SHT1x / SHT7x Relative Humidity & Temperature Sensor System
www.sensirion.com v2.02 July 2004 6/9
4 Applications Information
4.1 Operating and Storage Conditions
0
20
40
-40 0 10040 80 120
60
80
100
[°C]
[%RH]
6020-20
Maximum operating
conditions
Normal operating
conditions
Figure 11 Recommended operating conditions
Conditions outside the recommended range may temporarily
offset the RH signal up to ±3 %RH. After return to normal
conditions it will slowly return towards calibration state by
itself. See 4.3 “Reconditioning Procedure” to accelerate this
process. Prolonged exposure to extreme conditions may
accelerate ageing.
4.2 Exposure to Chemicals
Chemical vapors may interfere with the polymer layers used
for capacitive humidity sensors. The diffusion of chemicals
into the polymer may cause a shift in both offset and
sensitivity. In a clean environment the contaminants will
slowly outgas. The reconditioning procedure described
below will accelerate this process. High levels of pollutants
may cause permanent damage to the sensing polymer.
4.3 Reconditioning Procedure
The following reconditioning procedure will bring the sensor
back to calibration state after exposure to extreme conditions
or chemical vapors.
80-90 °C (176-194°F) at < 5 %RH for 24h (baking) followed by
20-30 °C (70-90°F) at > 74 %RH for 48h (re-hydration)
4.4 Temperature Effects
The relative humidity of a gas strongly depends on its
temperature. It is therefore essential to keep humidity
sensors at the same temperature as the air of which the
relative humidity is to be measured.
If the SHTxx shares a PCB with electronic components that
give off heat it should be mounted far away and below the
heat source and the housing must remain well ventilated.
To reduce heat conduction copper layers between the
SHT1x and the rest of the PCB should be minimized and a
slit may be milled in between (see figure 13).
4.5 Membranes
A membrane may be used to prevent dirt from entering the
housing and to protect the sensor. It will also reduce peak
concentrations of chemical vapors. For optimal response
times air volume behind the membrane must be kept to a
minimum. For the SHT1x package Sensirion recommends
the SF1 filter cap for optimal IP67 protection.
4.6 Light
The SHTxx is not light sensitive. Prolonged direct exposure
to sunshine or strong UV radiation may age the housing.
4.7 Materials Used for Sealing / Mounting
Many materials absorb humidity and will act as a buffer,
increasing response times and hysteresis. Materials in the
vicinity of the sensor must therefore be carefully chosen.
Recommended materials are: All Metals, LCP, POM (Delrin),
PTFE (Teflon), PE, PEEK, PP, PB, PPS, PSU, PVDF, PVF
For sealing and gluing (use sparingly): High filled epoxy for
electronic packaging (e.g. glob top, underfill), and Silicone.
Outgassing of these materials may also contaminate the
SHTxx (cf. 4.2). Store well ventilated after manufacturing or
bake at 50°C for 24h to outgas contaminants before
packing.
4.8 Wiring Considerations and Signal Integrity
Carrying the SCK and DATA signal parallel and in close
proximity (e.g. in wires) for more than 10cm may result in
cross talk and loss of communication. This may be resolved
by routing VDD and/or GND between the two data signals.
Please see the application note “ESD, Latchup and EMC” for
more information.
Power supply pins (VDD, GND) should be decoupled with a
100 nF capacitor if wires are used.
4.9 Qualifications
Extensive tests were performed in various environments.
Please contact SENSIRION for detailed information.
Environment Norm Results(1)
Temperature
Cycles JESD22-A104-B
-40 °C / 125 °C, 1000 cy
Within
Specifications
HAST
Pressure Cooker JESD22-A110-B
2.3 bar 125 °C 85 %RH Reversible shift
by +2 %RH
High Temperature
and Humidity JESD22-A101-B
85 °C 85 %RH 1250h
Reversible shift
by +2 %RH
Salt Atmosphere DIN-50021ss Within Spec.
Condensing Air - Within Spec.
Freezing cycles
fully submerged -20 / +90 °C, 100 cy
30min dwell time
Reversible shift
by +2 %RH
arious Automotive
Chemicals DIN 72300-5 Within
Specifications
Table 9 Qualification tests (excerpt)
4.10 ESD (Electrostatic Discharge)
ESD immunity is qualified according to MIL STD 883E,
method 3015 (Human Body Model at ±2 kV)).
Latch-up immunity is provided at a force current of ±100 mA
with Tamb = 80 °C according to JEDEC 17. See application
note “ESD, Latchup and EMC” for more information.
(1) The temperature sensor passed all tests without any detectable drift. Package and electronics also passed 100%