EC1500SJTS-66.000M TR - Ecliptek Corporation

EC1500SJTS-66.000M TR

EC15 00 SJ TS -66.000M TR

Series

3.3V Plastic J-Lead SMD CMOS Oscillator

Frequency Tolerance/Stability

±100ppm Maximum

Package

Operating Temperature Range

0°C to +70°C

Packaging Options

Tape & Reel

Nominal Frequency

66.000MHz

Output Control Function

Tri-State (High Impedance)

Duty Cycle

50 ±10(%)

ELECTRICAL SPECIFICATIONS

Nominal Frequency 66.000MHz

Frequency Tolerance/Stability ±100ppm Maximum (Inclusive of all conditions: Calibration Tolerance at 25°C, Frequency Stability over the

Operating Temperature Range, Supply Voltage Change, Output Load Change, First Year Aging at 25°C,

Shock, and Vibration)

Aging at 25°C ±5ppm/year Maximum

Operating Temperature Range 0°C to +70°C

Supply Voltage 3.3Vdc ±10%

Input Current 35mA Maximum

Output Voltage Logic High (Voh) Vdd-0.4Vdc Minimum , IOH = -8mA

Output Voltage Logic Low (Vol) 0.4Vdc Maximum, IOL = +8mA

Rise/Fall Time 5nSec Maximum (Measured over 10% to 90% of waveform)

Duty Cycle 50 ±10(%) (Measured at 50% of waveform)

Load Drive Capability 15pF HCMOS Load Maximum

Output Logic Type HCMOS

Output Control Function Tri-State (High Impedance)

Tri-State Input Voltage (Vih and Vil) +2.0Vdc Minimum to enable output, +0.8Vdc Maximum to disable output (High Impedance), No Connect to

enable output.

Absolute Clock Jitter ±100pSec Maximum

One Sigma Clock Period Jitter ±25pSec Maximum

Start Up Time 10mSec Maximum

Storage Temperature Range -55°C to +125°C

ENVIRONMENTAL & MECHANICAL SPECIFICATIONS

Fine Leak Test MIL-STD-883, Method 1014, Condition A

Gross Leak Test MIL-STD-883, Method 1014, Condition C

Mechanical Shock MIL-STD-202, Method 213, Condition C

Resistance to Soldering Heat MIL-STD-202, Method 210

Resistance to Solvents MIL-STD-202, Method 215

Solderability MIL-STD-883, Method 2003

Temperature Cycling MIL-STD-883, Method 1010

Vibration MIL-STD-883, Method 2007, Condition A

www.ecliptek.com | Specification Subject to Change Without Notice | Rev Q 2/19/2010 | Page 1 of 4

EC1500SJTS-66.000M TR

MECHANICAL DIMENSIONS (all dimensions in millimeters)

MARKING

ORIENTATION

9.8

MAX

14.0

MAX

4.7

MAX

0.25 MIN

5.080

±0.203

7.620

±0.203

0.510 ±0.203

PIN CONNECTION

1 Tri-State

2 Ground

3 Output

4 Supply Voltage

LINE MARKING

1ECLIPTEK

266.000M

3XXYZZ

XX=Ecliptek Manufacturing

Code

Y=Last Digit of Year

ZZ=Week of Year

All Tolerances are ±0.1

Suggested Solder Pad Layout

Solder Land

(X4)

All Dimensions in Millimeters

5.8

3.81

1.27 (X4)

3.0 (X4)

www.ecliptek.com | Specification Subject to Change Without Notice | Rev Q 2/19/2010 | Page 2 of 4

DIA 50 MIN

DIA 20.2 MIN

DIA 13.0 ±0.2

2.5 MIN Width

10.0 MIN Depth

Tape slot in Core

for Tape Start

DIA 40 MIN

Access Hole at

Slot Location

1.5 MIN

Tape & Reel Dimensions

*Compliant to EIA 481A

EC1500SJTS-66.000M TR

24.0 ±0.3

11.5 ±0.1

10.75 ±0.10

4.0 ±0.2

2.0 ±0.1

12.0 ±0.1 B0*

1.5 +1.0/-0.0

A0*

0.3 ±0.1

K0*

30.4 MAX

360 MAX

Quantity Per Reel: 1,000 units

24.4 +2.0/-0.0

www.ecliptek.com | Specification Subject to Change Without Notice | Rev Q 2/19/2010 | Page 3 of 4

T Min

T Max

Critical Zone

T to T

L P

Ramp-up Ramp-down

t 25°C to Peak

t Preheat

StL

Temperature (T)

Time (t)

Recommended Solder Reflow Methods

EC1500SJTS-66.000M TR

Low Temperature Infrared/Convection 240°C

TS MAX to TL (Ramp-up Rate) 5°C/second Maximum

Preheat

- Temperature Minimum (TS MIN) N/A

- Temperature Typical (TS TYP) 150°C

- Temperature Maximum (TS MAX) N/A

- Time (tS MIN) 60 - 120 Seconds

Ramp-up Rate (TL to TP)5°C/second Maximum

Time Maintained Above:

- Temperature (TL)150°C

- Time (tL)200 Seconds Maximum

Peak Temperature (TP)240°C Maximum

Target Peak Temperature (TP Target) 240°C Maximum 1 Time / 230°C Maximum 2 Times

Time within 5°C of actual peak (tp)10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time

Ramp-down Rate 5°C/second Maximum

Time 25°C to Peak Temperature (t) N/A

Moisture Sensitivity Level Level 1

Low Temperature Manual Soldering

185°C Maximum for 10 seconds Maximum, 2 times Maximum.

High Temperature Manual Soldering

260°C Maximum for 5 seconds Maximum, 2 times Maximum.

www.ecliptek.com | Specification Subject to Change Without Notice | Rev Q 2/19/2010 | Page 4 of 4