0 Virtex-4 FPGA Data Sheet: DC and Switching Characteristics R DS302 (v3.5) June 16, 2009 0 0 Product Specification Virtex-4 FPGA Electrical Characteristics Virtex(R)-4 FPGAs are available in -12, -11, and -10 speed grades, with -12 having the highest performance. Virtex-4 FPGA DC and AC characteristics are specified for both commercial and industrial grades. Except the operating temperature range or unless otherwise noted, all the DC and AC electrical parameters are the same for a particular speed grade (that is, the timing characteristics of a -10 speed grade industrial device are the same as for a -10 speed grade commercial device). However, only selected speed grades and/or devices might be available in the industrial range. All supply voltage and junction temperature specifications are representative of worst-case conditions. The parameters included are common to popular designs and typical applications. This Virtex-4 FPGA Data Sheet is part of an overall set of documentation on the Virtex-4 family of FPGAs that is available on the Xilinx(R) website: * * * * * * * * * Virtex-4 Family Overview, DS112 Virtex-4 FPGA User Guide, UG070 Virtex-4 FPGA Configuration Guide, UG071 XtremeDSP for Virtex-4 FPGAs User Guide, UG073 Virtex-4 Packaging and Pinout Specification, UG075 Virtex-4 PCB Designer's Guide, UG072 Virtex-4 RocketIOTM Multi-Gigabit Transceiver User Guide, UG076 Virtex-4 FPGA Embedded Tri-Mode Ethernet MAC User Guide, UG074 PowerPC(R) 405 Processor Block Reference Guide, UG018 All specifications are subject to change without notice. Virtex-4 FPGA DC Characteristics Table 1: Absolute Maximum Ratings Symbol Description Units VCCINT Internal supply voltage relative to GND -0.5 to 1.32 V VCCAUX Auxiliary supply voltage relative to GND -0.5 to 3.0 V VCCO Output drivers supply voltage relative to GND -0.5 to 3.75 V VBATT Key memory battery backup supply -0.5 to 4.05 V VREF Input reference voltage -0.3 to 3.75 V I/O input voltage relative to GND (all user and dedicated I/Os) -0.75 to 4.05 V -0.95 to 4.4 VIN I/O input voltage relative to GND (restricted to maximum of 100 user I/Os) (3,4) (Commercial Temperature) -0.85 to 4.3 V (Industrial Temperature) 2.5V or below I/O input voltage relative to GND (user and dedicated I/Os) IIN -0.75 to VCCO + 0.5 V Current applied to an I/O pin, powered or unpowered 100 mA Total current applied to all I/O pins, powered or unpowered 200 mA (c) 2004-2009 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the United States and other countries. The PowerPC name and logo are registered trademarks of IBM Corp. and used under license. All other trademarks are the property of their respective owners. DS302 (v3.5) June 16, 2009 Product Specification www.xilinx.com 1 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics Table 1: Absolute Maximum Ratings (Continued) Symbol Description Units Voltage applied to 3-state 3.3V output (all user and dedicated I/Os) -0.75 to 4.05 V -0.95 to 4.4 VTS Voltage applied to 3-state 3.3V output (restricted to maximum of 100 user I/Os) (3,4) (Commercial Temperature) -0.85 to 4.3 V (Industrial Temperature) 2.5V or below I/O input voltage relative to GND (user and dedicated I/Os) -0.75 to VCCO + 0.5 V AVCCAUXRX Receive auxiliary supply voltage relative to analog ground, GNDA (RocketIO pins) -0.5 to 1.32 V AVCCAUXTX Transmit auxiliary supply voltage relative to analog ground, GNDA (RocketIO pins) -0.5 to 1.32 V Management auxiliary supply voltage relative to analog ground, GNDA (RocketIO pins) -0.5 to 3.0 V VTRX Terminal receive supply voltage relative to GND -0.5 to 3.0 V VTTX Terminal transmit supply voltage relative to GND -0.5 to 1.65 V TSTG Storage temperature (ambient) -65 to 150 C +220 C +125 C AVCCAUXMGT TSOL TJ Maximum soldering Maximum junction temperature (2) temperature (2) Notes: 1. Stresses beyond those listed under Absolute Maximum Ratings might cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time might affect device reliability. 2. For soldering guidelines and thermal considerations, see the Virtex-4 Packaging and Pinout Specification on the Xilinx website. 3. When using more than 100 3.3V I/Os, refer to the Virtex-4 FPGA User Guide, Chapter 6, "3.3V I/O Design Guidelines." 4. For more flexibility in specific designs, a maximum of 100 user I/Os can be stressed beyond the normal spec for no more than 20% of a data period. There are no bank restrictions. Table 2: Recommended Operating Conditions Symbol VCCINT VCCAUX VCCO(1,3,4,5) Description Min Max Units Commercial 1.14 1.26 V Industrial 1.14 1.26 V Commercial 2.375 2.625 V Industrial 2.375 2.625 V Commercial 1.14 3.45 V Supply voltage relative to GND, TJ = -40C to +100C Industrial 1.14 3.45 V 3.3V supply voltage relative to GND, TJ = 0C to +85C Commercial GND - 0.20 3.45 V Industrial GND - 0.20 3.45 V 2.5V and below supply voltage relative to GND, TJ = 0C to +85C Commercial GND - 0.20 VCCO + 0.2 V 2.5V and below supply voltage relative to GND, TJ = -40C to +100C Industrial GND - 0.20 VCCO + 0.2 V Internal supply voltage relative to GND, TJ = 0C to +85C Internal supply voltage relative to GND, TJ = -40C to +100C Auxiliary supply voltage relative to GND, TJ = 0C to +85C Auxiliary supply voltage relative to GND, TJ = -40C to +100C Supply voltage relative to GND, TJ = 0C to +85C 3.3V supply voltage relative to GND, TJ = -40C to +100C VIN IIN VBATT(2) Maximum current through any pin in a powered or unpowered bank when forward biasing the clamp diode. Commercial 10 mA Industrial 10 mA Battery voltage relative to GND, TJ = 0C to +85C Commercial 1.0 3.6 V Industrial 1.0 3.6 V Battery voltage relative to GND, TJ = -40C to +100C DS302 (v3.5) June 16, 2009 Product Specification www.xilinx.com 2 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics Table 2: Recommended Operating Conditions (Continued) Symbol Description AVCCAUXRX (6) Auxiliary receive supply voltage relative to GNDA AVCCAUXTX (6) AVCCAUXMGT Min Max Units Commercial 1.14 1.26 V Industrial 1.14 1.26 V Commercial 1.14 1.26 V Industrial 1.14 1.26 V Commercial 2.375 2.625 V Industrial 2.375 2.625 V Commercial 0.25 2.5 V Industrial 0.25 2.5 V Commercial 1.14 1.575 V Industrial 1.14 1.575 V Auxiliary transmit supply voltage relative to GNDA Auxiliary management supply voltage relative to GNDA VTRX(7) Terminal receive supply voltage relative to GND VTTX Terminal transmit supply voltage relative to GND Notes: 1. Configuration data is retained even if VCCO drops to 0V. 2. VBATT is required only when using bitstream encryption. If battery is not used, connect VBATT to either ground or VCCAUX. 3. For 3.3V I/O operation, refer to the Virtex-4 FPGA User Guide. 4. Includes VCCO of 1.2V, 1.5V, 1.8V, 2.5V, and 3.3V 5. The configuration output supply voltage VCC_CONFIG is also known as VCCO_0 6. IMPORTANT! All unused RocketIO transceivers must be connected to power and GND. When using RocketIO transceivers, refer to the power filtering section of the Virtex-4 RocketIO Multi-Gigabit Transceiver User Guide. Unused transceivers must be powered by an appropriate voltage level source. Passive filtering must meet the requirements discussed in the Virtex-4 RocketIO Multi-Gigabit Transceiver User Guide. 7. Internal AC coupling is enabled. Table 3: DC Characteristics Over Recommended Operating Conditions Symbol Data Rate (Gb/s) Description Min Typ Max Units VDRINT Data retention VCCINT voltage (below which configuration data might be lost) 0.9 V VDRI Data retention VCCAUX voltage (below which configuration data might be lost) 2.0 V IREF VREF current per pin 10 A Input or output leakage current per pin (sample-tested) 10 A Input capacitance (sample-tested) 10 pF IL CIN IRPU(1) Pad pull-up (when selected) @ VIN = 0V, VCCO = 3.3V 5 200 A Pad pull-up (when selected) @ VIN = 0V, VCCO = 3.0V 5 125 A Pad pull-up (when selected) @ VIN = 0V, VCCO = 2.5V 5 120 A Pad pull-up (when selected) @ VIN = 0V, VCCO = 1.8V 5 60 A Pad pull-up (when selected) @ VIN = 0V, VCCO = 1.5V 5 40 A IRPD(1) Pad pull-down (when selected) @ VIN = VCCO 5 100 A IBATT(1) Battery supply current 75 100 nA 6.5 292 427 mA 5.0 302 485 mA 4.25 291 446 mA 3.125 279 382 mA 1.25/2.5 263 351 mA 1.25 Digital RX 314 432 mA I CCAUXRX(2) Operating AVCCAUXRX supply current DS302 (v3.5) June 16, 2009 Product Specification www.xilinx.com 3 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics Table 3: DC Characteristics Over Recommended Operating Conditions (Continued) Symbol I CCAUXTX(2) I CCAUXMGT(2) Data Rate (Gb/s) Description Min Typ Max Units 6.5 170 339 mA 5.0 180 355 mA 4.25 173 330 mA 3.125 165 307 mA 2.5 157 298 mA 1.25 151 295 mA 3 5 mA Operating AVCCAUXTX supply current Operating AVCCAUXMGT supply current I TTX(2) Operating ITTX supply current when transmitter is AC coupled or VTTX = VTRX 100 210 mA I TRX(2,3) Operating ITRX supply current when receiver is AC coupled or VTTX = VTRX 12 24 mA n PCPU r Temperature diode ideality factor 1.02 n Power dissipation of PowerPC 405 processor block 0.45 mW/MHz 2 Series resistance Notes: 1. Typical values are specified at nominal voltage, 25C. 2. Typical ICC numbers given per tile with both MGTs operating with default settings. Maximum ICC numbers given per tile with both MGTs operating with maximum amplitude and emphasis settings. 3. Varies with AC / DC coupling. Table 4: Quiescent Supply Current Symbol ICCINTQ Description Quiescent VCCINT supply current DS302 (v3.5) June 16, 2009 Product Specification Device Typ (1) Max Units XC4VLX15 46 Note (6) mA XC4VLX25 77 Note (6) mA XC4VLX40 121 Note (6) mA XC4VLX60 167 Note (6) mA XC4VLX80 220 Note (6) mA XC4VLX100 292 Note (6) mA XC4VLX160 384 Note (6) mA XC4VLX200 489 Note (6) mA XC4VSX25 94 Note (6) mA XC4VSX35 140 Note (6) mA XC4VSX55 271 Note (6) mA XC4VFX12 47 Note (6) mA XC4VFX20 71 Note (6) mA XC4VFX40 139 Note (6) mA XC4VFX60 203 Note (6) mA XC4VFX100 311 Note (6) mA XC4VFX140 442 Note (6) mA www.xilinx.com 4 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics Table 4: Quiescent Supply Current (Continued) Symbol ICCOQ Quiescent VCCO supply current ICCAUXQ ICCAUXRX Description (4) Quiescent VCCAUX supply current Quiescent AVCCAUXRX supply current DS302 (v3.5) June 16, 2009 Product Specification Device Typ (1) Max Units XC4VLX15 1.25 Note (6) mA XC4VLX25 1.25 Note (6) mA XC4VLX40 1.25 Note (6) mA XC4VLX60 1.5 Note (6) mA XC4VLX80 1.5 Note (6) mA XC4VLX100 1.75 Note (6) mA XC4VLX160 2.5 Note (6) mA XC4VLX200 2.5 Note (6) mA XC4VSX25 1.25 Note (6) mA XC4VSX35 1.25 Note (6) mA XC4VSX55 1.5 Note (6) mA XC4VFX12 1.25 Note (6) mA XC4VFX20 1.25 Note (6) mA XC4VFX40 1.25 Note (6) mA XC4VFX60 1.5 Note (6) mA XC4VFX100 1.75 Note (6) mA XC4VFX140 2.5 Note (6) mA XC4VLX15 31 Note (6) mA XC4VLX25 36 Note (6) mA XC4VLX40 43 Note (6) mA XC4VLX60 74 Note (6) mA XC4VLX80 83 Note (6) mA XC4VLX100 95 Note (6) mA XC4VLX160 133 Note (6) mA XC4VLX200 150 Note (6) mA XC4VSX25 62 Note (6) mA XC4VSX35 70 Note (6) mA XC4VSX55 91 Note (6) mA XC4VFX12 31 Note (6) mA XC4VFX20 35 Note (6) mA XC4VFX40 69 Note (6) mA XC4VFX60 80 Note (6) mA XC4VFX100 98 Note (6) mA XC4VFX140 143 Note (6) mA XC4VFX20 25 154 mA XC4VFX60 35 154 mA XC4VFX100 50 154 mA www.xilinx.com 5 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics Table 4: Quiescent Supply Current (Continued) Symbol ICCAUXTX (4) ITTX (4,5) ITRX (4,5) IAUXMGT (4) Description Quiescent AVCCAUXTX supply current Quiescent VTTX supply current Quiescent VTRX supply current Quiescent VAUXMGT supply current Device Typ (1) Max Units XC4VFX20 10 44 mA XC4VFX60 15 44 mA XC4VFX100 20 44 mA XC4VFX20 1 2 mA XC4VFX60 1 2 mA XC4VFX100 1 2 mA XC4VFX20 1 2 mA XC4VFX60 1 2 mA XC4VFX100 1 2 mA XC4VFX20 1 2 mA XC4VFX60 1 2 mA XC4VFX100 1 2 mA Notes: 1. 2. 3. 4. 5. 6. Typical values are specified at nominal voltage, 25C. Typical values are for blank configured devices with no output current loads, no active input pull-up resistors, all I/O pins are 3-state and floating. If DCI or differential signaling is used, more accurate quiescent current estimates can be obtained by using the Power Estimator or XPower tool. Given for entire die. Powered and unconfigured. Unconnected (if channel is driven to voltage). Use the XPower Estimator (XPE) tool to calculate maximum static power for specific process, voltage, and temperature conditions. DS302 (v3.5) June 16, 2009 Product Specification www.xilinx.com 6 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics Power-On Power Supply Requirements Xilinx FPGAs require a certain amount of supply current during power-on to insure proper device initialization. The actual current consumed depends on the power-on ramp rate of the power supply. The power supplies can be turned on in any sequence, though the specifications shown in Table 5 are for the recommended power-on sequence of VCCINT, VCCAUX, VCCO. Xilinx does not specify the current for other power-on sequences. Table 5 shows the minimum current required by Virtex-4 devices for proper power-on and configuration. If the current minimums shown in Table 5 are met, the device powers on properly after all three supplies have passed through their power-on reset threshold voltages. Once initialized and configured, use the XPower tool to estimate current drain on these supplies. Table 5: Power-On Current for Virtex-4 Devices ICCINTMIN ICCAUXMIN ICCOMIN Typ (1) Max (2) Typ (1) Max (2) Typ (1) Max (2) Units XC4VLX15 110 750 60 100 50 75 mA XC4VLX25 160 1350 85 125 75 100 mA XC4VLX40 250 1500 110 150 75 105 mA XC4VLX60 300 1925 225 300 150 250 mA XC4VLX80 400 2550 280 350 150 275 mA XC4VLX100 500 3200 335 425 200 300 mA XC4VLX160 700 3700 500 600 250 400 mA XC4VLX200 850 3850 500 600 250 400 mA XC4VSX25 175 725 110 150 75 105 mA XC4VSX35 250 1350 165 200 100 150 mA XC4VSX55 400 2225 225 300 150 225 mA XC4VFX12 111 750 56 100 50 75 mA XC4VFX20 151 1100 56 100 75 125 mA XC4VFX40 244 1650 167 250 125 225 mA XC4VFX60 339 2250 222 350 150 275 mA XC4VFX100 511 3300 278 500 200 300 mA XC4VFX140 702 4250 500 825 250 375 mA Device Notes: 1. Typical values are specified at nominal voltage, 25C. 2. Maximum values are specified under worst-case process, voltage, and temperature conditions. Table 6: Power Supply Ramp Time Symbol Description Ramp Time Units VCCINT Internal supply voltage relative to GND 0.20 to 50.0 ms VCCO Output drivers supply voltage relative to GND 0.20 to 50.0 ms VCCAUX Auxiliary supply voltage relative to GND 0.20 to 50.0 ms DS302 (v3.5) June 16, 2009 Product Specification www.xilinx.com 7 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics SelectIOTM DC Input and Output Levels Values for VIL and VIH are recommended input voltages. Values for IOL and IOH are guaranteed over the recommended operating conditions at the VOL and VOH test points. Only selected standards are tested. These are chosen to ensure that all standards meet their specifications. The selected standards are tested at a minimum VCCO with the respective VOL and VOH voltage levels shown. Other standards are sample tested. Table 7: SelectIO DC Input and Output Levels IOSTANDARD Attribute VIL VIH VOL VOH IOL IOH V, Min V, Max V, Min V, Max V, Max V, Min mA mA LVTTL -0.2 0.8 2.0 3.45 0.4 2.4 Note(3) Note(3) LVCMOS33, LVDCI33 -0.2 0.8 2.0 3.45 0.4 VCCO - 0.4 Note(3) Note(3) LVCMOS25, LVDCI25 -0.3 0.7 1.7 VCCO + 0.3 0.4 VCCO - 0.4 Note(3) Note(3) LVCMOS18, LVDCI18 -0.3 35% VCCO 65% VCCO VCCO + 0.3 0.4 VCCO - 0.45 Note(4) Note(4) LVCMOS15, LVDCI15 -0.3 35% VCCO 65% VCCO VCCO + 0.3 0.4 VCCO - 0.45 Note(4) Note(4) PCI33_3(5) -0.2 30% VCCO 50% VCCO VCCO 10% VCCO 90% VCCO 1.5 -0.5 PCI66_3(5) -0.2 30% VCCO 50% VCCO VCCO 10% VCCO 90% VCCO 1.5 -0.5 PCI-X(5) -0.2 35% VCCO 50% VCCO VCCO 10% VCCO 90% VCCO 1.5 -0.5 GTLP -0.3 VREF - 0.1 VREF + 0.1 - 0.6 N/A 36 N/A GTL -0.3 VREF - 0.05 VREF + 0.05 - 0.4 N/A 32 N/A HSTL I(2) -0.3 VREF - 0.1 VREF + 0.1 VCCO + 0.3 0.4 VCCO - 0.4 8 -8 HSTL II(2) -0.3 VREF - 0.1 VREF + 0.1 VCCO + 0.3 0.4 VCCO - 0.4 16 -16 HSTL III(2) -0.3 VREF - 0.1 VREF + 0.1 VCCO + 0.3 0.4 VCCO - 0.4 24 -8 HSTL IV(2) -0.3 VREF - 0.1 VREF + 0.1 VCCO + 0.3 0.4 VCCO - 0.4 48 -8 DIFF HSTL II(2) -0.3 50% VCCO - 0.1 50% VCCO + 0.1 VCCO + 0.3 0.4 VCCO - 0.4 - - SSTL2 I -0.3 VREF - 0.15 VREF + 0.15 VCCO + 0.3 VTT - 0.61 VTT + 0.61 8.1 -8.1 SSTL2 II -0.3 VREF - 0.15 VREF + 0.15 VCCO + 0.3 VTT - 0.81 VTT + 0.81 16.2 -16.2 DIFF SSTL2 II -0.3 50% VCCO - 0.15 50% VCCO + 0.15 VCCO + 0.3 0.5 VCCO - 0.5 - - SSTL18 I -0.3 VREF - 0.125 VREF + 0.125 VCCO + 0.3 VTT - 0.47 VTT + 0.47 6.7 -6.7 SSTL18 II -0.3 VREF - 0.125 VREF + 0.125 VCCO + 0.3 VTT - 0.60 VTT + 0.60 13.4 -13.4 DIFF SSTL18 II -0.3 50% VCCO - 0.125 50% VCCO + 0.125 VCCO + 0.3 0.4 VCCO - 0.4 - - Notes: 1. Tested according to relevant specifications. 2. Applies to both 1.5V and 1.8V HSTL. 3. Using drive strengths of 2, 4, 6, 8, 12, 16, or 24 mA. 4. Using drive strengths of 2, 4, 6, 8, 12, or 16 mA. 5. For more information on PCI33_3, PCI66_3, and PCI-X, refer to the Virtex-4 FPGA User Guide, SelectIO Resources, Chapter 6. DS302 (v3.5) June 16, 2009 Product Specification www.xilinx.com 8 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics LDT DC Specifications (LDT_25) Table 8: LDT DC Specifications Symbol VCCO VOD DC Parameter Supply Voltage Differential Output Voltage(1,2) VOD Change in VOD Magnitude VOCM Output Common Mode Voltage VOCM Conditions RT = 100 across Q and Q signals Min Typ Max Units 2.38 2.5 2.63 V 495 600 715 mV 15 mV 715 mV 15 mV 1000 mV 15 mV 780 mV 15 mV -15 RT = 100 across Q and Q signals 495 Change in VOCM Magnitude -15 VID Input Differential Voltage 200 VID Change in VID Magnitude -15 VICM Input Common Mode Voltage 440 Change in VICM Magnitude -15 VICM 600 600 600 Notes: 1. Recommended input maximum voltage not to exceed VCC0 + 0.2V. 2. Recommended input minimum voltage not to go below -0.5V. LVDS DC Specifications (LVDS_25) Table 9: LVDS DC Specifications Symbol VCCO DC Parameter Conditions Supply Voltage Min Typ Max Units 2.38 2.5 2.63 V 1.602 V VOH Output High Voltage for Q and Q RT = 100 across Q and Q signals VOL Output Low Voltage for Q and Q RT = 100 across Q and Q signals 0.898 VODIFF Differential Output Voltage(1,2) (Q - Q), Q = High (Q - Q), Q = High RT = 100 across Q and Q signals 247 350 454 mV VOCM Output Common-Mode Voltage RT = 100 across Q and Q signals 1.125 1.250 1.375 V VIDIFF Differential Input Voltage (Q - Q), Q = High (Q - Q), Q = High 100 350 600 mV VICM Input Common-Mode Voltage 0.3 1.2 2.2 V V Notes: 1. Recommended input maximum voltage not to exceed VCC0 + 0.2V. 2. Recommended input minimum voltage not to go below -0.5V. DS302 (v3.5) June 16, 2009 Product Specification www.xilinx.com 9 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics Extended LVDS DC Specifications (LVDSEXT_25) Table 10: Extended LVDS DC Specifications Symbol VCCO DC Parameter Conditions Supply Voltage Min Typ Max Units 2.38 2.5 2.63 V VOH Output High Voltage for Q and Q RT = 100 across Q and Q signals - - 1.785 V VOL Output Low Voltage for Q and Q RT = 100 across Q and Q signals 0.715 - - V VODIFF Differential Output Voltage (Q - Q), Q = High (Q - Q), Q = High RT = 100 across Q and Q signals 440 - 820 mV VOCM Output Common-Mode Voltage RT = 100 across Q and Q signals 1.125 1.250 1.375 V VIDIFF Differential Input Voltage(1,2) Common-mode input voltage = 1.25V (Q - Q), Q = High (Q - Q), Q = High 100 - 1000 mV VICM Input Common-Mode Voltage 0.3 1.2 2.2 V Differential input voltage = 350 mV Notes: 1. Recommended input maximum voltage not to exceed VCC0 + 0.2V. 2. Recommended input minimum voltage not to go below -0.5V. LVPECL DC Specifications (LVPECL_25) These values are valid when driving a 100 differential load only, i.e., a 100 resistor between the two receiver pins. The VOH levels are 200 mV below standard LVPECL levels and are compatible with devices tolerant of lower com- mon-mode ranges. Table 11 summarizes the DC output specifications of LVPECL. For more information on using LVPECL, see the Virtex-4 FPGA User Guide: Chapter 6, SelectIO Resources. Table 11: LVPECL DC Specifications Symbol DC Parameter Min Typ Max Units VOH Output High Voltage VCC - 1.025 1.545 VCC - 0.88 V VOL Output Low Voltage VCC - 1.81 0.795 VCC - 1.62 V VICM Input Common-Mode Voltage 0.6 2.2 V 0.100 1.5 V VIDIFF Differential Input Voltage(1,2) Notes: 1. Recommended input maximum voltage not to exceed VCC0 + 0.2V. 2. Recommended input minimum voltage not to go below -0.5V. DS302 (v3.5) June 16, 2009 Product Specification www.xilinx.com 10 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics RocketIO DC Input and Output Levels Table 12 summarizes the DC input and output specifications of the Virtex-4 FPGA RocketIO Multi-Gigabit Serial Transceivers. Figure 1 shows the single-ended output volt- age swing. Figure 2 shows the peak-to-peak differential output voltage. Consult the Virtex-4 RocketIO Multi-Gigabit Transceiver User Guide for further details. Table 12: RocketIO DC Specifications DC Parameter Symbol Conditions Min Typ Max Units Peak-to-Peak Differential Input Voltage DVIN Internal AC Coupled 110 2400 mV Single-Ended Input Range SEVIN Internal AC Coupled 0 VTRX mV Internal AC Coupled 100 VTRX - 100 mV Common Mode Input Voltage Range VICM Single-Ended Output Voltage Swing (2, 3) VOUT Common Mode Output Voltage Range (3) VTCM Peak-to-Peak Differential Output Voltage (2, 3) Bypassed Internal AC Coupled (1) 800 450 mV 725 mV 1000 DVPPOUT 900 1050 Signal detect threshold RXOOBVDPP RX TBD Electrical idle amplitude TXOOBVDPP TX 65 mV 1400 mV mV RocketIO MGT Clock DC Input Levels Peak-to-Peak Differential Input Voltage Differential Input Resistance VIDIFF 2 x | VMGTCLKP - VMGTCKLN | RIN 100 600 2000 mV 71 105 124 Notes: 1. The maximum VTRX is 1.26V when bypassing the internal AC coupled VICM. VTRX must be less than or equal to AVCCAUXRX. 2. The output swing and pre-emphasis levels are selected using the attributes discussed in Chapter 4: PMA Analog Considerations in the Virtex-4 RocketIO Multi-Gigabit Transceiver User Guide for details. 3. VTTX is 1.5 5%; different amplitudes possible with adjusted DAC values. +V TXP DVOUT TXN 0 DS302_02_031708 Figure 1: Single-Ended Output Voltage Swing +V DVPPOUT 0 -V TXP-TXN DS302_03_031708 Figure 2: Peak-to-Peak Differential Output Voltage DS302 (v3.5) June 16, 2009 Product Specification www.xilinx.com 11 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics Interface Performance Characteristics Table 13: Interface Performance Speed Grade Description -12 -11 -10 710 MHz 710 MHz 645 MHz 1 Gb/s 1 Gb/s 800 Mb/s DDR2 SDRAM (High-Performance SERDES Design)(2) 600 Mb/s 533 Mb/s 500 Mb/s Design)(3) Networking Applications SFI-4.1 (SDR LVDS Interface)(1) SPI-4.2 (DDR LVDS Interface) Memory Interfaces 420 Mb/s 410 Mb/s 400 Mb/s QDRII SRAM (Low-Latency Direct Clocking Design)(4) 550 Mb/s 500 Mb/s 400 Mb/s Design)(5) 344 Mb/s 336 Mb/s 330 Mb/s 470 Mb/s 470 Mb/s 400 Mb/s DDR2 SDRAM (Low-Latency Direct Clocking DDR SDRAM (Low-Latency Direct Clocking RLDRAM II (Low-Latency Direct Clocking Design)(6) Notes: 1. Input clocks above 622 MHz require AC coupling. 2. Performance defined using design implementation described in application note XAPP721, High-Performance DDR2 SDRAM Interface Data Capture Using ISERDES and OSERDES. 3. Performance defined using design implementation described in application note XAPP702, DDR2 Controller Using Virtex-4 Devices. 4. Performance defined using design implementation described in application note XAPP703, QDR II SRAM Interface for Virtex-4 Devices. 5. Performance defined using design implementation described in application note XAPP709, DDR SDRAM Controller Using Virtex-4 FPGA Devices. 6. Performance defined using design implementation described in application note XAPP710, Synthesizable CIO DDR RLDRAM II Controller for Virtex-4 FPGAs. Switching Characteristics Switching characteristics are specified on a per-speedgrade basis and can be designated as Advance, Preliminary, or Production. Each designation is defined as follows: Speed Grade Designations Device Advance These specifications are based on simulations only and are typically available soon after device design specifications are frozen. Although speed grades with this designation are considered relatively stable and conservative, some under-reporting might still occur. Preliminary These specifications are based on complete ES (engineering sample) silicon characterization. Devices and speed grades with this designation are intended to give a better indication of the expected performance of production silicon. The probability of under-reporting delays is greatly reduced as compared to Advance data. Production These specifications are released once enough production silicon of a particular device family member has been characterized to provide full correlation between specifications and devices over numerous production lots. There is no under-reporting of delays, and customers receive formal notification of any subsequent changes. Typically, the slowest speed grades transition to Production before faster speed grades. Table 14 correlates the current status of each Virtex-4 device with a corresponding speed specification version 1.68 designation. DS302 (v3.5) June 16, 2009 Product Specification Table 14: Virtex-4 Device Speed Grade Designations Advance Preliminary Production XC4VLX15 -12, -11, -10 XC4VLX25 -12, -11, -10 XC4VLX40 -12, -11, -10 XC4VLX60 -12, -11, -10 XC4VLX80 -12, -11, -10 XC4VLX100 -12, -11, -10 XC4VLX160 -12, -11, -10 XC4VLX200 -11, -10 XC4VSX25 -12, -11, -10 XC4VSX35 -12, -11, -10 XC4VSX55 -12, -11, -10 XC4VFX12 -12, -11, -10 XC4VFX20 -12, -11, -10 XC4VFX40 -12, -11, -10 XC4VFX60 -12, -11, -10 XC4VFX100 -12, -11, -10 XC4VFX140 -11, -10 www.xilinx.com 12 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics Since individual family members are produced at different times, the migration from one category to another depends completely on the status of the fabrication process for each device. All specifications are always representative of worst-case supply voltage and junction temperature conditions. Testing of Switching Characteristics All devices are 100% functionally tested. Internal timing parameters are derived from measuring internal test patterns. Listed below are representative values. For more specific, more precise, and worst-case guaranteed data, use the values reported by the static timing analyzer (TRCE in the Xilinx Development System) and back-annotate to the simulation net list. Unless otherwise noted, values apply to all Virtex-4 devices. PowerPC Switching Characteristics Consult the PowerPC 405 Processor Block Reference Guide for further information. Table 15: PowerPC 405 Processor Clocks Absolute AC Characteristics Speed Grade -12 Description -11 -10 Min Max Min Max Min Max Units CPMC405CLOCK frequency(1,4) 0 450 0 400 0 350 MHz CPMDCRCLK(3) 0 450 0 400 0 350 MHz CPMFCMCLK(3) NA NA NA NA NA NA MHz JTAGC405TCK frequency (2) 0 225 0 200 0 175 MHz PLBCLK(3) 0 450 0 400 0 350 MHz BRAMDSOCMCLK(3) 0 450 0 400 0 350 MHz BRAMISOCMCLK(3) 0 450 0 400 0 350 MHz CPMC405CLOCK frequency(1,4) 0 333 0 275 0 233 MHz CPMDCRCLK(3) 0 333 0 275 0 233 MHz CPMFCMCLK(3) 0 333 0 275 0 233 MHz JTAGC405TCK frequency(2) 0 166.5 0 137.5 0 116.5 MHz PLBCLK(3) 0 333 0 275 0 233 MHz BRAMDSOCMCLK(3) 0 333 0 275 0 233 MHz BRAMISOCMCLK(3) 0 333 0 275 0 233 MHz Characteristics when APU Not Used Characteristics when APU Used Notes: 1. Worst-case DCM output clock jitter is included in these specifications. 2. The theoretical maximum frequency of this clock is one-half the CPMC405CLOCK. However, the achievable maximum is system dependent, and will be much less. 3. The theoretical maximum frequency of these clocks is equal to the CPMC405CLOCK. Integer clock ratios are required for the CPMC405CLOCK and BRAMDSOCMCLK, CPMC405CLOCK and BRAMISOCMCLK, CPMC405CLOCK and CPMDCRCLK, CPMC405CLOCK and CPMFCMCLK, and CPMC405CLOCK and PLBCLK. The integer ratios can be different for each interface. However, the achievable maximum is system dependent. 4. Maximum operating frequency of CPMC405CLOCK is specified with the input pin TIEC405DISOPERANDFWD connected to a logic 1. DS302 (v3.5) June 16, 2009 Product Specification www.xilinx.com 13 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics Table 16: Processor Block Switching Characteristics Speed Grade Description Symbol -12 -11 -10 Units Setup and Hold Relative to Clock (CPMC405CLOCK) Clock and Power Management control inputs TPPCDCK_CORECKI/ TPPCCKD_CORECKI 0.60 0.20 0.65 0.20 0.74 0.23 ns, Min Reset control inputs TPPCDCK_RSTCHIP/ TPPCCKD_RSTCHIP 0.60 0.20 0.65 0.20 0.74 0.23 ns, Min Debug control inputs TPPCDCK_EXBUSHAK/ TPPCCKD_EXBUSHAK 0.60 0.20 0.65 0.20 0.74 0.23 ns, Min Trace control inputs TPPCDCK_TRCDIS/ TPPCCKD_TRCDIS 0.60 0.20 0.65 0.20 0.74 0.23 ns, Min External Interrupt Controller control inputs TPPCDCK_CINPIRQ/ TPPCCKD_CINPIRQ 1.04 0.20 1.15 0.20 1.40 0.23 ns, Min Clock and Power Management control outputs TPPCCKO_CORESLP 1.35 1.51 1.74 ns, Max Reset control outputs TPPCCKO_RSTCHIP 1.44 1.59 1.83 ns, Max Debug control outputs TPPCCKO_DBGLDAPU 1.34 1.48 1.70 ns, Max Trace control outputs TPPCCKO_TRCCYCLE 1.52 1.68 1.83 ns, Max CPMC405CLOCK minimum pulse width, High TCPWH 1.11 1.25 1.43 ns, Min CPMC405CLOCK minimum pulse width, Low TCPWL 1.11 1.25 1.43 ns, Min Clock to Out Clock Table 17: Processor Block PLB Switching Characteristics Speed Grade Description Symbol -12 -11 -10 Units Setup and Hold Relative to Clock (PLBCLK) Processor Local Bus (ICU/DCU) control inputs TPPCDCK_ICUBUSY/ TPPCCKD_ICUBUSY 0.60 0.20 0.66 0.20 0.76 0.23 ns, Min Processor Local Bus (ICU/DCU) data inputs TPPCDCK_ICURDDB/ TPPCCKD_ICURDDB 0.90 0.20 1.00 0.20 1.15 0.23 ns, Min Clock to Out Processor Local Bus (ICU/DCU) control outputs TPPCCKO_DCUABORT 1.61 1.78 2.05 ns, Max Processor Local Bus (ICU/DCU) address bus outputs TPPCCKO_ICUABUS 1.66 1.85 2.13 ns, Max Processor Local Bus (ICU/DCU) data bus outputs TPPCCKO_DCUWRDBUS 2.08 2.24 2.57 ns, Max Table 18: Processor Block JTAG Switching Characteristics Speed Grade Description Symbol -12 -11 -10 Units Setup and Hold Relative to Clock (JTAGC405TCK) JTAG control inputs TPPCDCK_JTGTDI TPPCCKD_JTGTDI 1.16 0.20 1.29 0.20 1.48 0.23 ns, Min JTAG reset input TPPCDCK_JTGTRSTN TPPCCKD_JTGTRSTN 0.60 0.20 0.65 0.20 0.74 0.23 ns, Min TPPCCKO_JTGTDO 1.68 1.79 2.14 ns, Max Clock to Out JTAG control outputs DS302 (v3.5) June 16, 2009 Product Specification www.xilinx.com 14 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics Table 19: PowerPC 405 Data-Side On-Chip Memory Switching Characteristics Speed Grade Description Symbol -12 -11 -10 Units TPPCDCK_DSOCMRDDB TPPCCKD_DSOCMRDDB 0.60 0.20 0.65 0.20 0.74 0.23 ns, Min Data-Side On-Chip Memory control outputs TPPCCKO_BRAMBWR 2.07 2.30 2.65 ns, Max Data-Side On-Chip Memory address bus outputs TPPCCKO_BRAMABUS 2.07 2.30 2.65 ns, Max Data-Side On-Chip Memory data bus outputs TPPCCKO_IBRAMWRDBUS01 1.61 1.79 2.06 ns, Max Setup and Hold Relative to Clock (BRAMDSOCMCLK) Data-Side On-Chip Memory data bus inputs Clock to Out Table 20: PowerPC 405 Instruction-Side On-Chip Memory Switching Characteristics Speed Grade Description Symbol -12 -11 -10 Units TPPCDCK_ISOCMRDDB TPPCCKD_ISOCMRDDB 0.74 0.20 0.82 0.20 0.94 0.23 ns, Min Instruction-Side On-Chip Memory control outputs TPPCCKO_IBRAMEN 3.04 3.37 3.88 ns, Max Instruction-Side On-Chip Memory address bus outputs TPPCCKO_IBRAMRDABUS 1.67 1.85 2.13 ns, Max Instruction-Side On-Chip Memory data bus outputs TPPCCKO_IBRAMWRDBUS 1.67 1.86 2.14 ns, Max Setup and Hold Relative to Clock (BRAMISOCMCLK) Instruction-Side On-Chip Memory data bus inputs Clock to Out Table 21: Processor Block DCR Bus Switching Characteristics Speed Grade Description Symbol -12 -11 -10 Units Setup and Hold Relative to Clock (CPMDCRCLOCK) Device Control Register Bus control inputs TPPCDCK_EXDCRACK TPPCCKD_EXDCRACK 0.12 0.15 0.13 0.17 0.15 0.19 ns, Min Device Control Register Bus data inputs TPPCDCK_EXDCRDBUSI TPPCCKD_EXDCRDBUSI 0.57 0.16 0.57 0.16 1.02 0.27 ns, Min Device Control Register Bus control outputs TPPCCKO_EXDCRRD 1.20 1.35 1.54 ns, Max Device Control Register Bus address bus outputs TPPCCKO_EXDCRABUS 1.28 1.45 1.66 ns, Max Device Control Register Bus data bus outputs TPPCCKO_EXDCRDBUSO 1.31 1.45 1.67 ns, Max Clock to Out DS302 (v3.5) June 16, 2009 Product Specification www.xilinx.com 15 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics Table 22: Processor Block APU Interface Switching Characteristics Speed Grade Description Symbol -12 -11 -10 Units Setup and Hold Relative to Clock (CPMDFCMCLOCK) APU bus control inputs TPPCDCK_DCDCREN TPPCCKD_DCDCREN 0.33 0.20 0.36 0.20 0.42 0.23 ns, Min APU bus data inputs TPPCDCK_RESULT TPPCCKD_RESULT 0.61 0.20 0.67 0.20 0.78 0.23 ns, Min APU bus control outputs TPPCCKO_APUFCMDEC 1.53 1.75 2.00 ns, Max APU bus data outputs TPPCCKO_RADATA 1.53 1.75 2.00 ns, Max Clock to Out RocketIO Switching Characteristics Consult the Virtex-4 RocketIO Multi-Gigabit Transceiver User Guide for further information. Table 23: Maximum RocketIO Transceiver Performance Speed Grade Description RocketIO Transceiver -12 -11 -10 Units 6.5 6.5 3.125 Gb/s Table 24: RocketIO Reference Clock Switching Characteristics Description Symbol Conditions Min Typ Max Units -10 Speed Grade Reference Clock frequency range(1) FGCLK CLK 106 400 MHz -11/-12 Speed Grades 106 644 MHz All Speed Grades GREFCLK Reference Clock frequency range(1) FGREFCLK CLK 106 320 MHz Reference Clock frequency tolerance FGTOL CLK -350 +350 ppm Reference Clock rise time TRCLK 20% - 80% 400 ps Reference Clock fall time TFCLK 20% - 80% 400 ps 55 % 40 ps Reference Clock duty cycle Reference Clock total jitter, peak-peak (2) Clock recovery frequency acquisition time Spread Spectrum Clocking (3) TDCREF CLK TGJTT CLK TLOCK Initial lock of the PLL from startup (programmable) 0% to -0.5% 45 1 30 ms 33 kHz Notes: 1. MGTCLK input can be used for all serial bit rates. GREFCLK can be used for serial bit rates up to 1 Gb/s. 2. Measured at the package pin. For serial rates equal to or above 1 Gb/s, MGTCLK must be used. UI = Unit Interval. 3. Tested with synchronous reference clock. TRCLK 80% 20% TFCLK DS302_04_031708 Figure 3: Reference Clock Timing Parameters DS302 (v3.5) June 16, 2009 Product Specification www.xilinx.com 16 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics Table 25: RocketIO Receiver Switching Characteristics Description Symbol Serial data rate, -10 FGRX Serial data rate, -11 FGRX XAUI Receive Jitter Tolerance (8B/10B CJPAT) (2) Receive Deterministic Jitter Tolerance Receive Total Jitter Tolerance Receive Sinusoidal Jitter Tolerance TDJTOL TTJTOL (6) TSJTOL (7) General Receive Jitter Tolerance Receive deterministic jitter tolerance Sinusoidal jitter tolerance TDJTOL (2,4) TSJTOL RXUSRCLK frequency TRX RXUSRCLK2 frequency TRX2 Conditions Rate (Gb/s) Mode (3) 3.125 Min Typ Max Units 0.622 3.125 Gb/s 0.622 6.5 Gb/s Frequency ACDR 0.37 3.125 ACDR 3.125 ACDR f = 22.1 kHz 0.65 8.5 3.125 ACDR f = 1.875 MHz 0.10 f = 20 MHz 0.10 3.125 ACDR Rate (Gb/s) Mode(3) Pattern 6.5(5) ACDR PRBS7 0.65 5.0(5) ACDR PRBS7 0.65 4.25(5) ACDR PRBS7 0.65 3.125 ACDR PRBS7 0.60 2.5 ACDR PRBS7 0.55 1.25 ACDR PRBS7 0.50 1.25 DCDR PRBS7 0.50 1.25 DCDR PRBS31 0.40 0.622 DCDR PRBS31 0.40 6.5(9) ACDR PRBS7 0.65 5.0(9) ACDR PRBS7 0.65 4.25(9) ACDR PRBS7 0.65 3.125 (8) ACDR PRBS7 0.50 2.5(8) 0.50 ACDR PRBS7 1.25(8) ACDR PRBS7 0.50 1.25(8) DCDR PRBS7 0.55 1.25(8) DCDR PRBS31 0.35 0.622(8) DCDR PRBS31 0.55 For slower speed grades = MaxDataRate/32 UI (1) UI (1) 250 MHz 250 MHz RXUSRCLK duty cycle TRXDC 40 60 % RXUSRCLK2 duty cycle TRX2DC 40 60 % 20 ps Differential input skew Differential receive input TISKEW sensitivity(2) VEYE 110 mV On-chip AC coupling corner frequency Signal detect response time Input capacitance at the Die Excess capacitance at the solder ball RXSIGDETResponsetime ns CDIE fF CBALL fF Notes: 1. UI = Unit Interval 2. Using receiver equalization setting of 111 (14 dB). 3. ACDR = Analog CDR and DCDR = Digital CDR. 4. Deterministic jitter (DJ) is composed of 75% ISI + 25% high frequency sinusoidal jitter (SJ). 5. Deterministic Jitter (DJ) composed of ISI + 0.10 UI of high frequency SJ + 0.15 UI of RJ. DS302 (v3.5) June 16, 2009 Product Specification 30 6. 7. 8. 9. Sum of DJ, random jitter (RJ) of at least 0.55 UI, and sinusoidal jitter as defined by mask in IEEE Std 802.3ae-2002, Figure 47-5. SJ in addition to 0.55 UI of DJ +RJ. Jitter frequency = 5 MHz. Jitter frequency = 10 MHz. www.xilinx.com 17 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics Table 26: RocketIO Transmitter Switching Characteristics Description Symbol Conditions Max Units Serial data rate, -10 FGTX 0.622 3.125 Gb/s Serial data rate, -11 FGTX 0.622 6.5 Gb/s Data Min Typ Rate (Gb/s) TJ RJ 6.5 0.35 0.30 TJ 0.45 PRBS7 5.0 0.30 DJ 0.25 TJ 0.40 RJ TX Jitter PRBS7 DJ RJ Generation (3) 0.50 PRBS7 4.25 0.25 DJ 0.21 TJ 0.28 RJ PRBS7 3.125 0.14 DJ 0.14 TJ 0.25 RJ PRBS7 2.5 0.18 DJ 0.12 TJ 0.12 RJ PRBS7 1.25 0.10 DJ 0.06 TJ 0.08 RJ PRBS31 0.622 0.06 DJ TX rise time(2) TX fall time(2) UI (1) 0.04 TRTX 20% - 80% 90 ps TFTX 20% - 80% 90 ps For slower speed grades = MaxDataRate/32 TXUSRCLK frequency TXUSRCLK2 frequency 250 MHz 250 MHz TXUSRCLK duty cycle TTXDC 40 60 % TXUSRCLK2 duty cycle TTX2DC 40 60 % Differential output skew TISKEW 12 20 ps TXOOBTransition 15 Electrical idle transition time ns Notes: 1. UI = Unit Interval. 2. Default attributes, measured at 2.5 Gb/s. 3. Peak-to-Peak values measured relative to 1e-12 Error rate. Default attributes. TX feedback divider (TXPLLNDIVSEL) = 10. DS302 (v3.5) June 16, 2009 Product Specification www.xilinx.com 18 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics IOB Pad Input/Output/3-State Switching Characteristics Table 27 summarizes the values of standard-specific data input delay adjustments, output delays terminating at pads (based on standard and 3-state delays. TIOPI is described as the delay from IOB pad through the input buffer to the I-pin of an IOB pad. The delay varies depending on the capability of the SelectIO input buffer. TIOOP is described as the delay from the O pin to the IOB pad through the output buffer of an IOB pad. The delay varies depending on the capability of the SelectIO output buffer. TIOTP is described as the delay from the T pin to the IOB pad through the output buffer of an IOB pad, when 3-state is disabled. The delay varies depending on the SelectIO capability of the output buffer. Table 28 summarizes the value of TIOTPHZ. TIOTPHZ is described as the delay from the T pin to the IOB pad through the output buffer of an IOB pad, when 3-state is enabled (i.e., a high impedance state). Table 27: IOB Switching Characteristics(1,2) IOSTANDARD Attribute(1) TIOPI TIOOP TIOTP Speed Grade Speed Grade Speed Grade Units -12 -11 -10 -12 -11 -10 -12 -11 -10 LVDS_25 1.00 1.15 1.28 1.61 1.71 1.85 1.61 1.71 1.85 ns RSDS_25 1.00 1.15 1.28 1.61 1.71 1.85 1.61 1.71 1.85 ns LVDSEXT_25 1.01 1.16 1.30 1.65 1.75 1.91 1.65 1.75 1.91 ns LDT_25 1.00 1.15 1.28 1.58 1.68 1.82 1.58 1.68 1.82 ns BLVDS_25 1.00 1.15 1.28 1.99 2.15 2.34 1.99 2.15 2.34 ns ULVDS_25 1.00 1.15 1.28 1.59 1.68 1.83 1.59 1.68 1.83 ns PCI33_3 (PCI, 33 MHz, 3.3V) 0.76 0.87 0.97 2.52 2.76 3.02 2.52 2.76 3.02 ns PCI66_3 (PCI, 66 MHz, 3.3V) 0.76 0.87 0.97 2.22 2.46 2.72 2.22 2.46 2.72 ns PCI-X 0.76 0.87 0.97 2.19 2.21 2.25 2.19 2.21 2.25 ns GTL 1.28 1.47 1.63 1.75 1.87 2.03 1.75 1.87 2.03 ns GTLP 1.31 1.51 1.68 1.75 1.87 2.03 1.75 1.87 2.03 ns HSTL_I 1.28 1.47 1.64 2.00 2.16 2.35 2.00 2.16 2.35 ns HSTL_II 1.28 1.47 1.64 1.83 1.96 2.13 1.83 1.96 2.13 ns HSTL_III 1.28 1.47 1.64 1.90 2.04 2.22 1.90 2.04 2.22 ns HSTL_IV 1.28 1.47 1.64 1.75 1.87 2.03 1.75 1.87 2.03 ns HSTL_I _18 1.26 1.44 1.60 1.89 2.03 2.21 1.89 2.03 2.21 ns HSTL_II _18 1.26 1.44 1.60 1.85 1.98 2.16 1.85 1.98 2.16 ns HSTL_III _18 1.26 1.44 1.60 1.80 1.93 2.09 1.80 1.93 2.09 ns HSTL_IV_18 1.26 1.44 1.60 1.77 1.89 2.06 1.77 1.89 2.06 ns SSTL2_I 1.31 1.51 1.68 2.06 2.23 2.43 2.06 2.23 2.43 ns SSTL2_II 1.31 1.51 1.68 1.85 1.98 2.16 1.85 1.98 2.16 ns LVTTL, Slow, 2 mA 0.76 0.87 0.97 5.66 6.37 7.03 5.66 6.37 7.03 ns LVTTL, Slow, 4 mA 0.76 0.87 0.97 4.10 4.57 5.04 4.10 4.57 5.04 ns LVTTL, Slow, 6 mA 0.76 0.87 0.97 4.00 4.46 4.91 4.00 4.46 4.91 ns LVTTL, Slow, 8 mA 0.76 0.87 0.97 4.00 4.46 4.91 4.00 4.46 4.91 ns DS302 (v3.5) June 16, 2009 Product Specification www.xilinx.com 19 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics Table 27: IOB Switching Characteristics(1,2) (Continued) IOSTANDARD Attribute(1) TIOPI TIOOP TIOTP Speed Grade Speed Grade Speed Grade Units -12 -11 -10 -12 -11 -10 -12 -11 -10 LVTTL, Slow, 12 mA 0.76 0.87 0.97 3.26 3.61 3.96 3.26 3.61 3.96 ns LVTTL, Slow, 16 mA 0.76 0.87 0.97 2.87 3.16 3.46 2.87 3.16 3.46 ns LVTTL, Slow, 24 mA 0.76 0.87 0.97 2.60 2.85 3.12 2.60 2.85 3.12 ns LVTTL, Fast, 2 mA 0.76 0.87 0.97 3.96 4.41 4.86 3.96 4.41 4.86 ns LVTTL, Fast, 4 mA 0.76 0.87 0.97 2.87 3.16 3.46 2.87 3.16 3.46 ns LVTTL, Fast, 6 mA 0.76 0.87 0.97 2.51 2.74 3.00 2.51 2.74 3.00 ns LVTTL, Fast, 8 mA 0.76 0.87 0.97 2.34 2.55 2.79 2.34 2.55 2.79 ns LVTTL, Fast, 12 mA 0.76 0.87 0.97 2.09 2.26 2.47 2.09 2.26 2.47 ns LVTTL, Fast, 16 mA 0.76 0.87 0.97 2.09 2.26 2.47 2.09 2.26 2.47 ns LVTTL, Fast, 24 mA 0.76 0.87 0.97 1.88 2.02 2.20 1.88 2.02 2.20 ns LVCMOS33, Slow, 2 mA 0.76 0.87 0.97 6.98 7.88 8.73 6.98 7.88 8.73 ns LVCMOS33, Slow, 4 mA 0.76 0.87 0.97 4.92 5.52 6.09 4.92 5.52 6.09 ns LVCMOS33, Slow, 6 mA 0.76 0.87 0.97 4.07 4.54 5.00 4.07 4.54 5.00 ns LVCMOS33, Slow, 8 mA 0.76 0.87 0.97 3.25 3.59 3.95 3.25 3.59 3.95 ns LVCMOS33, Slow, 12 mA 0.76 0.87 0.97 2.83 3.11 3.42 2.83 3.11 3.42 ns LVCMOS33, Slow, 16 mA 0.76 0.87 0.97 2.11 2.28 2.49 2.11 2.28 2.49 ns LVCMOS33, Slow, 24 mA 0.76 0.87 0.97 2.11 2.28 2.49 2.11 2.28 2.49 ns LVCMOS33, Fast, 2 mA 0.76 0.87 0.97 5.98 6.73 7.44 5.98 6.73 7.44 ns LVCMOS33, Fast, 4 mA 0.76 0.87 0.97 3.55 3.93 4.33 3.55 3.93 4.33 ns LVCMOS33, Fast, 6 mA 0.76 0.87 0.97 2.93 3.23 3.55 2.93 3.23 3.55 ns LVCMOS33, Fast, 8 mA 0.76 0.87 0.97 2.09 2.25 2.46 2.09 2.25 2.46 ns LVCMOS33, Fast, 12 mA 0.76 0.87 0.97 1.93 2.08 2.27 1.93 2.08 2.27 ns LVCMOS33, Fast, 16 mA 0.76 0.87 0.97 1.79 1.91 2.08 1.79 1.91 2.08 ns LVCMOS33, Fast, 24 mA 0.76 0.87 0.97 1.79 1.91 2.08 1.79 1.91 2.08 ns LVCMOS25, Slow, 2 mA 0.69 0.80 0.88 4.77 5.34 5.89 4.77 5.34 5.89 ns LVCMOS25, Slow, 4 mA 0.69 0.80 0.88 4.09 4.56 5.02 4.09 4.56 5.02 ns LVCMOS25, Slow, 6 mA 0.69 0.80 0.88 3.53 3.92 4.31 3.53 3.92 4.31 ns LVCMOS25, Slow, 8 mA 0.69 0.80 0.88 3.53 3.92 4.31 3.53 3.92 4.31 ns LVCMOS25, Slow, 12 mA 0.69 0.80 0.88 2.90 3.19 3.50 2.90 3.19 3.50 ns LVCMOS25, Slow, 16 mA 0.69 0.80 0.88 2.75 3.02 3.31 2.75 2.02 3.31 ns LVCMOS25, Slow, 24 mA 0.69 0.80 0.88 2.33 2.54 2.77 2.33 2.54 2.77 ns LVCMOS25, Fast, 2 mA 0.69 0.80 0.88 3.20 3.54 3.89 3.20 3.54 3.89 ns LVCMOS25, Fast, 4 mA 0.69 0.80 0.88 2.66 2.92 3.19 2.66 2.92 3.19 ns LVCMOS25, Fast, 6 mA 0.69 0.80 0.88 2.36 2.57 2.81 2.36 2.57 2.81 ns LVCMOS25, Fast, 8 mA 0.69 0.80 0.88 2.13 2.31 2.52 2.13 2.31 2.52 ns LVCMOS25, Fast, 12 mA 0.69 0.80 0.88 2.06 2.23 2.43 2.06 2.23 2.43 ns DS302 (v3.5) June 16, 2009 Product Specification www.xilinx.com 20 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics Table 27: IOB Switching Characteristics(1,2) (Continued) IOSTANDARD Attribute(1) TIOPI TIOOP TIOTP Speed Grade Speed Grade Speed Grade Units -12 -11 -10 -12 -11 -10 -12 -11 -10 LVCMOS25, Fast, 16 mA 0.69 0.80 0.88 1.89 2.03 2.21 1.89 2.03 2.21 ns LVCMOS25, Fast, 24 mA 0.69 0.80 0.88 1.83 1.96 2.13 1.83 1.96 2.13 ns LVCMOS18, Slow, 2 mA 0.97 1.12 1.25 4.77 5.34 5.89 4.77 5.34 5.89 ns LVCMOS18, Slow, 4 mA 0.97 1.12 1.25 3.56 3.95 4.35 3.56 3.95 4.35 ns LVCMOS18, Slow, 6 mA 0.97 1.12 1.25 3.29 3.64 4.00 3.29 3.64 4.00 ns LVCMOS18, Slow, 8 mA 0.97 1.12 1.25 3.10 3.42 3.76 3.10 3.42 3.76 ns LVCMOS18, Slow, 12 mA 0.97 1.12 1.25 3.09 3.41 3.74 3.09 3.41 3.74 ns LVCMOS18, Slow, 16 mA 0.97 1.12 1.25 2.94 3.24 3.55 2.94 3.24 3.55 ns LVCMOS18, Fast, 2 mA 0.97 1.12 1.25 3.20 3.54 3.89 3.20 3.54 3.89 ns LVCMOS18, Fast, 4 mA 0.97 1.12 1.25 2.52 2.75 3.02 2.52 2.75 3.02 ns LVCMOS18, Fast, 6 mA 0.97 1.12 1.25 2.29 2.49 2.72 2.29 2.49 2.72 ns LVCMOS18, Fast, 8 mA 0.97 1.12 1.25 2.13 2.31 2.52 2.13 2.31 2.52 ns LVCMOS18, Fast, 12 mA 0.97 1.12 1.25 2.01 2.17 2.36 2.01 2.17 2.36 ns LVCMOS18, Fast, 16 mA 0.97 1.12 1.25 1.94 2.09 2.27 1.94 2.09 2.27 ns LVCMOS15, Slow, 2 mA 1.05 1.20 1.34 5.33 5.99 6.61 5.33 5.99 6.61 ns LVCMOS15, Slow, 4 mA 1.05 1.20 1.34 4.21 4.70 4.88 4.21 4.70 4.88 ns LVCMOS15, Slow, 6 mA 1.05 1.20 1.34 3.49 3.87 4.26 3.49 3.87 4.26 ns LVCMOS15, Slow, 8 mA 1.05 1.20 1.34 3.49 3.87 4.26 3.49 3.87 4.26 ns LVCMOS15, Slow, 12 mA 1.05 1.20 1.34 3.11 3.43 3.77 3.11 3.43 3.77 ns LVCMOS15, Slow, 16 mA 1.05 1.20 1.34 2.92 3.21 3.53 2.92 3.21 3.53 ns LVCMOS15, Fast, 2 mA 1.05 1.20 1.34 3.42 3.79 4.17 3.42 3.79 4.17 ns LVCMOS15, Fast, 4 mA 1.05 1.20 1.34 2.76 3.03 3.32 2.76 3.03 3.32 ns LVCMOS15, Fast, 6 mA 1.05 1.20 1.34 2.46 2.69 2.94 2.46 2.69 2.94 ns LVCMOS15, Fast, 8 mA 1.05 1.20 1.34 2.28 2.48 2.71 2.28 2.48 2.71 ns LVCMOS15, Fast, 12 mA 1.05 1.20 1.34 2.12 2.29 2.50 2.12 2.29 2.50 ns LVCMOS15, Fast, 16 mA 1.05 1.20 1.34 2.06 2.23 2.43 2.06 2.23 2.43 ns LVDCI_33 0.76 0.87 0.97 2.61 2.86 3.13 2.61 2.86 3.13 ns LVDCI_25 0.69 0.80 0.88 2.52 2.76 3.02 2.52 2.76 3.02 ns LVDCI_18 0.97 1.12 1.25 2.47 2.69 2.95 2.47 2.69 2.95 ns LVDCI_15 1.05 1.20 1.34 2.45 2.68 2.93 2.45 2.68 2.93 ns LVDCI_DV2_25 0.69 0.80 0.88 1.93 2.08 2.27 1.93 2.08 2.27 ns LVDCI_DV2_18 0.97 1.12 1.25 1.95 2.09 2.28 1.95 2.09 2.28 ns LVDCI_DV2_15 1.05 1.20 1.34 2.18 2.36 2.58 2.18 2.36 2.58 ns GTL_DCI (3) 1.18 1.36 1.51 1.75 1.87 2.03 1.75 1.87 2.03 ns GTLP_DCI (3) 0.96 1.11 1.23 1.75 1.87 2.03 1.75 1.87 2.03 ns HSTL_I_DCI (3) 1.28 1.47 1.64 2.00 2.16 2.35 2.00 2.16 2.35 ns DS302 (v3.5) June 16, 2009 Product Specification www.xilinx.com 21 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics Table 27: IOB Switching Characteristics(1,2) (Continued) IOSTANDARD Attribute(1) TIOPI TIOOP TIOTP Speed Grade Speed Grade Speed Grade Units -12 -11 -10 -12 -11 -10 -12 -11 -10 HSTL_II_DCI (3) 1.28 1.47 1.64 1.83 1.96 2.13 1.83 1.96 2.13 ns HSTL_III_DCI (3) 1.28 1.47 1.64 1.90 2.04 2.22 1.90 2.04 2.22 ns HSTL_IV_DCI (3) 1.28 1.47 1.64 1.75 1.87 2.03 1.75 1.87 2.03 ns HSTL_I_DCI_18 (3) 1.26 1.44 1.60 1.89 2.03 2.21 1.89 2.03 2.21 ns HSTL_II_DCI_18 (3) 1.26 1.44 1.60 1.85 1.98 2.16 1.85 1.98 2.16 ns HSTL_III_DCI_18 (3) 1.26 1.44 1.60 1.80 1.93 2.09 1.80 1.93 2.09 ns HSTL_IV_DCI_18 (3) 1.26 1.44 1.60 1.77 1.89 2.06 1.77 1.89 2.06 ns SSTL2_I_DCI (3) 1.31 1.51 1.68 2.09 2.25 2.46 2.09 2.25 2.46 ns SSTL2_II_DCI (3) 1.31 1.51 1.68 2.07 2.24 2.45 2.07 2.24 2.45 ns LVPECL_25 1.38 1.59 1.77 1.52 1.61 1.74 1.52 1.61 1.74 ns SSTL18_I 1.31 1.51 1.68 2.15 2.33 2.54 2.15 2.33 2.54 ns SSTL18_II 1.31 1.51 1.68 1.92 2.06 2.24 1.92 2.06 2.24 ns SSTL18_I_DCI (3) 1.31 1.51 1.68 1.97 2.12 2.32 1.97 2.12 2.32 ns SSTL18_II_DCI (3) 1.31 1.51 1.68 1.87 2.00 2.18 1.87 2.00 2.18 ns Notes: 1. The I/O standard is selected in the Xilinx ISE(R) software tool using the IOSTANDARD attribute. 2. All I/O timing specifications are measured with VCCO at -5% from nominal. 3. The values of the DCI reference resistors must be within a 20-100 range. Refer to UG070, Virtex-4 FPGA User Guide, for detailed information. Table 28: IOB 3-state ON Output Switching Characteristics (TIOTPHZ) Speed Grade Symbol TIOTPHZ Description T input to Pad high-impedance -12 -11 -10 Units 0.88 1.01 1.12 ns Ethernet MAC Switching Characteristics Consult UG074: Virtex-4 FPGA Embedded Tri-mode Ethernet MAC User Guide for further information. Table 29: Maximum Ethernet MAC Performance Speed Grade Description -12 Ethernet MAC Maximum Performance DS302 (v3.5) June 16, 2009 Product Specification -11 10/100/1000 -10 Units Mb/s www.xilinx.com 22 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics I/O Standard Adjustment Measurement Methodology Input Delay Measurements Table 30 shows the test setup parameters used for measuring input delay. Table 30: Input Delay Measurement Methodology I/O Standard Description Attribute VL (1,2) VH (1,2) VMEAS (1,4,5) VREF (1,3,5) LVTTL (Low-Voltage Transistor-Transistor Logic) LVTTL 0 3.0 1.4 - LVCMOS (Low-Voltage CMOS), 3.3V LVCMOS33 0 3.3 1.65 - LVCMOS, 2.5V LVCMOS25 0 2.5 1.25 - LVCMOS, 1.8V LVCMOS18 0 1.8 0.9 - LVCMOS, 1.5V LVCMOS15 0 1.5 0.75 - PCI (Peripheral Component Interface), 33 MHz, 3.3V PCI33_3 Per PCI Specification - PCI, 66 MHz, 3.3V PCI66_3 Per PCI Specification - PCI-X, 133 MHz, 3.3V PCIX Per PCI-X Specification - GTL (Gunning Transceiver Logic) GTL VREF - 0.2 VREF + 0.2 VREF 0.80 GTL Plus GTLP VREF - 0.2 VREF + 0.2 VREF 1.0 HSTL (High-Speed Transceiver Logic), Class I & II HSTL_I, HSTL_II VREF - 0.5 VREF + 0.5 VREF 0.75 HSTL, Class III & IV HSTL_III, HSTL_IV VREF - 0.5 VREF + 0.5 VREF 0.90 HSTL, Class I & II, 1.8V HSTL_I_18, HSTL_II_18 VREF - 0.5 VREF + 0.5 VREF 0.90 HSTL, Class III & IV, 1.8V HSTL_III_18, HSTL_IV_18 VREF - 0.5 VREF + 0.5 VREF 1.08 SSTL (Stub Terminated Transceiver Logic), Class I & II, 3.3V SSTL3_I, SSTL3_II VREF - 1.00 VREF + 1.00 VREF 1.5 SSTL, Class I & II, 2.5V SSTL2_I, SSTL2_II VREF - 0.75 VREF + 0.75 VREF 1.25 SSTL, Class I & II, 1.8V SSTL18_I, SSTL18_II VREF - 0.5 VREF + 0.5 VREF 0.90 AGP-2X/AGP (Accelerated Graphics Port) AGP VREF - (0.2 xVCCO) VREF + (0.2 xVCCO) VREF AGP Spec LVDS (Low-Voltage Differential Signaling), 2.5V LVDS_25 1.2 - 0.125 1.2 + 0.125 1.2 LVDSEXT (LVDS Extended Mode), 2.5V LVDSEXT_25 1.2 - 0.125 1.2 + 0.125 1.2 ULVDS (Ultra LVDS), 2.5V ULVDS_25 0.6 - 0.125 0.6 + 0.125 0.6 LDT (HyperTransport), 2.5V LDT_25 0.6 - 0.125 0.6 + 0.125 0.6 Notes: 1. Input delay measurement methodology parameters for LVDCI and HSLVDCI are the same as for LVCMOS standards of the same voltage. Parameters for all other DCI standards are the same as for the corresponding non-DCI standards. 2. Input waveform switches between VLand VH. 3. Measurements are made at typical, minimum, and maximum VREF values. Reported delays reflect worst case of these measurements. VREF values listed are typical. 4. Input voltage level from which measurement starts. 5. This is an input voltage reference that bears no relation to the VREF / VMEAS parameters found in IBIS models and/or noted in Figure 4. DS302 (v3.5) June 16, 2009 Product Specification www.xilinx.com 23 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics Output Delay Measurements Output delays are measured using a Tektronix P6245 TDS500/600 probe (< 1 pF) across approximately 4 inches of FR4 microstrip trace. Standard termination was used for all testing. The propagation delay of the 4 inch trace is characterized separately and subtracted from the final measurement, and is therefore not included in the generalized test setup shown in Figure 4. Measurements and test conditions are reflected in the IBIS models except where the IBIS format precludes it. Parameters VREF, RREF, CREF, and VMEAS fully describe the test conditions for each I/O standard. The most accurate prediction of propagation delay in any given application can be obtained through IBIS simulation, using the following method: 1. Simulate the output driver of choice into the generalized test setup, using values from Table 31. VREF 2. Record the time to VMEAS . FPGA Output 3. Simulate the output driver of choice into the actual PCB trace and load, using the appropriate IBIS model or capacitance value to represent the load. RREF 4. Record the time to VMEAS . VMEAS 5. Compare the results of steps 2 and 4. The increase or decrease in delay yields the actual worst-case propagation delay (clock-to-input) of the PCB trace. (voltage level when taking delay measurement) CREF (probe capacitance) DS302_05_031708 Figure 4: Generalized Test Setup Table 31: Output Delay Measurement Methodology I/O Standard Attribute Description RREF () CREF(1) (pF) VMEAS (V) VREF (V) LVTTL (Low-Voltage Transistor-Transistor Logic) LVTTL (all) 1M 0 1.4 0 LVCMOS (Low-Voltage CMOS), 3.3V LVCMOS33 1M 0 1.65 0 LVCMOS, 2.5V LVCMOS25 1M 0 1.25 0 LVCMOS, 1.8V LVCMOS18 1M 0 0.9 0 LVCMOS, 1.5V LVCMOS15 1M 0 0.75 0 LVCMOS, 1.2V LVCMOS12 1M 0 0.75 0 25 10 (2) 0.94 0 25 10 (2) 2.03 3.3 25 10 (2) 0.94 0 25 10 (2) 2.03 3.3 25 10 (3) 0.94 PCIX (falling edge 25 10 (3) 2.03 3.3 GTL (Gunning Transceiver Logic) GTL 25 0 0.8 1.2 GTL Plus GTLP 25 0 1.0 1.5 HSTL (High-Speed Transceiver Logic), Class I HSTL_I 50 0 VREF 0.75 HSTL, Class II HSTL_II 25 0 VREF 0.75 HSTL, Class III HSTL_III 50 0 0.9 1.5 HSTL, Class IV HSTL_IV 25 0 0.9 1.5 HSTL, Class I, 1.8V HSTL_I_18 50 0 VREF 0.9 HSTL, Class II, 1.8V HSTL_II_18 25 0 VREF 0.9 HSTL, Class III, 1.8V HSTL_III_18 50 0 1.1 1.8 PCI (Peripheral Component Interface), 33 MHz, 3.3V PCI, 66 MHz, 3.3V PCI-X, 133 MHz, 3.3V DS302 (v3.5) June 16, 2009 Product Specification PCI33_3 (rising edge) PCI33_3 (falling edge) PCI66_3 (rising edge) PCI66_3 (falling edge) PCIX (rising edge) www.xilinx.com 24 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics Table 31: Output Delay Measurement Methodology (Continued) I/O Standard Attribute Description RREF () CREF(1) (pF) VMEAS (V) VREF (V) HSTL, Class IV, 1.8V HSTL_IV_18 25 0 1.1 1.8 SSTL (Stub Series Terminated Logic), Class I, 1.8V SSTL18_I 50 0 VREF 0.9 SSTL, Class II, 1.8V SSTL18_II 25 0 VREF 0.9 SSTL, Class I, 2.5V SSTL2_I 50 0 VREF 1.25 SSTL, Class II, 2.5V SSTL2_II 25 0 VREF 1.25 LVDS (Low-Voltage Differential Signaling), 2.5V LVDS_25 50 0 VREF 1.2 LVDSEXT (LVDS Extended Mode), 2.5V LVDSEXT_25 50 0 VREF 1.2 BLVDS (Bus LVDS), 2.5V BLVDS_25 1M 0 1.2 0 LDT (HyperTransport), 2.5V LDT_25 50 0 VREF 0.6 LVPECL (Low-Voltage Positive Emitter-Coupled Logic), 2.5V LVPECL_25 1M 0 0.90 0 LVDCI/HSLVDCI (Low-Voltage Digitally Controlled Impedance), 3.3V LVDCI_33, HSLVDCI_33 1M 0 1.65 0 LVDCI/HSLVDCI, 2.5V LVDCI_25, HSLVDCI_25 1M 0 1.25 0 LVDCI/HSLVDCI, 1.8V LVDCI_18, HSLVDCI_18 1M 0 0.9 0 LVDCI/HSLVDCI, 1.5V LVDCI_15, HSLVDCI_15 1M 0 0.75 0 HSTL (High-Speed Transceiver Logic), Class I & II, with DCI HSTL_I_DCI, HSTL_II_DCI 50 0 VREF 0.75 HSTL, Class III & IV, with DCI HSTL_III_DCI, HSTL_IV_DCI 50 0 0.9 1.5 HSTL, Class I & II, 1.8V, with DCI HSTL_I_DCI_18, HSTL_II_DCI_18 50 0 VREF 0.9 HSTL, Class III & IV, 1.8V, with DCI HSTL_III_DCI_18, HSTL_IV_DCI_18 50 0 1.1 1.8 SSTL (Stub Series Termi.Logic), Class I & II, 1.8V, with DCI SSTL18_I_DCI, SSTL18_II_DCI 50 0 VREF 0.9 SSTL, Class I & II, 2.5V, with DCI SSTL2_I_DCI, SSTL2_II_DCI 50 0 VREF 1.25 GTL (Gunning Transceiver Logic) with DCI GTL_DCI 50 0 0.8 1.2 GTL Plus with DCI GTLP_DCI 50 0 1.0 1.5 Notes: 1. CREF is the capacitance of the probe, nominally 0 pF. 2. Per PCI specifications. 3. Per PCI-X specifications. DS302 (v3.5) June 16, 2009 Product Specification www.xilinx.com 25 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics Input/Output Logic Switching Characteristics Table 32: ILOGIC Switching Characteristics Speed Grade Symbol Description -12 -11 -10 Units Setup/Hold TICE1CK / TICKCE1 CE1 pin Setup/Hold with respect to CLK 0.58 -0.23 0.66 -0.23 0.79 -0.23 ns TICECK / TICKCE DLYCE pin Setup/Hold with respect to C 0.16 0.11 0.19 0.13 0.23 0.16 ns TIRSTCK / TICKRST DLYRST pin Setup/Hold with respect to C -0.03 0.37 -0.02 0.45 -0.02 0.54 ns TIINCCK / TICKINC DLYINC pin Setup/Hold with respect to C 0.01 0.36 0.01 0.43 0.01 0.51 ns TISRCK / TICKSR SR/REV pin Setup/Hold with respect to CLK 1.15 -0.56 1.33 -0.56 1.59 -0.56 ns TIDOCK / TIOCKD D pin Setup/Hold with respect to CLK without Delay 0.24 -0.10 0.28 -0.10 0.34 -0.10 ns D pin Setup/Hold with respect to CLK (IOBDELAY_TYPE = DEFAULT) 6.64 -5.99 7.63 -5.99 8.84 -5.99 ns D pin Setup/Hold with respect to CLK (IOBDELAY_TYPE = FIXED, IOBDELAY_VALUE = 0) (1) 0.81 -0.63 0.87 -0.63 1.09 -0.63 ns D pin to O pin propagation delay, no Delay 0.17 0.20 0.24 ns D pin to O pin propagation delay (IOBDELAY_TYPE = DEFAULT) 6.00 6.91 7.96 ns D pin to O pin propagation delay (IOBDELAY_TYPE = FIXED, IOBDELAY_VALUE = 0) (1) 0.74 0.79 0.99 ns D pin to Q1 pin using flip-flop as a latch without Delay 0.50 0.59 0.71 ns D pin to Q1 pin using flip-flop as a latch (IOBDELAY_TYPE = DEFAULT) 6.90 7.94 9.21 ns D pin to Q1 pin using flip-flop as a latch (IOBDELAY_TYPE = FIXED, IOBDELAY_VALUE = 0) (1) 1.07 1.18 1.45 ns TICKQ CLK to Q outputs 0.53 0.60 0.72 ns TICE1Q CE1 pin to Q1 using flip-flop as a latch, propagation delay 0.90 1.06 1.27 ns TRQ SR/REV pin to OQ/TQ out 1.70 2.03 2.44 ns TGSRQ Global Set/Reset to Q outputs 1.54 1.73 2.03 ns Minimum Pulse Width, SR/REV inputs 0.53 0.59 0.70 ns, Min TIDOCKD / TIOCKDD Combinatorial TIDI TIDID Sequential Delays TIDLO TIDLOD Set/Reset TRPW Notes: 1. Recorded at 0 tap value. Refer to Timing Report for other values. DS302 (v3.5) June 16, 2009 Product Specification www.xilinx.com 26 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics Table 33: OLOGIC Switching Characteristics Speed Grade Symbol Description -12 -11 -10 Units Setup/Hold TODCK / TOCKD D1/D2 pins Setup/Hold with respect to CLK 0.52 -0.22 0.62 -0.22 0.75 -0.22 ns TOOCECK / TOCKOCE OCE pin Setup/Hold with respect to CLK 0.53 -0.33 0.64 -0.33 0.77 -0.33 ns TOSRCK / TOCKSR SR/REV pin Setup/Hold with respect to CLK 0.99 -0.55 1.18 -0.55 1.42 -0.55 ns TOTCK / TOCKT T1/T2 pins Setup/Hold with respect to CLK 0.52 -0.22 0.62 -0.22 0.75 -0.22 ns TOTCECK / TOCKTCE TCE pin Setup/Hold with respect to CLK 0.53 -0.33 0.64 -0.33 0.77 -0.33 ns TODQ D1 to OQ out 0.56 0.65 0.76 ns TOTQ T1 to TQ out 0.56 0.65 0.76 ns TIOSRON REV pin to TQ out 1.14 1.37 1.64 ns TOCKQ CLK to OQ/TQ out 0.41 0.49 0.59 ns TRQ SR/REV pin to OQ/TQ out 1.14 1.37 1.64 ns TGSRQ Global Set/Reset to Q outputs 1.54 1.73 2.03 ns Minimum Pulse Width, SR/REV inputs 0.53 0.59 0.70 ns, Min Combinatorial Sequential Delays Set/Reset TRPW DS302 (v3.5) June 16, 2009 Product Specification www.xilinx.com 27 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics Input Serializer/Deserializer Switching Characteristics Table 34: ISERDES Switching Characteristics Speed Grade Symbol Description -12 -11 -10 Units Setup/Hold for Control Lines TISCCK_BITSLIP / TISCKC_BITSLIP BITSLIP pin Setup/Hold with respect to CLKDIV 0.28 -0.20 0.34 -0.16 0.40 -0.13 ns TISCCK_CE / TISCKC_CE(2) CE pin Setup/Hold with respect to CLK (for CE1) 0.48 -0.37 0.57 -0.30 0.69 -0.25 ns TISCCK_CE2 / TISCKC_CE2(2) CE pin Setup/Hold with respect to CLKDIV (for CE2) 0.11 -0.04 0.14 -0.03 0.16 -0.02 ns TISCCK_DLYCE / TISCKC_DLYCE DLYCE pin Setup/Hold with respect to CLKDIV 0.16 0.11 0.19 0.13 0.23 0.16 ns TISCCK_DLYINC / TISCKC_DLYINC DLYINC pin Setup/Hold with respect to CLKDIV 0.01 0.36 0.01 0.43 0.01 0.51 ns TISCCK_DLYRST / TISCKC_DLYRST DLYRST pin Setup/Hold with respect to CLKDIV -0.03 0.37 -0.02 0.45 -0.02 0.54 ns TISCCK_SR SR pin Setup with respect to CLKDIV 0.64 0.77 0.92 ns D pin Setup/Hold with respect to CLK (IOBDELAY = IBUF or NONE) 0.24 -0.11 0.28 -0.11 0.34 -0.11 ns D pin Setup/Hold with respect to CLK (IOBDELAY = IFD or BOTH, IOBDELAY_TYPE = DEFAULT) 6.64 -6.51 7.63 -6.51 8.84 -6.51 ns D pin Setup/Hold with respect to CLK(1) (IOBDELAY = IFD or BOTH, IOBDELAY_TYPE = FIXED, IOBDELAY_VALUE = 0) 0.81 -0.68 0.87 -0.68 1.08 -0.68 ns D pin Setup/Hold with respect to CLK at DDR mode (IOBDELAY = IBUF or NONE) 0.24 -0.11 0.28 -0.11 0.34 -0.11 ns D pin Setup/Hold with respect to CLK at DDR mode (IOBDELAY = IFD or BOTH, IOBDELAY_TYPE = DEFAULT) 6.64 -6.51 7.63 -6.51 8.84 -6.51 ns D pin Setup/Hold with respect to CLK at DDR mode(1) (IOBDELAY = IFD or BOTH, IOBDELAY_TYPE = FIXED, IOBDELAY_VALUE = 0) 0.81 -0.68 0.87 -0.68 1.08 -0.68 ns CLKDIV to out at Q pin 0.59 0.71 0.85 ns TISDO_DO_IOBDELAY_IFD D input to DO output pin (IOBDELAY = IFD) 0.17 0.20 0.24 ns TISDO_DO_IOBDELAY_NONE D input to DO output pin (IOBDELAY = NONE) 0.17 0.20 0.24 ns D input to DO output pin (IOBDELAY = BOTH, IOBDELAY_TYPE = DEFAULT) 6.00 6.91 7.96 ns D input to DO output pin(1) (IOBDELAY = BOTH, IOBDELAY_TYPE = FIXED, IOBDELAY_VALUE = 0) 0.74 0.79 0.99 ns D input to DO output pin (IOBDELAY = IBUF, IOBDELAY_TYPE = DEFAULT) 6.00 6.91 7.96 ns D input to DO output pin(1) (IOBDELAY = IBUF, IOBDELAY_TYPE = FIXED, IOBDELAY_VALUE = 0) 0.74 0.79 0.99 ns Setup/Hold for Data Lines TISDCK_D / TISCKD_D TISDCK_DDR / TISCKD_DDR Sequential Delays TISCKO_Q Propagation Delays TISDO_DO_IOBDELAY_BOTH TISDO_DO_IOBDELAY_IBUF Notes: 1. Recorded at 0 tap value. Refer to Timing Report for other values. 2. TISCCK_CE2 and TISCKC_CE2 are reported as TISCCK_CE / TISCKC_CE in TRCE report. DS302 (v3.5) June 16, 2009 Product Specification www.xilinx.com 28 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics Input Delay Switching Characteristics Table 35: Input Delay Switching Characteristics Speed Grade Symbol Description -12 -11 -10 Units IDELAYCTRL TIDELAYCTRLCO_RDY Reset to Ready for IDELAYCTRL (Maximum) 3.00 3.00 3.00 s FIDELAYCTRL_REF REFCLK frequency 200 200 200 MHz IDELAYCTRL_REF_PRECISION (2) REFCLK precision 10 10 10 MHz TIDELAYCTRL_RPW Minimum Reset pulse width 50.0 50.0 50.0 ns 75 75 75 ps IDELAY TIDELAYRESOLUTION IDELAY Chain Delay Resolution TIDELAYTOTAL_ERR Cumulative delay at a given tap(3) TIDELAYPAT_JIT FMAX Pattern dependent period jitter in delay chain for clock pattern Pattern dependent period jitter in delay chain for random data pattern (PRBS 23) C clock maximum frequency [(tap - 1) x 75 + 34] 0.07[(tap - 1) x 75 + 34] ps 0 0 0 Note (4) 10 2 10 2 10 2 Note (4) 300 250 250 MHz Notes: 1. Refer to Xilinx Application Note XAPP707 for details on IDELAY timing characteristics. 2. See the "REFCLK - Reference Clock" section (specific to IDELAYCTRL) in the Virtex-4 FPGA User Guide: Chapter 7, SelectIO Logic Resources. 3. This value accounts for tap 0, an anomaly in the tap chain with an average value of 34 ps. 4. Units in ps peak-to-peak per tap. DS302 (v3.5) June 16, 2009 Product Specification www.xilinx.com 29 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics Output Serializer/Deserializer Switching Characteristics Table 36: OSERDES Switching Characteristics Speed Grade Symbol Description -12 -11 -10 Units Setup/Hold TOSDCK_D / TOSCKD_D D input Setup/Hold with respect to CLKDIV 0.35 -0.05 0.42 -0.04 0.50 -0.03 ns TOSDCK_T / TOSCKD_T(1) T input Setup/Hold with respect to CLK 0.43 -0.16 0.52 -0.16 0.62 -0.16 ns TOSDCK_T2 / TOSCKD_T2(1) T input Setup/Hold with respect to CLKDIV 0.35 -0.05 0.42 -0.04 0.50 -0.03 ns TOSCCK_OCE / TOSCKC_OCE OCE input Setup/Hold with respect to CLK 0.45 0.01 0.53 0.02 0.64 0.03 ns TOSCCK_S SR (Reset) input Setup with respect to CLKDIV 0.67 0.80 0.96 ns TOSCCK_TCE / TOSCKC_TCE TCE input Setup/Hold with respect to CLK 0.45 0.01 0.53 0.02 0.64 0.03 ns TOSCKO_OQ Clock to out from CLK to OQ 0.41 0.49 0.59 ns TOSCKO_TQ Clock to out from CLK to TQ 0.41 0.49 0.59 ns TOSDO_TTQ T input to TQ Out 0.56 0.65 0.76 ns TOSCO_OQ Asynchronous Reset to OQ 1.14 1.37 1.64 ns TOSCO_TQ Asynchronous Reset to TQ 1.14 1.37 1.64 ns Sequential Delays Combinatorial Notes: 1. TOSDCK_T2 and TOSCKD_T2 are reported as TOSDCK_T / TOSCKD_T in TRCE report. DS302 (v3.5) June 16, 2009 Product Specification www.xilinx.com 30 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics CLB Switching Characteristics Table 37: CLB Switching Characteristics Speed Grade -12 Symbol Description -11 XC4VFX(2) XC4VLX/SX -10 ALL DEVICES Units Combinatorial Delays TILO 4-input function: F/G inputs to X/Y outputs 0.15 0.15 0.17 0.20 ns, Max TIF5 5-input function: F/G inputs to F5 output 0.36 0.35 0.40 0.46 ns, Max TIF5X 5-input function: F/G inputs to X output 0.44 0.43 0.49 0.57 ns, Max TIF6Y FXINA or FXINB inputs to YMUX output 0.30 0.30 0.34 0.39 ns, Max TINAFX FXINA input to FX output via MUXFX 0.21 0.21 0.23 0.27 ns, Max TINBFX FXINB input to FX output via MUXFX 0.21 0.20 0.23 0.26 ns, Max TBXX BX input to XMUX output 0.59 0.58 0.65 0.76 ns, Max TBYY BY input to YMUX output 0.43 0.43 0.48 0.56 ns, Max TBXCY BX input to COUT output - Getting into carry chain(3) 0.60 0.59 0.66 0.78 ns, Max TBYCY BY input to COUT output - Getting into carry chain(3) 0.49 0.48 0.54 0.63 ns, Max TBYP CIN input to COUT output - Carry chain delay(3) TOPCYF TOPCYG 0.07 0.07 0.08 0.09 ns, Max F input to COUT output - Getting out from carry chain(3) 0.45 0.44 0.50 0.58 ns, Max G input to COUT output - Getting out from carry chain(3) 0.44 0.43 0.48 0.57 ns, Max Sequential Delays TCKO FF Clock CLK to XQ/YQ outputs 0.28 0.28 0.31 0.36 ns, Max TCKLO Latch Clock CLK to XQ/YQ outputs 0.37 0.36 0.41 0.48 ns, Max Setup and Hold Times of CLB Flip-Flops Before/After Clock CLK TDICK / TCKDI BX/BY inputs 0.36 -0.09 0.36 -0.09 0.40 -0.09 0.47 -0.09 ns, Min TCECK / TCKCE CE input 0.58 -0.16 0.57 -0.16 0.64 -0.16 0.75 -0.16 ns, Min TFXCK / TCKFX FXINA/FXINB inputs 0.42 -0.14 0.41 -0.14 0.46 -0.14 0.54 -0.14 ns, Min TSRCK / TCKSR SR/BY inputs (synchronous) 1.04 -0.74 1.02 -0.73 1.15 -0.73 1.35 -0.73 ns, Min CIN Data Inputs (DI) - Getting out from carry chain(3) 0.52 -0.23 0.51 -0.23 0.57 -0.23 0.67 -0.23 ns, Min TRPW Minimum Pulse Width, SR/BY inputs 0.54 0.53 0.59 0.70 ns, Min TRQ Delay from SR/BY inputs to XQ/YQ outputs (asynchronous) 1.05 1.03 1.15 1.35 ns, Max FTOG Toggle Frequency (MHz) (for export control) 1181 1205 1205(4) 1028 MHz TCINCK / TCKCIN Set/Reset Notes: 1. A Zero "0" Hold Time listing indicates no hold time or a negative hold time. Negative values cannot be guaranteed "best-case," but if a "0" is listed, there is no positive hold time. 2. The values in this column apply to all XC4VFX -12 parts except XC4VFX12 -12. For XC4VFX12 -12 values, use the values in the adjacent 4VLX/SX -12 column. 3. These items are of interest for Carry Chain applications. 4. XC4VFX -11 devices are 1181 MHz. DS302 (v3.5) June 16, 2009 Product Specification www.xilinx.com 31 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics CLB Distributed RAM Switching Characteristics (SLICEM Only) ) Table 38: CLB Distributed RAM Switching Characteristics Speed Grade -12 Symbol Description -11 XC4VFX(2) XC4VLX/SX -10 ALL DEVICES Units Sequential Delays TSHCKO Clock CLK to X outputs (WE active)(3) 1.61 1.58 1.77 2.08 ns, Max TSHCKOF5 Clock CLK to F5 output (WE active) 1.53 1.50 1.69 1.98 ns, Max Setup and Hold Times Before/After Clock CLK TDS / TDH BX/BY data inputs (DI) 1.26 -0.90 1.23 -0.88 1.46 -0.88 1.80 -0.88 ns, Min TAS / TAH F/G address inputs 0.88 -0.37 0.86 -0.37 0.97 -0.34 1.13 -0.29 ns, Min TWS / TWH WE input (SR) 1.10 -0.48 1.08 -0.47 1.21 -0.47 1.42 -0.47 ns, Min TWPH Minimum Pulse Width, High 0.53 0.52 0.59 0.69 ns, Min TWPL Minimum Pulse Width, Low 0.55 0.54 0.60 0.70 ns, Min TWC Minimum clock period to meet address write cycle time 0.76 0.74 0.84 0.98 ns, Min Clock CLK Notes: 1. A Zero "0" Hold Time listing indicates no hold time or a negative hold time. Negative values cannot be guaranteed "best-case," but if a "0" is listed, there is no positive hold time. 2. The values in this column apply to all XC4VFX -12 parts except XC4VFX12 -12. For XC4VFX12 -12 values, use the values in the adjacent XC4VLX/SX -12 column. 3. TSHCKO also represents the CLK to XMUX output. Refer to TRCE report for the CLK to XMUX path. CLB Shift Register Switching Characteristics (SLICEM Only) ) Table 39: CLB Shift Register Switching Characteristics Speed Grade -12 Symbol Description XC4VFX(2) -11 XC4VLX/SX XC4VFX(3) -10 XC4VLX/SX ALL Units Sequential Delays TREG Clock CLK to X/Y outputs 2.12 2.08 2.19 2.19 2.57 ns, Max TREGXB Clock CLK to XB output via MC15 LUT output 1.83 1.73 1.90 1.84 2.16 ns, Max TREGYB Clock CLK to YB output via MC15 LUT output 1.84 1.74 1.92 1.85 2.17 ns, Max TCKSH Clock CLK to Shiftout 1.70 1.60 1.76 1.70 1.99 ns, Max TREGF5 Clock CLK to F5 output 2.05 2.01 2.11 2.11 2.47 ns, Max Setup and Hold Times Before/After Clock CLK TWS / TWH WE input (SR) 0.87 -0.76 0.85 -0.76 0.96 -0.70 0.96 -0.70 1.12 -0.62 ns, Min TDS / TDH BX/BY data inputs (DI) 1.28 -1.12 1.25 -1.11 1.45 -1.11 1.45 -1.11 1.75 -1.11 ns, Min TWPH Minimum Pulse Width, High 0.53 0.52 0.59 0.59 0.69 ns, Min TWPL Minimum Pulse Width, Low 0.55 0.54 0.60 0.60 0.70 ns, Min Clock CLK Notes: 1. A Zero "0" Hold Time listing indicates no hold time or a negative hold time. Negative values cannot be guaranteed "best-case," but if a "0" is listed, there is no positive hold time. 2. The values in this column apply to all XC4VFX -12 parts except XC4VFX12 -12. For XC4VFX12 -12 values, use the values in the adjacent XC4VLX/SX -12 column. 3. The values in this column apply to all XC4VFX -11 parts. DS302 (v3.5) June 16, 2009 Product Specification www.xilinx.com 32 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics Block RAM and FIFO Switching Characteristics Table 40: Block RAM Switching Characteristics Speed Grade Symbol Description -12 -11 -10 Units Clock CLK to DOUT output (without output register)(2) 1.65 1.83 2.10 ns, Max Clock CLK to DOUT output with ECC (without output register) 3.00 3.33 3.83 ns, Max Clock CLK to DOUT output (with output register)(3) 0.72 0.80 0.92 ns, Max Clock CLK to DOUT output with ECC (with output register) 2.00 2.20 2.50 ns, Max Sequential Delays TRCKO_DORA TRCKO_DOA Setup and Hold Times Before Clock CLK TRCCK_ADDR / TRCKC_ADDR ADDR inputs 0.34 0.26 0.37 0.28 0.43 0.33 ns, Min TRDCK_DI / TRCKD_DI DIN inputs(4) 0.18 0.26 0.20 0.28 0.23 0.33 ns, Min TRCCK_EN / TRCKC_EN EN input(5) 0.41 0.26 0.45 0.28 0.52 0.33 ns, Min TRCCK_REGCE / TRCKC_REGCE CE input of output register 0.25 0.26 0.27 0.28 0.32 0.33 ns, Min TRCCK_SSR / TRCKC_SSR RST input 0.25 0.26 0.27 0.28 0.32 0.33 ns, Min TRCCK_WE / TRCKC_WE WEN input 0.59 0.26 0.65 0.28 0.75 0.33 ns, Min Maximum Frequency FMAX Write first and no change mode 500.00 450.45 400.00 MHz FMAX Read first mode 500.00 450.45 400.00 MHz CLK-to-CLK Read first mode 500.00 450.45 400.00 MHz Notes: 1. A Zero "0" Hold Time listing indicates no hold time or a negative hold time. Negative values cannot be guaranteed "best-case," but if a "0" is listed, there is no positive hold time. 2. TRCKO_DORA includes TRCKO_DOWA, TRCKO_DOPAR, and TRCKO_DOPAW as well as the B port equivalent timing parameters. 3. TRCKO_DOA includes TRCKO_DOPA as well as the B port equivalent timing parameters. 4. TRCKO_DI includes both A and B inputs as well as the parity inputs of A and B. 5. Xilinx block RAMs do not have asynchronous inputs on an enabled port address. During the time that a port is enabled, its addresses must be stable during the specified set-up time. Do not create an asynchronous input on an enabled port address. DS302 (v3.5) June 16, 2009 Product Specification www.xilinx.com 33 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics Table 41: FIFO Switching Characteristics Speed Grade Symbol Description -12 -11 -10 Units Sequential Delays TFCKO_DO Clock CLK to DO output (2) 0.72 0.80 0.92 ns, Max TFCKO_FLAGS Clock CLK to FIFO flags outputs (3) 0.93 1.04 1.19 ns, Max TFCKO_POINTERS Clock CLK to FIFO pointer outputs (4) 1.16 1.29 1.48 ns, Max Setup and Hold Times Before Clock CLK TFDCK_DI / TFCKD_DI DI input (5) 0.18 0.26 0.20 0.28 0.23 0.33 ns, Min TFCCK_EN / TFCKC_EN Enable inputs (6) 0.66 0.26 0.73 0.28 0.84 0.33 ns, Min Reset RST to FLAGS (7) 1.32 1.46 1.68 ns, Max 500.00 450.45 400.00 MHz Reset Delays TFCO_FLAGS Maximum Frequency FMAX FIFO in all modes Notes: 1. A Zero "0" Hold Time listing indicates no hold time or a negative hold time. Negative values cannot be guaranteed "best-case," but if a "0" is listed, there is no positive hold time. 2. TFCKO_DO includes parity output (TFCKO_DOP). 3. TFCKO_FLAGS includes the following parameters: TFCKO_AEMPTY, TFCKO_AFULL, TFCKO_EMPTY, TFCKO_FULL, TFCKO_RDERR, TFCKO_WRERR. 4. TFCKO_POINTERS includes both TFCKO_RDCOUNT and TFCKO_WRCOUNT. 5. TFDCK_DI includes parity inputs (TFDCK_DIP). 6. TFCCK_EN includes both WRITE and READ enable. 7. TFCO_FLAGS includes the following flags: AEMPTY, AFULL, EMPTY, FULL, RDERR, WRERR, RDCOUNT and WRCOUNT. DS302 (v3.5) June 16, 2009 Product Specification www.xilinx.com 34 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics XtremeDSPTM Switching Characteristics Table 42: XtremeDSP Switching Characteristics Speed Grade Symbol Description -12 -11 -10 Units Setup and Hold of CE Pins TDSPCCK_CE / TDSPCKC_CE Setup/Hold of all CE inputs of the DSP48 slice 0.39 0.09 0.43 0.10 0.49 0.12 ns TDSPCCK_RST / TDSPCKC_RST Setup/Hold of all RST inputs of the DSP48 slice 0.32 0.09 0.36 0.10 0.40 0.12 ns TDSPDCK_{AA, BB, CC} / TDSPCKD_{AA, BB, CC} Setup/Hold of {A, B, C} input to {A, B, C} register 0.25 0.23 0.28 0.26 0.32 0.29 ns TDSPDCK_{AM, BM} / TDSPCKD_{AM, BM} Setup/Hold of {A, B} input to M register 1.82 0.00 2.03 0.00 2.28 0.00 ns TDSPCKO_PP Clock to out from P register to P output 0.64 0.71 0.79 ns TDSPCKO_PM Clock to out from M register to P output 2.38 2.65 2.98 ns {A, B} input to P output (LEGACY_MODE = MULT18X18) 3.53 3.92 4.41 ns From {A, B} register to P register (LEGACY_MODE = MULT18X18) 317.46 285.71 253.94 MHz Fully Pipelined 500.00 450.05 400.00 MHz Setup and Hold Times of Data Sequential Delays Combinatorial TDSPDO_{AP, BP}L Maximum Frequency FMAX DS302 (v3.5) June 16, 2009 Product Specification www.xilinx.com 35 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics Configuration Switching Characteristics Table 43: Configuration Switching Characteristics Speed Grade Symbol Description -12 -11 -10 Units Power-up Timing Characteristics TCONFIG(1,2) Maximum time to configure device after VCCINT has been applied. 10 10 10 minutes TPL Program Latency 0.5 0.5 0.5 s/frame, Max TPOR Power-on-Reset TICCK CCLK (output) delay 500 500 500 ns, Min TPROGRAM Program Pulse Width 300 300 300 ns, Min TPL + 10 TPL + 10 TPL + 10 ms, Max Master/Slave Serial Mode Programming Switching TDCC / TCCD DIN Setup/Hold, slave mode 0.5 1.0 0.5 1.0 0.5 1.0 ns, Min TDSCK / TSCKD DIN Setup/Hold, master mode 0.5 1.0 0.5 1.0 0.5 1.0 ns, Min TCCO DOUT 7.5 7.5 7.5 ns, Max TCCH High Time 2.0 2.0 2.0 ns, Min TCCL Low Time 2.0 2.0 2.0 ns, Min FCC_SERIAL Maximum Frequency, master mode with respect to nominal CCLK. 100 100 100 MHz, Max FMAX_SLAVE / FMAX_ICAP Maximum Frequency, slave mode external CCLK 100 100 100 MHz, Max FMCCTOL Frequency Tolerance, master mode with respect to nominal CCLK. 50 50 50 % TSMDCC / TSMCCD SelectMAP Data Setup/Hold 2.0 0.0 2.0 0.0 2.0 0.0 ns, Min TSMCSCC / TSMCCCS CS_B Setup/Hold 1.0 0.5 1.0 0.5 1.0 0.5 ns, Min TSMCCW / TSMWCC RDWR_B Setup/Hold 6.0 1.0 6.0 1.0 6.0 1.0 ns, Min TSMCKBY BUSY Propagation Delay 8.0 8.0 8.0 ns, Max FCC_SELECTMAP Maximum Frequency, master mode with respect to nominal CCLK. 100 100 100 MHz, Max FMAX_SELECTMAP Maximum Configuration Frequency, slave mode external CCLK 100 100 100 MHz, Max FMAX_READBACK Maximum Readback Frequency 80 80 80 MHz, Max FMCCTOL Frequency Tolerance, master mode with respect to nominal CCLK. 50 50 50 % TSMCO SelectMAP Readback Clock-to-Out 8.0 8.0 8.0 ns, Max SelectMAP Mode Programming Switching DS302 (v3.5) June 16, 2009 Product Specification www.xilinx.com 36 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics Table 43: Configuration Switching Characteristics (Continued) Speed Grade Symbol Description -12 -11 -10 Units Boundary-Scan Port Timing Specifications TTAPTCK TMS and TDI Setup time before TCK 1.0 1.0 1.0 ns, Min TTCKTAP TMS and TDI Hold time after TCK 2.0 2.0 2.0 ns, Min TTCKTDO TCK falling edge to TDO output valid 6.0 6.0 6.0 ns, Max FTCK Maximum configuration TCK clock frequency 66 66 66 MHz, Max FTCKB Maximum Boundary-Scan TCK clock frequency 50 50 50 MHz, Max Dynamic Reconfiguration Port (DRP) for DCM CLKIN_FREQ_DLL_HF_MS_MAX Maximum frequency for DCLK 500 450 400 MHz, Max TDMCCK_DADDR/TDMCKC_DADDR DADDR Setup/Hold time 0.54 0.00 0.63 0.00 0.72 0.00 ns, Max TDMCCK_DI/TDMCKC_DI DI Setup/Hold time 0.54 0.00 0.63 0.00 0.72 0.00 ns, Max TDMCCK_DEN/TDMCKC_DEN DEN Setup/Hold time 0.58 0.00 0.58 0.00 0.58 0.00 ns, Max TDMCCK_DWE/TDMCKC_DWE DWE Setup/Hold time 0.58 0.00 0.58 0.00 0.58 0.00 ns, Max TDMCKO_DO CLK to out of DO(2) 0 0 0 ns, Max TDMCKO_DRDY CLK to out of DRDY 0.68 0.80 0.92 ns, Max Notes: 1. TBCCCK_CE and TBCCKC_CE must be satisfied to assure glitch-free operation of the global clock when switching between clocks. These parameters do not apply to the BUFGMUX_VIRTEX4 primitive that assures glitch-free operation. The other global clock setup and hold times are optional; only needing to be satisfied if device operation requires simulation matches on a cycle-for-cycle basis when switching between clocks. 2. DO holds until the next DRP operation. DS302 (v3.5) June 16, 2009 Product Specification www.xilinx.com 37 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics Clock Buffers and Networks Table 44: Global Clock Switching Characteristics (Including BUFGCTRL) Speed Grade Symbol Description -12 -11 -10 Units TBCCCK_CE / TBCCKC_CE(1) CE pins Setup/Hold 0.27 0.00 0.31 0.00 0.35 0.00 ns TBCCCK_S / TBCCKC_S(1) S pins Setup/Hold 0.27 0.00 0.31 0.00 0.35 0.00 ns TBCCKO_O BUFGCTRL delay 0.70 0.77 0.90 ns Global clock tree 500 450 400 MHz Maximum Frequency FMAX Notes: 1. TBCCCK_CE and TBCCKC_CE must be satisfied to assure glitch-free operation of the global clock when switching between clocks. These parameters do not apply to the BUFGMUX_VIRTEX4 primitive that assures glitch-free operation. The other global clock setup and hold times are optional; only needing to be satisfied if device operation requires simulation matches on a cycle-for-cycle basis when switching between clocks. DCM and PMCD Switching Characteristics Table 45: Operating Frequency Ranges for DCM in Maximum Speed (MS) Mode Speed Grade Symbol Description -12 -11 -10 Units 32 32 32 MHz 150 150 150 MHz 64 64 64 MHz 300 300 300 MHz 2 2 2 MHz 100 100 100 MHz 32 32 32 MHz 210 210 210 MHz 32 32 32 MHz 150 150 150 MHz 1 1 1 MHz 210 210 210 MHz 1 1 1 KHz 500 450 400 MHz 150 150 150 MHz 500 450 400 MHz 300 300 300 MHz 500 450 400 MHz 9.4 9.4 9.4 MHz 333 300 267 MHz Outputs Clocks (Low Frequency Mode) CLKOUT_FREQ_1X_LF_MS_MIN CLKOUT_FREQ_1X_LF_MS_MAX CLKOUT_FREQ_2X_LF_MS_MIN CLKOUT_FREQ_2X_LF_MS_MAX CLKOUT_FREQ_DV_LF_MS_MIN CLKOUT_FREQ_DV_LF_MS_MAX CLKOUT_FREQ_FX_LF_MS_MIN CLKOUT_FREQ_FX_LF_MS_MAX CLK0, CLK90, CLK180, CLK270 CLK2X, CLK2X180 CLKDV CLKFX, CLKFX180 Input Clocks (Low Frequency Mode) CLKIN_FREQ_DLL_LF_MS_MIN CLKIN_FREQ_DLL_LF_MS_MAX CLKIN_FREQ_FX_LF_MS_MIN CLKIN_FREQ_FX_LF_MS_MAX PSCLK_FREQ_LF_MS_MIN PSCLK_FREQ_LF_MS_MAX CLKIN (using DLL outputs)(1,3,4,5,6) CLKIN (using DFS outputs only)(2,3,4) PSCLK Outputs Clocks (High Frequency Mode) CLKOUT_FREQ_1X_HF_MS_MIN CLKOUT_FREQ_1X_HF_MS_MAX CLKOUT_FREQ_2X_HF_MS_MIN CLKOUT_FREQ_2X_HF_MS_MAX CLKOUT_FREQ_DV_HF_MS_MIN CLKOUT_FREQ_DV_HF_MS_MAX DS302 (v3.5) June 16, 2009 Product Specification CLK0, CLK90, CLK180, CLK270 CLK2X, CLK2X180 CLKDV www.xilinx.com 38 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics Table 45: Operating Frequency Ranges for DCM in Maximum Speed (MS) Mode (Continued) Speed Grade Symbol CLKOUT_FREQ_FX_HF_MS_MIN CLKOUT_FREQ_FX_HF_MS_MAX Description CLKFX, CLKFX180 -12 -11 -10 Units 210 210 210 MHz 350 315 300 MHz Input Clocks (High Frequency Mode) CLKIN_FREQ_DLL_HF_MS_MIN CLKIN_FREQ_DLL_HF_MS_MAX CLKIN_FREQ_FX_HF_MS_MIN CLKIN_FREQ_FX_HF_MS_MAX PSCLK_FREQ_HF_MS_MIN PSCLK_FREQ_HF_MS_MAX CLKIN (using DLL outputs)(1,3,4,5,6) CLKIN (using DFS outputs only)(2,3,4) PSCLK 150 150 150 MHz 500 450 400 MHz 50 50 50 MHz 350 315 300 MHz 1 1 1 KHz 500 450 400 MHz Notes: 1. DLL outputs are used in these instances to describe the outputs: CLK0, CLK90, CLK180, CLK270, CLK2X, CLK2X180, and CLKDV. 2. DFS outputs are used in these instances to describe the outputs: CLKFX and CLKFX180. 3. When using the DCMs CLKIN_DIVIDE_BY_2 attribute these values should be doubled. 4. When using a CLKIN frequency > 400 MHz and the DCMs CLKIN_DIVIDE_BY_2 attribute, the CLKIN duty cycle must be within 5% (45/55 to 55/45). 5. The DCM must be reset if the clock input clock stops for more than 100 ms. 6. These values also apply when using both DLL and DFS outputs. Table 46: Operating Frequency Ranges for DCM in Maximum Range (MR) Mode Speed Grade Symbol Description -12 -11 -10 Units 19 19 19 MHz 40 36 32 MHz 38 38 38 MHz 80 72 64 MHz 1.2 1.2 1.2 MHz 26.7 24 21.3 MHz 19 19 19 MHz 40 36 32 MHz 19 19 19 MHz 40 36 32 MHz 1 1 1 MHz 35 32 28 MHz 1 1 1 KHz 262.50 236.30 210.00 MHz Outputs Clocks (Low Frequency Mode) CLKOUT_FREQ_1X_LF_MR_MIN CLKOUT_FREQ_1X_LF_MR_MAX CLKOUT_FREQ_2X_LF_MR_MIN CLKOUT_FREQ_2X_LF_MR_MAX CLKOUT_FREQ_DV_LF_MR_MIN CLKOUT_FREQ_DV_LF_MR_MAX CLKOUT_FREQ_FX_LF_MR_MIN CLKOUT_FREQ_FX_LF_MR_MAX CLK0, CLK90, CLK180, CLK270 CLK2X, CLK2X180 CLKDV CLKFX, CLKFX180 Input Clocks (Low Frequency Mode) CLKIN_FREQ_DLL_LF_MR_MIN CLKIN_FREQ_DLL_LF_MR_MAX CLKIN_FREQ_FX_LF_MR_MIN CLKIN_FREQ_FX_LF_MR_MAX PSCLK_FREQ_LF_MR_MIN PSCLK_FREQ_LF_MR_MAX CLKIN (using DLL outputs)(1,3,4,5,6) CLKIN (using DFS outputs only)(2,3,4) PSCLK Notes: 1. DLL Outputs are used in these instances to describe the outputs: CLK0, CLK90, CLK180, CLK270, CLK2X, CLK2X180, and CLKDV. 2. DFS Outputs are used in these instances to describe the outputs: CLKFX and CLKFX180. 3. When using the DCMs CLKIN_DIVIDE_BY_2 attribute these values should be doubled. 4. When using a CLKIN frequency > 400 MHz and the DCMs CLKIN_DIVIDE_BY_2 attribute, the CLKIN duty cycle must be within 5% (45/55 to 55/45). 5. The DCM must be reset if the clock input clock stops for more than 100 ms. 6. These values also apply when using both DLL and DFS outputs. DS302 (v3.5) June 16, 2009 Product Specification www.xilinx.com 39 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics Table 47: Input Clock Tolerances Symbol Description Frequency Range Value Units < 1 MHz 25 - 75 % 1 - 50 MHz (1) Duty Cycle Input Tolerance (in %) CLKIN_PSCLK_PULSE_RANGE_1 PSCLK only CLKIN_PSCLK_PULSE_RANGE_1_50 CLKIN_PSCLK_PULSE_RANGE_50_100 CLKIN_PSCLK_PULSE_RANGE_100_200 25 - 75 % MHz (1) 30 - 70 % 100 - 200 MHz (1) 40 - 60 % 200 - 400 MHz (1) 45 - 55 % > 400 MHz 45 - 55 % 50 - 100 PSCLK and CLKIN CLKIN_PSCLK_PULSE_RANGE_200_400 CLKIN_PSCLK_PULSE_RANGE_400 Speed Grade -12 -11 -10 300 300 345 ps 300 300 345 ps Input Clock Cycle-Cycle Jitter (Low Frequency Mode) CLKIN_CYC_JITT_DLL_LF CLKIN_CYC_JITT_FX_LF CLKIN (using DLL outputs)(2,5,6) CLKIN (using DFS outputs)(3) Input Clock Cycle-Cycle Jitter (High Frequency Mode) CLKIN_CYC_JITT_DLL_HF CLKIN (using DLL outputs)(2,5,6) 150 150 173 ps CLKIN_CYC_JITT_FX_HF CLKIN (using DFS outputs)(3) 150 150 173 ps CLKIN_PER_JITT_DLL_LF CLKIN (using DLL outputs)(2,5,6) 1.0 1.0 1.15 ns CLKIN_PER_JITT_FX_LF CLKIN (using DFS outputs)(3) 1.0 1.0 1.15 ns CLKIN_PER_JITT_DLL_HF CLKIN (using DLL outputs)(2,5,6) 1.0 1.0 1.15 ns CLKIN_PER_JITT_FX_HF CLKIN (using DFS outputs)(3) 1.0 1.0 1.15 ns CLKFB off-chip feedback 1.0 1.0 1.15 ns Input Clock Period Jitter (Low Frequency Mode) Input Clock Period Jitter (High Frequency Mode) Feedback Clock Path Delay Variation CLKFB_DELAY_VAR_EXT Notes: 1. For boundary frequencies, use the more restrictive specifications. 2. DLL Outputs are used in these instances to describe the outputs: CLK0, CLK90, CLK180, CLK270, CLK2X, CLK2X180, and CLKDV. 3. DFS Outputs are used in these instances to describe the outputs: CLKFX and CLKFX180. 4. If both DLL and DFS outputs are used, follow the more restrictive specifications. 5. The DCM must be reset if the clock input clock stops for more than 100 ms. 6. These values also apply when using both DLL and DFS outputs. DS302 (v3.5) June 16, 2009 Product Specification www.xilinx.com 40 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics Output Clock Jitter Table 48: Output Clock Jitter Speed Grade Description Symbol Constraints -12 -11 -10 Units Clock Synthesis Period Jitter CLK0 CLKOUT_PER_JITT_0 100 100 100 ps CLK90 CLKOUT_PER_JITT_90 150 150 150 ps CLK180 CLKOUT_PER_JITT_180 150 150 150 ps CLK270 CLKOUT_PER_JITT_270 150 150 150 ps CLK2X, CLK2X180 CLKOUT_PER_JITT_2X 200 200 200 ps CLKDV (integer division) CLKOUT_PER_JITT_DV1 150 150 150 ps CLKDV (non-integer division) CLKOUT_PER_JITT_DV2 300 300 300 ps CLKFX, CLKFX180 CLKOUT_PER_JITT_FX Note (2) Note (2) Note (2) ps Notes: 1. PMCD outputs are not included in this table because they do not introduce jitter. 2. Values for this parameter are available from the architecture wizard. Output Clock Phase Alignment Table 49: Output Clock Phase Alignment Speed Grade Description Symbol Constraints -12 -11 -10 Units 120 120 120 ps CLKOUT_PHASE 140 140 140 ps CLKOUT_DUTY_CYCLE_DLL(3,4) 150 150 150 ps CLKOUT_DUTY_CYCLE_FX(4) 200 200 200 ps Phase Offset Between CLKIN and CLKFB CLKIN / CLKFB CLKIN_CLKFB_PHASE Phase Offset Between Any DCM Outputs All CLK outputs Duty Cycle Precision DLL outputs(1) DFS outputs(2) Notes: 1. DLL Outputs are used in these instances to describe the outputs: CLK0, CLK90, CLK180, CLK270, CLK2X, CLK2X180, and CLKDV. 2. DFS Outputs are used in these instances to describe the outputs: CLKFX and CLKFX180. 3. CLKOUT_DUTY_CYCLE_DLL applies to the 1X clock outputs (CLK0, CLK90, CLK180, and CLK270) only if DUTY_CYCLE_CORRECTION=TRUE. 4. The measured value includes the duty cycle distortion of the global clock tree. DS302 (v3.5) June 16, 2009 Product Specification www.xilinx.com 41 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics Table 50: Miscellaneous Timing Parameters Speed Grade Symbol Description -12 -11 -10 Units Time Required to Achieve LOCK T_LOCK_DLL_240 DLL output - Frequency range > 240 MHz (2) 20 20 20 s T_LOCK_DLL_120_240 DLL output - Frequency range 120 - 240 MHz (1,2) 63 63 63 s T_LOCK_DLL_60_120 DLL output - Frequency range 60 - 120 MHz (1,2) 225 225 225 s MHz(1,2) 325 325 325 s T_LOCK_DLL_40_50 DLL output - Frequency range 40 - 50 MHz (1,2) 500 500 500 s T_LOCK_DLL_30_40 DLL output - Frequency range 30 - 40 MHz (1,2) 900 900 900 s T_LOCK_DLL_24_30 DLL output - Frequency range 24 - 30 MHz(1,2) 1250 1250 1250 s T_LOCK_DLL_30 DLL output - Frequency range < 30 MHz (2) 1250 1250 1250 s 10 10 10 ms T_LOCK_DLL_50_60 DLL output - Frequency range 50 - 60 outputs(3) T_LOCK_FX_MAX DFS T_LOCK_DLL_FINE_SHIFT Multiplication factor for DLL lock time with Fine Shift 2 2 2 FINE_SHIFT_RANGE_MS Absolute shifting range in maximum speed mode 7 7 7 ns FINE_SHIFT_RANGE_MR Absolute shifting range in maximum range mode 10 10 10 ns DCM_TAP_MS_MIN Tap delay resolution (Min) in maximum speed mode 5 5 5 ps DCM_TAP_MS_MAX Tap delay resolution (Max) in maximum speed mode 40 40 40 ps DCM_TAP_MR_MIN Tap delay resolution (Min) in maximum range mode 10 10 10 ps DCM_TAP_MR_MAX Tap delay resolution (Max) in maximum range mode 60 60 60 ps 200 200 200 ms 10 10 10 sec 100 100 100 ms Fine Phase Shifting Delay Lines Input Signal Requirements DCM_RESET(4) DCM_INPUT_CLOCK_STOP Minimum duration that RST must be held asserted Maximum duration that RST can be held asserted.(5) Maximum duration that CLKIN and CLKFB can be stopped(6,7). Notes: 1. For boundary frequencies, choose the higher delay. 2. DLL Outputs are used in these instances to describe the outputs: CLK0, CLK90, CLK180, CLK270, CLK2X, CLK2X180, and CLKDV. 3. DFS Outputs are used in these instances to describe the outputs: CLKFX and CLKFX180. 4. CLKIN must be present and stable during the DCM_RESET. 5. This only applies to production step 1 LX and SX devices. For these devices, use the design solutions described in Answer Record 21127 for support of longer reset durations. Production step 2 LX and SX devices and all production FX devices do not have this requirement. 6. For production step 1 LX and SX devices, use the design solutions described in Answer Record 21127 for support of longer durations of stopped clocks. For production step 2 LX and SX devices and all production FX devices, the ISE software automatically inserts a small macro to support longer durations of stopped clocks. 7. For all stepping levels, once the input clock is toggling again and stable after being stopped, DCM must be reset. DS302 (v3.5) June 16, 2009 Product Specification www.xilinx.com 42 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics Table 51: Frequency Synthesis Attribute Min Max CLKFX_MULTIPLY 2 32 CLKFX_DIVIDE 1 32 Table 52: DCM Switching Characteristics Symbol Description Speed Grade -12 -11 -10 Units TDMCCK_PSEN / TDMCKC_PSEN PSEN Setup/Hold 0.93 0.00 0.93 0.00 1.07 0.00 ns TDMCCK_PSINCDEC / TDMCKC_PSINCDEC PSINCDEC Setup/Hold 0.93 0.00 0.93 0.00 1.07 0.00 ns TDMCKO_PSDONE Clock to out of PSDONE 0.60 0.60 0.69 ns Table 53: PMCD Switching Characteristic Symbol Description Speed Grade -12 -11 -10 Units TPMCCCK_REL / TPMCCKC_REL REL Setup/Hold for all outputs 0.60 0.00 0.60 0.00 0.60 0.00 ns TPMCCO_CLK{A1,B,C,D} RST assertion to clock output deassertion 4.00 4.00 4.50 ns TPMCCKO_CLK{A1,B,C,D} Max clock propagation delay of PMCD for all outputs 4.60 4.60 5.20 ns PMCD_CLK_SKEW Max phase between all outputs assuming all inputs 150 150 150 ps CLKIN_FREQ_PMCD_CLKA_MAX (1) Max input/output frequency 500 450 400 MHz CLKIN_PSCLK_PULSE_RANGE Max duty cycle input tolerance (same as DCM) PMCD_REL_HIGH_PULSE_MIN Min pulse width for REL 1.11 1.11 1.25 ns PMCD_RST_HIGH_PULSE_MIN Min pulse width for RST 1.11 1.11 1.25 ns Note (2) Notes: 1. There is no minimum frequency for PMCD. 2. Refer to Table 47 parameter: CLKIN_PSCLK_PULSE_RANGE. DS302 (v3.5) June 16, 2009 Product Specification www.xilinx.com 43 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics System-Synchronous Switching Characteristics Virtex-4 FPGA Pin-to-Pin Output Parameter Guidelines All devices are 100% functionally tested. The representative values for typical pin locations and normal clock loading are listed in Table 54. Values are expressed in nanoseconds unless otherwise noted. Table 54: Global Clock Input to Output Delay for LVCMOS25 Standard, 12 mA, Fast Slew Rate, with DCM Symbol Description Device Speed Grade -12 -11 -10 Units LVCMOS25 Global Clock Input to Output Delay using Output Flip-Flop, 12mA, Fast Slew Rate, with DCM. TICKOFDCM Global Clock and OFF with DCM XC4VLX15 2.43 2.81 3.25 ns XC4VLX25 2.60 2.95 3.36 ns XC4VLX40 2.54 2.91 3.32 ns XC4VLX60 2.69 3.05 3.45 ns XC4VLX80 2.88 3.27 3.72 ns XC4VLX100 2.94 3.33 3.79 ns XC4VLX160 2.94 3.35 3.82 ns XC4VLX200 N/A 3.51 4.02 ns XC4VSX25 2.65 2.99 3.39 ns XC4VSX35 2.81 3.18 3.60 ns XC4VSX55 2.83 3.20 3.62 ns XC4VFX12 2.43 2.78 3.18 ns XC4VFX20 2.54 2.88 3.26 ns XC4VFX40 2.87 3.25 3.67 ns XC4VFX60 2.92 3.31 3.77 ns XC4VFX100 3.16 3.58 4.06 ns XC4VFX140 N/A 3.79 4.30 ns Notes: 1. Listed above are representative values where one global clock input drives one vertical clock line in each accessible column, and where all accessible IOB and CLB flip-flops are clocked by the global clock net. 2. DCM output jitter is already included in the timing calculation. DS302 (v3.5) June 16, 2009 Product Specification www.xilinx.com 44 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics Table 55: Global Clock Input to Output Delay for LVCMOS25 Standard, 12 mA, Fast Slew Rate, without DCM Symbol Description Device Speed Grade -12 -11 -10 Units LVCMOS25 Global Clock Input to Output Delay using Output Flip-Flop, 12 mA, Fast Slew Rate, without DCM. TICKOF Global Clock and OFF without DCM XC4VLX15 6.42 7.22 8.14 ns XC4VLX25 6.50 7.32 8.25 ns XC4VLX40 6.70 7.54 8.50 ns XC4VLX60 6.86 7.72 8.70 ns XC4VLX80 6.98 7.85 8.85 ns XC4VLX100 7.23 8.15 9.18 ns XC4VLX160 7.46 8.40 9.46 ns XC4VLX200 N/A 8.79 9.88 ns XC4VSX25 6.69 7.52 8.47 ns XC4VSX35 6.75 7.59 8.56 ns XC4VSX55 7.10 7.99 9.00 ns XC4VFX12 6.41 7.21 8.13 ns XC4VFX20 6.60 7.42 8.37 ns XC4VFX40 6.97 7.84 8.83 ns XC4VFX60 6.98 7.86 8.85 ns XC4VFX100 7.46 8.40 9.45 ns XC4VFX140 N/A 8.80 9.90 ns Notes: 1. Listed above are representative values where one global clock input drives one vertical clock line in each accessible column, and where all accessible IOB and CLB flip-flops are clocked by the global clock net. DS302 (v3.5) June 16, 2009 Product Specification www.xilinx.com 45 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics Virtex-4 FPGA Pin-to-Pin Input Parameter Guidelines All devices are 100% functionally tested. The representative values for typical pin locations and normal clock loading are listed in Table 56. Values are expressed in nanoseconds unless otherwise noted. Table 56: Global Clock Setup and Hold for LVCMOS25 Standard, with DCM Symbol Description Device Speed Grade Units -12 -11 -10 XC4VLX15 1.35 -0.72 1.52 -0.67 1.54 -0.62 ns XC4VLX25 1.28 -0.58 1.50 -0.57 1.58 -0.55 ns XC4VLX40 1.25 -0.55 1.44 -0.50 1.50 -0.46 ns XC4VLX60 1.25 -0.43 1.47 -0.40 1.55 -0.36 ns XC4VLX80 1.22 -0.26 1.42 -0.21 1.49 -0.15 ns XC4VLX100 1.27 -0.20 1.48 -0.14 1.56 -0.08 ns XC4VLX160 1.54 -0.20 1.79 -0.13 1.89 -0.05 ns XC4VLX200 N/A 1.90 0.03 2.00 0.15 ns XC4VSX25 1.25 -0.50 1.47 -0.48 1.55 -0.48 ns XC4VSX35 1.21 -0.41 1.43 -0.38 1.50 -0.34 ns XC4VSX55 1.25 -0.23 1.47 -0.18 1.55 -0.13 ns XC4VFX12 1.35 -0.71 1.55 -0.69 1.61 -0.69 ns XC4VFX20 1.25 -0.52 1.48 -0.51 1.56 -0.51 ns XC4VFX40 1.23 -0.18 1.45 -0.13 1.52 -0.08 ns XC4VFX60 1.17 -0.06 1.37 0.01 1.44 0.09 ns XC4VFX100 1.21 0.11 1.42 0.20 1.49 0.31 ns XC4VFX140 N/A 1.68 0.21 1.76 0.31 ns Input Setup and Hold Time Relative to Global Clock Input Signal for LVCMOS25 Standard.(1) TPSDCM / TPHDCM No Delay Global Clock and IFF(2) with DCM Notes: 1. Setup time is measured relative to the Global Clock input signal with the fastest route and the lightest load. Hold time is measured relative to the Global Clock input signal with the slowest route and heaviest load. 2. These measurements include: CLK0 DCM jitter IFF = Input Flip-Flop or Latch 3. Use IBIS to determine any duty-cycle distortion incurred using various standards. DS302 (v3.5) June 16, 2009 Product Specification www.xilinx.com 46 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics Table 57: Global Clock Setup and Hold for LVCMOS25 Standard, with DCM in Source-Synchronous Mode Speed Grade Symbol Description Device -12 -11 -10 Units Example Data Input Setup and Hold Times Relative to a Forwarded Clock Input Pin,(1) Using DCM and Global Clock Buffer. For situations where clock and data inputs conform to different standards, adjust the setup and hold values accordingly using the values shown in IOB Switching Characteristics(1,2), page 19. TPSDCM_0 / TPHDCM_0 No Delay Global Clock and IFF (2) with DCM in Source-Synchronous Mode XC4VLX15 -0.33 0.73 -0.33 0.88 -0.33 1.03 ns XC4VLX25 -0.29 0.86 -0.29 0.97 -0.29 1.09 ns XC4VLX40 -0.37 0.90 -0.37 1.04 -0.37 1.19 ns XC4VLX60 -0.32 1.02 -0.32 1.15 -0.32 1.29 ns XC4VLX80 -0.38 1.18 -0.38 1.34 -0.38 1.50 ns XC4VLX100 -0.31 1.24 -0.31 1.41 -0.31 1.57 ns XC4VLX160 -0.31 1.50 -0.31 1.69 -0.31 1.89 ns XC4VLX200 N/A -0.31 1.97 -0.31 2.19 ns XC4VSX25 -0.32 0.95 -0.32 1.07 -0.32 1.17 ns XC4VSX35 -0.37 1.04 -0.37 1.17 -0.37 1.31 ns XC4VSX55 -0.32 1.22 -0.32 1.36 -0.32 1.52 ns XC4VFX12 -0.26 0.73 -0.26 0.86 -0.26 0.96 ns XC4VFX20 -0.31 0.92 -0.31 1.03 -0.31 1.14 ns XC4VFX40 -0.35 1.26 -0.35 1.41 -0.35 156 ns XC4VFX60 -0.43 1.39 -0.43 1.56 -0.43 1.74 ns XC4VFX100 -0.38 1.55 -0.38 1.75 -0.38 1.96 ns XC4VFX140 N/A -0.44 2.03 -0.44 2.25 ns Notes: 1. The timing values were measured using the fine-phase adjustment feature of the DCM. These measurements include CLK0 DCM jitter. Package skew is not included in these measurements. 2. IFF = Input Flip-Flop DS302 (v3.5) June 16, 2009 Product Specification www.xilinx.com 47 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics Table 58: Global Clock Setup and Hold for LVCMOS25 Standard, without DCM Symbol Description Device Speed Grade Units -12 -11 -10 XC4VLX15 1.82 0.11 2.33 0.19 2.74 0.39 ns XC4VLX25 1.79 0.20 2.30 0.29 2.70 0.50 ns XC4VLX40 2.06 0.13 2.61 0.22 3.06 0.44 ns XC4VLX60 2.39 0.04 2.99 0.12 3.50 0.34 ns XC4VLX80 2.36 0.16 2.96 0.26 3.47 0.49 ns XC4VLX100 4.85 -0.09 5.83 -0.09 6.76 -0.01 ns XC4VLX160 2.56 0.46 3.21 0.59 3.76 0.88 ns XC4VLX200 N/A 3.57 0.64 4.17 0.95 ns XC4VSX25 2.12 0.14 2.68 0.23 3.14 0.44 ns XC4VSX35 2.10 0.21 2.66 0.30 3.12 0.52 ns XC4VSX55 1.99 0.57 2.53 0.71 2.97 0.98 ns XC4VFX12 1.82 0.12 2.33 0.20 2.73 0.39 ns XC4VFX20 1.75 0.38 2.26 0.49 2.65 0.73 ns XC4VFX40 1.82 0.64 2.34 0.78 2.75 1.05 ns XC4VFX60 2.42 0.25 3.03 0.35 3.54 0.59 ns XC4VFX100 1.99 1.11 2.21 1.31 2.60 1.64 ns XC4VFX140 N/A 2.80 1.26 3.28 1.61 ns Input Setup and Hold Time Relative to Global Clock Input Signal for LVCMOS25 Standard.(1) TPSFD / TPHFD Full Delay Global Clock and IFF(2) without DCM Notes: 1. Setup time is measured relative to the Global Clock input signal with the fastest route and the lightest load. Hold time is measured relative to the Global Clock input signal with the slowest route and heaviest load. 2. IFF = Input Flip-Flop or Latch. 3. A Zero "0" Hold Time listing indicates no hold time or a negative hold time. Negative values cannot be guaranteed "best-case," but if a "0" is listed, there is no positive hold time. DS302 (v3.5) June 16, 2009 Product Specification www.xilinx.com 48 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics ChipSyncTM Source-Synchronous Switching Characteristics The parameters in this section provide the necessary values for calculating timing budgets for Virtex-4 FPGA source-synchronous transmitter and receiver data-valid windows. Table 59: Duty Cycle Distortion and Clock-Tree Skew Symbol Description Device Speed Grade Units -12 -11 -10 All 150 150 150 ps XC4VLX15 50 60 60 ps XC4VLX25 90 100 110 ps XC4VLX40 140 160 180 ps XC4VLX60 140 160 180 ps XC4VLX80 200 230 260 ps XC4VLX100 270 310 350 ps XC4VLX160 270 310 350 ps XC4VLX200 N/A 310 350 ps XC4VSX25 50 60 70 ps XC4VSX35 90 100 120 ps XC4VSX55 140 170 190 ps XC4VFX12 50 60 70 ps XC4VFX20 60 70 70 ps XC4VFX40 90 110 120 ps XC4VFX60 140 170 190 ps XC4VFX100 200 230 260 ps XC4VFX140 N/A 310 350 ps I/O clock tree duty cycle distortion All 100 100 100 ps I/O clock tree skew across one clock region All 50 50 50 ps TBUFIOSKEW I/O clock tree skew across multiple clock regions All 50 50 50 ps TDCD_BUFR Regional clock tree duty cycle distortion All 250 250 250 ps TBUFIO_MAX_FREQ I/O clock tree MAX frequency All 710 710 645 MHz TBUFR_MAX_FREQ Regional clock tree MAX frequency All 300 250 250 MHz TDCD_CLK TCKSKEW TDCD_BUFIO Global Clock Tree Duty Cycle Distortion(1) Global Clock Tree Skew(2) Notes: 1. These parameters represent the worst-case duty cycle distortion observable at the pins of the device using LVDS output buffers. For cases where other I/O standards are used, IBIS can be used to calculate any additional duty cycle distortion that might be caused by asymmetrical rise/fall times. 2. The TCKSKEW value represents the worst-case vertical clock-tree skew observable between sequential I/O elements. Significantly less clock-tree skew exists for I/O registers that are close to each other and fed by the same or adjacent clock-tree branches. Use the Xilinx FPGA_Editor and Timing Analyzer tools to evaluate clock skew specific to your application. DS302 (v3.5) June 16, 2009 Product Specification www.xilinx.com 49 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics Table 60: Package Skew Symbol TPKGSKEW Description Device Package Value Units SF363 80 ps FF668 120 ps SF363 90 ps FF668 110 ps FF668 110 ps FF1148 150 ps FF668 130 ps FF1148 140 ps FF1148 155 ps FF1148 140 ps FF1513 180 ps FF1148 145 ps FF1513 180 ps XC4VLX200 FF1513 180 ps XC4VSX25 FF668 90 ps XC4VSX35 FF668 100 ps XC4VSX55 FF1148 145 ps SF363 90 ps FF668 100 ps FF672 110 ps FF672 120 ps FF1152 150 ps FF672 110 ps FF1152 170 ps FF1152 150 ps FF1517 170 ps FF1517 150 ps Package Skew(1) XC4VLX15 XC4VLX25 XC4VLX40 XC4VLX60 XC4VLX80 XC4VLX100 XC4VLX160 XC4VFX12 XC4VFX20 XC4VFX40 XC4VFX60 XC4VFX100 XC4VFX140 Notes: 1. These values represent the worst-case skew between any two balls of the package: shortest flight time to longest flight time from Pad to Ball (7.1 ps per mm). 2. Package trace length information is available for these device/package combinations. This information can be used to deskew the package. DS302 (v3.5) June 16, 2009 Product Specification www.xilinx.com 50 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics Table 61: Sample Window Symbol Description Sampling Error at Receiver Pins(1) TSAMP TSAMP_BUFIO Speed Grade Device Sampling Error at Receiver Pins using BUFIO(2) Units -12 -11 -10 All 450 500 550 ps All 350 400 450 ps Notes: 1. This parameter indicates the total sampling error of Virtex-4 FPGA DDR input registers across voltage, temperature, and process. The characterization methodology uses the DCM to capture the DDR input registers' edges of operation. These measurements include: - CLK0 DCM jitter - DCM accuracy (phase offset) - DCM phase shift resolution These measurements do not include package or clock tree skew. 2. This parameter indicates the total sampling error of Virtex-4 FPGA DDR input registers across voltage, temperature, and process. The characterization methodology uses the BUFIO clock network and IDELAY to capture the DDR input registers' edges of operation. These measurements do not include package or clock tree skew. Table 62: ChipSync Pin-to-Pin Setup/Hold and Clock-to-Out Symbol Speed Grade Description Units -12 -11 -10 -0.45 0.97 -0.45 1.08 -0.44 1.17 ns 4.10 4.54 5.02 ns Data Input Setup and Hold Times Relative to a Forwarded Clock Input Pin Using BUFIO TPSCS / TPHCS Setup/Hold of I/O clock across multiple clock regions Pin-to-Pin Clock-to-Out Using BUFIO TICKOFCS Clock-to-Out of I/O clock across multiple clock regions Production Stepping Table 63: JTAG ID Code by Step Step 1 Step 2 XC4VLX15 3 5 XC4VLX25 9 A XC4VLX40 3 5 XC4VLX60 2 or 3 4 or 5 XC4VLX80 3 5 XC4VLX100 2 or 3 4 or 5 XC4VLX160 0 or 3 4 or 5 XC4VLX200 0 or 3 2 or 5 Production devices are marked with a stepping version, with the exception of some step 1 devices. Designs should be compiled with a CONFIG STEPPING parameter set to a specific stepping version. This parameter is set in the UCF file: XC4VSX25 2 4 XC4VSX35 2 4 XC4VSX55 2 4 XC4VFX12 0 or 2 CONFIG STEPPING = "#"; (where # is the stepping version) XC4VFX20 2 The default stepping level used by the ISE software is reported in the PAR report. XC4VFX60 2 8 XC4VFX100 0 6 XC4VFX140 0 4 The Virtex-4 FPGA stepping identification system denotes the capability improvement of production released devices. By definition, devices from one stepping are functional supersets of previous devices. Bitstreams compiled for a device with an earlier stepping are guaranteed to operate correctly in subsequent device steppings. New device steppings can be shipped in place of earlier device steppings. Existing production designs are guaranteed on new device steppings. To take advantage of the capabilities of a newer device stepping, customers are able to order a new stepping version and compile a new bitstream. Table 63 shows the JTAG ID code by step. Device Step 0 6 0 XC4VFX40 Notes: 1. Shaded cells represent devices not produced at that stepping. DS302 (v3.5) June 16, 2009 Product Specification www.xilinx.com 51 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics Current Virtex-4 Production Devices Table 64 summarizes the current production LX and SX device stepping. Table 64: Current LX and SX Production Devices LX/SX Device Stepping Step 1 Step 2 Example Ordering Code XC4VLX60-10FF672C XC4VLX60-10FF672CS2 Device steppings shipped when ordered per Example Ordering Code Step 1 or Step 2 Step 2 * * * * The DFS macro is no longer needed Capability Improvements (1) TCONFIG requirement is removed DCM_RESET requirement is removed DCM_INPUT_CLOCK_STOP requirement is removed by a macro (automatically inserted by ISE software) CONFIG STEPPING parameter (must be set in UCF file) "1" "2" Minimum Software Required ISE 7.1i SP4 ISE 7.1i SP4 Minimum Speed Specification Required. 1.58 1.58 Notes: 1. See LX and SX Errata for details on LX and SX Step 1 and ES silicon. Table 65 summarizes the current production FX device stepping. Table 65: Current FX Production Devices FX Device Stepping Step 0 Step 1 Example Ordering Code XC4VFX60-10FF1152C XC4VFX60-10FF1152CS1 Device steppings shipped when ordered per Example Ordering Code Step 0 or Step 1 Step 1 Capability Improvements See FX Errata for details CONFIG STEPPING parameter (must be set in UCF file) "0" "0" or "1" Minimum Software Required ISE 8.1i SP2 ISE 8.1i SP2 Minimum Speed Specification Required 1.58 1.58 Notes: 1. Speed Specification v1.65 or later must be used for XC4VFX40 devices (all speed grades) and for XC4VFX100 (-12 speed grade only). In this case, these family members (and speed grades) are released to production before a speed specification is released with the correct label (Advance, Preliminary, or Production). These labeling discrepancies will be corrected in a subsequent speed specification release. DS302 (v3.5) June 16, 2009 Product Specification www.xilinx.com 52 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics Revision History The following table shows the revision history for this document. Date Version 08/02/04 1.0 Initial Xilinx release. Printed Handbook version. 09/09/04 1.1 Edits in Tables 12, 13, 18, 19, 20, 22, 26, 28, 37, and 38. Removed Table 39. 01/18/05 1.2 Added parameters to Tables 4 and 5. Removed System Monitor and ADC parameters. 02/01/05 1.3 Changed parameters in Tables 1, 2, 3, 7, and 11. Added Interface Performance Characteristics section. Added Switching Characteristics section and Table 14. Added parameters to the following tables: 4-6, 14, 16-30, 32-40, and 46. 02/24/05 1.4 Changed the notes in Table 2. Added Set/Reset parameters to Table 32 and Table 33. Changed description in Table 35. Changed Set/Reset in Table 37. Changed PSCLK units in Table 45. Added parameters to Table 46. Changed DCM_TAP_MS_MIN in Table 50. 05/19/05 1.5 Added RocketIO and PowerPC parameters to Table 1, Table 2, and Table 3. Removed conditions from VIDIFF and VICM in Table 9. Revised Table 13. Added RocketIO DC Input and Output Levels section. Added PowerPC Switching Characteristics section. Added RocketIO Switching Characteristics section. Removed Table 31 from version 1.4. Revised Table 35. Along with changes to Table 43 and Table 50, there are three new requirements to ensure maximum operating frequencies for the DCM. Added parameters to Table 54, Table 55, Table 56, Table 58, Table 59, Table 60, Table 61, Table 62. 06/17/05 1.6 Revised VIN and VTS in Table 1 and Note 4. Revised typical PCPU specification in Table 3. Revised symbols and values in the Processor tables: Table 16 through Table 22. Revised TDCREF in Table 24. Corrected the CLKOUT_FREQ_FX_HF_MS_MIN in Table 45, the CLKOUT_FREQ_FX_LF_MR_MIN in Table 46, and the "Input Clock Period Jitter" in Table 47. Corrected units in Table 59. 06/27/05 1.7 Changed VIL and VIH for LVCMOS15 in Table 7. Revised Table 14. Replaced value for VEYE in Table 25. Added Note 4 to Table 50. Added Table 57: Global Clock Setup and Hold for LVCMOS25 Standard, with DCM in Source-Synchronous Mode. Added value for XC4VLX160-FF1513 in Table 60. Added values for -12 speed specifications to most of the tables. Revised the -10 and -11 speeds in most of the switching characteristics tables. 08/06/05 1.8 Updated to speed specification v1.56. Added VCC_CONFIG note to Table 2. Clarified design information in Table 13. Corrected TPROGRAM in Table 43. Added DRP configuration timing for DCMs to Table 43. Added global clock tree maximum frequency to Table 44. Corrected CLKOUT_FREQ_FX_LF_MS_MIN in Table 45. Added footnotes 3 and 4 to Table 45 and Table 46. Added more data to the TCKSKEW in Table 59. 08/29/05 1.9 Corrected VOCM in Table 8. Revised Table 11. Added RocketIO MGT Clock DC Input Levels to Table 12. Revised SFI-4.1 performance values in Table 13. Added software tools requirements ISE7.1i SP4, to description above Table 14. Added -11X speed grade to Table 14 and Table 23. Edited Table 15 and Table 16. Edited Table 24. Added note 2 to Table 25, and moved RXOOBVDPP to Table 12. Added conditions to TDJ and TRJ in Table 26. Moved TXOOBVDPP to Table 12. Added RSDS to Table 27. Added note 4 to Table 49. Added Production Stepping section. 09/28/05 1.10 Table 2: Removed Note 1. Recommended maximum voltage drop for VCCAUX is 10 mV/ms. DS302 (v3.5) June 16, 2009 Product Specification Revisions www.xilinx.com 53 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics Date Version Revisions 02/03/06 1.11 Revised the speed specification requirements in Switching Characteristics, page 12, with parameter changes in Table 54 and Table 56. Added Note 7 to Table 2. Added to the IRPU and IRPD specifications in Table 3. Changed LVCMOS18 to meet the JEDEC specification in Table 7. Inserted notes into Table 8, Table 9, and Table 10. Corrected note 1 in Table 11. In Table 12, revised Common Mode Input Voltage Range (VICM) typical from 800 mV to 600 mV and added a new Note 1. Also in Table 12, changed Common Mode Voltage specification from 95mV to 950mV. Changed performance numbers in Table 23. Removed the typical specification for TDJ from Table 26. Added note 2 to Table 27. In Table 35, added maximum to TIDELAYCTRLCO_RDY, and a new parameter TIDELAYPAT_JIT. Revised Note 1 in Table 43. Added note 5 to Table 45. Revised notes 3 and 5 in Table 50. Changed the CLKIN_FREQ_PMCD_CLKA_MAX -12 specification in Table 53. Changed the TBUFIO_MAX_FREQ specification in Table 59. Changed the information in the Production Stepping and Current Virtex-4 Production Devices sections. 03/22/06 1.12 Modified second paragraph in Power-On Power Supply Requirements. Added/Changed numbers for ICCINTMIN, ICCAUXMIN, and ICCOMIN, and added Note 2 (Table 5). Changed the typ value of the DC Parameter, Common Mode Input Voltage Range from 600 MV to 800 MV in Table 12. Added three DC parameters to Table 12, Input Common-Mode Voltage (VICMC), Peak-to-Peak Differential Input Voltage (VIDIFF), and Differential Input Resistance (RIN). Changed the SPI4.2 entry for -11 from 900 Mb/s to 1 Gb/s in Table 13. Added Note 3 to Table 15. Reduced the maximum frequency from 322 MHz to 250 MHz (in Table 25 and Table 26). Added Note 5 to Table 40. 06/01/06 1.13 Changed VIN and VTS values and added notes to Table 1, page 1. Removed -11X speed grade from Table 14. Updated to speed specification v1.60. Removed -11X speed grade, changed the -12 and -11 speed grade to 6.5 Gb/s, and deleted Note 1 in Table 23, page 16. Deleted first condition and changed second condition to 2.5 Gb/s to 6.5 Gb/s for Reference Clock total jitter, peak-peak (TGJTT) in Table 24, page 16. Changed the max value for Serial data rate FGTX to 6.5 Gb/s. Deleted first condition and changed second condition to 2.5 Gb/s to 6.5 Gb/s for Serial data output deterministic jitter (TDJ) and deleted first condition and changed second condition to 2.5 Gb/s to 6.5 Gb/s for Serial data output random jitter (TRJ), both in Table 26, page 18. 06/23/06 1.14.1 Virtex-4 FPGA Electrical Characteristics, page 1: removed paragraph on that introduced the -11x for XC4VFX devices. Table 3, page 3: added new values for ICCAUXRX , ICCAUXTX, ICCCAUXMGT, ITTX , ITRX , and new notes 2 and 3. Table 4, page 4: added new symbols and for values ICCAUXRX, ICCAUXTX, ITTX , ITRX ,IAUMGT and new notes 4 and 5. Table 12, page 11: changed DC parameters and values and added note. Table 14: changed speed designations for the XC4VFX devices. Table 24, page 16 and Table 25, page 17, for most characteristics: changed conditions, speed grade (typ and max) values, and units. Table 26, page 18, for most characteristics: changed conditions, speed grade (typ and max) values, and units. Updated notes. Table 43, page 36: removed the Tcnfig symbol, values, and note 1. Note 2 is now Note 1, and the reference has also been changed. Table 50, page 42: removed Input Signal Requirements. Table 54, page 44, Table 55, page 45, Table 56, page 46, Table 57, page 47, and Table 58, page 48: corrected large speed numbers to N/A. 08/23/06 1.15 Table 24, page 16: changed value for Reference Clock Rise/Fall Time (TRCLK; TFCLK) from 65 ps Typ to 400 ps Max. Table 35, page 29: changed the speeds specification for the -12, -11, and -10 Speed Grades for TIDELAYRESOLUTION , deleted row for TIDELAYRESOLUTION_ERR and added row for TIDELAYTOTAL_ERR. Table 39, page 32: changed the speeds specification for -12 Speed Grades, Sequential Delay characteristics: TREG , TREGXB, TREGYB, TCKSH, and TREGF5. Table 65, page 52: added stepping information for Virtex-4 FX devices. DS302 (v3.5) June 16, 2009 Product Specification www.xilinx.com 54 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics Date Version Revisions 09/07/06 1.16 Added 2.5V rows to VIN and VTS (Table 1, page 1). Updated value DVIN from 200 mV to 110 mV in Table 12, page 11. Updated speed grade specifications for XCV4FX devices in Table 14. Updated jitter tolerance and VEYE in Table 25, page 17. Corrected equation for TIDELAYTOTAL_ERR in Table 35, page 29. 10/06/06 1.17 * * SPEED SPECIFICATION version for this data sheet release: v1.62. Table 1: Removed former note 3 on VIN . * Table 14: Moved XC4VFX12-11, XC4VFX20-11, XC4VFX60-11, and XC4VFX100-11 devices to Production status. Table 15: Expanded to break out processor clock specifications into Characteristics when APU Not Used and Characteristics when APU Used. Removed specs for CPMFCMCLK, not available. Table 25, Table 26: Updated RX and TX jitter data and notes. Table 39: Modified TREGXB, TREGYB, and TCKSH timing parameters to comply with v1.62 speed specification. * * * 12/11/06 2.0 * * * * * * * * * * * * * * * * * * * * DS302 (v3.5) June 16, 2009 Product Specification SPEED SPECIFICATION version for this data sheet release: v1.62. Table 1: Modified Note (3) referring to 3.3V I/O design guidelines. Added IIN parameters. Table 2: Corrected recommended VTRX range to 0.25V - 2.5V. Added IIN parameters. Table 7: Added LVDCI attributes with LVCMOS. Table 13: Added Note (1) for SDR LVDS Interface requiring AC coupling above 622 MHz. Added DDR2 SDRAM (High-Performance SERDES Design) with reference to XAPP721. Updated all specification values. Pin-to-Pin Performance and Register-to-Register Performance tables (formerly Table 13 and Table 14) deleted. Table 14: XC4VFX12 changed to Production status. Table 15: Added APU-used max characteristics for -12 devices. Table 24: Added values for Spread-Spectrum Clocking and footnote. Table 26: Changed symbol for jitter parameters from TJ, RJ, and DJ to TJ, RJ, and DJ respectively. Table 32: Added Note (1) to refer to Timing Report for non-zero tap values. Made DLY setup/hold parameters relative to C, not CLKDIV. Table 34: Amended Note (1) to refer to Timing Report for non-zero tap values. Table 35: Added Note (1) to refer to XAPP707 for details on IDELAY timing characteristics. Changed TIDELAYRESOLUTION from 74 ps to 75 ps to match Timing Analyzer. Modified formula for TIDELAYTOTAL_ERR to use 75 ps resolution. Table 40: Added CLK-to-DOUT parameters for "with ECC" case. Added CLK-to-CLK parameter. Table 43, Table 44, Table 59: Added configuration parameter values for -12 speed grade. Table 45: Added FMAX for -12 speed grade. Table 45, Table 46, Table 47: Added Note (6) stating that CLKIN values for DLL only also apply to DLL and DFS together. Table 46, Table 47: Replicated Note (5) from Table 45 and applied to all CLKIN with DLL parameters. Table 47, Table 50: Added notes to clarify boundary-frequency cases. Table 48: Modified Note (1) to point to the architecture wizard for CLKFX output jitter. Added Note (2) to indicate that PMCD outputs introduce no jitter. www.xilinx.com 55 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics Date Version Revisions 12/11/06 (Cont'd) 2.0 (Cont'd) * * * Table 50: Removed T_LOCK_FX_MIN parameter. Added DCM_RESET. Table 53: Added Note (1), no minimum frequency for PMCD. Table 64: Added Note (1) to refer to LX and SX Errata for capability improvements. 03/27/07 2.1 * * * * SPEED SPECIFICATION version for this data sheet release: v1.64. Table 4: Added Note (6) regarding max quiescent supply current. Table 5: Filled in missing power-on current values for FX devices. Table 24: Added new parameter FGREFCLK. Added Min value for Spread Spectrum Clocking frequency. Corrected "Conditions". Table 26: Revised Notes (2) and (3). Table 37, Table 38: Added column/values for XC4VFX -12. Table 39: Added columns/values for XC4VFX -11 and -12. Corrected XC4VLX/SX -11 and -12 values for TREGXB, TREGYB, and TCKSH. * * * * Table 43: Restored parameter TCONFIG and footnote (1) from earlier revision. Added new parameter TSMCO (SelectMAP Readback Clock-to-Out). * Table 50: Restored DCM_RESET Minimum and DCM_INPUT_CLOCK_STOP parameters from earlier revision. Added Notes (4) through (7) to these parameters. Table 60: Removed FF1760 package. Not supported. Table 63: Added FX devices and JTAG IDs. * * 06/08/07 2.2 * * * * SPEED SPECIFICATION version for this data sheet release: v1.65. Table 14: Promoted -12 speed grade devices of XC4VFX12, XC4VFX20, and XC4VFX60 to Production status. Table 37: Removed parameter TISCCK_REV. Not meaningful because pin should always be connected to GND. Table 43: Added parameter FMAX_SELECTMAP. for maximum Slave SelectMAP mode external configuration clock frequency. Table 63: Filled in Step 1 values for XC4VFX20, XC4VFX60, and XC4VFX100. Table 65: Added Step 1 data. * * SPEED SPECIFICATION version for this data sheet release: v1.65. Table 3: Added MAX value for IBATT . * * Table 25: Added unit (ns) to RXSIGDET. Table 27: Added Note (3) specifying range of DCI reference resistors and referring to UG070. Added section Ethernet MAC Switching Characteristics, page 22, and replaced Table 29. Added section I/O Standard Adjustment Measurement Methodology, page 23, including Table 30, Table 31, and Figure 4. Table 43: Added parameter FMAX_ICAP . Added word "Data" to description of SelectMAP Setup/Hold. Table 64: Added to Capability Improvements, for Step 1 that the DFS macro is no longer needed. * * 08/10/07 2.3 * * * * 09/10/07 2.4 * * * * DS302 (v3.5) June 16, 2009 Product Specification SPEED SPECIFICATION version for this data sheet release: v1.67. Table 14: Promoted all speed grades for XC4VFX40 devices, and -12 speed grade for XC4VFX100 devices, to Production status. Table 63: Filled in Step 1 value for XC4VFX40. Table 65: Added Note 1. www.xilinx.com 56 R Virtex-4 FPGA Data Sheet: DC and Switching Characteristics Date Version 09/28/07 3.0 Revisions * * * * * * 12/11/07 3.1 * * * SPEED SPECIFICATION version for this data sheet release: v1.67. Promoted data sheet to Production status. Table 14: Moved XC4VFX140, all speed grades, from Advance to Production status. Table 59: Added/updated all Global Clock Tree Skew values. Qualified Note (2) by adding "vertical". Table 60: Added Package Skew values for XC4VFX40, XC4VFX100, and XC4VFX140. Table 63: Added JTAG ID code for XC4VFX140. * SPEED SPECIFICATION version for this data sheet release: v1.68. Added new copyright notice and legal disclaimer section. Table 13: Removed table note references to XAPP700, XAPP704, and XAPP705 (obsolete). Renumbered table notes. Table 15: Added new Note 1, renumbered subsequent table notes. Table 30: Removed table rows for LVPECL_33, LVDS_33, and LVDSEXT_33. Table 30, Table 31: Corrected "electron-coupled" to "emitter-coupled". Table 31: For LVDS Extended Mode 2.5V, corrected I/O Standard Attribute to LVDSEXT_25. Table 37: Added Note 4 specifying FTOG for -11 FX devices as 1181 MHz. * Table 43: Added parameter FMAX_READBACK . * Table 58: Corrected TPSFD for XC4VFX100 devices to 1.99 ns. * Section Production Stepping, page 51: Advised that current stepping level is reported by the ISE tool in the PAR report. * * * * 04/10/08 3.2 * * * * SPEED SPECIFICATION version for this data sheet release: v1.68. Table 28, page 22: Re-inserted table. Table 43, page 36: Updated Symbol names for the DRP entries. Table 63, page 51: Revised code for XC4VFX40 package to 0. 06/06/08 3.3 * * SPEED SPECIFICATION version for this data sheet release: v1.68. Table 3, page 3: In Note (2), clarified differences between settings for typical and maximum ICC numbers. * Table 24, page 16: Revised FGCLK to show different maximum frequencies depending on the speed grade. Removed TPHASE. * Table 35, page 29: Reorganized according to IDELAYCTRL and IDELAY. 11/26/08 3.4 * Table 35, page 29: Added FMAX. 06/16/09 3.5 * Table 40, page 33: Changed TRCKO_DOA to a Max parameter. Notice of Disclaimer THE XILINX HARDWARE FPGA AND CPLD DEVICES REFERRED TO HEREIN ("PRODUCTS") ARE SUBJECT TO THE TERMS AND CONDITIONS OF THE XILINX LIMITED WARRANTY WHICH CAN BE VIEWED AT http://www.xilinx.com/warranty.htm. THIS LIMITED WARRANTY DOES NOT EXTEND TO ANY USE OF PRODUCTS IN AN APPLICATION OR ENVIRONMENT THAT IS NOT WITHIN THE SPECIFICATIONS STATED IN THE XILINX DATA SHEET. ALL SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE. PRODUCTS ARE NOT DESIGNED OR INTENDED TO BE FAIL-SAFE OR FOR USE IN ANY APPLICATION REQUIRING FAIL-SAFE PERFORMANCE, SUCH AS LIFE-SUPPORT OR SAFETY DEVICES OR SYSTEMS, OR ANY OTHER APPLICATION THAT INVOKES THE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR PROPERTY OR ENVIRONMENTAL DAMAGE ("CRITICAL APPLICATIONS"). USE OF PRODUCTS IN CRITICAL APPLICATIONS IS AT THE SOLE RISK OF CUSTOMER, SUBJECT TO APPLICABLE LAWS AND REGULATIONS. DS302 (v3.5) June 16, 2009 Product Specification www.xilinx.com 57