8. Reflow soldering footprint SOD323F (SC-90)
msa433
1.65
0.50
(2×)
2.10
1.60
2.80
0.60
3.05
0.500.95
solder lands
solder resist
occupied area
solder paste
BZX100A_1 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 01 — 30 May 2007 8 of 10
NXP Semiconductors BZX100A
Single Zener diode
13. Revision history
Table 9. Revision history
Document ID Release date Data sheet status Change notice Supersedes
BZX100A_1 20070530 Product data sheet - -
BZX100A_1 © NXP B.V. 2007. All rights reserved.
Product data sheet Rev. 01 — 30 May 2007 9 of 10
NXP Semiconductors BZX100A
Single Zener diode
14. Legal information
14.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
14.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
14.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of a NXP Semiconductors product can reasonably be expected to
result in personal injury, death or severe property or environmental damage.
NXP Semiconductors accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or applications and therefore
such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
14.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
15. Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, send an email to: salesaddresses@nxp.com
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
NXP Semiconductors BZX100A
Single Zener diode
© NXP B.V. 2007. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 30 May 2007
Document identifier: BZX100A_1
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
16. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 General description. . . . . . . . . . . . . . . . . . . . . . 1
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.4 Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
2 Pinning information. . . . . . . . . . . . . . . . . . . . . . 1
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 2
4 Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
6 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3
7 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4
8 Application information. . . . . . . . . . . . . . . . . . . 5
9 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 6
9.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 6
10 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6
11 Packing information. . . . . . . . . . . . . . . . . . . . . . 6
12 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
13 Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 8
14 Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9
14.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9
14.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
14.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
14.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
15 Contact information. . . . . . . . . . . . . . . . . . . . . . 9
16 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
