MAX14778
Dual ±25V Above- and Below-the-Rails
4:1 Analog Multiplexer
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Functional Diagram
19-5929; Rev 1; 6/12
Ordering Information appears at end of data sheet.
For related parts and recommended products to use with this part,
refer to www.maxim-ic.com/MAX14778.related.
EVALUATION KIT AVAILABLE
General Description
The MAX14778 dual 4:1 analog multiplexer supports
analog signals up to Q25V with a single 3.0 to 5.5V
supply. Each multiplexer has separate control inputs to
allow independent switching, making the device ideal for
multiplexing different communications signals with the
same connector pins. Extended ESD protection of Q6kV
(Human Body Model) enable direct interfacing to cables
and connectors.
The MAX14778 features a low 1.5I (max) on-resistance
and 3mI (typ) flatness to maximize signal integrity over
the entire common-mode voltage range. Each multiplex-
er can carry up to 300mA of continuous current through
the multiplexer in either direction.
The MAX14778 supports switching of full-speed USB 1.1
signals (12Mbps) and RS-485 data rates of up to 20Mbps.
The MAX14778 is available in a 20-pin (5mm x 5mm)
TQFN package and is specified over the -40NC to +85NC
extended temperature range.
Applications
RS-485/RS-232/USB 1.1 Multiplexing
POS Peripherals
Handheld Industrial Devices
Communication Systems
Audio/Data Multiplexing
Connector Sharing
Gaming Machines
Features
S ±25V Signal Range
S Single 3.0V to 5.5V Supply
S Two Independent Multiplexers
S 1.5I RON (max)
S 3mI RON Flatness (typ)
S 300mA Maximum Current Through Multiplexer
S 78pF Input Capacitance
S 75MHz Large-Signal Bandwidth
S Break-Before-Make Operation
S Extended ESD Protection on A� and B� Pins
Q6kV Human Body Model (HBM)
CONTROL A BIAS
GENERATION
SA0ENA
A0
A1
A2
A3
SA1 VDD
VP
VN
ACOM
CONTROL B
SB0ENB SB1 GND
B0
B1
B2
B3
BCOM
MAX14778
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,
or visit Maxim’s website at www.maxim-ic.com.
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MAX14778
Dual ±25V Above- and Below-the-Rails
4:1 Analog Multiplexer
(All voltages referenced to GND.)
VDD .......................................................................... -0.3V to +6V
VP ........................... -0.3V to the lesser of +52V and (VN + 70V)
VN ................ The lesser of (VDD - 40V) and (VP - 70V) to +0.3V
VP to VN .................................................................-0.3V to +70V
ENA, ENB, SA_, SB_ ................................ -0.3V to (VDD + 0.3V)
A_, ACOM, B_,
BCOM .. (VN - 0.3V) to the lesser of (VP + 0.3V) and (VN + 52V)
Continuous Current Through Switch ............................. ±500mA
Continuous Power Dissipation (TA = +70NC)
TQFN (derate 33.3mW/NC above +70NC)...............2666.7mW
Operating Temperature Range .......................... -40NC to +85NC
Junction Temperature .....................................................+150NC
Storage Temperature Range ............................ -65NC to +150NC
Lead Temperature (soldering, 10s) ...............................+300NC
Soldering Temperature (reflow) ......................................+260NC
TQFN
Junction-to-Ambient Thermal Resistance (BJA) ..........30NC/W
Junction-to-Case Thermal Resistance (BJC) .................2NC/W
ABSOLUTE MAXIMUM RATINGS
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
ELECTRICAL CHARACTERISTICS
(VDD = 3.0V to 5.5V, TA = -40NC to +85NC, unless otherwise noted. Typical values are at VDD = 5V, TA = +25NC.) (Note 2)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
DC CHARACTERISTICS
Supply Voltage Range VDD 3.0 5.5 V
Supply Current IDD
ENA = ENB = high VDD P VDDTH 4.27 10
mA
VDD > VDDTH 2.54 6
VENA = VENB = VDD/2 VDD P VDDTH 4.31 10
VDD > VDDTH 2.59 6
Charge-Pump Threshold VDDTH (Note 3) 4.64 V
Analog Signal Range VIN Figure 1, switch open or closed -25 +25 V
Continuous Current
Through Switch ICOM -300 +300 mA
On-Resistance RON Figure 1, ICOM = Q300mA, VIN = Q25V 0.84 1.5 Ω
On-Resistance Flatness RFLAT(ON) Figure 1, -25V P VIN P +25V,
ICOM = Q300mA 3 mΩ
A_, B_ Off-Leakage
Current
IA(OFF),
IB(OFF) Figure 2, VIN = 25V, VOUT = 0V -200 +200 nA
ACOM, BCOM
Off-Leakage Current
IACOM(OFF),
IBCOM(OFF) Figure 2, VOUT = 15V, VIN = 0V -1 +1 FA
A_, B_ On-Leakage
Current
IA(ON),
IB(ON)
Figure 2, VIN = Q25V, ACOM or BCOM
is unconnected -1 +1 FA
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MAX14778
Dual ±25V Above- and Below-the-Rails
4:1 Analog Multiplexer
Note 2: All units are production tested at TA = +25NC. Specifications over temperature are guaranteed by design.
Note 3: When VDD is higher than the charge-pump threshold, the internal 5V regulated charge pump is turned off and the input to
the high-voltage charge pumps is provided by VDD.
Note 4: The MAX14778 requires a 100nF capacitor on both VP and VN to GND to guarantee full ESD protection. See the
Applications Information section for details on ESD test conditions.
ELECTRICAL CHARACTERISTICS (continued)
(VDD = 3.0V to 5.5V, TA = -40NC to +85NC, unless otherwise noted. Typical values are at VDD = 5V, TA = +25NC.) (Note 2)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS
LOGIC INPUTS (ENA, ENB, SA�, SB�)
Input Logic-Low Voltage VIL
VDD = 5.5V 0.8
V
VDD = 4.5V 0.8
VDD = 3.6V 0.7
VDD = 3.0V 0.7
Input Logic-High Voltage VIH
VDD = 5.5V 2.1
V
VDD = 4.5V 2.0
VDD = 3.6V 1.9
VDD = 3.0V 1.7
AC CHARACTERISTICS
Power-Up Time tPOR 404 ms
Enable Turn-On Time tON Figure 3, VIN = Q10V, RL = 10kI,
CL = 15pF 2 ms
Enable Turn-Off Time tOFF Figure 3, VIN = Q10V, RL = 10kI,
CL = 15pF 1.5 ms
Break-Before-Make
Interval tBBM Figure 4, VIN = Q10V, RL = 10kI,
CL = 15pF 840 Fs
Charge Injection Q Figure 5, VA_ = 0V, CL = 1nF 1720 pC
Off-Isolation VISO Figure 6, VA_ = 1VRMS, f = 100kHz,
RL = 50I, CL = 15pF -80 dB
Crosstalk VCT Figure 6, f = 100kHz, RS = RL = 50I-103 dB
-3dB Bandwidth BW Figure 6, RS = 50I, RL = 50I75 MHz
Total Harmonic Distortion
Plus Noise THD+N RS = RL = 1kI, f = 20Hz to 20kHz 0.003 %
Input Capacitance CIN A_, B_ pins 78 pF
THERMAL PROTECTION
Thermal-Shutdown
Threshold TSHUT 145 NC
Thermal-Shutdown
Hysteresis THYST 25 NC
ESD PROTECTION
A_, B_ Pins (Note 4) Human Body Model Q6kV
All Other Pins Human Body Model Q2kV
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MAX14778
Dual ±25V Above- and Below-the-Rails
4:1 Analog Multiplexer
Test Circuits/Timing Diagrams
Figure 1. On-Resistance Measurement
Figure 2. Leakage Current Measurement
A_
B_
ACOM
BCOM
ICOM
VDD
GND
MAX14778
+5V
1µF
V
VIN
VIN
A_
B_
IA(OFF)
IB(OFF)
ACOM
BCOM
VDD
GND
MAX14778
+5V
1µF
A
IACOM(OFF)
IBCOM(OFF)
A
VOUT VIN
A_
B_
IA(ON)
IB(ON)
ACOM
BCOM
VDD
GND
MAX14778
+5V
1µF
A
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MAX14778
Dual ±25V Above- and Below-the-Rails
4:1 Analog Multiplexer
Test Circuits/Timing Diagrams (continued)
Figure 3. Turn-On/Turn-Off Timing
Figure 4. Break-Before-Make Timing
tR < 20ns
tF < 20ns
50%
VIL
LOGIC
INPUT
RL
ENA
ENB
VIN
VIH
tOFF
0V
A_
B_
ACOM
BCOM
0.9 x V0UT 0.1 x VOUT
tON
VOUT
SWITCH
OUTPUT
LOGIC
INPUT
CL
VOUT
MAX14778
VOUT = VIN RL + RON
( RL )
CL INCLUDES FIXTURE AND STRAY CAPACITANCE.
RLCL
VOUT
ACOM
SA1
SA0
ENA
VDD
A_
GND
MAX14778
VOUT = VIN RL + RON
( RL )
CL INCLUDES FIXTURE AND STRAY CAPACITANCE.
LOGIC
INPUT
VIN
+5V
1µF
tR < 20ns
0V
+5V
0V
VOUT
LOGIC
INPUT
SWITCH
OUTPUT
tBBM
80%
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MAX14778
Dual ±25V Above- and Below-the-Rails
4:1 Analog Multiplexer
Test Circuits/Timing Diagrams (continued)
Figure 5. Charge Injection
Figure 6. Off-Isolation, -3dB Bandwidth, and Crosstalk
CL = 1
n
F
VOUT
ACOM
BCOM
ENA
ENB
A_
B_
VDD
GND
LOGIC
INPUT
+5V
MAX14778 0V
VOUT
+5V
ON OFFOFF
DVOUT
Q = CL x DVOUT
LOGIC
INPUT
MEASUREMENTS ARE STANDARDIZED AGAINST SHORTS AT IC TERMINALS.
OFF-ISOLATION IS MEASURED BETWEEN ACOM AND "OFF" A_ TERMINAL ON EACH MULTIPLEXER.
-3dBW IS MEASURED BETWEEN ACOM AND "ON" A_ TERMINAL ON EACH MULTIPLEXER.
CROSSTALK IS MEASURED FROM ONE CHANNEL TO ALL OTHER CHANNELS.
SIGNAL DIRECTION THROUGH MULTIPLEXER IS REVERSED; WORST VALUES ARE RECORDED.
VDD
VOUT
ENA
SA_
A0
ACOM
VIN
OFF-ISOLATION = 20log VOUT
VIN
ON-LOSS = 20log VOUT
VIN
CROSSTALK = 20log VOUT
VIN
NETWORK
ANALYZER
50I
50I50I
50I
MEAS REF
0V OR VDD
50I
MAX14778
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MAX14778
Dual ±25V Above- and Below-the-Rails
4:1 Analog Multiplexer
Typical Operating Characteristics
(VDD = 5.0V, TA = +25°C, unless otherwise noted.)
ON-RESISTANCE
vs. COMMON-MODE VOLTAGE
MAX14778 toc01
VACOM (V)
ON-RESISTANCE (I)
155-5-15
0.96
0.97
0.98
0.99
1.00
0.95
-25 25
IACOM = 300mA
VDD = 3.3V
VDD = 5V
ON-RESISTANCE
vs. COMMON-MODE VOLTAGE
MAX14778 toc02
VACOM (V)
ON-RESISTANCE (I)
155-5-15
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.3
1.4
1.5
0.5
-25 25
TA = +85°C
TA = +25°C
TA = -40°C
IACOM = 300mA
OFF-LEAKAGE CURRENT
vs. TEMPERATURE
MAX14778 toc03
TA (°C)
OFF-LEAKAGE CURRENT (nA)
603510-15
1
10
100
0.1
-40 85
VA1 = 25V
A0 SELECTED
ACOM = GND
ON-LEAKAGE CURRENT
vs. TEMPERATURE
MAX14778 toc04
TA (°C)
ON-LEAKAGE CURRENT (nA)
603510-15
10
100
1000
1
-40 85
VA0 = 25V
A0 SELECTED
ACOM UNCONNECTED
CHARGE INJECTION
vs. ANALOG SIGNAL VOLTAGE
MAX14778 toc05
VACOM (V)
Q (pC)
155-5-15
200
400
600
800
1,000
1,200
0
-25 25
CL = 1nF
SUPPLY CURRENT vs. TEMPERATURE
MAX14778 toc06
TA (°C)
IDD (mA)
6035-15 10
0.5
1.0
1.5
2.0
3.0
2.5
3.5
4.0
0
-40 85
VDD = 3.3V
VDD = 5V
CROSSTALK vs. FREQUENCY
MAX14778 toc07
FREQUENCY (MHz)
CROSSTALK (dB)
101
-100
-80
-60
-40
-20
0
-120
0.1 100
A0 TO B0
A0 AND B0 SELECTED
OFF-ISOLATION vs. FREQUENCY
MAX14778 toc08
FREQUENCY (MHz)
OFF-ISOLATION (dB)
101
-60
-50
-40
-30
-20
-10
0
-70
0.1 100
A0 TO ACOM
A2 SELECTED
FREQUENCY RESPONSE
MAX14778 toc09
FREQUENCY (MHz)
VOUT/VIN (dB)
101
-9
-8
-7
-6
-5
-4
-3
-2
-1
0
1
-10
0.1 100
A0 TO ACOM
A0 SELECTED
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MAX14778
Dual ±25V Above- and Below-the-Rails
4:1 Analog Multiplexer
Typical Operating Characteristics (continued)
(VDD = 5.0V, TA = +25°C, unless otherwise noted.)
THD+N vs. FREQUENCY
MAX14778 toc10
FREQUENCY (kHz)
THD+N (%)
20.2
0.001
0.01
0.1
1
0.0001
0.02 20
A0 TO ACOM
RS = 600I
RL = 1kI
PSRR vs. FREQUENCY
MAX14778 toc11
FREQUENCY (kHz)
PSRR (dB)
1010.1
-120
-100
-80
-60
-40
-20
0
-140
0.01 100
VDD TO ACOM
TURN-OFF TIME
vs. ANALOG-SIGNAL VOLTAGE
MAX14778 toc13
VACOM (V)
tOFF (ms)
155-5-15
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
0.50
0
-25 25
CHARGE PUMP NOISE WITH
SWITCH DISABLED
MAX14778 toc15
FREQ (MHz)
MAG (dB)
90807060504030
-120
-100
-80
-60
-40
-20
0
-140
20 100
MEASURED AT BCOM
ENB = GND
RBW = 5100Hz
TURN-ON TIME
vs. ANALOG-SIGNAL VOLTAGE
MAX14778 toc12
VACOM (V)
tON (ms)
155-5-15
1.02
1.04
1.06
1.08
1.10
1.12
1.14
1.16
1.18
1.20
1.00
-25 25
CHARGE PUMP NOISE WITH
SWITCH ENABLED
MAX14778 toc14
FREQ (MHz)
MAG (dB)
90807060504030
-120
-100
-80
-60
-40
-20
0
-140
20 100
MEASURED AT BCOM
ENB = VDD
BS0 = BS1 = VDD
B2 IS CONNECTED TO GND
WITH A 50I RESISTOR
RBW = 5100Hz
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MAX14778
Dual ±25V Above- and Below-the-Rails
4:1 Analog Multiplexer
Pin Description
Pin Configuration
PIN NAME FUNCTION
1 BCOM MUX B Common Terminal
2 VPPositive Charge-Pump Output. Bypass VP to GND with a 100nF 50V ceramic capacitor.
3 GND Ground
4 VNNegative Charge-Pump Output. Bypass VN to GND with a 100nF 50V ceramic capacitor.
5 ACOM MUX A Common Terminal
6 A0 MUX A Bidirectional Analog Input/Output 0
7 A1 MUX A Bidirectional Analog Input/Output 1
8 A2 MUX A Bidirectional Analog Input/Output 2
9 A3 MUX A Bidirectional Analog Input/Output 3
10 ENA MUX A Enable Input
11 SA0 MUX A Channel Select Input 0
12 SA1 MUX A Channel Select Input 1
13 VDD Power-Supply Input. Bypass VDD to GND with a 1FF ceramic capacitor.
14 SB1 MUX B Channel Select Input 1
15 SB0 MUX B Channel Select Input 0
16 ENB MUX B Enable Input
17 B3 MUX B Bidirectional Analog Input/Output 3
18 B2 MUX B Bidirectional Analog Input/Output 2
19 B1 MUX B Bidirectional Analog Input/Output 1
20 B0 MUX B Bidirectional Analog Input/Output 0
— EP Exposed Pad. Connect EP to VN. EP is not intended as an electrical connection point.
MAX14778
TQFN
5mm x 5mm
TOP VIEW
19
20 *EP
+
18
17
7
6
8
VP
VN
ACOM
9
BCOM
SB1
SA1
SA0
SB0
12
B2
45
15 14 12 11
B1
B0
*CONNECT EXPOSED PAD TO VN.
A3
A2
A1
A0
GND VDD
3
13
B3
16 10 ENA
ENB
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MAX14778
Dual ±25V Above- and Below-the-Rails
4:1 Analog Multiplexer
Truth Tables
Table 1. MUX A Channel Selection Table 2. MUX B Channel Selection
X = Don’t care X = Don’t care
Detailed Description
The MAX14778 dual 4:1 analog multiplexer integrates
bias circuitry to provide a Q25V analog voltage range
with a single 3.0 to 5.5V supply. This extended input
range allows multiplexing different communications
signals such as RS-232, RS-485, audio and USB 1.1 onto
the same connector.
Integrated Bias Generation
The MAX14778 contains a total of three charge pumps to
generate bias voltages for the internal switches: a 5V regu-
lated charge pump, a positive high-voltage (+35V) charge
pump, and a negative high-voltage (-27V) charge pump.
When VDD is above 4.7V (typ), the 5V regulated charge
pump is bypassed and VDD provides the input for the high-
voltage charge pumps, reducing overall supply current.
An external 100nF capacitor is required for each high-
voltage charge pump between VP/VN and GND.
Analog Signal Levels
The MAX14778 transmits signals of up to Q25V with a
single 3.0 to 5.5V supply due to integrated bias circuitry.
The device features 1.5Ω (max) on-resistance and 3mI
(typ) flatness for analog signals between -25V and +25V
(see the Typical Operating Characteristics). The current
flow through the multiplexers can be bidirectional, allow-
ing operation either as a multiplexer or demultiplexer.
Digital Interface
The MAX14778 has two digital select inputs for each
MUX: SA1 and SA0 control MUX A; SB1 and SB0 control
MUX B. Drive the digital select inputs high or low to select
which input (A_, B_) is connected to the common termi-
nal (ACOM, BCOM) for each MUX. See the Truth Tables
for more information.
Each MUX features an independent enable input (ENA
and ENB). Drive ENA or ENB low to disconnect all inputs
from the common terminal for that MUX, regardless of the
status of the select inputs or the other enable input.
Applications Information
Connector Sharing
The MAX14778 supports a Q25V analog signal range
independently for each input/output, allowing physical
connector sharing between interface types that have
differing signal ranges.
The multiprotocol connector-sharing application in the
Typical Operating Circuits shows an application with
RS-232, half-duplex RS-485, full-speed USB 1.1, and
audio signals sharing the same connector. The device
allows signals to pass over the entire signal range speci-
fied by each standard while safely isolating the unused
transceivers.
ENA SA1 SA0 ACOM
CONNECTED TO
0 X X Open
1 0 0 A0
1 0 1 A1
1 1 0 A2
1 1 1 A3
ENB SB1 SB0 BCOM
CONNECTED TO
0 X X Open
1 0 0 B0
1 0 1 B1
1 1 0 B2
1 1 1 B3
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MAX14778
Dual ±25V Above- and Below-the-Rails
4:1 Analog Multiplexer
Non-Powered Condition
The MAX14778 can tolerate input voltages on the A_, B_,
ACOM, and BCOM pins in the ±25V range when it is not
powered.
When VDD = 0V, the DC input leakage current into the
A_, B_, ACOM or BCOM pins will typically be below 1µA.
Some devices can have a larger leakage current up to
mA range due to technology spread.
With VDD not powered, internal diodes between the ana-
log pins and the VP and VN will charge up the external
capacitors on VP and VN when positive and/or negative
voltages are applied to these pins. This causes transient
input current flow.
Large dv/dt on the inputs causes large capacitive charg-
ing currents, which have to be limited to the 300mA
Absolute Maximum Ratings in order to not destroy the
internal diodes. With 100nF capacitors on VP and VN, the
dv/dt must be limited to 3V/µs once the capacitors reach
their final voltage; the input current decays to the leakage
current levels mentioned above.
High-ESD Protection
Electrostatic discharge (ESD)-protection structures are
incorporated on all pins to protect against electrostatic
discharges up to Q2kV Human Body Model (HBM)
encountered during handling and assembly. A_ and B_
are further protected against ESD up to Q6kV (HBM)
without damage. The ESD structures withstand high ESD
both in normal operation and when the device is powered
down. After an ESD event, the MAX14778 continues to
function without latchup.
ESD Test Conditions
ESD performance depends on a variety of conditions.
Contact Maxim for a reliability report that documents test
setup, test methodology, and test results.
The MAX14778 requires a 100nF capacitor on both VP
and VN to GND to guarantee full ESD protection.
Human Body Model
Figure 7 shows the Human Body Model. Figure 8 shows
the current waveform it generates when discharged
into a low impedance. This model consists of a 100pF
capacitor charged to the ESD voltage of interest that is
then discharged into the device through a 1.5kI resistor.
Figure 7. Human Body ESD Test Model Figure 8. Human Body Current Waveform
CHARGE CURRENT-
LIMIT RESISTOR
DISCHARGE
RESISTANCE
STORAGE
CAPACITOR
CS
100pF
RC
1MI
RD
1.5kI
HIGH-
VOLTAGE
DC
SOURCE
DEVICE
UNDER
TEST
36.8%
tRL TIME
tDL
CURRENT WAVEFORM
PEAK-TO-PEAK RINGING
(NOT DRAWN TO SCALE)
Ir
10%
00
AMPERES
IP 100%
90%
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MAX14778
Dual ±25V Above- and Below-the-Rails
4:1 Analog Multiplexer
Typical Operating Circuits
CONTROL
CONTROL
INPUTS
SA1ENA SA0 SB1 SB0 ENB
RS-232
TRANSCEIVER
RS-485
TRANSCEIVER
USB 1.1
TRANSCEIVER
AUDIO
SOURCE
MULTIPROTOCOL CONNECTOR
SHARING APPLICATION
A0TX
RX
A
B
D+
D-
L
R
B0
ACOM
VN
VP
+5V
VDD
1µF
100nF
BCOM
A1
B1
A2
B2
A3
B3
MAX14778
GND
100nF SHARED
CONNECTOR
+5V
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MAX14778
Dual ±25V Above- and Below-the-Rails
4:1 Analog Multiplexer
Typical Operating Circuits (continued)
CONTROL
CONTROL
INPUTS
SA1ENA SA0 SB1 SB0 ENB
RS-232
TRANSCEIVER
RS-485
TRANSCEIVER
USB 1.1
TRANSCEIVER
KEYBOARD
WEDGE
SCANNER CONNECTOR
SHARING APPLICATION
A0TX
RX
A
B
D+
D-
CLOCK
DATA
B0
ACOM
VN
VP
+5V
VDD
1µF
100nF
BCOM
A1
B1
A2
B2
A3
B3
MAX14778
GND
100nF SHARED
CONNECTOR
+5V
���������������������������������������������������������������� Maxim Integrated Products 14
MAX14778
Dual ±25V Above- and Below-the-Rails
4:1 Analog Multiplexer
Ordering Information
+Denotes a lead(Pb)-free/RoHS-compliant package.
*EP = Exposed pad.
Chip Information
PROCESS: BiCMOS
Package Information
For the latest package outline information and land patterns
(footprints), go to www.maxim-ic.com/packages. Note that a
“+”, “#”, or “-” in the package code indicates RoHS status only.
Package drawings may show a different suffix character, but
the drawing pertains to the package regardless of RoHS status.
PART TEMP RANGE PIN-PACKAGE
MAX14778ETP+ -40NC to +85NC20 TQFN-EP*
PACKAGE
TYPE
PACKAGE
CODE
OUTLINE
NO.
LAND
PATTERN NO.
20 TQFN-EP T2055+4 21-0140 90-0009
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied.
Maxim reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits) shown in the Electrical
Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 15
© 2012 Maxim Integrated Products Maxim is a registered trademark of Maxim Integrated Products, Inc.
MAX14778
Dual ±25V Above- and Below-the-Rails
4:1 Analog Multiplexer
Revision History
REVISION
NUMBER
REVISION
DATE DESCRIPTION PAGES
CHANGED
0 6/11 Initial release —
1 6/12
Added new TOCs 14 and 15, updated Non-Powered Condition section, updated
Note 4, Pin Description, ESD Test Conditions, Typical Operating Circuits, updated
capacitor values
3, 8, 9, 10, 11,
12, 13
