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BIPOLAR ANALOG INTEGRATED CIRCUIT
µ
PC4556
HIGH PERFORMANCE DUAL DECOMPENSATED
OPERATIONAL AMPLIFIER
DATA SHEET
Document No. G10240EJ7V0DS00 (7th edition)
Date Published March 2004 N CP(K)
Printed in Japan
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
1987
DESCRIPTION
The
µ
PC4556 is a dual operational amplifier which features further advanced A.C. performance than that of the
µ
PC4558.
Decompensation characteristic guarantees 20MHz gain-bandwidth product higher than 20 dB. Also featured are low input
noise and high output drive capability making this device the optimum choice for audio application.
FEATURES
• Gain bandwidth products: 20 MHz (Av ≥ 20 dB)
• High slew rate: 5 V/
µ
s
• Low input noise voltage: 6
µ
Vp-p
• Internal frequency compensation (Av ≥ 20 dB)
ORDERING INFORMATION
Part Number Package
µ
PC4556C 8-pin plastic DIP (7.62 mm (300))
µ
PC4556G2 8-pin plastic SOP (5.72 mm (225))
EQUIVALENT CIRCUIT
V+
I
I
I
N
Q
3
R
2
Q
1
Q
5
R
1
Q
2
Q
4
R
3
R
4
C
1
C
2
Q
6
R
5
Q
8
Q
7
Q
14
Q
9
Q
11
Q
12
Q
10
Q
13
Q
15
R
6
R
7
R
8
D
OUT
−
V
PIN CONFIGURATION (Top View)
PC4556C, 4556G2
11
2
3
4
8
7
6
5
V
+
OUT
2
I
I2
I
N2
+
I
I1
I
N1
OUT
1
V
2
+
µ
−
−
−
Data Sheet G10240EJ7V0DS
2
µ
PC4556
ABSOLUTE MAXIMUM RATINGS (TA = 25°C)
Parameter Symbol Ratings Unit
Voltage between V+ and V– Note 1 V+ – V– –0.3 to +36 V
Differential Input Voltage VID ±30 V
Input VoltageNote 2 VI V––0.3 to V+ +0.3 V
Output VoltageNote 3 VO V––0.3 to V+ +0.3 V
C PackageNote 4 700 mW
Power Dissipation
G2 PackageNote 5
PT
440 mW
Output Short Circuit DurationNote 6 Indefinite sec
Operating Ambient Temperature TA –20 to +80 °C
Storage Temperature Tstg –55 to +125 °C
Notes 1. Reverse connection of supply voltage can cause destruction.
2. The input voltage should be allowed to input without damage or destruction. Even during the transition period of
supply voltage, power on/off etc., this specification should be kept. The normal operation will establish when the
both inputs are within the Common Mode Input Voltage Range of electrical characteristics.
3. This specification is the voltage which should be allowed to supply to the output terminal from external without
damage or destructive. Even during the transition period of supply voltage, power on/off etc., this specification
should be kept. The output voltage of normal operation will be the Output Voltage Swing of electrical
characteristics.
4. Thermal derating factor is –7.0 mV/°C when operating ambient temperature is higher than 25°C.
5. Thermal derating factor is –4.4 mV/°C when operating ambient temperature is higher than 25°C.
6. Pay careful attention to the total power dissipation not to exceed the absolute maximum ratings, Note 4 and
Note 5.
RECOMMENDED OPERATING CONDITIONS
Parameter Symbol MIN. TYP. MAX. Unit
Supply Voltage V± ±4 ±16 V
Data Sheet G10240EJ7V0DS 3
µ
PC4556
ELECTRICAL CHARACTERISTICS (TA = 25°C, V± = ±15 V)
Parameter Symbol Conditions MIN. TYP. MAX. Unit
Input Offset Voltage VIO RS ≤ 10 kΩ ±0.5 ±6 mV
Input Offset Current Note 7 IIO ±5 ±200 nA
Input Bias Current Note 7 IB 180 500 nA
Large Signal Voltage Gain AV RL ≥ 2 kΩ , VO = ±10 V 20000 100000
Power Consumption Pd IO = 0 A 90 170 mW
Common Mode Rejection Ratio CMR RS ≤ 10 kΩ 70 90 dB
Supply Voltage Rejection Ratio SVR RS ≤ 10 kΩ 30 150
µ
V/V
RL ≥ 2 kΩ ±12 ±14 V Output Voltage Swing
Vom
IO = ±25 mA ±10 ±11.5 V
Common Mode Input Voltage Range VICM ±12 ±14 V
Slew Rate SR AV ≥ 10 (20 dB) 5 V/
µ
s
Input Equivalent Noise Voltage Vn RS = 1 kΩ, f = 1 Hz to 1 kHz 6
µ
Vp-p
Channel Separation f = 1 kHz 105 dB
Notes 7. Input bias currents flow out from IC. Because each currents are base current of PNP-transistor on input stage.
Data Sheet G10240EJ7V0DS
4
µ
PC4556
TYPICAL APPLICATION CIRCUIT
R3
VO
R2R1
VIN R3 9 R2⋅≥
R1 = R2
+
−
R4
VIN
R3
C
R2
VO
R1
R4, C are necessary
when R2 < 10 R1⋅
+
−
R2/R4
⋅2 R4 5 MHz⋅π⋅
C ≥
R4 R2
≤1
9
Noninverting Amplifier
Inverting Amplifier
Data Sheet G10240EJ7V0DS 5
µ
PC4556
TYPICAL PERFORMANCE CHARACTERISTICS (TA = 25°C, TYP.)
T
A
- Operating Ambient Temperature - °C
POWER DISSIPATION
P
T
- Total Power Dissipation - mW
800
600
400
200
020 40 60 80 100
227 C/W°
143 C/W°
PC4556G2
µ
PC4556C
µ
1 10 100 1 k 10 k 100 k 1 M 10 M
120
100
80
60
40
20
0
f - Frequency - Hz
OPEN LOOP FREQUENCY RESPONSE
A
V
- Open Loop Voltage Gain - dB
V= ±15 V
±
020406080
INPUT OFFSET VOLTAGE
VIO - Input Offset Voltage - mV
−20
3
2
1
0
−1
−2
−3
V =
±
15 V
The characteristic of the optional sample.
(Quantity:five)
±
TA - Operating Ambient Temperature - C°
−200 20406080
200
160
120
80
40
0
INPUT BIAS CURRENT
I
B
- Input Bias Current - nA
V= ±15 V
±
T
A
- Operating Ambient Temperature - C°
100 1 k 10 k 100 k 1 M
f - Frequency - Hz
LARGE SIGNAL FREQUENCY RESPONSE
V
om
- Output Voltage Swing - V
p-p
V= ±15 V
±
32
28
24
20
16
12
8
4
0
0 20406080
OUTPUT CURRENT LIMIT
V= ±15 V
±
V
O
I
O SOURCE
+
V
O
I
O SINK
−
±20
±15
±10
±5
V
O
- Output Voltage - V
±
I
O
- Output Current - mA
Data Sheet G10240EJ7V0DS
6
µ
PC4556
0
OUTPUT VOLTAGE SWING
V - Supply Voltage - V
±
±10 ±20
20
10
0
−10
−20
VICM - Common Mode Input Voltage Range - V
0
4
3
2
1
SUPPLY CURRENT
V - Supply Voltage - V
±
I
CC
- Supply Current - mA
±
10
±
20
1 10 100 1 k
1000
300
100
30
10
Voltage Density
e
n
- Input Equivalent Noise
INPUT EQUIVALENT NOISE VOLTAGE DENSITY
f - Frequency - Hz
- nV/ Hz
0 10203040
VO - Output Voltage - V
VOLTAGE FOLLOWER PULSE RESPONSE
t - Time -
s
µ
10
5
0
−5
−10
V= ±15 V
±
Data Sheet G10240EJ7V0DS 7
µ
PC4556
PACKAGE DRAWINGS (Unit : mm)
14
85
ITEM MILLIMETERS
NOTES
1. Each lead centerline is located within 0.25 mm of
its true position (T.P.) at maximum material condition.
P8C-100-300B,C-2
N 0.25
P 0.9 MIN.
R0∼15°
A 10.16 MAX.
B 1.27 MAX.
F 1.4 MIN.
G 3.2±0.3
J 5.08 MAX.
K 7.62 (T.P.)
C 2.54 (T.P.)
D 0.50±0.10
H 0.51 MIN.
I 4.31 MAX.
L 6.4
M 0.25+0.10
−0.05
2. ltem "K" to center of leads when formed parallel.
M
A
R
M
P
I
J
H
G
F
DN
C
B
8-PIN PLASTIC DIP (7.62mm(300))
L
K
Data Sheet G10240EJ7V0DS
8
µ
PC4556
ITEM
B
C
I
8-PIN PLASTIC SOP (5.72 mm (225))
D
E
F
G
H
J
P
MILLIMETERS
1.27 (T.P.)
0.78 MAX.
4.4±0.15
0.1±0.1
0.42
1.59±0.21
6.5±0.3
1.49
+0.08
−0.07
1.1±0.2
3°+7°
−3°
NOTE
Each lead centerline is located within 0.12 mm of
its true position (T.P.) at maximum material condition. A 5.2 +0.17
−0.20
K
L
M
N
0.6±0.2
0.17
0.12
0.10
+0.08
−0.07
S8GM-50-225B-6
85
14
S
M
C
detail of lead end
A
M
SN
FG
B
E
D
P
H
IJ
K
L
Data Sheet G10240EJ7V0DS 9
µ
PC4556
RECOMMENDED SOLDERING CONDITIONS
The
µ
PC4556 should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
representative.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Type of Surface Mount Device
µ
PC4556G2: 8-pin plastic SOP (5.72 mm (225))
Process Conditions Symbol
Infrared Ray Reflow Peak temperature: 235°C or below (Package surface temperature),
Reflow time: 30 seconds or less (at 210°C or higher),
Maximum number of reflow processes: 3 time.
IR35-00-3
Vapor Phase Soldering Peak temperature: 215°C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200°C or higher),
Maximum number of reflow processes: 3 time.
VP15-00-3
Wave Soldering Solder temperature: 260°C or below, Flow time: 10 seconds or less,
Maximum number of flow processes: 1 time,
Pre-heating temperature: 120°C or below (Package surface temperature).
WS60-00-1
Partial Heating Method Pin temperature: 300°C or below,
Heat time: 3 seconds or less (Per each side of the device).
–
Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or the
device will be damaged by heat stress.
Type of Through-hole Device
µ
PC4556C: 8-pin plastic DIP (7.62 mm (300))
Process Conditions
Wave Soldering
(only to leads)
Solder temperature: 260°C or below,
Flow time: 10 seconds or less.
Partial Heating Method Pin temperature: 300°C or below,
Heat time: 3 seconds or less (per each lead).
Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure that
the package body does not get jet soldered.
µ
PC4556
The information in this document is current as of March, 2004. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or
data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all
products and/or types are available in every country. Please check with an NEC Electronics sales
representative for availability and additional information.
No part of this document may be copied or reproduced in any form or by any means without the prior
written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may
appear in this document.
NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from the use of NEC Electronics products listed in this document
or any other liability arising from the use of such products. No license, express, implied or otherwise, is
granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of a customer's equipment shall be done under the full
responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by
customers or third parties arising from the use of these circuits, software and information.
While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products,
customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To
minimize risks of damage to property or injury (including death) to persons arising from defects in NEC
Electronics products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment and anti-failure features.
NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and
"Specific".
The "Specific" quality grade applies only to NEC Electronics products developed based on a customer-
designated "quality assurance program" for a specific application. The recommended applications of an NEC
Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of
each NEC Electronics product before using it in a particular application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots.
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support).
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC
Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications
not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to
determine NEC Electronics' willingness to support a given application.
(Note)
(1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its
majority-owned subsidiaries.
(2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as
defined above).
•
•
•
•
•
•
M8E 02. 11-1
