LM160QML
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SNOSAR0A NOVEMBER 2010REVISED MARCH 2013
LM160QML High Speed Differential Comparator
Check for Samples: LM160QML
1FEATURES DESCRIPTION
The LM160 is a very high speed differential input,
2 Ensured High Speed: 20nS max complementary TTL output voltage comparator with
Tight Delay Matching on Both Outputs improved characteristics over the μA760/μA760C, for
Complementary TTL Outputs which it is a pin-for-pin replacement. The device has
been optimized for greater speed, input impedance
High Input Impedance and fan-out, and lower input offset voltage. Typically
Low Speed Variation with Overdrive Variation delay varies only 3nS for overdrive variations of 5mV
Fan-Out of 4 to 400mV.
Low Input Offset Voltage Complementary outputs having minimum skew are
Series 74 TTL Compatible provided. Applications involve high speed analog to
digital convertors and zero-crossing detectors in disk
file systems.
Connection Diagrams
Figure 1. Metal Can Package
See Package Number LMC0008C
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2010–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LM160QML
SNOSAR0A NOVEMBER 2010REVISED MARCH 2013
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Schematic Diagram
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
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Absolute Maximum Ratings(1)
Positive Supply Voltage +8V
Negative Supply Voltage 8V
Peak Output Current 20 mA
Differential Input Voltage ±5V
Input Voltage V+VIV
Operating Temperature Range 55°C TA+125°C
Storage Temperature Range 65°C TA+150°C
Thermal Resistance θJA Still Air 165°C/W
400 LF/min 67°C/W
θJC 25°C/W
Lead Temperature (Soldering, 10 sec.) 260°C
ESD Tolerance(2) 1,600V
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
(2) Human body model, 1.5 kΩin series with 100 pF.
Quality Conformance Inspection
Mil-Std-883, Method 5005 - Group A
Subgroup Description Temp (°C)
1 Static tests at +25
2 Static tests at +125
3 Static tests at -55
4 Dynamic tests at +25
5 Dynamic tests at +125
6 Dynamic tests at -55
7 Functional tests at +25
8A Functional tests at +125
8B Functional tests at -55
9 Switching tests at +25
10 Switching tests at +125
11 Switching tests at -55
12 Settling time at +25
13 Settling time at +125
14 Settling time at -55
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LM160H/883 Electrical Characteristics DC Parameters Sub-
Symbol Parameter Conditions Notes Min Max Unit groups
VOH B Logical "1" Output Voltage VCC ±4.5V, IO= -320µA 2.4 V 1, 2, 3
VOH A Logical "1" Output Voltage VCC ±4.5V, IO= -320µA 2.4 V 1, 2, 3
VOLA Logical "0" Output Voltage VCC ±4.5V, IO= 6.4mA 0.4 V 1, 2, 3
VOLB Logical "0" Output Voltage VCC = 4.5V, IO= 6.4mA 0.4 V 1, 2, 3
IIB Input Bias Current VCC = ±5V, VIN = 5V 20 µA 1, 2, 3
ICC+ Positive Supply Current VCC = ±6.5V 32 mA 1, 2, 3
ICC- Negative Supply Current VCC = ±6.5V -16 mA 1, 2, 3
IOS B Short Circuit Current VCC = ±4.5V -15 -52 mA 1, 2, 3
IOS A Short Circuit Current VCC = ±4.5V -15 -52 mA 1, 2, 3
VIO Input Offset Voltage VCC = ±5V -5.0 5.0 mV 1, 2, 3
IIO Input Offset Current VCC = ±5V -3.0 3.0 µA 1, 2, 3
VCC = ±5V, VIN(1) = 0,
II(1) Unbalanced Input Current See(1) -1.0 mA 1, 2, 3
VIN (2) = 5V
VCC = ±5V, VIN (1) = 5V,
II(2) Unbalanced Input Current See(1) -1.0 mA 1, 2, 3
VIN (2) = 0V
VCC Supply Voltage See(1) ±4.5 ±6.5 V 1, 2, 3
BVCC Supply Breakdown Voltage See(1) ±8.0 V 1, 2, 3
Common Mode Input Voltage
VCM VCC = ±6.5V See(1) ±4.0 V 1, 2, 3
Range
VDiff Differential Input Voltage Range See(1) ±5.0 V 1, 2, 3
(1) Parameter tested gonogo, only.
LM160H/883 Electrical Characteristics AC Parameters
The following conditions apply, unless otherwise specified. VCC = ±5V, ƒ = 10MHz (sinusoidal) Sub-
Symbol Parameter Conditions Notes Min Max Unit groups
tResp Response Time VIN = 30mVPPSee(1) 25 nS 9
tResp Response Time VIN = 2 VPPSee(1) 20 nS 9
(1) Bench test, use 70256644.
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Typical Performance Characteristics
Input Current vs Ambient
Offset Voltage Temperature
Figure 2. Figure 3.
Supply Current vs Ambient
Input Characteristics Temperature
Figure 4. Figure 5.
Delay of Output 1 With
Propagation Delay vs Respect to Output 2 vs
Ambient Temperature Ambient Temperature
Figure 6. Figure 7.
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Typical Performance Characteristics (continued)
Common-Mode
Pulse Response
Figure 8.
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AC Test Circuit
VI50 mV FANOUT=1 FANOUT=4
V+=+5V R=2.4KR=630
V=5V C=15 pF C=30 pF
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REVISION HISTORY
Released Revision Section Changes
11/30/2010 A New Release, Corporate format 1 MDS data sheets converted into one Corp. data
sheet format. The drift table was eliminated since it
did not apply MNLM160-X Rev 0BL will be archived.
03/26/2013 A All Sections Changed layout of National Data Sheet to TI format
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PACKAGE OPTION ADDENDUM
www.ti.com 11-Apr-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Top-Side Markings
(4)
Samples
5962-8767401GA ACTIVE TO-99 LMC 8 20 TBD Call TI Call TI -55 to 125 LM160H/883
5962-8767401GA Q A
CO
5962-8767401GA Q >
T
LM160H/883 ACTIVE TO-99 LMC 8 20 TBD Call TI Call TI -55 to 125 LM160H/883
5962-8767401GA Q A
CO
5962-8767401GA Q >
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(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
PACKAGE OPTION ADDENDUM
www.ti.com 11-Apr-2013
Addendum-Page 2
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