DS90CR215, DS90CR216
www.ti.com
SNLS129D –MARCH 1999–REVISED APRIL 2013
DS90CR215/DS90CR216 +3.3V Rising Edge Data Strobe LVDS
21-Bit Channel Link - 66 MHz
Check for Samples: DS90CR215,DS90CR216
1FEATURES DESCRIPTION
The DS90CR215 transmitter converts 21 bits of
2• Single +3.3V Supply CMOS/TTL data into three LVDS (Low Voltage
• Chipset (Tx + Rx) Power Consumption <250 Differential Signaling) data streams. A phase-locked
mW (typ) transmit clock is transmitted in parallel with the data
• Power-down Mode (<0.5 mW total) streams over a fourth LVDS link. Every cycle of the
transmit clock 21 bits of input data are sampled and
• Up to 173 Megabytes/sec Bandwidth transmitted. The DS90CR216 receiver converts the
• Up to 1.386 Gbps Data Throughput LVDS data streams back into 21 bits of CMOS/TTL
• Narrow Bus Reduces Cable Size data. At a transmit clock frequency of 66 MHz, 21 bits
of TTL data are transmitted at a rate of 462 Mbps per
• 290 mV Swing LVDS Devices for Low EMI LVDS data channel. Using a 66 MHz clock, the data
• +1V Common Mode Range (Around +1.2V) throughput is 1.386 Gbit/s (173 Mbytes/s).
• PLL Requires No External Components The multiplexing of the data lines provides a
• Low Profile 48-Lead TSSOP Package substantial cable reduction. Long distance parallel
• Rising Edge Data Strobe single-ended buses typically require a ground wire
per active signal (and have very limited noise
• Compatible with TIA/EIA-644 LVDS Standard rejection capability). Thus, for a 21-bit wide data and
• ESD Rating > 7 kV one clock, up to 44 conductors are required. With the
• Operating Temperature: −40°C to +85°C Channel Link chipset as few as 9 conductors (3 data
pairs, 1 clock pair and a minimum of one ground) are
needed. This provides a 80% reduction in required
cable width, which provides a system cost savings,
reduces connector physical size and cost, and
reduces shielding requirements due to the cables'
smaller form factor.
The 21 CMOS/TTL inputs can support a variety of
signal combinations. For example, five 4-bit nibbles
plus 1 control, or two 9-bit (byte + parity) and 3
control.
Block Diagram
Figure 1. DS90CR215 Figure 2. DS90CR216 - Improved AC Specifications
48-Lead TSSOP See Package Number DGG0048A
See Package Number DGG0048A Recommended Alternative Device
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 1999–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
DS90CR215, DS90CR216
SNLS129D –MARCH 1999–REVISED APRIL 2013
www.ti.com
Connection Diagrams
Figure 3. DS90CR215 Figure 4. DS90CR216
Typical Application
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
2Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: DS90CR215 DS90CR216
DS90CR215, DS90CR216
www.ti.com
SNLS129D –MARCH 1999–REVISED APRIL 2013
Absolute Maximum Ratings(1)(2)
Supply Voltage (VCC)−0.3V to +4V
CMOS/TTL Input Voltage −0.3V to (VCC + 0.3V)
CMOS/TTL Output Voltage −0.3V to (VCC + 0.3V)
LVDS Receiver Input Voltage −0.3V to (VCC + 0.3V)
LVDS Driver Output Voltage −0.3V to (VCC + 0.3V)
LVDS Output Short Circuit Duration Continuous
Junction Temperature +150°C
Storage Temperature Range −65°C to +150°C
Lead Temperature (Soldering, 4 sec.) +260°C
Maximum Package Power Dissipation @ +25°C DGG0048A (TSSOP) DS90CR215 1.98 W
Package: DS90CR216 1.89 W
Package Derating DS90CR215 16 mW/°C above +25°C
DS90CR216 15 mW/°C above +25°C
ESD Rating (HBM, 1.5 kΩ, 100 pF) > 7 kV
(1) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
(2) “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be guaranteed. They are not meant to
imply that the device should be operated at these limits. “Electrical Characteristics” specify conditions for device operation.
Recommended Operating Conditions Min Nom Max Units
Supply Voltage (VCC) 3.0 3.3 3.6 V
Operating Free Air Temperature (TA)−40 +25 +85 °C
Receiver Input Range 0 2.4 V
Supply Noise Voltage (VCC) 100 mVPP
Electrical Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified
Symbol Parameter Conditions Min Typ Max Unit
s
CMOS/TTL DC SPECIFICATIONS
VIH High Level Input Voltage 2.0 VCC V
VIL Low Level Input Voltage GND 0.8 V
VOH High Level Output Voltage I OH =−0.4 mA 2.7 3.3 V
VOL Low Level Output Voltage I OL = 2 mA 0.06 0.3 V
VCL Input Clamp Voltage I CL =−18 mA −0.79 −1.5 V
IIN Input Current V IN = VCC, GND, ±5.1 ±10 μA
2.5V or 0.4V
IOS Output Short Circuit Current V OUT = 0V -60 −120 mA
LVDS DRIVER DC SPECIFICATIONS
VOD Differential Output Voltage R L= 100Ω250 290 450 mV
ΔVOD Change in V OD between Complimentary Output 35 mV
States
VOS Offset Voltage(1) 1.125 1.25 1.375 V
ΔVOS Change in V OSbetween Complimentary Output 35 mV
States
IOS Output Short Circuit Current V OUT = 0V, −3.5 −5 mA
RL= 100Ω
IOZ Output TRI-STATE Current PWR DWN = 0V, ±1 ±10 μA
VOUT = 0V or VCC
LVDS RECEIVER DC SPECIFICATIONS
(1) VOS previously referred as VCM.
Copyright © 1999–2013, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: DS90CR215 DS90CR216
DS90CR215, DS90CR216
SNLS129D –MARCH 1999–REVISED APRIL 2013
www.ti.com
Electrical Characteristics (continued)
Over recommended operating supply and temperature ranges unless otherwise specified
Symbol Parameter Conditions Min Typ Max Unit
s
VTH Differential Input High Threshold V CM = +1.2V +100 mV
VTL Differential Input Low Threshold −100 mV
IIN Input Current V IN = +2.4V, VCC = 3.6V ±10 μA
VIN = 0V, VCC = 3.6V ±10 μA
TRANSMITTER SUPPLY CURRENT
ICCTW Transmitter Supply Current Worst Case (with RL= 100Ω, f = 32.5 MHz 31 45 mA
Loads) CL= 5 pF, f = 37.5 MHz 32 50 mA
Worst Case Pattern f = 66 MHz 37 55 mA
(Figure 5 Figure 6),
TA=−10°C to +70°C
RL= 100Ω, f = 40 MHz 38 51 mA
CL= 5 pF, f = 66 MHz 42 55 mA
Worst Case Pattern
(Figure 5 Figure 6),
TA=−40°C to +85°C
ICCTZ Transmitter Supply Current Power Down PWR DWN = Low 10 55 μA
Driver Outputs in TRI-STATE
under Powerdown Mode
RECEIVER SUPPLY CURRENT
ICCRW Receiver Supply Current Worst Case CL= 8 pF, f = 32.5 MHz 49 65 mA
Worst Case Pattern f = 37.5 MHz 53 70 mA
(Figure 5 Figure 7), T f = 66 MHz 78 105 mA
A=−10°C to +70°C
CL= 8 pF, f = 40 MHz 55 82 mA
Worst Case Pattern f = 66 MHz 78 105 mA
(Figure 5 Figure 7),
TA=−40°C to +85°C
ICCRZ Receiver Supply Current Power Down PWR DWN = Low 10 55 μA
Receiver Outputs Stay Low during
Powerdown Mode
Transmitter Switching Characteristics
Over recommended operating supply and −40°C to +85°C ranges unless otherwise specified
Symbol Parameter Min Typ Max Units
LLHT LVDS Low-to-High Transition Time (Figure 6) 0.5 1.5 ns
LHLT LVDS High-to-Low Transition Time (Figure 6) 0.5 1.5 ns
TCIT TxCLK IN Transition Time (Figure 8) 5 ns
TCCS TxOUT Channel-to-Channel Skew (Figure 9) 250 ps
TPPos0 Transmitter Output Pulse Position for Bit0 (1) f = 40 MHz −0.4 0 0.4 ns
(Figure 20)
TPPos1 Transmitter Output Pulse Position for Bit1 3.1 3.3 4.0 ns
TPPos2 Transmitter Output Pulse Position for Bit2 6.5 6.8 7.6 ns
TPPos3 Transmitter Output Pulse Position for Bit3 10.2 10.4 11.0 ns
TPPos4 Transmitter Output Pulse Position for Bit4 13.7 13.9 14.6 ns
TPPos5 Transmitter Output Pulse Position for Bit5 17.3 17.6 18.2 ns
TPPos6 Transmitter Output Pulse Position for Bit6 21.0 21.2 21.8 ns
(1) The min. and max. are based on the actual bit position of each of the 7 bits within the LVDS data stream across PVT.
4Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: DS90CR215 DS90CR216
DS90CR215, DS90CR216
www.ti.com
SNLS129D –MARCH 1999–REVISED APRIL 2013
Transmitter Switching Characteristics (continued)
Over recommended operating supply and −40°C to +85°C ranges unless otherwise specified
Symbol Parameter Min Typ Max Units
TPPos0 Transmitter Output Pulse Position for Bit0 (2) f = 66 MHz −0.4 0 0.3 ns
(Figure 20)
TPPos1 Transmitter Output Pulse Position for Bit1 1.8 2.2 2.5 ns
TPPos2 Transmitter Output Pulse Position for Bit2 4.0 4.4 4.7 ns
TPPos3 Transmitter Output Pulse Position for Bit3 6.2 6.6 6.9 ns
TPPos4 Transmitter Output Pulse Position for Bit4 8.4 8.8 9.1 ns
TPPos5 Transmitter Output Pulse Position for Bit5 10.6 11.0 11.3 ns
TPPos6 Transmitter Output Pulse Position for Bit6 12.8 13.2 13.5 ns
TCIP TxCLK IN Period (Figure 10) 15 T 50 ns
TCIH TxCLK IN High Time (Figure 10) 0.35T 0.5T 0.65T ns
TCIL TxCLK IN Low Time (Figure 10) 0.35T 0.5T 0.65T ns
TSTC TxIN Setup to TxCLK IN (Figure 10) 2.5 ns
THTC TxIN Hold to TxCLK IN (Figure 10) 0 ns
TCCD TxCLK IN to TxCLK OUT Delay @ 25°C,VCC=3.3V (Figure 12) 3 3.7 5.5 ns
TPLLS Transmitter Phase Lock Loop Set (Figure 14) 10 ms
TPDD Transmitter Powerdown Delay (Figure 18) 100 ns
(2) The min. and max. limits are based on the worst bit by applying a −400ps/+300ps shift from ideal position.
Receiver Switching Characteristics
Over recommended operating supply and −40°C to +85°C ranges unless otherwise specified
Symbol Parameter Min Typ Max Units
CLHT CMOS/TTL Low-to-High Transition Time (Figure 7) 2.2 5.0 ns
CHLT CMOS/TTL High-to-Low Transition Time (Figure 7) 2.2 5.0 ns
RSPos0 Receiver Input Strobe Position for Bit 0 (1)(Figure 21) f = 40 MHz 1.0 1.4 2.15 ns
RSPos1 Receiver Input Strobe Position for Bit 1 4.5 5.0 5.8 ns
RSPos2 Receiver Input Strobe Position for Bit 2 8.1 8.5 9.15 ns
RSPos3 Receiver Input Strobe Position for Bit 3 11.6 11.9 12.6 ns
RSPos4 Receiver Input Strobe Position for Bit 4 15.1 15.6 16.3 ns
RSPos5 Receiver Input Strobe Position for Bit 5 18.8 19.2 19.9 ns
RSPos6 Receiver Input Strobe Position for Bit 6 22.5 22.9 23.6 ns
RSPos0 Receiver Input Strobe Position for Bit 0 (2)(Figure 21) f = 66 MHz 0.7 1.1 1.4 ns
RSPos1 Receiver Input Strobe Position for Bit 1 2.9 3.3 3.6 ns
RSPos2 Receiver Input Strobe Position for Bit 2 5.1 5.5 5.8 ns
RSPos3 Receiver Input Strobe Position for Bit 3 7.3 7.7 8.0 ns
RSPos4 Receiver Input Strobe Position for Bit 4 9.5 9.9 10.2 ns
RSPos5 Receiver Input Strobe Position for Bit 5 11.7 12.1 12.4 ns
RSPos6 Receiver Input Strobe Position for Bit 6 13.9 14.3 14.6 ns
RSKM RxIN Skew Margin (3)(Figure 22) f = 40 MHz 490 ps
f = 66 MHz 400 ps
RCOP RxCLK OUT Period (Figure 11) 15 T 50 ns
RCOH RxCLK OUT High Time (Figure 11) f = 40 MHz 6.0 10.0 ns
f = 66 MHz 4.0 6.1 ns
(1) The min. and max. are based on the actual bit position of each of the 7 bits within the LVDS data stream across PVT.
(2) The min. and max. limits are based on the worst bit by applying a −400ps/+300ps shift from ideal position.
(3) Receiver Skew Margin is defined as the valid data sampling region at the receiver inputs. This margin takes into account for transmitter
pulse positions (min and max) and the receiver input setup and hold time (internal data sampling window). This margin allows LVDS
interconnect skew, inter-symbol interference (both dependent on type/length of cable), and clock jitter less than 250 ps.
Copyright © 1999–2013, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Links: DS90CR215 DS90CR216
DS90CR215, DS90CR216
SNLS129D –MARCH 1999–REVISED APRIL 2013
www.ti.com
Receiver Switching Characteristics (continued)
Over recommended operating supply and −40°C to +85°C ranges unless otherwise specified
Symbol Parameter Min Typ Max Units
RCOL RxCLK OUT Low Time (Figure 11) f = 40 MHz 10.0 13.0 ns
f = 66 MHz 6.0 7.8 ns
RSRC RxOUT Setup to RxCLK OUT (Figure 11) f = 40 MHz 6.5 14.0 ns
f = 66 MHz 2.5 8.0 ns
RHRC RxOUT Hold to RxCLK OUT (Figure 11) f = 40 MHz 6.0 8.0 ns
f = 66 MHz 2.5 4.0 ns
RCCD RxCLK IN to RxCLK OUT Delay (Figure 13) f = 40 MHz 4.0 6.7 8.0 ns
f = 66 MHz 5.0 6.6 9.0 ns
RPLLS Receiver Phase Lock Loop Set (Figure 15) 10 ms
RPDD Receiver Powerdown Delay (Figure 19) 1 μs
AC Timing Diagrams
Figure 5. “Worst Case” Test Pattern
Figure 6. DS90CR215 (Transmitter) LVDS Output Load and Transition Times
6Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: DS90CR215 DS90CR216
DS90CR215, DS90CR216
www.ti.com
SNLS129D –MARCH 1999–REVISED APRIL 2013
Figure 7. DS90CR216 (Receiver) CMOS/TTL Output Load and Transition Times
Figure 8. D590CR215 (Transmitter) Input Clock Transition Time
A. Measurements at VDIFF = 0V
B. TCCS measured between earliest and latest LVDS edges
C. TxCLK Differential Low→High Edge
Figure 9. D590CR215 (Transmitter) Channel-to-Channel Skew
Figure 10. D590CR215 (Transmitter) Setup/Hold and High/Low Times
Copyright © 1999–2013, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Links: DS90CR215 DS90CR216
TxCLK IN
TxCLK OUT
TCCD
DS90CR215, DS90CR216
SNLS129D –MARCH 1999–REVISED APRIL 2013
www.ti.com
Figure 11. D590CR216 (Receiver) Setup/Hold and High/Low Times
Figure 12. DS90CR215 (Transmitter) Clock In to Clock Out Delay
Figure 13. D590CR216 (Receiver) Clock In to Clock Out Delay
Figure 14. DS90CR215 (Transmitter) Phase Lock Loop Set Time
8Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: DS90CR215 DS90CR216
DS90CR215, DS90CR216
www.ti.com
SNLS129D –MARCH 1999–REVISED APRIL 2013
Figure 15. DS9OCR216 (Receiver) Phase Lock Loop Set Time
Figure 16. Seven Bits of LVDS in Once Clock Cycle
Figure 17. 21 Parallel TTL Data Inputs Mapped to LVDS Outputs (DS90CR215)
Figure 18. Transmitter Powerdown Delay
Copyright © 1999–2013, Texas Instruments Incorporated Submit Documentation Feedback 9
Product Folder Links: DS90CR215 DS90CR216
DS90CR215, DS90CR216
SNLS129D –MARCH 1999–REVISED APRIL 2013
www.ti.com
C—Setup and Hold Time (Internal data sampling window) defined by Rspos (receiver input strobe position) min and
max
Tppos—Transmitter output pulse position (min and max)
RSKM ≥Cable Skew (type, length) + Source Clock Jitter (cycle to cycle) + ISI (Inter-symbol interference)
Cable Skew—typicaIIy 10 ps–40 ps per foot, media dependent
Cycle-to-cycle jitter is less than 250 ps
ISI is dependent on interconnect length; may be zero
Figure 22. Receiver LVDS Input Skew Margin
12 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: DS90CR215 DS90CR216
DS90CR215, DS90CR216
www.ti.com
SNLS129D –MARCH 1999–REVISED APRIL 2013
APPLICATIONS INFORMATION
The DS90CR215 and DS90CR216 are backward compatible with the existing 5V Channel Link
transmitter/receiver pair (DS90CR213, DS90CR214). To upgrade from a 5V to a 3.3V system the following must
be addressed:
1. Change 5V power supply to 3.3V. Provide this supply to the VCC, LVDS VCC and PLL V CC.
2. Transmitter input and control inputs except 3.3V TTL/CMOS levels. They are not 5V tolerant.
3. The receiver powerdown feature when enabled wilI lock receiver output to a logic low. However, the 5V/66
MHz receiver maintain the outputs in the previous state when powerdown occurred.
DS90CR215 Pin Descriptions — Channel Link Transmitter
Pin Name I/O No. Description
TxIN I 21 TTL level input.
TxOUT+ O 3 Positive LVDS differential data output.
TxOUT−O 3 Negative LVDS differential data output.
TxCLK IN I 1 TTL level clock input. The rising edge acts as data strobe. Pin name TxCLK IN.
TxCLK OUT+ O 1 Positive LVDS differential clock output.
TxCLK OUT−O 1 Negative LVDS differential clock output.
PWR DWN I 1 TTL level input. Assertion (low input) TRI-STATEs the outputs, ensuring low current at power down.
VCC I 4 Power supply pins for TTL inputs.
GND I 5 Ground pins for TTL inputs.
PLL V CC I 1 Power supply pins for PLL.
PLL GND I 2 Ground pins for PLL.
LVDS V CC I 1 Power supply pin for LVDS outputs.
LVDS GND I 3 Ground pins for LVDS outputs.
DS90CR216 Pin Descriptions — Channel Link Receiver
Pin Name I/O No. Description
RxIN+ I 3 Positive LVDS differential data inputs.
RxIN−I 3 Negative LVDS differential data inputs.
RxOUT O 21 TTL level data outputs.
RxCLK IN+ I 1 Positive LVDS differential clock input.
RxCLK IN−I 1 Negative LVDS differential clock input.
RxCLK OUT O 1 TTL level clock output. The rising edge acts as data strobe. Pin name RxCLK OUT.
PWR DWN I 1 TTL level input. When asserted (low input) the receiver outputs are low.
VCC I 4 Power supply pins for TTL outputs.
GND I 5 Ground pins for TTL outputs.
PLL V CC I 1 Power supply for PLL.
PLL GND 1 2 Ground pin for PLL.
LVDS V CC I 1 Power supply pin for LVDS inputs.
LVDS GND I 3 Ground pins for LVDS inputs.
The Channel Link devices are intended to be used in a wide variety of data transmission applications. Depending
upon the application the interconnecting media may vary. For example, for lower data rate (clock rate) and
shorter cable lengths (< 2m), the media electrical performance is less critical. For higher speed/long distance
applications the media's performance becomes more critical. Certain cable constructions provide tighter skew
(matched electrical length between the conductors and pairs). Twin-coax for example, has been demonstrated at
distances as great as 5 meters and with the maximum data transfer of 1.38 Gbit/s. Additional applications
information can be found in the following Interface Application Notes:
Copyright © 1999–2013, Texas Instruments Incorporated Submit Documentation Feedback 13
Product Folder Links: DS90CR215 DS90CR216
DS90CR215, DS90CR216
SNLS129D –MARCH 1999–REVISED APRIL 2013
www.ti.com
AN = #### Topic
AN-1041 (SNLA218) Introduction to Channel Link
AN-1035 (SNOA355) PCB Design Guidelines for LVDS and Link
Devices
AN-806 (SNLA026) Transmission Line Theory
AN-905 (SNLA035) Transmission Line Calculations and Differential
Impedance
AN-916 (SNLA219) Cable Information
CABLES
A cable interface between the transmitter and receiver needs to support the differential LVDS pairs. The 21-bit
CHANNEL LINK chipset (DS90CR215/216) requires four pairs of signal wires and the 28-bit CHANNEL LINK
chipset (DS90CR285/286) requires five pairs of signal wires. The ideal cable/connector interface would have a
constant 100Ωdifferential impedance throughout the path. It is also recommended that cable skew remain below
150 ps (@ 66 MHz clock rate) to maintain a sufficient data sampling window at the receiver.
In addition to the four or five cable pairs that carry data and clock, it is recommended to provide at least one
additional conductor (or pair) which connects ground between the transmitter and receiver. This low impedance
ground provides a common mode return path for the two devices. Some of the more commonly used cable types
for point-to-point applications include flat ribbon, flex, twisted pair and Twin-Coax. All are available in a variety of
configurations and options. Flat ribbon cable, flex and twisted pair generally perform well in short point-to-point
applications while Twin-Coax is good for short and long applications. When using ribbon cable, it is
recommended to place a ground line between each differential pair to act as a barrier to noise coupling between
adjacent pairs. For Twin-Coax cable applications, it is recommended to utilize a shield on each cable pair. All
extended point-to-point applications should also employ an overall shield surrounding all cable pairs regardless
of the cable type. This overall shield results in improved transmission parameters such as faster attainable
speeds, longer distances between transmitter and receiver and reduced problems associated with EMS or EMI.
The high-speed transport of LVDS signals has been demonstrated on several types of cables with excellent
results. However, the best overall performance has been seen when using Twin-Coax cable. Twin-Coax has very
low cable skew and EMI due to its construction and double shielding. All of the design considerations discussed
here and listed in the supplemental application notes provide the subsystem communications designer with many
useful guidelines. It is recommended that the designer assess the tradeoffs of each application thoroughly to
arrive at a reliable and economical cable solution.
BOARD LAYOUT
To obtain the maximum benefit from the noise and EMI reductions of LVDS, attention should be paid to the
layout of differential lines. Lines of a differential pair should always be adjacent to eliminate noise interference
from other signals and take full advantage of the noise canceling of the differential signals. The board designer
should also try to maintain equal length on signal traces for a given differential pair. As with any high speed
design, the impedance discontinuities should be limited (reduce the numbers of vias and no 90 degree angles on
traces). Any discontinuities which do occur on one signal line should be mirrored in the other line of the
differential pair. Care should be taken to ensure that the differential trace impedance match the differential
impedance of the selected physical media (this impedance should also match the value of the termination
resistor that is connected across the differential pair at the receiver's input). Finally, the location of the CHANNEL
LINK TxOUT/RxIN pins should be as close as possible to the board edge so as to eliminate excessive pcb runs.
All of these considerations will limit reflections and crosstalk which adversely effect high frequency performance
and EMI.
UNUSED INPUTS
All unused inputs at the TxIN inputs of the transmitter must be tied to ground. All unused outputs at the RxOUT
outputs of the receiver must then be left floating.
14 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: DS90CR215 DS90CR216
DS90CR215, DS90CR216
www.ti.com
SNLS129D –MARCH 1999–REVISED APRIL 2013
TERMINATION
Use of current mode drivers requires a terminating resistor across the receiver inputs. The CHANNEL LINK
chipset will normally require a single 100Ωresistor between the true and complement lines on each differential
pair of the receiver input. The actual value of the termination resistor should be selected to match the differential
mode characteristic impedance (90Ωto 120Ωtypical) of the cable. Figure 23 shows an example. No additional
pull-up or pull-down resistors are necessary as with some other differential technologies such as PECL. Surface
mount resistors are recommended to avoid the additional inductance that accompanies leaded resistors. These
resistors should be placed as close as possible to the receiver input pins to reduce stubs and effectively
terminate the differential lines.
Figure 23. LVDS Serialized Link Termination
DECOUPLING CAPACITORS
Bypassing capacitors are needed to reduce the impact of switching noise which could limit performance. For a
conservative approach three parallel-connected decoupling capacitors (Multi-Layered Ceramic type in surface
mount form factor) between each VCC and the ground plane(s) are recommended. The three capacitor values are
0.1 μF, 0.01μF and 0.001 μF. An example is shown in Figure 24. The designer should employ wide traces for
power and ground and ensure each capacitor has its own via to the ground plane. If board space is limiting the
number of bypass capacitors, the PLL VCC should receive the most filtering/bypassing. Next would be the LVDS
VCC pins and finally the logic VCC pins.
Figure 24. CHANNEL LINK
Decoupling Configuration
CLOCK JITTER
The CHANNEL LINK devices employ a PLL to generate and recover the clock transmitted across the LVDS
interface. The width of each bit in the serialized LVDS data stream is one-seventh the clock period. For example,
a 66 MHz clock has a period of 15 ns which results in a data bit width of 2.16 ns. Differential skew (Δt within one
differential pair), interconnect skew (Δt of one differential pair to another) and clock jitter will all reduce the
available window for sampling the LVDS serial data streams. Care must be taken to ensure that the clock input
to the transmitter be a clean low noise signal. Individual bypassing of each VCC to ground will minimize the noise
passed on to the PLL, thus creating a low jitter LVDS clock. These measures provide more margin for channel-
to-channel skew and interconnect skew as a part of the overall jitter/skew budget.
Copyright © 1999–2013, Texas Instruments Incorporated Submit Documentation Feedback 15
Product Folder Links: DS90CR215 DS90CR216
DS90CR215, DS90CR216
SNLS129D –MARCH 1999–REVISED APRIL 2013
www.ti.com
COMMON MODE vs. DIFFERENTIAL MODE NOISE MARGIN
The typical signal swing for LVDS is 300 mV centered at +1.2V. The CHANNEL LINK receiver supports a 100
mV threshold therefore providing approximately 200 mV of differential noise margin. Common mode protection is
of more importance to the system's operation due to the differential data transmission. LVDS supports an input
voltage range of Ground to +2.4V. This allows for a ±1.0V shifting of the center point due to ground potential
differences and common mode noise.
POWER SEQUENCING AND POWERDOWN MODE
Outputs of the CNANNEL LINK transmitter remain in TRI-STATE until the power supply reaches 2V. Clock and
data outputs will begin to toggle 10 ms after VCC has reached 3V and the Powerdown pin is above 1.5V. Either
device may be placed into a powerdown mode at any time by asserting the Powerdown pin (active low). Total
power dissipation for each device will decrease to 5 μW (typical).
The CHANNEL LINK chipset is designed to protect itself from accidental loss of power to either the transmitter or
receiver. If power to the transmit board is lost, the receiver clocks (input and output) stop. The data outputs
(RxOUT) retain the states they were in when the clocks stopped. When the receiver board loses power, the
receiver inputs are shorted to V CC through an internal diode. Current is limited (5 mA per input) by the fixed
current mode drivers, thus avoiding the potential for latchup when powering the device.
Figure 25. Single-Ended and Differential Waveforms
16 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: DS90CR215 DS90CR216
DS90CR215, DS90CR216
www.ti.com
SNLS129D –MARCH 1999–REVISED APRIL 2013
REVISION HISTORY
Changes from Revision C (April 2013) to Revision D Page
• Changed layout of National Data Sheet to TI format .......................................................................................................... 16
Copyright © 1999–2013, Texas Instruments Incorporated Submit Documentation Feedback 17
Product Folder Links: DS90CR215 DS90CR216
PACKAGE OPTION ADDENDUM
www.ti.com 1-Nov-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
DS90CR215MTD NRND TSSOP DGG 48 38 TBD Call TI Call TI -40 to 85 DS90CR215MTD
>B
DS90CR215MTD/NOPB ACTIVE TSSOP DGG 48 38 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 85 DS90CR215MTD
>B
DS90CR215MTDX/NOPB ACTIVE TSSOP DGG 48 1000 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 85 DS90CR215MTD
>B
DS90CR216MTD NRND TSSOP DGG 48 38 TBD Call TI Call TI DS90CR216MTD
>B
DS90CR216MTD/NOPB NRND TSSOP DGG 48 38 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR DS90CR216MTD
>B
DS90CR216MTDX NRND TSSOP DGG 48 1000 TBD Call TI Call TI DS90CR216MTD
>B
DS90CR216MTDX/NOPB NRND TSSOP DGG 48 1000 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR DS90CR216MTD
>B
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
PACKAGE OPTION ADDENDUM
www.ti.com 1-Nov-2013
Addendum-Page 2
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
DS90CR215MTDX/NOPB TSSOP DGG 48 1000 330.0 24.4 8.6 13.2 1.6 12.0 24.0 Q1
DS90CR216MTDX TSSOP DGG 48 1000 330.0 24.4 8.6 13.2 1.6 12.0 24.0 Q1
DS90CR216MTDX/NOPB TSSOP DGG 48 1000 330.0 24.4 8.6 13.2 1.6 12.0 24.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 16-May-2015
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
DS90CR215MTDX/NOPB TSSOP DGG 48 1000 367.0 367.0 45.0
DS90CR216MTDX TSSOP DGG 48 1000 367.0 367.0 45.0
DS90CR216MTDX/NOPB TSSOP DGG 48 1000 367.0 367.0 45.0
PACKAGE MATERIALS INFORMATION
www.ti.com 16-May-2015
Pack Materials-Page 2
MECHANICAL DATA
MTSS003D – JANUARY 1995 – REVISED JANUAR Y 1998
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DGG (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
4040078/F 12/97
48 PINS SHOWN
0,25
0,15 NOM
Gage Plane
6,00
6,20 8,30
7,90
0,75
0,50
Seating Plane
25
0,27
0,17
24
A
48
1
1,20 MAX
M
0,08
0,10
0,50
0°–8°
56
14,10
13,90
48
DIM
A MAX
A MIN
PINS **
12,40
12,60
64
17,10
16,90
0,15
0,05
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2016, Texas Instruments Incorporated
