
EGP10A THRU EGP10G
GLASS PASSIVATED FAST EFFICIENT RECTIFIER
Reverse Voltage - 50 to 400 Volts Forward Current - 1.0 Ampere
FEATURES
♦ Plastic package has Underwriters Laboratories
Flammability Classification 94V-0
♦ Glass passivated cavity-free junction
♦ Superfast recovery time for high efficiency
♦ Low forward voltage, high current capability
♦ Low leakage current
♦ High surge current capability
♦ High temperature metallurgically
bonded construction
♦ High temperature soldering guaranteed:
300°C/10 seconds, 0.375" (9.5mm) lead length,
5 lbs. (2.3kg) tension
MECHANICAL DATA
Case: JEDEC DO-204AL molded plastic over glass body
Terminals: Plated axial leads, solderable per MIL-STD-750,
Method 2026
Polarity: Color band denotes cathode end
Mounting Position: Any
Weight: 0.012 ounce, 0.3 gram
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified.
EGP EGP EGP EGP EGP EGP
SYMBOLS 10A 10B 10C 10D 10F 10G UNITS
Maximum repetitive peak reverse voltage VRRM 50 100 150 200 300 400 Volts
Maximum RMS voltage VRMS 35 70 105 140 210 280 Volts
Maximum DC blocking voltage VDC 50 100 150 200 300 400 Volts
Maximum average forward rectified current
0.375" (9.5mm) lead length at T A=55°C I(AV) 1.0 Amp
Peak forward surge current
8.3ms single half sine-wave superimposed
on rated load IFSM 30.0 Amps
Maximum instantaneous forward voltage at 1.0A VF0.95 1.25 Volts
Maximum DC reverse current TA=25°C 5.0
at rated DC blocking voltage TA=125°C IR100 µA
Maximum reverse recovery time (NOTE 1) trr 50.0 ns
Typical junction capacitance (NOTE 2) CJ22.0 15.0 pF
Typical thermal resistance (NOTE 3)R
ΘJA 50.0 °C/W
Operating junction and storage temperature range TJ, TSTG -65 to +150 °C
NOTES:
(1) Reverse recovery test conditions: IF=0.5A, IR=1.0A, Irr=0.25A
(2) Measured at 1.0 MHZand applied reverse voltage of 4.0 Volts
(3) Thermal resistance from junction to ambient at 0.375" (9.5mm) lead length, P.C.B. mounted
0.107 (2.7)
0.080 (2.0)
0.034 (0.86)
0.028 (0.71)
DIA.
1.0 (25.4)
MIN.
1.0 (25.4)
MIN.
0.205 (5.2)
0.160 (4.1)
DIA.
DO-204AL
Dimensions in inches and (millimeters)
*
Glass Encapsulation technique is covered by
Patent No. 3,996,602, brazed-lead assembly to Patent No. 3,930,306
PATENTED*