PACKAGE OPTION ADDENDUM
www.ti.com 13-Mar-2020
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
76010012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 76010012A
SNJ54LS
151FK
7601001EA ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type -55 to 125 7601001EA
SNJ54LS151J
7601001EA ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type -55 to 125 7601001EA
SNJ54LS151J
JM38510/07901BEA ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type -55 to 125 JM38510/
07901BEA
JM38510/07901BFA ACTIVE CFP W 16 1 TBD Call TI N / A for Pkg Type -55 to 125 JM38510/
07901BFA
JM38510/30901B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/
30901B2A
JM38510/30901B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/
30901B2A
JM38510/30901BEA ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type -55 to 125 JM38510/
30901BEA
JM38510/30901BEA ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type -55 to 125 JM38510/
30901BEA
JM38510/30901BFA ACTIVE CFP W 16 1 TBD Call TI N / A for Pkg Type -55 to 125 JM38510/
30901BFA
JM38510/30901BFA ACTIVE CFP W 16 1 TBD Call TI N / A for Pkg Type -55 to 125 JM38510/
30901BFA
M38510/07901BEA ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type -55 to 125 JM38510/
07901BEA
M38510/07901BFA ACTIVE CFP W 16 1 TBD Call TI N / A for Pkg Type -55 to 125 JM38510/
07901BFA
M38510/30901B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/
30901B2A
M38510/30901B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 JM38510/
30901B2A
M38510/30901BEA ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type -55 to 125 JM38510/
30901BEA
M38510/30901BEA ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type -55 to 125 JM38510/
PACKAGE OPTION ADDENDUM
www.ti.com 13-Mar-2020
Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
30901BEA
M38510/30901BFA ACTIVE CFP W 16 1 TBD Call TI N / A for Pkg Type -55 to 125 JM38510/
30901BFA
M38510/30901BFA ACTIVE CFP W 16 1 TBD Call TI N / A for Pkg Type -55 to 125 JM38510/
30901BFA
SN54LS151J ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type -55 to 125 SN54LS151J
SN54LS151J ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type -55 to 125 SN54LS151J
SN54S151J ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type -55 to 125 SN54S151J
SN74LS151D ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) NIPDAU Level-1-260C-UNLIM 0 to 70 LS151
SN74LS151D ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) NIPDAU Level-1-260C-UNLIM 0 to 70 LS151
SN74LS151DR ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) NIPDAU Level-1-260C-UNLIM 0 to 70 LS151
SN74LS151DR ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) NIPDAU Level-1-260C-UNLIM 0 to 70 LS151
SN74LS151N ACTIVE PDIP N 16 25 Green (RoHS
& no Sb/Br) NIPDAU N / A for Pkg Type 0 to 70 SN74LS151N
SN74LS151N ACTIVE PDIP N 16 25 Green (RoHS
& no Sb/Br) NIPDAU N / A for Pkg Type 0 to 70 SN74LS151N
SN74LS151NE4 ACTIVE PDIP N 16 25 Green (RoHS
& no Sb/Br) NIPDAU N / A for Pkg Type 0 to 70 SN74LS151N
SN74LS151NE4 ACTIVE PDIP N 16 25 Green (RoHS
& no Sb/Br) NIPDAU N / A for Pkg Type 0 to 70 SN74LS151N
SN74LS151NSR ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) NIPDAU Level-1-260C-UNLIM 0 to 70 74LS151
SN74LS151NSR ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) NIPDAU Level-1-260C-UNLIM 0 to 70 74LS151
SNJ54LS151FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 76010012A
SNJ54LS
151FK
SNJ54LS151FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 76010012A
SNJ54LS
151FK
PACKAGE OPTION ADDENDUM
www.ti.com 13-Mar-2020
Addendum-Page 3
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
SNJ54LS151J ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type -55 to 125 7601001EA
SNJ54LS151J
SNJ54LS151J ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type -55 to 125 7601001EA
SNJ54LS151J
SNJ54S151J ACTIVE CDIP J 16 1 TBD Call TI N / A for Pkg Type -55 to 125 SNJ54S151J
SNJ54S151W ACTIVE CFP W 16 1 TBD Call TI N / A for Pkg Type -55 to 125 SNJ54S151W
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com 13-Mar-2020
Addendum-Page 4
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54LS151, SN74LS151 :
Catalog: SN74LS151
Military: SN54LS151
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
Military - QML certified for Military and Defense Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74LS151DR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
SN74LS151NSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74LS151DR SOIC D 16 2500 333.2 345.9 28.6
SN74LS151NSR SO NS 16 2000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
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