3
SY58011U
Micrel, Inc.
M9999-110311
hbwhelp@micrel.com or (408) 955-1690
Absolute Maximum Ratings(Note 1)
Power Supply Voltage (VCC) .......................–0.5V to +4.0V
Input Voltage (VIN) ......................................... –0.5V to VCC
CML Output Voltage (VOUT) ........... VCC–1.0V to VCC+0.5V
Current (VT)
Source or sink current on VT pin........................ ±100mA
Input Current
Source or sink current on IN, /IN ......................... ±50mA
Current (VREF)
Source or sink current on VREF-AC, Note 4 ....... ±1.5mA
Lead Temperature Soldering, (20 seconds) ............. 260°C
Storage Temperature Range (TSTORE) ... –65°C to +150°C
Operating Ratings(Note 2)
Supply Voltage (VCC) ............................ +2.375V to +3.60V
Operating Temperature Range (TA) .......... –40°C to +85°C
Package Thermal Resistance, Note 3
QFN (θJA)
Still-Air ............................................................ 60°C/W
500lfpm ........................................................... 54°C/W
QFN (ψJB)........................................................... 33°C/W
TA= –40°C to +85°C
Symbol Parameter Condition Min Typ Max Units
VCC Power Supply Voltage 2.375 3.60 V
ICC Power Supply Current Max. VCC, no load 75 95 mA
VIH Input HIGH Voltage IN, /IN, Note 6 VCC–1.6 VCC V
VIL Input LOW Voltage IN, /IN 0 VIH–0.1 V
VIN Input Voltage Swing see Figure 1a. 0.1 1.7 V
VDIFF_IN Differential Input Voltage Swing see Figure 1b. 0.2 V
RIN Into VT Resistance 40 50 60 ý
VREF-AC Output Reference Voltage VCC –1.3 VCC –1.2 VCC –1.1 V
IN to VT1.28 V
DC ELECTRICAL CHARACTERISTICS(Note 5)
VCC = 3.3V ±10% or 2.5V ±5%; TA = –40°C to +85°C; RL = 100ý across each output pair, or equivalent, unless otherwise stated.
Symbol Parameter Condition Min Typ Max Units
VOH Output HIGH Voltage Q0, /Q0, Q1, /Q1 VCC –0.020 VCC –0.010 VCC V
VOUT Output Voltage Swing Q0, /Q0, Q1, /Q1; see Figure 1a. 325 400 mV
VDIFF_OUT Differential Output Voltage Swing Q0, /Q0, Q1, /Q1; see Figure 1b. 650 800 mV
ROUT Output Source Impedance Q0, /Q0, Q1, /Q1 40 50 60 ohms
Notes:
1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not
implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings conditions for
extended periods may affect device reliability.
2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3. Thermal performance assumes exposed pad is soldered (or equivalent) to the device’s most negative potential (gnd) on the pcb.
4. Due to the limited drive capability, use for input of the same package only.
5. The circuit is designed to meet the dc specifications shown in the above table after thermal equilibrium has been established.
6. VIH (min) not lower than 1.2V.
CML DC ELECTRICAL CHARACTERISTICS(Note 5)