ECX-5614-33.333333M TR
PLEASE NOTE: Due to the inherent proprietary nature of custom part numbers, certain parameters
are intentionally excluded from this specification sheet.
ECX-5614 -33.333333M TR
Series
Ecliptek Custom Crystal
Nominal Frequency
33.333333MHz
Packaging Options
Tape & Reel
ELECTRICAL SPECIFICATIONS
Nominal Frequency 33.333333MHz
ENVIRONMENTAL & MECHANICAL SPECIFICATIONS
Fine Leak Test MIL-STD-883, Method 1014, Condition A
Gross Leak Test MIL-STD-883, Method 1014, Condition C
Lead Integrity MIL-STD-883, Method 2004
Mechanical Shock MIL-STD-202, Method 213, Condition C
Resistance to Soldering Heat MIL-STD-202, Method 210
Resistance to Solvents MIL-STD-202, Method 215
Solderability MIL-STD-883, Method 2003
Temperature Cycling MIL-STD-883, Method 1010
Vibration MIL-STD-883, Method 2007, Condition A
MECHANICAL DIMENSIONS (all dimensions in millimeters)
12.70
MIN
13.58
MAX
4.88 ±0.20
DIA 0.457
±0.051(X2)
4.70
MAX
11.18
MAX
LINE MARKING
1ECX-5614
233.333M
3XXYZZ
XX=Ecliptek Manufacturing
Designator
Y=Last Digit Of Year
ZZ=Week of Year
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/19/2010 | Page 1 of 4
Tape & Reel Dimensions
*Compliant to EIA 468B
32.0
MAX
18.0
±2.0
3.81 ±0.7 12.7
±0.3
0.9 MAX
18.0
+1.0/-0.5
DIA 81.5
MAX
14.0 MIN
38.0 MAX
DIA 178 MIN
370 MAX
56.0 MAX
ECX-5614-33.333333M TR
Quantity Per Reel: 1,000 Pieces
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/19/2010 | Page 2 of 4
T Min
S
T Max
S
Critical Zone
T to T
L P
Ramp-up Ramp-down
TL
TP
t 25°C to Peak
t Preheat
StL
tP
Temperature (T)
Time (t)
Recommended Solder Reflow Methods
ECX-5614-33.333333M TR
High Temperature Solder Bath (Wave Solder)
TS MAX to TL (Ramp-up Rate) 3°C/second Maximum
Preheat
- Temperature Minimum (TS MIN) 150°C
- Temperature Typical (TS TYP) 175°C
- Temperature Maximum (TS MAX) 200°C
- Time (tS MIN) 60 - 180 Seconds
Ramp-up Rate (TL to TP)3°C/second Maximum
Time Maintained Above:
- Temperature (TL)217°C
- Time (tL)60 - 150 Seconds
Peak Temperature (TP)260°C Maximum for 10 Seconds Maximum
Target Peak Temperature (TP Target) 250°C +0/-5°C
Time within 5°C of actual peak (tp)20 - 40 seconds
Ramp-down Rate 6°C/second Maximum
Time 25°C to Peak Temperature (t) 8 minutes Maximum
Moisture Sensitivity Level Level 1
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/19/2010 | Page 3 of 4
T Min
S
T Max
S
Critical Zone
T to T
L P
Ramp-up Ramp-down
TL
TP
t 25°C to Peak
t Preheat
StL
tP
Temperature (T)
Time (t)
Recommended Solder Reflow Methods
ECX-5614-33.333333M TR
Low Temperature Solder Bath (Wave Solder)
TS MAX to TL (Ramp-up Rate) 5°C/second Maximum
Preheat
- Temperature Minimum (TS MIN) N/A
- Temperature Typical (TS TYP) 150°C
- Temperature Maximum (TS MAX) N/A
- Time (tS MIN) 30 - 60 Seconds
Ramp-up Rate (TL to TP)5°C/second Maximum
Time Maintained Above:
- Temperature (TL)150°C
- Time (tL)200 Seconds Maximum
Peak Temperature (TP)245°C Maximum
Target Peak Temperature (TP Target) 245°C Maximum 1 Time / 235°C Maximum 2 Times
Time within 5°C of actual peak (tp)5 seconds Maximum 1 Time / 15 seconds Maximum 2 Times
Ramp-down Rate 5°C/second Maximum
Time 25°C to Peak Temperature (t) N/A
Moisture Sensitivity Level Level 1
Low Temperature Manual Soldering
185°C Maximum for 10 seconds Maximum, 2 times Maximum.
High Temperature Manual Soldering
260°C Maximum for 5 seconds Maximum, 2 times Maximum.
www.ecliptek.com | Specification Subject to Change Without Notice | Rev A 2/19/2010 | Page 4 of 4
