Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/
AXK(5/6)F
ACCTB23E 201211-T
ORDERING INFORMATION
For board-to-board For board-to-FPC
P5KF Series
Narrow pitch connectors
(0.5mm pitch)
FEATURES
1. Two-piece structure and 0.5mm
pitch.
The product lineup includes mated
heights of 1.5mm, 2.0mm and 2.5mm.
2. Strong resistance to adverse
environments! Utilizes
“” construction
for high contact reliability.
3. Simple lock structure provides
tactile feedback to ensure excellent
mating/unmating operation feel.
4. Effective mating length 0.55mm
In addition to achieving a low profile of
1.5mm between PCBs, the effective
mating length has been extended to
ensure that there is latitude for insertion.
5. The lower connector bottom surface
construction prevents contact and
shorts between the PCB and metal
terminals.
Benefits include freedom in pattern
wiring, helping to make PCB’s smaller.
6. Gull-wing-shaped terminals to
facilitate visual inspections.
7. Connectors for inspection available
APPLICATIONS
Digital devices, such as digital still
cameras and digital video cameras.
Socket Header
3.3mm
5.8mm
RoHS compliant
Simple lock mechanism
0.55mm
<Socket>
Connector bottom: Create any thru-hole and pattern wiring.
<Header>
Mated height
<Socket>
3: For mated height 1.5 mm
5: For mated height 2.0 mm and 2.5 mm
<Header>
3: For mated height 1.5 mm and 2.0 mm
5: For mated height 2.5 mm
Surface treatment (Contact portion / Terminal portion)
<Socket>
7: Ni plating on base, Au plating on surface/Ni plating on base, Au plating on surface (for Ni barrier available)
Contact portion
<Socket> Y: V notch type product (chamfered on both ends)
<Header> Y: V notch type product
Number of pins (2 digits)
Packing
G: 2,000 pieces embossed tape and plastic reel × 2
5F: Narrow Pitch Connector P5KF (0.5 mm pitch) Socket
6F: Narrow Pitch Connector P5KF (0.5 mm pitch) Header
Functions
3: With positioning bosses
4: Without positioning bosses
7YGAXK
Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/
AXK(5/6)F
ACCTB23E 201211-T
PRODUCT TYPES
Notes: 1. Regarding ordering units, During production: Please make orders in 1-reel units.
Samples for mounting confirmation: Available in units of 50 pieces. Please consult us. (See “Regarding sample orders to confirm proper mounting” on page 169.)
Samples: Small lot orders are possible. Please consult us.
2. The standard type comes without positioning bosses. Connectors with positioning bosses are available for on-demand production. For this type of connector, 9th
digit of the part no. changes from 4 to 3. e.g.
Mated height 1.5mm, 10 pin contacts for sockets: AXK5F10337YG
3. The 11th digit “Y” in the socket/header part number indicates the connector has a V notch. (For details, please consult one of our sales offices.)
Mated height No. of pins
Part No. Packing
Socket Header Inner carton (1-reel) Outer carton
1.5 mm
10 AXK5F10347YG AXK6F10347YG
2,000 pieces 4,000 pieces
12 AXK5F12347YG AXK6F12347YG
14 AXK5F14347YG AXK6F14347YG
16 AXK5F16347YG AXK6F16347YG
18 AXK5F18347YG AXK6F18347YG
20 AXK5F20347YG AXK6F20347YG
22 AXK5F22347YG AXK6F22347YG
24 AXK5F24347YG AXK6F24347YG
26 AXK5F26347YG AXK6F26347YG
30 AXK5F30347YG AXK6F30347YG
32 AXK5F32347YG AXK6F32347YG
34 AXK5F34347YG AXK6F34347YG
40 AXK5F40347YG AXK6F40347YG
50 AXK5F50347YG AXK6F50347YG
60 AXK5F60347YG AXK6F60347YG
70 AXK5F70347YG AXK6F70347YG
80 AXK5F80347YG AXK6F80347YG
2.0 mm
10 AXK5F10547YG AXK6F10347YG
12 AXK5F12547YG AXK6F12347YG
14 AXK5F14547YG AXK6F14347YG
16 AXK5F16547YG AXK6F16347YG
18 AXK5F18547YG AXK6F18347YG
20 AXK5F20547YG AXK6F20347YG
22 AXK5F22547YG AXK6F22347YG
24 AXK5F24547YG AXK6F24347YG
26 AXK5F26547YG AXK6F26347YG
30 AXK5F30547YG AXK6F30347YG
34 AXK5F34547YG AXK6F34347YG
40 AXK5F40547YG AXK6F40347YG
50 AXK5F50547YG AXK6F50347YG
60 AXK5F60547YG AXK6F60347YG
70 AXK5F70547YG AXK6F70347YG
80 AXK5F80547YG AXK6F80347YG
100 AXK5F00547YG AXK6F00347YG
2.5 mm
10 AXK5F10547YG AXK6F10547YG
12 AXK5F12547YG AXK6F12547YG
14 AXK5F14547YG AXK6F14547YG
16 AXK5F16547YG AXK6F16547YG
20 AXK5F20547YG AXK6F20547YG
22 AXK5F22547YG AXK6F22547YG
24 AXK5F24547YG AXK6F24547YG
30 AXK5F30547YG AXK6F30547YG
34 AXK5F34547YG AXK6F34547YG
40 AXK5F40547YG AXK6F40547YG
50 AXK5F50547YG AXK6F50547YG
60 AXK5F60547YG AXK6F60547YG
70 AXK5F70547YG AXK6F70547YG
80 AXK5F80547YG AXK6F80547YG
100 AXK5F00547YG AXK6F00547YG
Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/
AXK(5/6)F
ACCTB23E 201211-T
SPECIFICATIONS
1. Characteristics
2. Material and surface treatment
Item Specifications Conditions
Electrical
characteristics
Rated current 0.5A/pin contact (Max. 10 A at total pin contacts)
Rated voltage 60V AC/DC
Breakdown voltage 150V AC for 1 minute Detection current: 1mA
Insulation resistance Min. 1,000MΩ (initial) Using 500V DC megger
Contact resistance Max. 90mΩBased on the contact resistance measurement method specified by
JIS C 5402.
Mechanical
characteristics
Composite insertion force Max. 0.981N/pin contacts × pin contacts (initial)
Composite removal force Min. 0.0588N/pin contacts × pin contacts
Contact holding force Min. 0.981N/pin contact Measuring the maximum force.
As the contact is axially pull out.
Environmental
characteristics
Ambient temperature –55°C to +85°C No freezing at low temperatures
Soldering heat resistance
Max. peak temperature of 260°C (on the surface
of the PC board around the connector terminals) Infrared reflow soldering
300°C within 5 seconds, 350°C within 3 seconds Soldering iron
Storage temperature –55°C to +85°C (product only)
–40°C to +50°C (emboss packing) No freezing at low temperatures. No dew condensation.
Thermal shock resistance
(header and socket mated)
5 cycles, insulation resistance min. 100MΩ,
contact resistance max. 90mΩ
Conformed to MIL-STD-202F, method 107G
Humidity resistance
(header and socket mated)
120 hours, insulation resistance min. 100MΩ,
contact resistance max. 90mΩBath temperature 40±2°C, humidity 90 to 95% R.H.
Saltwater spray resistance
(header and socket mated)
24 hours, insulation resistance min. 100MΩ,
contact resistance max. 90mΩBath temperature 35±2°C, saltwarter concentration 5±1%
H2S resistance
(header and socket mated) 48 hours, contact resistance max. 90mΩBath temperature 40±2°C, gas concentration 3±1 ppm,
humidity 75 to 80% R.H.
Lifetime
characteristics Insertion and removal life 50 times Repeated insertion and removal speed of max. 200 times/hours
Unit weight
Mated height 1.5mm, 20 pin contacts;
Socket: 0.06g
Header: 0.04g
Part name Material Surface treatment
Molded portion LCP resin (UL94V-0) —
Contact/Post Copper alloy
Contact portion: Ni plating on base, Au plating on surface
Te r minal portion: Ni plating on base, Au plating on surface (Except for thick of terminal)
The section close to the soldering portion has a nickel barrier.
(The nickel base is exposed.)
Order Temperature (°C) Time (minutes)
1
2
3
4
–55
85
–55
0
−330
Max. 5
30
Max. 5
+3
0
0
−3
Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/
AXK(5/6)F
ACCTB23E 201211-T
DIMENSIONS (Unit: mm)
• Socket and header are mated
The CAD data of the products with a CAD Data mark can be downloaded from: http://industrial.panasonic.com/ac/e/
• Socket (Mated height: 1.5mm, 2.0mm, 2.5mm)
Dimension table (mm)
No. of pins A B
10 5.50 2.00
12 6.00 2.50
14 6.50 3.00
16 7.00 3.50
18 7.50 4.00
20 8.00 4.50
22 8.50 5.00
24 9.00 5.50
26 9.50 6.00
30 10.50 7.00
32 11.00 7.50
34 11.50 8.00
40 13.00 9.50
50 15.50 12.00
60 18.00 14.50
70 20.50 17.00
80 23.00 19.50
100 28.00 24.50
General tolerance: ±0.2
C
0.10
(0.80)
(0.80)
0.12±0.03
0.50±0.05
1.70
(Suction face) 4.80
B±0.1
A
4.20 5.80
0.20±0.03
0.50±0.05
Mated height C
1.5 mm 1.35
2.0 mm, 2.5 mm 1.85
CAD Data
• Header (Mated height: 1.5mm, 2.0mm, 2.5mm)
Dimension table (mm)
No. of pins A B
10 5.50 2.00
12 6.00 2.50
14 6.50 3.00
16 7.00 3.50
18 7.50 4.00
20 8.00 4.50
22 8.50 5.00
24 9.00 5.50
26 9.50 6.00
30 10.50 7.00
32 11.00 7.50
34 11.50 8.00
40 13.00 9.50
50 15.50 12.00
60 18.00 14.50
70 20.50 17.00
80 23.00 19.50
100 28.00 24.50
Mated height C
1.5 mm, 2.0 mm 1.25
2.5 mm 1.75
General tolerance: ±0.2
0.10
1.80
0.12±0.03
(0.75)
3.30
(0.75)
C
0.96
A
2.50
B±0.1
0.50±0.050.50±0.05
0.20±0.03
(Suction
face)
CAD Data
Mated height: 1.5 mm Mated height: 2.0 mm Mated height: 2.5 mm
1.50±0.15 2.00±0.15
2.50±0.15
Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/
AXK(5/6)F
ACCTB23E 201211-T
EMBOSSED TAPE DIMENSIONS (unit: mm, Common for respective contact type, socket and header)
Dimension table (mm)
Suffix: G (1 reel, 2,000 pieces embossed tape: Plastic reel package)
Connector orientation with respect to direction of progress of embossed tape
Mated height No. of pins Type of taping A B C D Quantity per reel
Socket and header are common:
1.5mm, 2.0mm, 2.5mm
10 to 58 Tape I 24.0 — 11.5 25.4 2,000 pcs.
60 to 70 Tape II 32.0 28.4 14.2 33.4 2,000 pcs.
72 to 100 Tape II 44.0 40.4 20.2 45.4 2,000 pcs.
• Tape dimensions (Conforming to JIS C 0806-1990.
However, some tapes have mounting hole pitches that do
not comply with the standard.)
Tape I Tape II
1.75
C
12.0
A±0.3
4
2
1.5 dia.
+0.1
0
Pull out direction
1.75
C
12.0
A±0.3
4
2
Pull out direction
B
1.5 dia.
+0.1
0
• Plastic reel dimensions (Conforming to EIAJ ET–7200B)
D±1
Top cover tape
Taping reel
Embossed carrier tape
Embossed mounting-hole
380 dia.
Type
Direction of
tape progress
Common for P5KF
Socket Header
Note: There is no indication on this product regarding top-bottom or left-right orientation.
Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/
Notes on Using Narrow-pitch Connectors (Common)
ACCTB48E 201204-T
Regarding the design of devices and PC board patterns
Regarding the selection of the connector placement machine and the mounting
procedures
Notes on Using Narrow-pitch Connectors
(Common)
1) When connecting several connectors
together by stacking, make sure to
maintain proper accuracy in the design of
structure and mounting equipment so
that the connectors are not subjected to
twisting and torsional forces.
2) With mounting equipment, there may
be up to a ±0.2 to 0.3-mm error in
positioning. Be sure to design PC boards
and patterns while taking into
consideration the performance and
abilities of the required equipment.
3) Some connectors have tabs embossed
on the body to aid in positioning. When
using these connectors, make sure that
the PC board is designed with positioning
holes to match these tabs.
4) To ensure the required mechanical
strength when soldering the connector
terminals, make sure the PC board
meets recommended PC board pattern
design dimensions given.
5) For all connectors of the narrow-pitch
series, to prevent the PC board from
coming off during vibrations or impacts,
and to prevent loads from falling directly
on the soldered portions, be sure to
design some means to fix the PC board
in place.
Example) Secure in place with screws
When connecting PC boards, take
appropriate measures to prevent the
connector from coming off.
6) Notes when using a FPC.
(1) When the connector is soldered to an
FPC board, during its insertion and
removal procedures, forces may be
applied to the terminals and cause the
soldering to come off. It is recommended
to use a reinforcement board on the
backside of the FPC board to which the
connector is being connected. Please
make the reinforcement board
dimensions bigger than the outer limits of
the recommended PC board pattern
(should be approximately 1 mm greater
than the outer limit).
Material should be glass epoxy or
polyimide, and the thickness should be
between 0.2 and 0.3 mm.
(2) Collisions, impacts, or turning of FPC
boards, may apply forces on the
connector and cause it to come loose.
Therefore, make to design retaining
plates or screws that will fix the connector
in place.
7) The narrow-pitch connector series is
designed to be compact and thin.
Although ease of handling has been
taken into account, take care when
mating the connectors, as displacement
or angled mating could damage or
deform the connector.
Connector
Spacer
Spacer PC board
Screw
1) Select the placement machine taking
into consideration the connector height,
required positioning accuracy, and
packaging conditions.
2) Be aware that if the catching force of
the placement machine is too great, it
may deform the shape of the connector
body or connector terminals.
3) Be aware that during mounting,
external forces may be applied to the
connector contact surfaces and terminals
and cause deformations.
4) Depending on the size of the
connector being used, self alignment
may not be possible. In such cases, be
sure to carefully position the terminal with
the PC board pattern.
5) The positioning bosses give an
approximate alignment for positioning on
the PC board. For accurate positioning of
the connector when mounting it to the PC
board, we recommend using an
automatic positioning machine.
6) Excessive mounter chucking force may
deform the molded or metal part of the
connector. Consult us in advance if
chucking is to be applied.
Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/
Notes on Using Narrow-pitch Connectors (Common)
ACCTB48E 201204-T
Regarding soldering
1. Reflow soldering
1) Measure the recommended profile
temperature for reflow soldering by
placing a sensor on the PC board near
the connector surface or terminals. (The
setting for the sensor will differ depending
on the sensor used, so be sure to
carefully read the instructions that comes
with it.)
2) As for cream solder printing, screen
printing is recommended.
3) To determine the relationship between
the screen opening area and the PC-
board foot pattern area, refer to the
diagrams in the recommended patterns
for PC boards and metal masks. Make
sure to use the terminal tip as a reference
position when setting. Avoid an excessive
amount of solder from being applied,
otherwise, interference by the solder will
cause an imperfect contact.
4) Consult us when using a screen-
printing thickness other than that
recommended.
5) When mounting on both sides of the
PC board and the connector is mounting
on the underside, use adhesives or other
means to ensure the connector is
properly fixed to the PC board. (Double
reflow soldering on the same side is
possible.)
6) N2 reflow, conducting reflow soldering
in a nitrogen atmosphere, increases the
solder flow too greatly, enabling wicking
to occur. Make sure that the solder feed
rate and temperature profile are
appropriate.
Soldering conditions
Please use the reflow temperature profile
conditions recommended below for
reflow soldering. Please contact us
before using a temperature profile other
than that described below (e.g. lead-free
solder).
• Narrow-pitch connectors
(except P8 type)
• Narrow-pitch connector (P8)
For products other than the ones above,
please refer to the latest product
specifications.
7) The temperatures are measured at the
surface of the PC board near the
connector terminals. (The setting for the
sensor will differ depending on the sensor
used, so be sure to carefully read the
instructions that comes with it.)
8) The temperature profiles given in this
catalog are values measured when using
the connector on a resin-based PC
board. When performed reflow soldering
on a metal board (iron, aluminum, etc.) or
a metal table to mount on a FPC, make
sure there is no deformation or
discoloration of the connector beforehand
and then begin mounting.
9) Consult us when using a screen-
printing thickness other than that
recommended.
10) Some solder and flux types may
cause serious solder creeping. Solder
and flux characteristics should be taken
into consideration when setting the reflow
soldering conditions.
2. Hand soldering
1) Set the soldering iron so that the tip
temperature is less than that given in the
table below.
2) Do not allow flux to spread onto the
connector leads or PC board. This may
lead to flux rising up to the connector
inside.
3) Touch the soldering iron to the foot
pattern. After the foot pattern and
connector terminal are heated, apply the
solder wire so it melts at the end of the
connector terminals.
4) Be aware that soldering while applying
a load on the connector terminals may
cause improper operation of the
connector.
5) Thoroughly clean the soldering iron.
6) Flux from the solder wire may get on
the contact surfaces during soldering
operations. After soldering, carefully
check the contact surfaces and clean off
any solder before use.
7) For soldering of prototype devices
during product development, you can
perform soldering at the necessary
locations by heating with a hot-air gun by
applying cream solder to the foot pattern
beforehand. However, at this time, make
sure that the air pressure does not move
connectors by carefully holding them
down with tweezers or other similar tool.
Also, be careful not to go too close to the
connectors and melt any of the molded
components.
8) If an excessive amount of solder is
applied during manual soldering, the
solder may creep up near the contact
points, or solder interference may cause
imperfect contact.
3. Solder reworking
1) Finish reworking in one operation.
2) For reworking of the solder bridge, use
a soldering iron with a flat tip. To prevent
flux from climbing up to the contact
surfaces, do not add more flux.
3) Keep the soldering iron tip temperature
below the temperature given in Table A.
Te rminal Paste
solder
PC board
foot pattern
60 to 120 sec.
Preheating
Peak temperature
200°C
220°C
Upper limited (Solder heat resistance)
Peak temperature 260°C
230°C
180°C
150°C
70 sec.
25 sec.
Lower limited (Solder wettability)
Time
Temperature
60 to 120 sec.
Preheating
Time
Temperature
Peak temperature
200°C
155 to 165°C
245°C max.
Within 30 sec.
Product name Soldering iron temperature
SMD type connectors 300°C within 5 sec.
350°C within 3 sec.
Apply the solder
wire here
Terminal
Pattern
PC board
Small angle as
possible up to
45 degrees
Soldering
iron
Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/
Notes on Using Narrow-pitch Connectors (Common)
ACCTB48E 201204-T
Handling Single Components
Storage of connectors
Other Notes
1) Make sure not to drop or allow parts to
fall from work bench
2) Excessive force applied to the
terminals could cause warping, come
out, or weaken the adhesive strength of
the solder. Handle with care.
3) Repeated bending of the terminals
may cause terminals to break.
4) Do not insert or remove the connector
when it is not soldered. Forcibly applied
external pressure on the terminals can
weaken the adherence of the terminals to
the molded part or cause the terminals to
lose their evenness.
5) Excessive prying-force applied to one
end may cause product breakage and
separation of the solder joints at the
terminal.
Excessive force applied for insertion in a
pivot action as shown may also cause
product breakage.
Align the header and socket positions
before connecting them.
Cleaning flux from PC board
1) To increase the cleanliness of the
cleaning fluid and cleaning operations,
prepare equipment for cleaning process
beginning with boil cleaning, ultrasonic
cleaning, and then vapor cleaning.
2) Carefully oversee the cleanliness of
the cleaning fluids to make sure that the
contact surfaces do not become dirty
from the cleaning fluid itself.
3) Since some powerful cleaning
solutions may dissolve molded
components of the connector and wipe
off or discolor printed letters, we
recommend aqua pura electronic parts
cleaners. Please consult us if you wish to
use other types of cleaning fluids.
4) Please note that the surfaces of
molded parts may whiten when cleaned
with alcohol.
Handling the PC board
• Handling the PC board after
mounting the connector
When cutting or bending the PC board
after mounting the connector, be careful
that the soldered sections are subjected
to excessive force.
The soldered areas should not be subjected to force.
1) To prevent problems from voids or air
pockets due to heat of reflow soldering,
avoid storing the connectors in areas of
high humidity. When storing the
connectors for more than six months, be
sure to consider storage area where the
humidity is properly controlled.
2) Depending on the connector type, the
color of the connector may vary from
connector to connector depending on
when it is produced.
Some connectors may change color
slightly if subjected to ultraviolet rays
during storage. This is normal and will not
affect the operation of the connector.
3) When storing the connectors with the
PC boards assembled and components
alreeady set, be careful not to stack them
up so the connectors are subjected to
excessive forces.
4) Avoid storing the connectors in
locations with excessive dust. The dust
may accumulate and cause improper
connections at the contact surfaces.
1) These products are made for the
design of compact and lightweight
devices and therefore the thickness of the
molded components has been made very
thin. Therefore, be careful during
insertion and removal operations for
excessive forces applied may damage
the products.
2) Dropping of the products or rough
mishandling may bend or damage the
terminals and possibly hinder proper
reflow soldering.
3) Before soldering, try not to insert or
remove the connector more than
absolutely necessary.
4) When coating the PC board after
soldering the connector to prevent the
deterioration of insulation, perform the
coating in such a way so that the coating
does not get on the connector.
5) There may be variations in the colors
of products from different production lots.
This is normal.
6) The connectors are not meant to be
used for switching.
7) Be sure not to allow external pressure
to act on connectors when assembling
PCBs or moving in block assemblies.
Panasonic Corporation Automation Controls Business Unit industrial.panasonic.com/ac/e/
Notes on Using Narrow-pitch Connectors (Common)
ACCTB48E 201204-T
Regarding sample orders to confirm proper mounting
When ordering samples to confirm
proper mounting with the placement
machine, connectors are delivered in 50-
piece units in the condition given right.
Consult a sale representative for ordering
sample units.
Condition when delivered from manufacturing
Required number
of products for
sample production
(Unit 50 pcs.)
Embossed tape
amount required for
the mounting
Reel
(Delivery can also be made on a reel by
customer request.)
Please refer to the latest product
specifications when designing your
product.
