MIL SPECS 4Y4E D Mi 0000125 0032243 5 MENILS | The documentation and process | ) conversion measures necessary to | . TIMCH-POUNDT ! | | comply with this revision shall be | completed by 19 April 1992 MIL-S-19500/228F 19 rn 1991 U NG MIL ~S-19500/228E 16 May 1969 MILITARY SPECIFICATION SEMICONDUCTOR DEVICE, DIODE, SILICON, RECTIFIER, TYPES 1N3611, 1N3611UR, 1N3612, 1N3612UR, 1N3613, 1N3613LR, 1N3614, 1N3614UR, 1N3957, 1N3957UR, JANTX This specification is approved for use by all Depart- ments and Agencies of the Department of Defense. 1. SCOPE 1.1 Scope. This specification covers the detail requirements for 1,0 ampere silicon rectifier diodes. One level of product assurance is provided for each device type as specified in MIL-S-19500. 1.2 Physical dimensions. See figures 1 and 2. 1.3 Maximum ratings. I ol/ , I Ta = 150C 2/ Io ly , Ta z lOOC 2/ \ | I i I I | | | 1 | j 1 Ipsw | | Types I Vp ot Vpwy | | | Ig = 300 mA de | ! I 1 I | 1 Ta = 150C { | | | 1 | | tp = 8 ms ( | | | l | | ' i T I i | I | IY ; Sipe) | A dc mA_dc | A_{pk) | 1N3611, 1N3611UR | 240 | 200 | 1.0 | 300 | 20 | | IN3612, 1N3612UR | 480 | 400 } 1.0 | 300 | 20 | | 1N3613, 1N3613UR 720 | 600 | 1.0 | 300 | 20 | | 1N3614, 1N3614UR | 920 | 800 |} 1.0 ) 300 | 30 | | _1N3457, 1N3457UR | 1150 | 1000 | 1,0 | 300 | 20 | | 1 | I | | \ Types { Barometric | Tog! Ty 1 Raja | | | pressure | I | | I |__(reduced) | | ! | | i i . ] . to I ! | mmig | SL I _L } c/w it | | I I 1 | | IN3611, 1N3611UR | 8 | -65 to +200 | -65 to +175 | 2.41 | | 1N3612, 1N3612UR | 8 1 -65 to +200 | -65 to +175 |} 2.41 | | 1N3613, 1N3613UR | 8 ! -65 to #200 | -65 to +175 | 2.41 | | 1N3614, 1N3614UR | 54 { -65 to +200 | -65 to +175 | 2.41 | | 1N3457, 1N3457UR | 87 | -65 to #200 | -65 to +175 | 2.41 | 1/ Ig rating is independent of heat sinking, special mounting, or forced air across the body or ~ lads of the device. 2/ Derate linearly at 13.3 mA/C between Ta = 100C and Ta = 175C. I | Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be | of use in improving this document should be addressed to: Defense Electronics Supply Center, | DESC-ECT, 1507 Wilmington Pike, Dayton, OH 45444-5280 by using the sel f-addressed | Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this |_ document or by letter. . AMSC N/A FSC 5961 DISTRIBUTION STATEMENT A. Approved for public release; distribution fs unlimited.MIL SPECS Q4UE D MM 0000125 0032244 ? MBMILS MIL~S-19500/ 228F 2. APPLICABLE DOCUMENTS 2.1 Government documents. 2.1.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks Sam a part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department of Defense Index of Specifications and Standards (DODISS) and supplement thereto, cited in the solicitation (see 6.2). SPECIFICATION MILITARY MIL-S-19500 - Semiconauctor Devices, General Specification for. STANDARD MILITARY MIL-STD-750 - Test Methods for Semiconductor Devices. (Unless otherwise indicated, copies of federal and military specifications, standards, and handbooks are available from the Standardization Documents Order Desk, Building 4D, 700 Robbins Avenue, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this document and the references cited herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Detail specification. The individual item requirements shal] be in accordance with 5500, and as speciti MIL -S-1 ed herein, 7.3.2 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein shall be as stacttied in MIL-3-19500, and as follows: : UR =- 22 2 ee ae ee Unleaded or surface mounted (round end-capped diodes). 3.3. Design, construction, and physical dimensions. The design, construction, and physical dimensions shal] be as specified in MIL-S-19500, and figures 1 and 2 herein. No lead (Pb) shall be used in the construction of the die bonds. 3.3.1 Lead material and finish. Lead material shall be solderable as defined in MIL-S-19500, MIL~STO-750, and herein. Where a choice of lead material or finish is desired, it shal] be specified in the acquisition document (see 6.2). 3.3.2 Diode construction, These devices shall be constructed utilizing non-cavity double plug construction with high temperature metallurgical bonding between both sides of the silicon die and terminal pins.MIL SPECS _ NQTES: 1. 2. 3. 4 ot 44E D MM 0000125 0032245 9 MMMILS MIL-S-19500/228F ee = @ Dimensions ! Inches { Millimeters ! itr | | Notes | } Min Max | Min | Max | 6 } . 060 .110 1.52 i 2.79 i 3 a | 0.641 0.861 4 | G .140 205 3.56 5.21 4 L .600 1.500 15.24 38.10 Dimensions are in inches. Metric equivalents are given for general infomation only. Dimension 68 shall be measured at the largest diameter. The G dimension shall include all uncontrolled areas of the device leads. FIGURE 1. Physical dimensions.MIL SPECS 44YE D MM 0000325 0032246 O MEMILS MIL-S-19500/228F -: + Bly ZY f Z ! Dimensions Lt Inches Millimeters J Min Max Min Max "op 0, 103) 2.31 1 2.62 | VF 17.019) 028) 0.48, 0.71 1 G | 168; .200 | 4.27 | 5.08 | ' Gy | 100 Ref 2.54 Ref ! Vs} .003 Min) 0,08 Min FIGURE 2. Physical dimensions for types 1N3611UR, 1N3612UR, 1N3613UR, 1N3614UR, 1N3957UR (DO-213AA).MIL SPECS SOE D MM 0000125 0032247 2 MMILS MIL-S-19500/228F 3.4 Marking. Devices shall be marked as specified in MIL-S-19500. At the option of the manufacturer, the following marking may be omitted from the body of the device: a. Manufacturer's identification, b. Country of origin. c. Lot identification code. d. "IN" of the type designation. 3.4.1 Marking of "UR" version devices. For "UR" version devices, all marking (except polarity) may be omitted trom the body, but shall be retained on the initial container. 3.4.2 Polarity. Polarity shall be as specified in MIL-S-19500. 4. QUALITY ASSURANCE PROVISIONS 4.1 Sampling and inspection. Sampling and inspection shall be in accordance with MIL-S-19500, and as specified herein. 4.2 Qualification snspection. Qualification inspection shall be in accordance with MIL ~S-1 and table erein, 4.3 Screening (JANTX level only). Screening shall be in accordance with MIL-S-19500 (table 11), and-as specified herein. The following measurements shal] be made in accordance with table I herein. Devices that exceed the limits of table I herein shall not be acceptable. 4Ve, = 0.1 V (pk) digg = 25 percent of initial value or #50 nA dc, whichever is greater. | i | | Screen (see table II | Measurement | | of MIL-S-19500) | | | | JANTX | | T | / | Thermal response (see 4.3.1) I | i | ] | | 9 | Not applicable l 1 | | | | I | ll | Ip and Vp | | : | | | | | \ 12 | See 4.3.2 | | | | I | I ! 13 Subgroup 2 of table I herein. | | i | | 1 | | I i/ Thermal response shall be performed anytime after screen 3 and before screen 11. 4.3.1 Thermal response (aVe measurements). The aVe measurements shall be performed in accordance with MIL-S metho . e aVe conditions and maximum aVe limit shall be derived by each vendor. The chosen aVp measurement and conditions for each device in the qualification lot shall be submitted in the qualification report: and thermal response curve shall be plotted. The chosen ar value shall be considered final after the manufacturer has had the opportunity to test five consecutive lots.MIL SPECS 44E D MM 0000125 0032248 4 MMNILS MIL-S-19500/228F 4.3.2 Power burn-in conditions. Power burn-in conditions are as follows (see 4.5.1): | i I | | | | Types \ VewM { Ig | Ta | Hours | ! | | | | I I { i { EN3611, 1N3611UR | 200 V de | lAde | 25C #3C | 9% I | 1N3612, 1N3612UR | 400 Vide {| LAdc 1 25 C43 C | 96 { | 1N3613, 1N3613UR | 600 Vde | LAde | 250 43. | 96 1 | 1N3614, 1N36146UR | 800 Vde | JlAdce | 25 C #3 C | 96 i | 1N3957, 1N3957UR 1 1000 Vde | lAde 260 43 C | 96 | | | | | | 4.4 quality conformance inspection. Quality conformance inspection shall be in accordance with MIL-S-1 . 4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with MIL~S-19500, and tate T herein. 4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specitied for subgroup testing in table IVb (JAN, JANTX, and JANTXV) of MIL~S-19500, and table II herein. Electrical measurements (end points) and delta requirements shall be in accordance with the applicable steps of table V herein. 4.4.3 Group C inspection. Group C inspection shall be conducted in accordance with the conditions specified tor subgroup testing in table V of MIL-S-19500, and table III herein. Electrical measurements (end points) and delta requirements shall be in accordance with the applicable steps of table V herein. 4.5 Methods of inspection. Methods of inspection shall be as specified in the appropriate stables as follows. se + = 4.5.1 Burn-in and steady-state operation life tests. These tests shall be conducted with a shalf-sine waveform 0 e spec peak voltage impressed across the diode in the reverse airection followed by a half-sine waveform of the specified average rectified current. The forward conduction angle of the rectified current shal] be neither greater than 180 degrees, nor less than 150 degrees. 4.5.2 Mounting. 4.5.2.1 Mounting conditions. The diodes shall be suspended by the leads with at least 6 inches of no. 22 or smaller wire between each lead and the power source. The connecting wires may be soldered to the leads, or MS27491-20 contacts may be used. Other clips may be used provided they have equal or less mass than the MS27491-20 contact. No forced air shall be permitted and the diodes shall: be shielded from drafts. 4.5.2.2 Alternate mounting conditions. At the option of the manufacturer, other chip or heat sink mounting Configurations may be ut!lized provided that I, is adjusted such that the junction temperature of each diode is maintained at least 120C above the specified ambient temperature of 25 C.WHE D MM 0000325 0032249 b MENILS MIL SPECS MIL-S-19500/228F Group A inspection. TABLE 1, ~_ at o uw ~ a uo uv 3 u < ~ < > > s 3S < > fn ne nn ee fat nae me a we ues ewe re are ens ee te me a ee oe ee - Q 3 ~ - 2 le g g ~~ o ee ee a a ae ee ee ee ee ee ee & - 4 ec .o wo . = Qo So - 2 _ = wN a = 2 ~ = Q sS & By 3 vv ow ex Pe ~ c an eo es -] uo o Lo i w o - sf o a wn Sd 3 a a - ~ aa 3 vu _ a ow ac a a e oo = >e >= roan a 8 3 on on om . ; o~ OO e o> < al <Q om om [= om w Qo f * = wy & - wo . = 1% aa bo ~ oa t ~ aw ey as Eg " uu o& a << a 5 3 3 8 3 os 3 = = @ =] o o o Qo 3S = N sz z+ s + + ~~ a =| i aad o o 5 - @ 2 & &. c _ -c ~ s 2 2 jm oo oe ve) o a0 - ra x xc & soc - - 3 vor o 3 3 3 b. 3 o o co] cew sf > 9 o 3 - 9 27 > uo as ecu 2 + gS > ao ew vv wy iy a ye 5 a uo a ~-oa t a a Po a a c a 3 oun 2a J .S S 3 x i @ os E aage ale g wl ss g s = - - o vo -_ o z ~ uw ez a =z oe db rs pling plan, see MIL-S-19500. l/ For samMIL SPECS WUE D MM O0001e5 0032250 2 MEMILS MIL-S-19500/228F TABLE II. Group 8 inspection for JANTX devices. I | MIL-STD-750 Inspection 1/ | ! | Methodl Conditions Subgroup 1 Solderability 2026 Resistance to solvents 1ce2 Subgroup 2 Thermal shock 1051 (temperature cycling) Test condition C 1071 Gross leak Electrical measurements Subgroup 3 Steady-state operation life 1026 | Ip. 300 mA de; Ta = 150C 45C; f = 60 Hz; VRwM = (see 1.3) Electrical measurements See table V, steps 1, 2, 3, 4, and Subgroup 4 | | | j \ | | | | i | | i | | \ i | | Hermetic seal \ | | \ | | | | | | | | { 1 | { | } Not applicable | 1 | | | { | | | | | | | | { | | | 1 \ | | | | | | | | | | | | | | | | | | | 1 | | I | { | | | | 1 1 I | | i \ | | See table V, steps 1 and 2 I | | \ { | | \ | | \ | { \ | See footnote at end of table.MIL SPECS W4E D MM 0000125 0032251 4 MMILS MIL-S-19500/228F TABLE 11. Group B inspection for JANTX devices - Continued. MIL~STD-750 Inspection 1/ OF Methoag] Conditions Subgroup 5 Thermal resistance Subgroup 6 High-temperature life (nonoperating) 4081 | Ty = 25C; Roja = (see 1.3) 1032 | Ty 200C Electrical measurements Subgroup 7 Surge current See table V, steps 1 and 2 4066 IFSM = 20 A (pk); 10 surges of 8.3 ms each at 1 minute intervals, superimposed on Tp = 300 pA dc; Vawy = rated (see 1.3); Tg = 18% End- point See table V, steps 1, 2, electrical and 5 measurements ene ame ce re es ee ee ee ee ee ee ee ee ee ee ee oe ee ee ae came Se ee SF em Stee ee ee ee cre ee ee ee ee ee ee ee a mee cee te ee ee ee eee ee ee are ee ee ee ee ee oe em ces re cm ee ee ce ee ane me ee ee ee ce ee -_ / For sampling plan, see MIL-S-19500.MIL SPECS QUE D MM 0000325 003eeS52 b&b MENILS MIL-S-19500/228F frequency Electrical measurements TABLE III. Group C inspection (all quality levels). { | T 1 : | MIL -STD-750 | | Inspection 1/ | J I 1 |Method | Conditions | \ I | | | I i | Subgroup 1 1 | | | | Physical dimensions | 2066 | See figure l | l 1 | I Subgroup 2 | | | Thermal shock } 1051 | Test condition A | | (temperature cycling)! | | | { Terminal strength 1 2036 | Test condition A; | | (tension) \ | weight = 4 pounds; | J | } t = 15 s; not applicable { | | | to "UR" devices i | | | I | Terminal strength 1 2036 | Test condition E; { | (Vead fatigue) | | not applicable to UR" ] | 1 | devices | I | i { | hermetic seal 11071 | | 1 i | | | Gross leak | | | | | | Moisture resistance 1021 Omit initial conditions | | Electrical \ | See table , steps 1 and 2 \ | measurements | i Subgroup 3 | | | | { | | | Shock |} 2016 | Nonoperating; 1,500 G; ] | | | 5 blows of 0.5 ms each | | | i in orientations: Xj, | | | 1 ,, and Yo (total i | | | 15 blows) 1 i | | | | Vibration, variable 1 2056 | Nonoperating t 1 . | | | | | | | 4 | 1 | | | | | | \ | | See footnote at end of table. 10 See table V, steps 1 and 2MIL SPECS W4E D MM 0000125 0032253 & MENILS MIL-S-19500/228F TABLE I11. Group C inspection (al) quality levels) - Continued. | | I | { MIL-STD-750 | | Inspection 1/ | t | | |Nethod | Conditions | | { | Subgroup 4 ! | Salt atmosphere 1101 =] | | (corrosion) 1 1 | { | \ I | Subgroup 5 | | | | 1 I | 1 Barometric pressure } 1001 | Pressure = (see 1.3); | { t = 1 minute (minimum) | | Measurement during | { See table , step 2 | | test | | | { | | Subgroup 6 ! ! ! 1 Steady-state 11026 | I, = 300 m dc; | | operation life i 1 Ta = 25C 43 C; f = 60 Hz | | | | Vpwm = (see 1.3) 1 { { | | | Electrical | | See table V, steps 1, 2, j | measurements I } and 1 | | { | - 11 / For sampling plan, see MIL-S-19500.MIL SPECS HUE D @@ 0000125 0032254 T MMILS MIL-S-19500/228F TABLE IV. Group E inspection (all quality levels) for qualification only. be submitted fn the qualification report. Vendors shall retain duplicate photos. analysis Subgroups 4 and 5 Not applicable Subgroup 6 Not applicable | a | Inspection | MIL -STD-750 | Qualification | | J ! conformance I | Method | Conditions I inspection | j I | | Subgroup 1 | | | 22 devices, c 21 | | | | | Thermal shock | 161 { 500 cycles | | (temperature cycling) | 1 | | I | | | Electrical measurements | | See table V, steps 1 2, 3, and 4} | I | | 1 Subgroup 2 j | | 22 devices, c = 1 | | | | | Steady-state dc | 1038 | Condition A; 1,000 hours | | blocking life |! or | | | | 1049 | | i | | | | Electrical measurements | { See table V, steps 1, 2, 3, | | | | 4, and 5 ] | Subgroup 3 | | I 3 devices, c = 0 | | | | Destructive physical | 2101 | Photos of cross sections shall | l | | | | | | | | I I | | | | | | | | | | 1 | | | | 1 | | | i | 1 | | | | | | | | | | ] { 12MIL SPECS WHE D MM O0001eS O03ee55 | MBNILS MIL -S+19500/228F TABLE V. Groups A, B, C, and E electrical measurements. i | | , | | | | MIL~STD-750 | 1 Limits | | 1Stepl| Inspection | | T Symbol Unit | | | |Metho di Conditions \ | Min | Max | | | | | | | I | | I 1 I | { j | i } | | 1. | Forwara voltage | 4011 | Pulse width = 6&3 ms | Vey $061.1 | Vde J } | { | maximum; duty { | | | { 1 | | | cycle = 2 percent I | | 1 | | \ \ | maximum; { { 1 | \ ! | | | Ip = 1.0 A ac l | | | | i I | l { | | | | } 2. | Reverse current | 4016 | OC methoa; Vp = rated | Ip) | $1.0 | uAde | | | (see 1.3) i i | 1 I | | | 1 3. 4 Forward vol tage 1 4011 | Pulse width = 8.3 ms 1 aVp) 1/ | #,1V de | | | | | maximum; duty | 1 max imum | | | 1 | cycle = 2 percent | I I \ | | | maximum; | i l | | | | ! Ip 1.0 A dc ! ! | | ! 1 | | 4. | Reverse current 1 4016 | DC method; Vp = rated | ap; 1/ | 425 percent of | | | | | (see 1.3) | | initial value or | | 1 | l | 1 *50 nA de | | | { I | ! (whichever is \ | | ! | 1 | greater) change | | i | ! | | from initial i | I | | | | group A reading | | \ 1 I | t | I | | 5. | Thermal response t 3201 | See 4.3.1 | aVe 1 | mV | l 1 | | | | lf Devices that exceed group A limits for this test shall be rejected. 13